Heat dissipation device applied to closed environment

Abstract

The utility model discloses a heat dissipation device applied to a closed environment, and relates to the heat dissipation device applied to the closed environment. The heat dissipation device solves the problem that in the prior art, a heat dissipation device in a closed environment is poor in heat dissipation effect. The heat dissipation device comprises a cold end and a hot end. The cold end is installed in the cooling cabin, the hot end is connected with the external environment, and heat generated by working parts in the cooling cabin is conducted to the external environment in a heat conduction mode. The hot end comprises hot end double fans, hot end cooling fins, heat insulation cotton and a hot end fan aluminum alloy fixing support. The cold end comprises cold end double fans, a hot end fan aluminum alloy fixing support, a cold end cooling fin and a semiconductor chilling plate. The hot-end double fans are mounted on the hot-end fan aluminum alloy fixing bracket; the cold-end double fans are mounted on the cold-end fan aluminum alloy fixing bracket; after the semiconductor chilling plate and the heat insulation cotton are installed on the hot end cooling fin, the cold end cooling fin is fixed to the hot end cooling fin and sealed through the rubber O-shaped ring. The LED lamp is simple in structure, easy to assemble, disassemble and maintain and better in heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to a heat dissipation device in a sealed environment. Background Art

[0002] Traditional heat sinks on the market are categorized into two types based on their spatial environment: open and closed. Open heat sinks typically utilize fans to create airflow, dissipating heat. Closed heat sinks typically employ a single method, such as conduction, which uses a metal heat sink to increase the heat dissipation area, but often lacks effective heat dissipation.

[0003] The utility model integrates multiple heat dissipation methods and a rational layout to design a high-performance heat dissipation device suitable for sealed environment conditions; at the same time, for some temperature-sensitive systems in special sealed environments, such as aerospace and other fields, by integrating forced ventilation heat dissipation, conduction heat dissipation, increased heat dissipation surface area, semiconductor heat dissipation and other heat dissipation methods, a heat dissipation device that can be used in a sealed environment is designed, which helps to maintain the normal operation of the system, maintain the stable temperature inside the cabin, and meet the heat dissipation needs of special environments.

[0004] Utility Model

[0005] The utility model aims to solve the problem of poor heat dissipation effect of heat dissipation devices in a closed environment in the prior art and provides a heat dissipation device for use in a closed environment.

[0006] A heat dissipation device used in a closed environment, comprising a cold end and a hot end; the cold end is connected to the interior of the cooling chamber, while the hot end is connected to the outside environment, and the heat generated by the working components inside the cooling chamber is conducted to the outside environment by heat conduction;

[0007] The hot end includes a hot end dual fan, a hot end heat sink, heat insulation cotton and a hot end fan aluminum alloy fixing bracket; the cold end includes a cold end fan aluminum alloy fixing bracket, a cold end dual fan, a cold end heat sink and a semiconductor refrigeration plate; the hot end dual fan is installed on the hot end fan aluminum alloy fixing bracket, and the hot end fan aluminum alloy fixing bracket is installed on the hot end heat sink;

[0008] The cold end dual fans are installed on the cold end fan aluminum alloy fixing bracket, and the cold end fan aluminum alloy fixing bracket is installed on the cold end heat sink; after the semiconductor refrigeration sheet and thermal insulation cotton are installed on the back of the hot end heat sink, the cold end heat sink is fixed on the hot end heat sink and sealed by a rubber O-ring.

[0009] Beneficial effects of the utility model:

[0010] (1) A combination of active and passive heat dissipation is adopted to achieve complementary advantages between the heat dissipation structures.

[0011] (2) The heat dissipation device described in the present invention has a double-layer sealing structure designed for the hot end seal, which can meet the heat dissipation requirements in a closed environment.

[0012] (3) In actual use environment, due to the complex and changeable environment, in response to different external conditions, the fan speed on both sides and the current of the semiconductor cooling plate can be controlled to adapt to different environmental conditions.

[0013] (4) Compared with traditional refrigeration methods, the heat dissipation device described in the present invention achieves efficient heat dissipation in a limited space. The heat dissipation device has a simple structure and is easy to assemble and disassemble and maintain. The thermal conductive silicone grease is evenly applied to the surfaces of both sides of the semiconductor refrigeration plate, which can greatly improve the heat dissipation efficiency of the device and the tightness of the heat sinks attached to both sides, making the results of the thermal control system more accurate and the heat dissipation effect better. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a general structural diagram of the heat dissipation device used in a closed environment according to the present utility model;

[0015] Figure 2 This is an exploded view of the heat dissipation device used in a closed environment according to the present invention;

[0016] Figure 3 This is a cross-sectional view of the sealing structure of the heat dissipation device used in a closed environment according to the present invention.

