Combined moisture-proof light emitting diode

Abstract

The utility model discloses a combined moisture-proof light-emitting diode, which relates to the technical field of light-emitting diodes and comprises a diode base, a dust-proof sinking groove is formed at the bottom of the diode base in a punch forming manner, and a heat-conducting overhead base is fixedly connected to the center of the bottom of the dust-proof sinking groove. The center of the upper end of the heat conduction overhead base is fixedly connected with a diode chip, the upper end, corresponding to the upper edge of the dustproof sinking groove, of the diode base is provided with a circle of sleeving convex ring, and through the arranged sleeving convex ring, the joint position of the transparent packaging cover and the sleeving convex ring extends upwards relative to the contact face of the transparent packaging cover and the diode base. Therefore, water vapor is prevented from entering along the contact surface of the transparent packaging cover and the sleeving convex ring, the moisture-proof effect is achieved, the downward bent power connection pins can also effectively prevent water liquid from entering the transparent packaging cover along the power connection pins under the capillary action, and the moisture-proof effect of a sealed inner cavity defined by the diode base and the interior of the transparent packaging cover is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of light emitting diodes, in particular to a combined moisture-proof light emitting diode. Background Art

[0002] A light-emitting diode (LED) is a solid-state semiconductor device that directly converts electricity into light. It uses an electric field to generate light, rather than the tungsten filaments of incandescent lamps or the three-color powders of energy-saving lamps. LEDs offer distinct advantages, including long life, high luminous efficiency, and zero radiation.

[0003] The ability to resist moisture is very important in the actual use of light-emitting diodes, especially when used outdoors. Due to the complex and changeable outdoor environment, high humidity and large temperature differences, these factors will have a negative impact on the performance and life of LEDs. To this end, we propose a combined moisture-proof light-emitting diode. Utility Model Content

[0004] The purpose of the present invention is to provide a combined moisture-proof light-emitting diode to solve the problem that moisture resistance is very important in the actual use of light-emitting diodes, especially when used outdoors. Due to the complex and changeable outdoor environment, high humidity and large temperature differences, these factors will have a negative impact on the performance and life of the LED.

[0005] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0006] A combined moisture-proof light-emitting diode includes a diode base, the bottom of the diode base is stamped with a dust-proof groove, and the bottom center of the dust-proof groove is fixedly connected to a heat-conducting overhead base, the upper center of the heat-conducting overhead base is fixedly connected to a diode chip, and the upper end of the diode base is provided with a circle of sleeve convex rings corresponding to the upper edge of the dust-proof groove, both sides of the upper end of the sleeve convex ring are fixedly connected to power pins, and the outer ends of the power pins are bent downward along the outer wall of the sleeve convex ring and extend outward along the outer side of the diode base, the outer wall of the sleeve convex ring is sleeved and fixed with a transparent packaging cover, and the bottom of the inner wall of the transparent packaging cover is in contact and sealed with the outer side of the sleeve convex ring.

[0007] Furthermore, a contact sealing ring is fixedly connected to the outer wall of the sleeve convex ring, and the contact sealing ring abuts against the inner wall of the transparent packaging cover, and the outer end of the power connection pin is bent around the outer side of the contact sealing ring.

[0008] Furthermore, the transparent packaging cover is provided with snap-fitting notches on both sides corresponding to the electrical pins, and a pressing sealing gasket is fixedly connected to the bottom of the transparent packaging cover and the bottom of the snap-fitting notch.

[0009] Furthermore, a reflector is fixedly connected to the upper edge of the inner wall of the transparent packaging cover, and the reflector is a conical cylindrical structure with a small opening facing downward. The bottom of the reflector is flush with the upper end of the heat-conducting overhead base, and the inner wall of the reflector is coated with fluorescent powder.

[0010] Furthermore, the inner circle of the upper end of the sleeve convex ring is provided with a circle of waterproof convex edge, and the lower edge of the reflector is located outside the waterproof convex edge.

[0011] Furthermore, the inner end of the power connection pin is fixedly connected with an arc-shaped pressure strip, and the arc-shaped pressure strip fits the outer wall of the waterproof convex edge and is fixed to the upper end outer ring of the sleeve convex ring.

