Semiconductor IC device braid packaging equipment

Abstract

The utility model provides semiconductor IC device braid packaging equipment, and relates to the technical field of IC device braid packaging. Semiconductor IC device braid packaging equipment comprises a packaging table, connecting plates, a placing wheel I, a supporting table, an electric conveying belt I, an electric conveying belt II, a supporting shell, a servo motor and a winding wheel, the connecting plates are installed on the two sides of the packaging table, the placing wheel I is rotationally arranged on one connecting plate, the supporting shell is installed on the other connecting plate, and the servo motor is arranged on the supporting shell. A servo motor is installed in the supporting shell, a winding wheel is fixedly connected to an output shaft of the servo motor, a supporting table is installed on the packaging table, and an electric conveying belt I and an electric conveying belt II are arranged on the supporting table. The two-way screw is rotated to enable the clamping plates on the two sides to slide towards the sides close to each other along the guide rods, the distance between the two clamping plates is the same as the width of the IC device, the IC device is limited and straightened through the two clamping plates, and the effects of straightening the IC device and avoiding deviation in the packaging process are achieved.

Description

Technical Field

[0001] The utility model provides a semiconductor IC device taping packaging device, which relates to the technical field of IC device taping packaging. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors.

[0003] After semiconductor IC devices are manufactured, they need to be taped and packaged. Traditional automated taping machines can cause inaccurate positioning, overlap, or missing components if they shift during placement on the material conveyor belt, impacting the integrity of subsequent packaging and product quality, potentially leading to problems and increased costs in subsequent processes.

[0004] Therefore, it is necessary to provide a semiconductor IC device taping packaging device that can straighten the IC device. Utility Model Content

[0005] In order to overcome the shortcomings of existing automated taping packaging machines that if components are offset during the placement process of the material conveyor belt, it is easy to affect the integrity of subsequent packaging and the quality of the product, the technical problem to be solved is to provide a semiconductor IC device taping packaging equipment that can straighten IC devices.

[0006] In order to achieve the above-mentioned purpose, the embodiment of the present invention provides the following technical solutions: a semiconductor IC device braid packaging equipment, including a packaging table, a connecting plate, a placement wheel I, a support table, an electric conveyor belt I, an electric conveyor belt II, a clamping component, a material unloading bin, a support seat I, a placement wheel II, a hot melt component, a support shell, a servo motor and a winding wheel, connecting plates are installed on both sides of the packaging table, a placement wheel I is rotatably provided on one connecting plate, a support shell is installed on the other connecting plate, a servo motor is installed in the support shell, a winding wheel is fixedly connected to the output shaft of the servo motor, a support table is installed on the packaging table, and the support table An electric conveyor belt I and an electric conveyor belt II are arranged on the support platform, a lower hopper is installed on the support platform, a transport and clamping component for clamping and transferring IC devices is arranged on the support platform, a support seat I is installed on the support platform, a placement wheel II is rotatably arranged on the support seat I, a hot melt component is installed on one side of the support platform, and also includes a fixed seat, a bidirectional screw, a splint and a guide rod, two fixed seats are installed on both sides of the top surface of the support platform, a bidirectional screw is rotatably arranged on the two fixed seats on one side, and a guide rod is fixedly connected to the two fixed seats on the other side, two splints are slidably arranged on the guide rod, and the two splints are threadedly connected to the bidirectional screw.

[0007] Furthermore, the clamping assembly includes a mounting base installed on the support platform, the mounting base spans the electric conveyor belt I and the electric conveyor belt II, an electric slide rail is installed on the mounting base, an electric slider is slidingly arranged on the electric slide rail, and a suction device is installed on the electric slider.

[0008] Furthermore, it also includes two support seats II installed on the support platform, one support seat II is fixedly connected to a limit rod, a limit plate is slidably provided on the limit rod, and the other support seat II is rotatably provided with a threaded rod, the limit plate is threadedly connected to the threaded rod, a limit shell is installed on one side of the support platform, and multiple transmission rollers are rotatably provided on the upper and lower sides of the limit shell.

[0009] Furthermore, it also includes a support plate installed on a connecting plate, the support plate is located directly below the winding wheel, a start button is installed on the support plate, and an alarm is installed on the same connecting plate, and the start button is electrically connected to the alarm.

[0010] Furthermore, a glass plate is embedded in the lower hopper.

[0011] Furthermore, protective pads are installed on the sides of the two splints that are close to each other.

[0012] Furthermore, a plurality of mounting plates are installed on the limiting shell, and a sponge block is installed on each mounting plate.

[0013] Compared with the prior art, the packaging equipment provided by the embodiment of the present invention has the following advantages: 1. By rotating the bidirectional screw, the clamping plates on both sides slide toward each other along the guide rod, so that the spacing between the two clamping plates is the same as the width of the IC device. The IC device is limited and aligned by the two clamping plates, thereby achieving the effect of aligning the IC device and avoiding deviation during packaging.

