Wafer bearing mechanism and laser processing equipment

Abstract

The utility model relates to a wafer bearing mechanism and laser processing equipment. The wafer bearing mechanism comprises a bearing disc and an annular bearing piece. The annular carrier is disposed around the carrier tray. The annular bearing part can move relative to the bearing disc in the axial direction of the bearing disc. Therefore, the wafer bearing mechanism can meet the bearing requirements of the wafers of different sizes, the efficiency of processing the wafers of different sizes is improved, and loss and pollution caused by replacement of the bearing disc are avoided.

Description

Technical Field

[0001] The present application relates to the technical field of wafer processing equipment, and in particular to a wafer supporting mechanism and laser processing equipment. Background Art

[0002] Currently, wafers must be placed on a wafer carrier during processing. Switching from a 6-inch wafer carrier to an 8-inch wafer carrier, or vice versa, requires manual wafer carrier replacement. Manual wafer carrier replacement takes a long time, reducing wafer processing efficiency.

[0003] Therefore, how to improve the efficiency of processing wafers of different sizes is a technical problem that needs to be solved. Utility Model Content

[0004] The embodiments of the present application provide a wafer supporting mechanism and laser processing equipment to improve the efficiency of processing wafers of different sizes, so as to at least partially solve the above-mentioned technical problems.

[0005] In order to achieve the above-mentioned object, according to a first aspect of the present application, a wafer carrying mechanism is provided, comprising:

[0006] Carrying tray;

[0007] The annular supporting member is disposed around the supporting plate, and the annular supporting member can move relative to the supporting plate along the axial direction of the supporting plate.

[0008] Optionally, the wafer carrying mechanism further includes a first lifting assembly, which is connected to the carrying plate and is configured to control the carrying plate to move in the axial direction of the carrying plate.

[0009] Optionally, the wafer carrying mechanism further includes a second lifting assembly, which is connected to the annular carrying member and is configured to control the annular carrying member to move in the axial direction of the carrying plate.

[0010] Optionally, the carrying surface of the carrying plate is provided with a first vacuum adsorption hole, and the carrying surface of the annular carrying member is provided with a second vacuum adsorption hole.

[0011] Optionally, the wafer carrying mechanism has a switchable first state and a second state;

[0012] When the wafer carrying mechanism is in the first state, the carrying surface of the carrying plate and the carrying surface of the annular carrying member are coplanar;

[0013] When the wafer carrying mechanism is in the second state, the carrying surface of the carrying plate and the carrying surface of the annular carrying member are offset.

[0014] Optionally, the wafer supporting mechanism also includes at least two first fixing members arranged at intervals along the circumference of the supporting plate, each of the first fixing members includes a first notch and a first limiting portion adjacent to the first notch, and the first notch is located on the side of the first limiting portion close to the center of the supporting plate along the radial direction of the supporting plate.

[0015] Optionally, the carrier plate includes at least two first accommodating notches arranged at intervals along the circumference of the carrier plate, and the first accommodating notches are sunken from the side of the carrier plate toward the center of the carrier plate along the radial direction of the carrier plate, and each first accommodating notch is configured to accommodate one of the first fixing members respectively.

[0016] Optionally, the wafer carrying mechanism further includes:

[0017] At least two groups of first mounting assemblies are respectively disposed in at least two of the first accommodating notches; each group of the first mounting assemblies includes a first base and a first mounting member, the first mounting member is fixed to the first base, the first mounting member includes a first mounting slot; the first fixing member further includes a first supporting portion connected to the first limiting portion, the first supporting portion being inserted into the first mounting slot;

[0018] At least two groups of third lifting assemblies, each group of the third lifting assemblies is connected to a group of the first bases of the first mounting assemblies, and each group of the third lifting assemblies is configured to control the first base to move in the axial direction of the carrying plate.

[0019] According to a second aspect of the present application, a laser processing device is provided, comprising the above-mentioned wafer supporting mechanism.

