Integrated modular power supply
By setting up heat dissipation components in the integrated modular power supply, including a heat dissipation cylinder, an internal heat dissipation fin and a heat dissipation fan, the problem of sealing and heat dissipation performance is solved, and the efficient heat dissipation effect is achieved, and the electrical components are protected from damage.
Patent Information
- Application Number
- CN202421625595.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-08-15
- Estimated Expiration
- 2034-07-10
AI Technical Summary
Existing integrated modular power supplies cannot take into account the sealing and heat dissipation performance.
The heat dissipation components are installed in the sealed shell, including a heat dissipation cylinder, a circumferential inner heat dissipation fin, a heat dissipation fan and a heat conduction plate, combined with a heat conduction coating and a dust barrier net to ensure sealing and improve the heat dissipation effect.
While maintaining sealing, the heat dissipation effect of the power module is effectively improved through the heat dissipation component to prevent damage to the electrical components.
Smart Images
Figure CN223231465U_ABST
Abstract
Description
Technical Field
[0001] The utility model provides an integrated modular power supply, which relates to the technical field of power supplies. Background Art
[0002] An integrated modular power supply is a power system design concept that modularly integrates power supplies into an overall system to provide a reliable power solution. This type of power supply typically includes multiple modules, such as DC-DC converters, AC-DC converters, filters, and control circuits. These modules are designed to operate independently or collaboratively to suit different power requirements and application scenarios.
[0003] Because modular power supplies contain numerous electrical components, dust, moisture, heat, high pH air and temperature, and humidity generated by the external environment can attack the circuit boards and electronic components within the power module, causing corrosion and damage to the components. To protect these components, modular power supplies typically feature a tightly sealed enclosure. However, sealing and heat dissipation performance often struggle to balance. Existing heat dissipation methods employ heat sink fins on both sides of the power module, but due to the tight seal, heat dissipation is difficult to achieve. Therefore, we propose an integrated modular power supply. Utility Model Content
[0004] The technical problem to be solved by the utility model is that the existing integrated modular power supply cannot take into account both sealing and heat dissipation performance.
[0005] In order to solve the above technical problems, the technical solution provided by the utility model is: an integrated modular power supply, including a sealed shell, a power module installed on the inside of the sealed shell, and a sealed top cover bolted to the top of the sealed shell, a heat dissipation component is symmetrically arranged in the sealed shell, and the heat dissipation component includes a heat dissipation tube penetrating the sealed shell, an inner heat dissipation fin arranged around the circumference of the heat dissipation tube, and a heat dissipation fan installed at one end of the heat dissipation tube.
[0006] Preferably, the heat dissipation assembly further includes a heat conducting plate which is covered on the outside of the heat dissipation tube, the heat conducting plate is in a U-shape, and one side of the heat conducting plate is attached to the power module.
[0007] Preferably, the inner heat sink passes through the side wall of the heat sink and is fixed to the heat sink, and the end of the inner heat sink close to the heat conducting plate is fixed to the inner wall of the heat conducting plate.
[0008] Preferably, both ends of the heat dissipation tube are threadedly connected to limit end covers, and a first dust-proof net is fixedly embedded on the limit end covers.
[0009] Preferably, a concave platform is provided on the sealing top cover, and external heat sinks are fixedly connected to the inner side of the concave platform at equal intervals.
[0010] Preferably, the surfaces of the heat dissipation tube, the heat conducting plate, the outer heat dissipation fins and the inner heat dissipation fins are all coated with a thermal conductive coating.
[0011] Preferably, a mounting ring cooperating with the cooling fan is fixedly connected to the inner side of the heat dissipation tube, and a second dust screen is fixedly connected to the inner side of the mounting ring.
[0012] Beneficial effects of the utility model:
[0013] By setting up the heat dissipation component, the heat in the sealed shell can be transferred to the center of the heat dissipation tube through the inner heat sink, and then blown out by the heat dissipation fan, thereby improving the heat dissipation effect while ensuring sealing. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the overall structure of an integrated modular power supply of the present utility model.
[0015] Figure 2 This is a disassembled diagram of an integrated modular power supply of the utility model.
[0016] Figure 3 This is a cross-sectional view of an integrated modular power supply of the present utility model.
[0017] Figure 4 This is an enlarged view of point A of an integrated modular power supply of the present utility model.
[0018] (1. Sealed housing; 2. Sealed top cover; 3. External heat sink; 4. Positioning end cap; 5. First dust screen; 6. Recessed platform; 7. Power module; 8. Internal heat sink; 9. Heat sink; 10. Heat conduction plate; 11. Mounting ring; 12. Cooling fan; 13. Second dust screen) DETAILED DESCRIPTION
[0019] The preferred embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.
[0020] Reference Figures 1 to 4 The present invention provides an integrated modular power supply, comprising a sealed housing 1, a power module 7 mounted on the inner side of the sealed housing 1, and a sealed top cover 2 bolted to the top of the sealed housing 1. A heat dissipation assembly is symmetrically arranged in the sealed housing 1, and the heat dissipation assembly comprises a heat dissipation tube 9 that passes through the sealed housing 1, inner heat dissipation fins 8 circumferentially arranged around the heat dissipation tube 9, and a heat dissipation fan 12 mounted on one end of the heat dissipation tube 9. Specifically, the heat dissipation tube 9 passes through the sealed housing 1 while still maintaining the sealing of the sealed housing 1. At the same time, an airflow is formed in the heat dissipation tube 9 by the heat dissipation fan 12, accelerating the air flow, so that the heat in the sealed housing 1 is transferred to the inner side of the heat dissipation tube 9 through the heat dissipation tube 9 and the inner heat dissipation fins 8, and then blown out by the heat dissipation fan 12, thereby achieving the heat dissipation effect.
