The ultrahigh-sensitivity MEMS
loudspeaker comprises a shell and a circuit board arranged at the bottom of the shell, an upper
magnetic circuit and a lower
magnetic circuit which are distributed up and down are arranged in a cavity formed by the shell and the circuit board, bonding pads are distributed on the lower
magnetic circuit, a supporting ring used for
welding the positive
electrode and the negative
electrode of a coil lead is arranged on the lower magnetic circuit, and a vibration
system is arranged on the supporting ring. The mode of combining the coil and the vibration film is adopted, the
semiconductor technology is utilized, the coil is made into multiple
layers, the
semiconductor printer and the micro-electro-mechanical
casting mold technology are adopted, conductive
silver paste is attached to the vibration film to form the coil, due to the fact that the
line width and the thickness of the coil in the
semiconductor technology are within 10 micrometers, the coil can be attached to multiple
layers, and the more the
layers are, the more the layers are. The longer the coil length is, the higher the sensitivity of the
loudspeaker is by more than 3db, the thickness of the MEMS
loudspeaker can be 1.0 mm through the multi-layer coil made through the
semiconductor technology, and the product sensitivity is 50% higher than that of a traditional MEMS.