[0020] Optionally, the laser processing equipment further includes an annular light blocking member, which is arranged around the annular carrier.

[0021] In the wafer support mechanism and laser processing equipment of the embodiments of the present application, an annular support member is disposed around a carrier plate and is movable relative to the carrier plate along the axial direction of the carrier plate. This allows the carrier plate and the annular support member to jointly support large wafers, while the carrier plate can independently support small wafers. The wafer support mechanism can meet the load requirements of wafers of different sizes, improve the efficiency of processing wafers of different sizes, and avoid loss and contamination caused by changing carrier plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic side view of the wafer carrying mechanism provided in an exemplary embodiment of the present application;

[0023] Figure 2 This is a structural schematic diagram of a wafer carrying mechanism in a first state provided in an exemplary embodiment of the present application;

[0024] Figure 3 This is a structural schematic diagram of a wafer carrying mechanism in a second state provided in an exemplary embodiment of the present application;

[0025] Figure 4 for Figure 1 A partially enlarged schematic diagram of the wafer supporting mechanism is shown.

[0026] Description of reference numerals:

[0027] 100. Wafer carrying mechanism; 200. Laser processing equipment;

[0028] 11. Carrying plate; 111. First accommodating notch; 11A. Side; 11A1. Arc-shaped side of the carrying plate; 11A2. Positioning side of the carrying plate; 112. First mounting hole;

[0029] 12, annular bearing member; 121, second accommodating notch; 12A, annular outer side surface; 122, second mounting hole; 12B, annular inner side surface; 12B1, arcuate inner side surface; 12B2, linear inner side surface 12B2;

[0030] 13. First fixing member; 131. First notch; 132. First limiting portion; 133. First supporting portion;

[0031] 14. First mounting assembly; 141. First base; 142. First mounting member; 1421. First mounting slot;

[0032] 151. First lifting assembly; 152. First lifting rod; 153. Second lifting assembly; 154. Second lifting rod;

[0033] 161, first vacuum adsorption hole; 162, second vacuum adsorption hole;

[0034] 17. Annular light blocking element. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0036] Please refer to Figures 1 to 4 As shown, an embodiment of the present application provides a wafer carrying mechanism 100. The wafer carrying mechanism 100 is used to carry wafers of different sizes so as to facilitate ion implantation, laser annealing, film formation and other processing on the wafers of different sizes.

[0037] The wafer support mechanism 100 includes an annular support member 12 and a carrier plate 11. The annular support member 12 surrounds the carrier plate 11 and is movable relative to the carrier plate 11 along its axial direction. This allows the carrier plate 11 and the annular support member 12 to jointly support large wafers, while the carrier plate 11 can independently support small wafers. The wafer support mechanism 100 can accommodate wafers of varying sizes, improving the efficiency of processing wafers of varying sizes and avoiding damage and contamination caused by changing carrier plates.

[0038] In some embodiments, the wafer carrier mechanism 100 has a switchable first state and a switchable second state. Figure 2 As shown, when the wafer carrying mechanism 100 is in the first state, the carrying surface of the carrying plate 11 and the carrying surface of the annular carrying member 12 are coplanar. Figure 3 As shown, when the wafer support mechanism 100 is in the second state, the support surface of the carrier plate 11 is offset from the support surface of the annular support member 12. Thus, when processing large wafers, the support surface of the annular support member 12 moves relative to the support surface of the carrier plate 11 in the axial direction of the carrier plate 11 until they are coplanar, and the carrier plate 11 and the annular support member 12 jointly support the large wafers. When processing small wafers, the support surface of the annular support member 12 can move relative to the support surface of the carrier plate 11 in the axial direction of the carrier plate 11 until they are offset, and the support surface of the carrier plate 11 alone supports the small wafers.

[0039] The shapes and sizes of the carrier plate 11 and the annular carrier 12 are designed according to the shapes and sizes of the wafers to be carried.