[0017] In the figure: 1. Hot-end dual fans; 2. Hot-end heat sink; 3. Thermal insulation cotton; 4. Hot-end fan aluminum alloy fixing bracket; 5. Cold-end fan aluminum alloy fixing bracket; 6. Cold-end dual fans; 7. Cold-end heat sink; 8. Rubber O-ring; 9. Auxiliary cooling fan; 10. Semiconductor refrigeration chip. DETAILED DESCRIPTION

[0018] Combine Figures 1 to 3 This embodiment is a heat dissipation device for use in a closed environment. It consists of a cold end and a hot end. The cold end connects to the interior of the cooling chamber, while the hot end connects to the outside environment. Heat generated by the working components within the chamber is conducted to the outside world. The junction between the cold and hot ends is insulated.

[0019] like Figure 2 As shown, the cold end includes a cold end fan aluminum alloy fixing bracket 5, a cold end dual fan 6, a cold end heat sink 7, a rubber O-ring 8, an auxiliary heat dissipation fan 9 and a semiconductor refrigeration sheet 10;

[0020] The hot end includes a hot end dual fan 1, a hot end heat sink 2, heat insulation cotton 3, and a hot end fan aluminum alloy fixing bracket 4; the cold end includes a cold end dual fan 6, a cold end heat sink 7 and a semiconductor cooling plate 10;

[0021] After the semiconductor refrigeration sheet 10 and the heat insulation cotton 3 are installed on the hot end heat sink 2 , the cold end heat sink 7 is fixed on the hot end heat sink 2 and sealed by the rubber O-ring 8 .

[0022] In this embodiment, the hot-end dual fans 1 utilize two silent bearing fans with a rotational speed of 3000 rpm and an air volume of 120 CFM. They are screwed to a lightweight hot-end fan aluminum alloy mounting bracket 4. The bracket 4 has three M4 countersunk screw holes on each side, which are screwed to the upper sidewall of the aluminum hot-end heat sink 2. The hot-end dual fans 1 dissipate heat from the cold-end heat sink 7 and semiconductor cooling plate 10 to the hot-end heat sink 2 as quickly as possible into the air, accelerating the heat dissipation process.

[0023] To better remove heat from the cold-end cabin, the cold-end heat sink 7 is entirely made of copper. The cold end utilizes air cooling. The cold-end dual fans 6 utilize two sets of silent bearing fans with a rotational speed of 2800 RPM and an air volume of 39.5 CFM. These fans are screwed to a lightweight aluminum alloy cold-end fan mounting bracket 5, which in turn secures them to the cold-end heat sink 7. To accelerate heat transfer within the cold-end cabin, two sets of auxiliary cooling fans 9 are added. These silent bearing fans operate at a rotational speed of 7500 RPM and an air volume of 7 CFM, enhancing air flow within the cabin.

[0024] The semiconductor cooling chip 10 is pre-processed with a semiconductor cooling chip installation groove on the hot end heat sink 2 for installing the semiconductor cooling chip. The outer dimensions of a single cooling chip are 40*40*3.6mm, and the maximum cooling power Qc max The power output is 50W. Thermal grease is evenly applied to both sides of the semiconductor refrigeration chip 10. The side of the refrigeration chip closest to the hot end heat sink 2 is the heating end, and the side closest to the cold end heat sink 7 is the cooling end. By applying 12V DC to the black and red leads of the semiconductor refrigeration chip 10, heat transfer occurs within the semiconductor refrigeration chip.

[0025] In this embodiment, in order to ensure good thermal conductivity of the structure, it is necessary to use heat insulation installation on the hot end heat sink and the cold end heat sink, and make a layer of heat insulation cotton in the middle, such as Figure 3 As shown, the hot end heat sink 2 is close to one side of the heat insulation cotton 3, and the heat insulation cotton is made of glass fiber material. Figure 2As shown, the thermal insulation cotton prefabricates 10 semiconductor refrigeration plate grooves. To ensure that the structure is tightly fitted, the thermal insulation cotton grooves and the semiconductor refrigeration plate are tightly fitted, and the other side of the thermal insulation cotton is tightly fitted to the cold end heat sink 7.