[0012] The beneficial effects of the utility model are as follows:

[0013] The heat dissipation device of the present invention is provided with a dustproof sink groove, and the dustproof sink groove supports the diode chip for suspended installation through the central heat-conducting overhead base. The heat-conducting overhead base can assist the heat conduction of the diode chip, quickly dissipate heat, and support the heat-conducting overhead base to prevent water from entering and contacting the diode chip. The power pins on both sides are electrically connected to the positive and negative poles of the diode chip through gold wires. The power pins are bent downward along the outer side of the sleeve convex ring and extend outward to the outside of the transparent packaging cover. The power pins are connected to an external power supply through the power pins to power the diode chip and drive the diode chip to emit light. The sleeve convex ring is provided so that the seam position of the transparent packaging cover and the sleeve convex ring extends upward relative to the contact surface between the transparent packaging cover and the diode base, thereby preventing water vapor from entering along the contact surface between the transparent packaging cover and the sleeve convex ring, thereby achieving a moisture-proof effect. The downwardly bent power pins can also effectively prevent water from entering the transparent packaging cover along the power pins under capillary action, thereby ensuring the moisture-proof effect of the sealed inner cavity surrounded by the diode base and the transparent packaging cover.

[0014] 2. The contact sealing ring provided in the present invention can fill the contact surface between the sleeve convex ring and the transparent packaging cover, thereby ensuring the sealing of the contact surface between the sleeve convex ring and the transparent packaging cover.

[0015] 3. The present invention provides a snap-fit notch to facilitate the passage of the power pins, and provides a press-fit sealing gasket that can improve the sealing and moisture-proof effect of the contact surface between the transparent packaging cover, the power pins, and the diode base. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional diagram of the utility model;

[0017] Figure 2 It is a front sectional view of the utility model;

[0018] Figure 3 This utility model Figure 2Enlarged view of point A in the middle;

[0019] Figure 4 It is a top sectional view of the present utility model.

[0020] Figure numerals: 1. diode base; 2. dustproof sink; 3. heat-conducting overhead base; 4. diode chip; 5. power pin; 6. sleeve convex ring; 7. transparent packaging cover; 8. contact sealing ring; 9. press sealing gasket; 10. arc-shaped molding; 11. reflective cover; 12. waterproof convex edge. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0022] See also Figure 1 - Figure 4 The utility model provides a combined moisture-proof light-emitting diode, including a diode base 1, a dust-proof groove 2 is stamped on the bottom of the diode base 1, and a heat-conducting overhead base 3 is fixedly connected to the bottom center of the dust-proof groove 2, a diode chip 4 is fixedly connected to the upper center of the heat-conducting overhead base 3, and a circle of sleeve convex ring 6 is provided at the upper end of the diode base 1 corresponding to the upper edge of the dust-proof groove 2, power connection pins 5 are fixedly connected on both sides of the upper end of the sleeve convex ring 6, and the outer ends of the power connection pins 5 are bent downward along the outer wall of the sleeve convex ring 6 and extend outward along the outer side of the diode base 1, a transparent packaging cover 7 is sleeved and fixed on the outer wall of the sleeve convex ring 6, and the bottom of the inner wall of the transparent packaging cover 7 is in contact and sealed with the outer side of the sleeve convex ring 6.

[0023] In this embodiment, preferably, the outer wall of the socket convex ring 6 is fixedly connected with a contact sealing ring 8, and the contact sealing ring 8 is abutted against the inner wall of the transparent packaging cover 7, and the outer end of the power pin 5 is bent around the outer side of the contact sealing ring 8; through the provision of the contact sealing ring 8, the contact sealing ring 8 can fill the contact surface between the socket convex ring 6 and the transparent packaging cover 7, thereby ensuring the sealing of the contact surface between the socket convex ring 6 and the transparent packaging cover 7.

[0024] In this embodiment, preferably, snap-fit notches are provided on both sides of the transparent packaging cover 7 corresponding to the power connection pins 5, and a pressing sealing gasket 9 is fixedly connected to the bottom of the transparent packaging cover 7 and the bottom of the snap-fit notch; the provided snap-fit notch facilitates the passage of the power connection pins 5, and the provided pressing sealing gasket 9 can improve the sealing and moisture-proof effect of the contact surface between the transparent packaging cover 7 and the power connection pins 5 and the diode base 1.

[0025] In this embodiment, preferably, a reflective cover 11 is fixedly connected to the upper edge of the inner wall of the transparent packaging cover 7, and the reflective cover 11 is a conical cylindrical structure with a small mouth facing downward, the bottom of the reflective cover 11 is flush with the upper end of the heat-conducting overhead base 3, and the inner wall of the reflective cover 11 is coated with fluorescent powder; through the setting of the reflective cover 11, the reflective cover 11 can achieve the effect of reflecting and focusing light, thereby improving the degree of light concentration and increasing the brightness of the light-emitting diode.

[0026] In this embodiment, preferably, a circle of waterproof convex edge 12 is provided on the inner circle of the upper end of the sleeve convex ring 6, and the lower edge of the reflective cover 11 is located on the outside of the waterproof convex edge 12; through the provision of the waterproof convex edge 12, the waterproof convex edge 12 can separate the power connection pins 5, thereby preventing the power connection pins 5 from leaking due to failure of the seal on the contact surface of the power connection pins 5, and causing water to enter the dustproof sink 2 along the upper edge of the sleeve convex ring 6, thereby further improving the moisture-proof effect.