[0021] Furthermore, the heat dissipation component further includes a heat conduction plate 10 covering the outside of the heat dissipation cylinder 9. The heat conduction plate 10 is in a U shape, and one side of the heat conduction plate 10 is adhered to the power module 7. The inner heat dissipation fins 8 penetrate through the side wall of the heat dissipation cylinder 9 and are fixedly connected to the heat dissipation cylinder 9. The end of the inner heat dissipation fin 8 close to the heat conduction plate 10 is fixedly connected to the inner wall of the heat conduction plate 10. Specifically, as Figure 4 shown, one end of the inner heat dissipation fin 8 extends into the heat dissipation cylinder 9, and the other end is placed inside the sealed housing 1. The inner heat dissipation fin 8 close to the heat conduction plate 10 is connected to the heat conduction plate 10. Thus, the heat inside the sealed housing 1 can be transferred to the center of the heat dissipation cylinder 9 through the heat conduction plate 10 and the inner heat dissipation fins 8. The heat conduction plate 10 and the multiple inner heat dissipation fins 8 arranged at equal intervals greatly increase the heat dissipation area and can effectively transfer heat.
[0022] Furthermore, as Figure 1 shown, limiting end caps 4 are threadedly connected to both ends of the heat dissipation cylinder 9, and first dust-proof nets 5 are fixedly embedded in the limiting end caps 4. After the heat dissipation cylinder 9 passes through the sealed housing 1, the limiting end caps 4 are screwed on both sides to clamp the heat dissipation cylinder 9 on the sealed housing 1 and fix it.
[0023] Furthermore, as Figure 1 shown, a concave platform 6 is provided on the sealed top cover 2, and outer heat dissipation fins 3 are fixedly connected at equal intervals inside the concave platform 6. The heat dissipation area of the sealed top cover 2 is increased through the concave platform 6 and the outer heat dissipation fins 3.
[0024] Furthermore, heat conduction coatings are applied on the surfaces of the heat dissipation cylinder 9, the heat conduction plate 10, the outer heat dissipation fins 3, and the inner heat dissipation fins 8. The heat dissipation effects of the heat dissipation cylinder 9, the heat conduction plate 10, the outer heat dissipation fins 3, and the inner heat dissipation fins 8 are improved through the heat conduction coatings.
[0025] Furthermore, as Figure 3 shown, a mounting ring 11 cooperating with the heat dissipation fan 12 is fixedly connected inside the heat dissipation cylinder 9, and a second dust-proof net 13 is fixedly connected inside the mounting ring 11. The mounting ring 11 is used to install and fix the heat dissipation fan 12. The second dust-proof net 13 and the first dust-proof net 5 work together to prevent dust and the like from entering the heat dissipation cylinder 9.
[0026] Working principle: When the power module 7 is in use, the heat dissipation fans 12 on both sides are turned on to generate an air flow inside the heat dissipation cylinder 9, accelerating the air flow. One end of the inner heat dissipation fin 8 extends into the heat dissipation cylinder 9, and the other end is placed inside the sealed housing 1. Thus, the heat inside the sealed housing 1 can be transferred to the center of the heat dissipation cylinder 9 and then blown out by the heat dissipation fan 12, achieving the heat dissipation effect and improving the heat dissipation effect on the premise of ensuring sealing.
[0027] The above description of the present invention and its embodiments is non-limiting. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by the above, and does not deviate from the purpose of the present invention, without inventive design, a structure and embodiment similar to the technical solution should fall within the scope of protection of the present invention.
Claims
1. An integrated modular power supply comprising a sealed housing, a power module mounted inside the sealed housing, and a sealed top cover bolted to the top of the sealed housing, characterized in that: A heat dissipation assembly is symmetrically arranged in the sealed shell, and the heat dissipation assembly includes a heat dissipation cylinder penetrating the sealed shell, inner heat dissipation fins arranged circumferentially around the heat dissipation cylinder, and a heat dissipation fan installed at one end of the heat dissipation cylinder.
2. The integrated modular power supply according to claim 1, characterized in that: The heat dissipation assembly also includes a heat conducting plate covered on the outside of the heat dissipation tube. The heat conducting plate is in a U-shape, and one side of the heat conducting plate is attached to the power module.
3. The integrated modular power supply according to claim 1, characterized in that: The inner heat sink penetrates the side wall of the heat sink and is fixed to the heat sink. The end of the inner heat sink close to the heat conduction plate is fixed to the inner wall of the heat conduction plate.
4. The integrated modular power supply according to claim 1, characterized in that: Both ends of the heat dissipation tube are threadedly connected to the limiting end covers, and the limiting end covers are fixedly embedded with a first dust-proof net.
5. The integrated modular power supply according to claim 1, characterized in that: The sealing top cover is provided with a concave platform, and external heat sinks are fixedly connected to the inner side of the concave platform at equal intervals.
6. The integrated modular power supply according to claim 5, characterized in that: The surfaces of the heat dissipation tube, the heat conducting plate, the outer heat dissipation fins and the inner heat dissipation fins are all coated with a heat conducting coating.
7. The integrated modular power supply according to claim 1, characterized in that: A mounting ring that matches the cooling fan is fixedly connected to the inner side of the cooling tube, and a second dust-proof net is fixedly connected to the inner side of the mounting ring.