[0040] In some embodiments, the shape of the carrier plate 11 is the same as that of the small-sized wafer. Figure 2 and Figure 3 As shown, in one exemplary embodiment, when the small wafer has a connected curved wafer side surface and a wafer positioning side surface, the side surface 11A of the susceptor 11 has a connected curved susceptor side surface 11A1 and a susceptor positioning side surface 11A2. Both the wafer positioning side surface and the susceptor positioning side surface 11A2 are straight side surfaces. Both the curved susceptor side surface 11A1 and the curved wafer side surface are circular side surfaces. In another exemplary embodiment, when the small wafer is circular, the susceptor 11 is also circular in shape.

[0041] In some embodiments, the size of the carrier plate 11 is the same as the size of the small-size wafer. In an exemplary embodiment, the size of the small-size wafer is a 6-inch wafer, and the diameter of the carrier plate 11 is 6 inches. It is understood that the diameter of the carrier plate 11 can also be other sizes.

[0042] The annular support 12 is annular. The shape and size of the annular support 12 match the shape and size of the large-sized wafer and the shape of the carrier plate 11. In one exemplary embodiment, when the large-sized wafer is circular, the annular outer side surface 12A of the annular support 12 is an arc-shaped outer side surface. The annular outer side surface 12A of the annular support 12 is the side of the annular support 12 facing away from the carrier plate 11.

[0043] In some embodiments, reference Figure 2 and Figure 3 As shown, when the carrier plate 11 has an interconnected carrier plate arcuate side surface 11A1 and a carrier plate positioning side surface 11A2, the annular inner side surface 12B of the annular carrier 12 includes an interconnected arcuate inner side surface 12B1 and a linear inner side surface 12B2. The annular inner side surface 12B of the annular carrier 12 is the side of the annular carrier 12 that is close to the carrier plate 11. In this way, when the bearing surface of the carrier plate 11 and the bearing surface of the annular carrier 12 are coplanar, the carrier plate arcuate side surface 11A1 is adjacent to and matches the arcuate inner side surface 12B1, and the linear inner side surface 12B2 is adjacent to and matches the carrier plate positioning side surface 11A2. The annular inner side surface 12B of the annular carrier 12 and the side surface 11A of the carrier plate 11 interlock with each other, and the gap between the annular carrier 12 and the carrier plate 11 is small, so that both can better support large-sized wafers.

[0044] In some embodiments, the annular carrier 12 and the carrier plate 11 are both made of metal materials such as stainless steel.

[0045] In some embodiments, reference Figure 1 As shown, the wafer carrier mechanism 100 further includes a first lifting assembly 151. The first lifting assembly 151 is connected to the carrier plate 11 and is configured to control the axial movement of the carrier plate 11. Thus, the first lifting assembly 151 drives the carrier plate 11 to move in its axial direction, allowing the annular carrier 12 to move relative to the carrier plate 11 along the axial direction of the carrier plate 11.

[0046] In some embodiments, the first lifting assembly 151 includes a first lifting rod 152, and the first lifting rod 152 is connected to the carrier plate 11. Figure 2 As shown, the carrier plate 11 includes a first mounting hole 112, which extends from the back side of the carrier plate 11 along the axial direction of the carrier plate 11 to the interior of the carrier plate 11, and the first lifting rod 152 is inserted into the first mounting hole 112. The back side of the carrier plate 11 is arranged opposite to the supporting surface of the carrier plate 11.

[0047] In some embodiments, at least two first lifting rods 152 may be arranged along the circumference of the carrier plate 11 . In some embodiments, one first lifting rod 152 may be connected to the center of the carrier plate 11 .

[0048] In some embodiments, the first lifting rod 152 may be connected to a driving mechanism such as a motor. In some embodiments, the first lifting rod 152 may be a telescopic rod.