[0014] 2. Pass the braid through the limit housing and then between the limit plate and the electric conveyor belt I. Rotate the threaded rod to slide the limit plate downward along the limit rod so that the limit plate fits the braid on the electric conveyor belt I, thereby preventing the braid from warping and causing packaging defects.

[0015] 3. After the reel winds a thicker IC device tape, the IC device tape squeezes the start button to press the start button. At this time, the alarm is triggered and sounds to achieve a warning effect, so as to prompt the staff to remove the wound IC device tape in time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model.

[0017] Figure 2 It is a schematic diagram of the three-dimensional cross-sectional structure of the packaging platform, connecting plate and supporting platform of the utility model.

[0018] Figure 3 It is a schematic diagram of the three-dimensional cross-sectional structure of the support shell, servo motor and winding wheel of the utility model.

[0019] Figure 4 It is a schematic three-dimensional cross-sectional structural diagram of the extractor, electric slider and electric slide rail of the present invention.

[0020] Figure 5 It is a schematic three-dimensional cross-sectional structural diagram of the electric transmission belt I, the electric transmission belt II and the support base I of the utility model.

[0021] Figure 6 It is a schematic diagram of the three-dimensional cross-sectional structure of the support platform, hot melt assembly and support seat II of the utility model.

[0022] Figure 7 It is a schematic three-dimensional cross-sectional structure diagram of the transmission roller, mounting plate and sponge block of the utility model.

[0023] Figure 8 It is a schematic three-dimensional cross-sectional structure diagram of the support plate, start button and alarm of the utility model.

[0024] Figure numbers: 1. Packing table, 2. Connecting plate, 3. Placement wheel I, 4. Support table, 5. Electric conveyor belt I, 6. Electric conveyor belt II, 7. Clamping assembly, 701. Suction device, 702. Electric slider, 703. Electric slide rail, 704. Mounting seat, 8. Unloading bin, 801. Glass plate, 9. Support seat I, 10. Placement wheel II, 11. Hot melt assembly, 12. Support shell, 13. Servo motor, 14. Winding wheel, 15. Fixed seat, 16. Bidirectional screw, 17. Clamp, 1701. Guide rod, 17O2. Protective pad, 18. Support seat II, 19. Limit rod, 20. Limit plate, 21. Threaded rod, 22. Limit shell, 23. Drive roller, 24. Mounting plate, 25. Sponge block, 26. Support plate, 27. Start button, 28. Alarm. DETAILED DESCRIPTION

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0026] Example 1: A semiconductor IC device taping packaging device, see Figures 1-6As shown, it includes a packaging table 1, a connecting plate 2, a placement wheel I3, a support table 4, an electric conveyor belt I5, an electric conveyor belt II6, a clamping component 7, a feeding bin 8, a support seat I9, a placement wheel II10, a hot melt component 11, a support shell 12, a servo motor 13 and a winding wheel 14. The connecting plates 2 are installed on both sides of the packaging table 1 by bolt connection. A placement wheel I3 for placing the tape is rotatably provided on one connecting plate 2, and a support shell 12 is installed on the other connecting plate 2 by bolt connection. A servo motor 13 is installed in the support shell 12 by bolt connection. The output shaft of the servo motor 13 is fixedly connected with a winding wheel 14 for winding the finished tape packaging by key connection. The support table 4 is installed on the top of the packaging table 1 by welding. The support table 4 is provided with an electric conveyor belt I5 for transmitting the tape and an electric conveyor belt II6 for transmitting IC devices. A winding wheel for lowering I is installed on the support table 4 by bolt connection. The unloading bin 8 of the C device, the unloading port of the unloading bin 8 is located directly above the electric conveyor belt Ⅱ6, and a clamping component 7 for clamping and rotating IC devices is provided on the support platform 4. A support seat Ⅰ9 is installed on the support platform 4 by means of bolt connection, and a placement wheel Ⅱ10 for placing the packaging film is rotatably provided on the support seat Ⅰ9. A hot melt component 11 for hot-melt packaging film is installed on the side of the support platform 4 away from the placement wheel Ⅰ3 by means of bolt connection, and also includes a fixed seat 15, a bidirectional screw 16, a splint 17 and a guide rod 1701. Two fixed seats 15 are installed on both sides of the top surface of the support platform 4 by means of bolt connection, and a bidirectional screw 16 is rotatably provided on the two fixed seats 15 on one side, and a guide rod 1701 is fixedly connected to the two fixed seats 15 on the other side by welding, and two splints 17 for limiting and aligning IC devices are horizontally slidably provided on the guide rod 1701, and the two splints 17 are threadedly connected to the bidirectional screw 16.