[0027] In this embodiment, preferably, the inner end of the power pin 5 is fixedly connected with an arc-shaped pressure strip 10, and the arc-shaped pressure strip 10 is fixed to the outer wall of the waterproof convex edge 12 and is fixed to the upper outer ring of the sleeve convex ring 6; through the setting of the arc-shaped pressure strip 10, the setting of the arc-shaped pressure strip 10 facilitates the clamping and fixing of the inner end of the power pin 5.

[0028] The working principle and use process of the present invention are as follows: when the device is used, the dustproof sink 2 is provided, and the dustproof sink 2 is used to lift the diode chip 4 for suspended installation through the central heat-conducting overhead base 3. The heat-conducting overhead base 3 can assist the heat conduction of the diode chip 4, and quickly dissipate heat while lifting the heat-conducting overhead base 3 to prevent water from entering and contacting the diode chip 4. The power pins 5 on both sides are provided, and the power pins 5 on both sides are electrically connected to the positive and negative poles of the diode chip 4 through gold wires. The power pins 5 are bent downward along the outer side of the sleeve convex ring 6 and extend outward to the outside of the transparent packaging cover 7. The diode chip 4 is powered by an external power supply connected to the power pin 5, driving the diode chip 4 to emit light. The socket convex ring 6 is provided so that the joint position of the transparent packaging cover 7 and the socket convex ring 6 extends upward relative to the contact surface between the transparent packaging cover 7 and the diode base 1, thereby preventing water vapor from entering along the contact surface between the transparent packaging cover 7 and the socket convex ring 6, thereby achieving a moisture-proof effect. In addition, the downwardly bent power pin 5 can also effectively prevent water from entering the transparent packaging cover 7 along the power pin 5 under capillary action, thereby ensuring the moisture-proof effect of the sealed inner cavity enclosed by the diode base 1 and the transparent packaging cover 7.

[0029] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A combined moisture-proof light-emitting diode, characterized in that: The invention comprises a diode base (1), wherein a dustproof trough (2) is stamped and formed at the bottom of the diode base (1), and a heat-conducting overhead base (3) is fixedly connected to the center of the bottom of the dustproof trough (2), and a diode chip (4) is fixedly connected to the center of the upper end of the heat-conducting overhead base (3), and a circle of sleeve convex ring (6) is provided at the upper end of the diode base (1) corresponding to the upper edge of the dustproof trough (2), and power connection pins (5) are fixedly connected to both sides of the upper end of the sleeve convex ring (6), and the outer ends of the power connection pins (5) are bent downward along the outer wall of the sleeve convex ring (6) and extend outward along the outer side of the diode base (1), and a transparent packaging cover (7) is sleeved and fixed to the outer wall of the sleeve convex ring (6), and the bottom of the inner wall of the transparent packaging cover (7) is in contact and sealed with the outer side of the sleeve convex ring (6).

2. The combined moisture-proof light-emitting diode according to claim 1, characterized in that: The outer wall of the sleeve convex ring (6) is fixedly connected to a contact sealing ring (8), and the contact sealing ring (8) abuts against the inner wall of the transparent packaging cover (7), and the outer end of the power connection pin (5) is bent around the outer side of the contact sealing ring (8).

3. The combined moisture-proof light-emitting diode according to claim 1, characterized in that: Both sides of the transparent packaging cover (7) are provided with snap-fitting notches corresponding to the electrical pins (5), and a pressing sealing pad (9) is fixedly connected to the bottom of the transparent packaging cover (7) and the bottom of the snap-fitting notch.

4. The combined moisture-proof light-emitting diode according to claim 1, characterized in that: A reflective cover (11) is fixedly connected to the upper edge of the inner wall of the transparent packaging cover (7), and the reflective cover (11) is a conical cylindrical structure with a small opening facing downwards. The bottom of the reflective cover (11) is flush with the upper end of the heat-conducting overhead base (3), and the inner wall of the reflective cover (11) is coated with fluorescent powder.

5. The combined moisture-proof light-emitting diode according to claim 4, characterized in that: The inner circle of the upper end of the sleeve convex ring (6) is provided with a circle of waterproof convex edge (12), and the lower edge of the reflector (11) is located outside the waterproof convex edge (12).

6. The combined moisture-proof light emitting diode according to claim 5, characterized in that: The inner end of the power connection pin (5) is fixedly connected to an arc-shaped pressure strip (10), and the arc-shaped pressure strip (10) fits the outer wall of the waterproof convex edge (12) and is fixed to the upper outer ring of the sleeve convex ring (6).

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