[0049] In some embodiments, reference Figure 1 As shown, the wafer carrier mechanism 100 further includes a second lifting assembly 153. The second lifting assembly 153 is connected to the annular carrier 12 and is configured to control the movement of the annular carrier 12 in the axial direction of the carrier plate 11. Thus, the second lifting assembly 153 drives the annular carrier 12 to move in the axial direction of the carrier plate 11, allowing the annular carrier 12 to move relative to the carrier plate 11 along the axial direction of the carrier plate 11.

[0050] In some embodiments, the wafer carrier mechanism 100 may include one of a first lifting assembly 151 and a second lifting assembly 153, so that the annular carrier 12 can move relative to the carrier plate 11 along the axial direction of the carrier plate 11 while simplifying the structure of the wafer carrier mechanism 100. For example, the wafer carrier mechanism 100 may include the second lifting assembly 153, in which case the carrier plate 11 may be fixed.

[0051] In some other embodiments, the wafer carrier mechanism 100 may include a first lifting assembly 151 and a second lifting assembly 153 , thereby improving the control flexibility of the movement of the annular carrier 12 relative to the carrier plate 11 .

[0052] In some embodiments, the second lifting assembly 153 includes a second lifting rod 154, and the second lifting rod 154 is connected to the annular support member 12. Figure 2 As shown, the annular support member 12 includes a second mounting hole 122. The second mounting hole 122 extends from the back surface of the annular support member 12 along the axial direction of the supporting plate 11 to the interior of the annular support member 12. The second lifting rod 154 is inserted into the second mounting hole 122. The back surface of the annular support member 12 is arranged opposite to the supporting surface of the annular support member 12.

[0053] In some embodiments, at least two second lifting rods 154 are arranged along the circumference of the annular support 12 , so that the at least two second lifting rods 154 can better support the annular support 12 .

[0054] In some embodiments, the second lifting rod 154 can be connected to a driving mechanism such as a motor. In some embodiments, the second lifting rod 154 can be a telescopic rod.

[0055] In some embodiments, reference Figure 2 and Figure 3 As shown, the supporting surface of the carrier plate 11 is provided with first vacuum adsorption holes 161, and the supporting surface of the annular carrier 12 is provided with second vacuum adsorption holes 162. In this way, the first vacuum adsorption holes 161 and the second vacuum adsorption holes 162 can be used to vacuum adsorb the wafers on the supporting surface, thereby fixing the wafers, reducing the risk of wafer movement, and improving the finished product yield of the processed wafers.

[0056] The first vacuum adsorption hole 161 and the second vacuum adsorption hole 162 are both connected to the vacuuming device through a connecting pipe. In this way, the vacuuming device vacuums the first vacuum adsorption hole 161 and the second vacuum adsorption hole 162.

[0057] The first vacuum holes 161 extend from the support surface of the carrier plate 11 to the interior of the carrier plate 11. In some embodiments, the first vacuum holes 161 are located at the center of the support surface of the carrier plate 11, thereby securing the wafer while reducing the stress points on the wafer. In other embodiments, multiple first vacuum holes 161 are arranged in a circular pattern on the support surface of the carrier plate 11.

[0058] The second vacuum adsorption holes 162 extend from the supporting surface of the annular support member 12 to the interior of the annular support member 12. In some embodiments, a plurality of second vacuum adsorption holes 162 are arranged along the circumference of the annular support member 12.

[0059] For example, referring to Figure 2 and Figure 3 As shown, when the carrier plate 11 has a connected curved carrier side surface 11A1 and a carrier positioning side surface 11A2, and the annular carrier 12 has a connected curved inner side surface 12B1 and a linear inner side surface 12B2, the second vacuum suction hole 162 is adjacent to the linear inner side surface 12B2. This reduces the risk of wafer movement at the interface between the carrier plate 11 and the annular carrier 12.