[0026] like Figure 3 As shown, this embodiment utilizes a dual sealing design for the hot-end seal, employing a rubber O-ring seal and silicone sealant. The rubber O-ring 8, made of nitrile rubber, is installed within a rectangular groove in the hot-end heat sink 2, with its other side contacting the surface of the structure to be sealed. When the O-ring is compressed, four surfaces, one on the O-ring's side, form surface-to-surface contact with the rectangular groove in the hot-end heat sink 2 and the other on the sealing surface. As the compression rate increases, the contact pressure increases, achieving a sealing effect. Because the rubber O-ring 8's properties change with environmental changes over time, to ensure the structure's sealing performance in complex, long-term environments, in addition to the rubber O-ring 8, a four-sided groove is machined into the outer surface of the hot-end heat sink 2 during processing. These grooves are filled with silicone sealant. Silicone sealant has excellent weather resistance, resisting erosion by natural factors such as ultraviolet rays, ozone, and temperature fluctuations. This dual sealing design ensures heat dissipation in a sealed environment.

[0027] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0028] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A heat dissipation device used in a closed environment, characterized by: The heat dissipation device comprises a cold end and a hot end; the cold end is connected to the interior of the cooling chamber, and the hot end is connected to the external environment, and the heat generated by the working components inside the cooling chamber is transferred to the external environment by heat conduction; The hot end comprises a hot end dual fan (1), a hot end heat sink (2), heat insulation cotton (3) and a hot end fan aluminum alloy fixing bracket (4); The cold end comprises a cold end fan aluminum alloy fixing bracket (5), a cold end dual fan (6), a cold end heat sink (7) and a semiconductor cooling fin (10); The hot end dual fans (1) are mounted on a hot end fan aluminum alloy fixing bracket (4), and the hot end fan aluminum alloy fixing bracket (4) is mounted on a hot end heat sink (2); The cold end dual fans (6) are mounted on the cold end fan aluminum alloy fixing bracket (5), and the cold end fan aluminum alloy fixing bracket (5) is mounted on the cold end heat sink (7); After the semiconductor refrigeration fin (10) and the heat insulation cotton (3) are installed on the back of the hot end heat sink (2), the cold end heat sink (7) is fixed on the hot end heat sink (2) and sealed by a rubber O-ring (8).

2. The heat dissipation device for use in a closed environment according to claim 1, characterized in that: The cold end further comprises two groups of auxiliary cooling fans (9), and each group of auxiliary cooling fans (9) is mounted on the hot end heat sink (2) via an L-shaped aluminum alloy bent plate.

3. The heat dissipation device for use in a closed environment according to claim 2, characterized in that: The auxiliary cooling fans (9) are two sets of silent bearing fans with a rotation speed of 7500RPM and an air volume of 7CFM.

4. The heat dissipation device for use in a closed environment according to claim 1, characterized in that: A semiconductor refrigeration fin (10) installation groove is processed on the back of the hot end heat sink (2), and a semiconductor refrigeration fin (10) installation groove is provided on the thermal insulation cotton (3). After the semiconductor refrigeration fin (10) and the thermal insulation cotton (3) are installed in sequence, the cold end heat sink (7) is installed on the hot end heat sink (2) by screw connection to achieve a tight fit.

5. The heat dissipation device for use in a closed environment according to claim 1, characterized in that: Thermal grease is evenly applied on both sides of the semiconductor refrigeration plate (10), the side close to the hot end heat sink (2) is the heating end, and the side close to the cold end heat sink (7) is the cooling end; the external dimensions of a single refrigeration plate are 40*40*3.6mm, and the maximum cooling power is 50W.

6. The heat dissipation device for use in a closed environment according to claim 1, characterized in that: The hot end dual fans (1) use two silent bearing fans with a rotation speed of 3000PRM and an air volume of 120CFM.

7. The heat dissipation device for use in a closed environment according to claim 1, characterized in that: The cold end dual fans (6) use two sets of silent bearing fans with a rotation speed of 2800RPM and an air volume of 39.5CFM.

8. The heat dissipation device for use in a closed environment according to claim 1, characterized in that: Four-sided grooves are machined on the outer surface of the hot end heat sink (2), and silicone glue is filled in the grooves.

9. The heat dissipation device for use in a closed environment according to claim 1, characterized in that: The cold end heat sink (7) is made of copper material as a whole, the heat insulation cotton (3) is made of glass fiber material, and the rubber O-ring (8) is made of nitrile rubber material.

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