COB comprehensive packaging structure

Abstract

The utility model discloses a COB comprehensive packaging structure which comprises a substrate, a reflective layer is arranged on the substrate, a plurality of chips are arranged on the reflective layer, packaging grooves are arranged on the left edge and the right edge of the substrate, dam structures are arranged on the front edge and the rear edge of the reflective layer, and packaging materials are filled in the dam structures. A channel is arranged between the box dam structure and the packaging groove, a light reflecting wall is arranged on the inner wall of the box dam structure, packaging flow guide faces are arranged on the left edge and the right edge of the substrate, the horizontal height of the packaging flow guide faces is smaller than that of the box dam structure, and box dams are arranged on the two sides of the substrate and used for preventing packaging materials from flowing out from the side edges and meanwhile preventing the packaging materials from flowing out. In addition, packaging flow guide faces are designed on the two sides, so that packaging materials can wrap the packaging grooves, the cured packaging materials are connected into the packaging grooves, the edges are prevented from aging and falling off, stability is improved, and the light reflection effect and the light condensation effect can be improved due to the fact that the light reflection walls are arranged on the periphery.

Description

Technical Field

[0001] The utility model relates to a COB circuit board, in particular to a COB comprehensive packaging structure. Background Art

[0002] When packaging COB circuit boards, multiple chips need to be wrapped and packaged. After long-term use, the edges will age, making the edges prone to debonding. Therefore, it is necessary to design a comprehensive packaging structure that can improve packaging stability.

[0003] Therefore, the existing COB circuit board needs to be further improved. Utility Model Content

[0004] The purpose of the utility model is to provide a COB comprehensive packaging structure, which can fully package the COB circuit board and improve stability.

[0005] In order to achieve the above purpose, the present invention adopts the following scheme:

[0006] A COB full packaging structure includes a substrate, a reflective layer is provided on the substrate, a plurality of chips are provided on the reflective layer, packaging grooves are provided on the left and right edges of the substrate, a dam structure is provided on the front and rear edges of the reflective layer, the dam structure is filled with packaging material, a channel is provided between the dam structure and the packaging groove, a reflective wall is provided on the inner wall of the dam structure, and packaging guide surfaces are provided on the left and right edges of the substrate, and the horizontal height of the packaging guide surfaces is lower than the horizontal height of the dam structure.

[0007] Furthermore, the plurality of chips are evenly distributed on the upper surface of the reflective layer at equal intervals.

[0008] Furthermore, the level of the packaging groove is lower than the level of the upper surface of the reflective layer.

[0009] Furthermore, the horizontal height of the dam structure is higher than the horizontal height of the upper surface of the reflective layer.

[0010] Furthermore, the packaging material enters the packaging groove from the channel for filling.

[0011] Furthermore, the reflective wall is arranged at an angle.

[0012] Furthermore, the inclination angle of the reflective wall is 45°.

[0013] Furthermore, the packaging material is epoxy resin material.

[0014] In summary, the present invention has the following beneficial effects compared to the prior art:

[0015] The present invention solves the shortcomings of the existing COB circuit board. Through the structural setting of the present invention, it has the following advantages: dams are provided on both sides of the substrate to prevent the packaging material from flowing out from the sides. At the same time, packaging guide surfaces are designed on the other two sides, which can make the packaging material wrap around the packaging groove, so that the solidified packaging material is connected to the packaging groove, preventing the edge from aging and falling off, and improving stability. Reflective walls are provided on all sides to improve the reflective effect and the focusing effect. The structure is simple and easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural diagram of the utility model;

[0017] Figure 2 for Figure 1 A local enlarged view of point A;

[0018] Figure 3 A three-dimensional diagram of the present invention DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] See also Figure 1-3 The present invention provides a COB comprehensive packaging structure, including a substrate 1, a reflective layer 2 is provided on the substrate 1, a plurality of chips 3 are provided on the reflective layer 2, packaging grooves 30 are provided on the left and right edges of the substrate 1, a dam structure 4 is provided on the front and rear edges of the reflective layer 2, the dam structure 4 is filled with a packaging material 5, a channel 50 is provided between the dam structure 4 and the packaging groove 30, a reflective wall 6 is provided on the inner wall of the dam structure 4, and packaging guide surfaces 7 are provided on the left and right edges of the substrate 1, and the horizontal height of the packaging guide surface 7 is lower than the horizontal height of the dam structure 4;

[0021] During packaging, the reflective layer 2 is filled with light-transmitting material. The material fills the corresponding area under the restriction of the dam structure 4 to prevent leakage from the side. The packaging material at the edge is guided into the packaging groove 30 through the packaging guide surface 7 and the channel 50 for filling.

[0022] At this time, the packaging material wraps both sides of the reflective layer 2 into the packaging groove 30. The dam structure 4 blocks and fills the packaging groove 30, so that the packaging material at the edge is not easy to fall off, which greatly improves the stability during use.

[0023] In the present invention, the plurality of chips 3 are evenly distributed on the upper surface of the reflective layer 2 at equal intervals.

[0024] In the present invention, the level of the packaging groove 30 is lower than the level of the upper surface of the reflective layer 2 .

[0025] The horizontal height of the dam structure 4 of the present invention is higher than the horizontal height of the upper surface of the reflective layer 2 .

[0026] The packaging material 5 of the present invention enters the packaging groove 30 from the channel 50 to be filled.

[0027] The reflective wall 6 of the present invention is arranged obliquely.

[0028] The inclination angle of the reflective wall 6 of the present invention is 45°.

[0029] The packaging material 5 of the present invention is epoxy resin material.

[0030] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for illustrative purposes. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A COB full packaging structure, comprising a substrate (1), characterized in that: A reflective layer (2) is provided on the substrate (1), a plurality of chips (3) are provided on the reflective layer (2), packaging grooves (30) are provided on the left and right edges of the substrate (1), a dam structure (4) is provided on the front and rear edges of the reflective layer (2), the dam structure (4) is filled with packaging material (5), a channel (50) is provided between the dam structure (4) and the packaging groove (30), a reflective wall (6) is provided on the inner wall of the dam structure (4), packaging guide surfaces (7) are provided on the left and right edges of the substrate (1), and the horizontal height of the packaging guide surfaces (7) is lower than the horizontal height of the dam structure (4).

2. A COB full packaging structure according to claim 1, characterized in that: The plurality of chips (3) are evenly distributed at equal intervals on the upper surface of the reflective layer (2).

3. The COB full packaging structure according to claim 2, characterized in that: The level of the packaging groove (30) is lower than the level of the upper surface of the reflective layer (2).

4. The COB full packaging structure according to claim 3, characterized in that: The horizontal height of the dam structure (4) is higher than the horizontal height of the upper surface of the reflective layer (2).

5. The COB full packaging structure according to claim 4, characterized in that: The packaging material (5) enters the packaging groove (30) from the channel (50) for filling.

6. The COB full packaging structure according to claim 5, characterized in that: The reflective wall (6) is arranged obliquely.

7. The COB full packaging structure according to claim 5, characterized in that: The inclination angle of the reflective wall (6) is 45°.

8. The COB full packaging structure according to claim 1, characterized in that: The packaging material (5) is an epoxy resin material.

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