[0060] In some embodiments, the area of the first vacuum adsorption hole 161 is the same as the area of the second vacuum adsorption hole 162, so that when the carrying plate 11 and the annular carrying member 12 jointly carry a large-size wafer, the first vacuum adsorption hole 161 and the second vacuum adsorption hole 162 apply the same adsorption force to different positions of the large-size wafer.

[0061] In some embodiments, the area of the first vacuum adsorption hole 161 and the area of the second vacuum adsorption hole 162 may be different. In one exemplary embodiment, the area of the first vacuum adsorption hole 161 is larger than the area of the second vacuum adsorption hole 162, so that the carrier plate 11 can exert a stronger adsorption force on both large and small wafers. In another exemplary embodiment, the area of the first vacuum adsorption hole 161 is smaller than the area of the second vacuum adsorption hole 162, so that the annular carrier 12 can exert a stronger adsorption force on the edge of the large wafer.

[0062] In some embodiments, reference Figure 4 As shown, the wafer carrier mechanism 100 also includes at least two first fixing members 13 spaced apart along the circumference of the carrier plate 11. Each first fixing member 13 includes a first notch 131 and a first limiting portion 132 adjacent to the first notch 131. In the radial direction of the carrier plate 11, the first notch 131 is located on the side of the first limiting portion 132 that is close to the center O of the carrier plate 11. Thus, during the processing of small-sized wafers, the small-sized wafer is placed on the carrier plate 11 and in the first notches 131 of the at least two first fixing members 13. The first limiting portions 132 of the at least two first fixing members 13 serve to circumferentially limit the movement of the small-sized wafer, reducing the risk of the small-sized wafer moving on the carrier plate 11, ensuring efficient wafer processing, and improving the yield of the processed product. Furthermore, a first fixing member 13 includes a first notch 131 and a first limiting portion 132 adjacent to the first notch 131, simplifying the structure of the first fixing member 13 and also simplifying the fixing process of the small-sized wafer.

[0063] At least two first fixing members 13 are arranged at equal intervals along the circumference of the carrier plate 11. In this way, the at least two first fixing members 13 can better fix the small-sized wafers.

[0064] In some embodiments, the first fixture 13 may include a ceramic material to reduce the risk of the first fixture 13 damaging the small-sized wafer.

[0065] In some embodiments, reference Figures 2 to 4 As shown, the carrier plate 11 includes at least two first accommodating notches 111 arranged at intervals along the circumference of the carrier plate 11. The first accommodating notches 111 along the radial direction of the carrier plate 11 are sunken from the side surface 11A of the carrier plate 11 toward the center O of the carrier plate 11. Each first accommodating notch 111 is configured to accommodate a first fixing member 13 respectively. In this way, the bottom surface of the first notch 131 of the first fixing member 13 is coplanar with the supporting surface of the carrier plate 11, and the small-sized wafer can be flatly arranged on the first fixing member 13 and the carrier plate 11. In addition, the first limiting portion 132 can better play a circumferential limiting role on the small-sized wafer, thereby reducing the risk of movement of the small-sized wafer.

[0066] In some embodiments, the first accommodating notch 111 penetrates the carrier plate 11 along the axial direction of the carrier plate 11. In other embodiments, the first accommodating notch 111 may also penetrate a portion of the carrier plate 11 along the axial direction of the carrier plate 11.

[0067] In some embodiments, the side surface of the first receiving notch 111 is a first inwardly recessed arc-shaped side surface, which is recessed toward the center O of the carrier plate 11. This facilitates placement of the first fixing member 13 in the first receiving notch 111 and reduces the area occupied by the first receiving notch 111, thereby increasing the carrying surface of the carrier plate 11 and enabling the carrier plate 11 to better carry small-sized wafers.

[0068] In some embodiments, reference Figure 4 As shown, the wafer carrier mechanism 100 also includes at least two groups of first mounting components 14, and the at least two groups of first mounting components 14 are respectively arranged in at least two first accommodating recesses 111. Each group of first mounting components 14 includes a first base 141 and a first mounting member 142. The first mounting member 142 is fixed on the first base 141, and the first mounting member 142 includes a first mounting groove 1421. Each first fixing member 13 also includes a first supporting portion 133 connected to the first limiting portion 132, and a first supporting portion 133 is inserted into the first mounting groove 1421. In this way, the first fixing member 13 is detachably mounted in the first accommodating recess 111 through the first mounting component 14.

[0069] The first limiting portion 132 and the first supporting portion 133 are connected in an L-shape. The first fixing member 13 can be obtained by removing a corner of a rectangular structure to form a first notch 131 .

[0070] In some embodiments, reference Figure 4 As shown, when the first support portion 133 is inserted into the first mounting groove 1421, the first support portion 133 can also be located on the annular carrier 12. In this way, the annular carrier 12 also supports the first support portion 133, ensuring that the first fixing member 13 has a better circumferential fixing effect on the small-sized wafer.

[0071] In some embodiments, the first base 141 and the first mounting member 142 may both include metal such as stainless steel.

[0072] In some embodiments, a gap is provided between the first base 141 and a sidewall of the first receiving recess 111 , so that the first base 141 can move in the first receiving recess 111 .

[0073] In some embodiments, the shape of the first base 141 is the same as the shape of the first accommodating recess 111, so that the first base 141 can adapt to the first accommodating recess 111. The first base 141 can provide a larger support area and better support the first mounting member 142, so that the first mounting member 142 can better fix the first fixing member 13.

[0074] In some embodiments, the first mounting member 142 may be columnar. For example, the first mounting member 142 may be cylindrical. The first mounting groove 1421 extends radially of the first mounting member 142 and penetrates the first mounting member 142 .

[0075] In some embodiments, the wafer carrier mechanism 100 further includes at least two sets of third lifting assemblies (not shown). Each set of third lifting assemblies is connected to the first base 141 of a set of first mounting assemblies 14, and each set of third lifting assemblies is configured to control the axial movement of the first base 141 on the carrier plate 11. Thus, when the carrier plate 11 carries a small-sized wafer, the third lifting assemblies drive the first mounting assembly 14 to move into the first accommodating notch 111, insert the first fixing member 13 into the first mounting groove 1421 of the first mounting member 142, and fix the small-sized wafer to the first fixing member 13 and the carrier plate 11. When the carrier plate 11 and the annular carrier 12 jointly carry a large-sized wafer, the first fixing member 13 is removed from the first mounting groove 1421, and then the third lifting assemblies drive the first mounting assembly 14 to move out of the first accommodating notch 111, thereby preventing the first fixing member 13 and the first mounting assembly 14 from interfering with the relative movement of the carrier plate 11 and the annular carrier 12 and the fixation of the large-sized wafer.

[0076] In some embodiments, the third lifting assembly includes a third lifting rod, one end of which is connected to the first base 141. The other end of the third lifting rod can be connected to the drive motor. The third lifting rod can also be a telescopic rod.

[0077] In some embodiments, the wafer carrier mechanism 100 further includes at least two second fixing members (not shown in the figure) arranged at intervals along the circumference of the annular carrier 12. The second fixing member includes a second notch and a second limiting portion adjacent to the second notch. Along the radial direction of the annular carrier 12, the second notch is located on the side of the second limiting portion close to the carrier plate 11. In this way, when the carrier plate 11 and the annular carrier 12 jointly carry a large-sized wafer, the edge portion of the large-sized wafer is located on the carrying surface of the annular carrier 12 and the bottom surface of the second notch. In addition, the second limiting portion serves to limit the large-sized wafer in the circumferential direction.

[0078] In some embodiments, at least two second fixing members are arranged at equal intervals along the circumference of the annular carrier 12. In this way, the second fixing members can better fix large-sized wafers.

[0079] In some embodiments, the second fixing member may be the same as the first fixing member 13 , and the first fixing member 13 may be reused as the second fixing member.

[0080] In some embodiments, the second fixture may include a ceramic material to reduce the risk of the second fixture causing damage to the large-sized wafer.

[0081] In some embodiments, reference Figure 2 and Figure 3 As shown, the annular carrier 12 also includes at least two second accommodating notches 121 arranged at intervals along the circumference of the annular carrier 12. A second accommodating notch 121 is configured to accommodate a second fixing member. Along the radial direction of the annular carrier 12, the second accommodating notch 121 is sunken from the annular outer side surface 12A of the annular carrier 12 toward the carrier plate 11, and the annular outer side surface 12A of the annular carrier 12 is the side of the annular carrier 12 away from the carrier plate 11. In this way, the bottom surface of the second notch of the second fixing member is coplanar with the bearing surface of the annular carrier 12, and the large-size wafer can be flatly arranged on the second fixing member, the annular carrier 12 and the carrier plate 11. In addition, the second limiting portion can better play a circumferential limiting role on the large-size wafer, reducing the risk of movement of the large-size wafer.

[0082] In some embodiments, the second accommodating notch 121 penetrates the annular support member 12 along the axial direction of the annular support member 12 .

[0083] In some embodiments, the side surface of the second receiving notch 121 is a second inwardly recessed arc-shaped side surface, which is recessed toward the carrier plate 11. This facilitates placement of the second fixing member in the second receiving notch 121, reduces the area occupied by the second receiving notch 121, and provides a larger supporting surface for the annular carrier 12 to better support large wafers.

[0084] In some embodiments, the wafer carrier mechanism 100 further includes at least two sets of second mounting assemblies (not shown in the figure), and the at least two sets of second mounting assemblies are respectively arranged in the at least two second receiving notches 121. Each set of second mounting assemblies includes a second base and a second mounting member, the second mounting member is fixed to the second base, and the second mounting member includes a second mounting groove. The second fixing member also includes a second support portion connected to the second limiting portion, and the second support portion is inserted into the second mounting groove. In this way, the second fixing member is detachably mounted in the second receiving notch 121 through the second mounting assembly.

[0085] In some embodiments, the second limiting portion and the second supporting portion are connected in an L-shape. The second fixing member can be obtained by removing a corner of the rectangular structure to form a second notch.

[0086] In some embodiments, the second base and the second mounting member may both comprise metal such as stainless steel.

[0087] In some embodiments, a gap is provided between the second base and a sidewall of the second receiving recess 121 , so that the second base can move in the second receiving recess 121 .

[0088] In some embodiments, the shape of the second base is the same as that of the second accommodating recess 121 , so that the second base can be adapted to the second accommodating recess 121 . The second base can provide a larger supporting area and better support the second mounting member.

[0089] In some embodiments, the second mounting member may be columnar. For example, the second mounting member may be cylindrical. The second mounting groove extends radially along the second mounting member and penetrates the second mounting member.

[0090] In some embodiments, the wafer carrier mechanism 100 further includes at least two sets of fourth lifting assemblies (not shown in the figures), each set of which is connected to a second base of a second mounting assembly. Each set of fourth lifting assemblies is configured to control the axial movement of the second base of the carrier plate 11. Thus, when the carrier plate 11 and the annular carrier 12 are jointly carrying a large wafer, the fourth lifting assemblies drive the second mounting member to move into the second accommodating notch 121, inserting the second fixing member into the second mounting groove, thereby circumferentially limiting the large wafer.

[0091] In some embodiments, the fourth lifting assembly includes a fourth lifting rod, one end of which is connected to the second base, the other end of which can be connected to the drive motor, and the fourth lifting rod can also be a telescopic rod.

[0092] Based on the same inventive concept, Figures 1 to 4 As shown, the embodiments of the present application further provide a laser processing device 200, which includes the wafer support mechanism 100 of any of the above embodiments. After ions are implanted into the wafer, a laser source in the laser processing device 200 emits laser light, which anneals the wafer to activate the implanted ions and repair lattice damage within the wafer.

[0093] In some embodiments, reference Figures 1 to 3 As shown, the laser processing equipment 200 further includes an annular light blocking member 17, which is disposed around the annular carrier 12. Thus, during the process of laser processing a wafer, the annular light blocking member 17 blocks the laser light from irradiating outside the wafer, thereby reducing the risk of the laser irradiating other structures outside the wafer and causing damage to the other structures.

[0094] In some embodiments, the annular light blocking member 17 further includes a circumferential connecting portion 171 disposed along the outer side of the annular light blocking member 17. The circumferential connecting portion 171 is connected to other structures in the laser processing device 200 to fix the annular light blocking member 17.

[0095] In some embodiments, the annular light blocking member 17 includes metal materials such as stainless steel to ensure that the annular light blocking member 17 has good light blocking performance.

[0096] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0097] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0098] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0099] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A wafer carrying mechanism, characterized in that: include: Carrying tray; The annular supporting member is disposed around the supporting plate, and the annular supporting member can move relative to the supporting plate along the axial direction of the supporting plate.

2. The wafer carrying mechanism according to claim 1, wherein: Also includes: The first lifting assembly is connected to the carrier plate and is configured to control the carrier plate to move in the axial direction of the carrier plate.

3. The wafer carrying mechanism according to claim 1 or 2, characterized in that: Also includes: The second lifting assembly is connected to the annular supporting member and is configured to control the annular supporting member to move in the axial direction of the supporting plate.

4. The wafer carrying mechanism according to claim 1, wherein: The carrying surface of the carrying plate is provided with a first vacuum adsorption hole, and the carrying surface of the annular carrying member is provided with a second vacuum adsorption hole.

5. The wafer carrying mechanism according to claim 1, wherein: The wafer carrying mechanism has a switchable first state and a switchable second state; When the wafer carrying mechanism is in the first state, the carrying surface of the carrying plate and the carrying surface of the annular carrying member are coplanar; When the wafer carrying mechanism is in the second state, the carrying surface of the carrying plate and the carrying surface of the annular carrying member are offset.

6. The wafer carrying mechanism according to claim 1, wherein: Also includes: At least two first fixing members are arranged at intervals along the circumference of the carrier plate, each of the first fixing members includes a first notch and a first limiting portion adjacent to the first notch, and the first notch is located on the side of the first limiting portion close to the center of the carrier plate along the radial direction of the carrier plate.

7. The wafer carrying mechanism according to claim 6, wherein: The carrier plate includes at least two first accommodating notches arranged at intervals along the circumference of the carrier plate. The first accommodating notches are sunken from the side of the carrier plate toward the center of the carrier plate along the radial direction of the carrier plate. Each first accommodating notch is configured to accommodate one of the first fixing members respectively.

8. The wafer carrying mechanism according to claim 7, wherein: Also includes: At least two groups of first mounting assemblies are respectively disposed in at least two of the first accommodating notches; each group of the first mounting assemblies includes a first base and a first mounting member, the first mounting member is fixed to the first base, the first mounting member includes a first mounting slot; the first fixing member further includes a first supporting portion connected to the first limiting portion, the first supporting portion being inserted into the first mounting slot; At least two groups of third lifting assemblies, each group of the third lifting assemblies is connected to a group of the first bases of the first mounting assemblies, and each group of the third lifting assemblies is configured to control the first base to move in the axial direction of the carrying plate.

9. A laser processing device, characterized in that: The wafer carrying mechanism comprises the wafer carrying mechanism according to any one of claims 1 to 8.

10. The laser processing equipment according to claim 9, characterized in that An annular light blocking member is also included, and the annular light blocking member is arranged around the annular carrier.

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