[0027] See Figure 4 As shown, the clamping assembly 7 includes a mounting base 704 installed on the support platform 4 by means of bolt connection, the mounting base 704 spans the electric conveyor belt I5 and the electric conveyor belt II6, an electric slide rail 703 is installed on the mounting base 704 by means of bolt connection, an electric slider 702 is arranged on the electric slide rail 703 in a transverse sliding manner, and a suction device 701 for sucking and transporting IC devices is installed on the bottom of the electric slider 702 by means of bolt connection.

[0028] When the semiconductor IC device needs to be packaged with tape, the tape is wound on the placement wheel I3, the packaging film is wound on the placement wheel II10, and one end of the tape and the packaging film is pulled and wound on the reel 14, and the pulled tape is placed on the electric conveyor belt I5. Then the IC device is placed in the unloading bin 8, and the reel 14 is driven to rotate by starting the servo motor 13 so that the tape and the packaging film are pulled out and stacked and wound on the reel 14. By starting the electric conveyor belt I5 and the electric conveyor belt II6, the unloading bin 8 drops the IC device onto the electric conveyor belt II6 in sequence. When the electric conveyor belt II6 transfers the IC device to the bottom of the mounting seat 704, the absorber 701 sucks up the IC device and drives the electric slider 702 through the electric slide rail 703 to slide the absorber 701 above the electric conveyor belt I5. At this time, the absorber 701 releases the IC device so that the IC device falls on the electric conveyor belt On the tape on Ⅰ5, after the electric conveyor belt Ⅰ5 drives the tape section with the IC device to move to the bottom of the placement wheel Ⅱ10, the packaging film presses and wraps the IC device on the tape, and the packaging film is hot-melted and adhered to the tape when passing through the hot melt component 11, so that the IC device completes the tape packaging, and then the packaged tape is reeled up by the rotation of the reeling wheel 14; when the electric conveyor belt Ⅱ6 transports the IC device, in order to ensure that the IC device sucked up by the absorber 701 will not be offset, before conveying the IC device, according to the width of the IC device, by rotating the bidirectional screw 16, the two sides of the clamping plate 17 slide along the guide rod 1701 toward each other, so that the spacing between the two clamping plates 17 is the same as the width of the IC device. After the IC device falls on the electric conveyor belt Ⅱ6, the two clamping plates 17 are used to limit and align the IC device to ensure that the IC device will not be offset when the absorber 701 sucks up the IC device.

[0029] Example 2: Based on Example 1, refer to Figure 7 As shown, it also includes two support seats II 18 installed on the side of the support platform 4 away from the hot melt component 11 by welding, one support seat II 18 is fixedly connected to the limit rod 19 by welding, and a limit plate 20 is longitudinally slidably arranged on the limit rod 19, and a threaded rod 21 is rotatably arranged on the other support seat II 18, and the limit plate 20 is threadedly connected to the threaded rod 21. A limit shell 22 is installed on the side of the support platform 4 close to the limit rod 19 by bolt connection, and three transmission rollers 23 are rotatably arranged on the upper and lower sides of the limit shell 22.

[0030] When the electric transmission belt Ⅰ5 transmits the braid, in order to prevent the braid from lifting and detaching from the electric transmission belt Ⅰ5, the braid is passed through the limit shell 22 and then passed between the limit plate 20 and the electric transmission belt Ⅰ5. According to the thickness of different braid products, the threaded rod 21 is rotated to make the limit plate 20 slide downward along the limit rod 19, so that the limit plate 20 fits the braid on the electric transmission belt Ⅰ5, so that the braid will not lift up.

[0031] See Figure 8 As shown, it also includes a support plate 26 installed on a connecting plate 2 by means of bolt connection. The support plate 26 is located directly below the winding wheel 14. A start button 27 is installed on the support plate 26 by means of bolt connection. An alarm 28 is installed on the top of the same connecting plate 2 by means of bolt connection. The start button 27 is electrically connected to the alarm 28.

[0032] When the reel 14 winds up the thicker IC device tape, the IC device tape will squeeze the start button 27 so that the start button 27 is pressed. At this time, the alarm 28 is triggered and sounds an alarm to prompt the staff to remove the wound IC device tape in time.

[0033] See Figure 2 、 Figure 4 and Figure 7 As shown, a glass plate 801 is embedded in the lower hopper 8; a protective pad 17O2 is installed on the side where the two plywood 17 are close to each other by bonding; a plurality of mounting plates 24 are installed on the limiting shell 22 by welding, and the mounting plates 24 are located between the transmission rollers 23, and a sponge block 25 is installed on each mounting plate 24 by bonding.

[0034] The remaining amount of IC devices in the unloading bin 8 can be observed through the glass plate 801, so that the IC devices can be replenished in time; when the splint 17 aligns the IC devices, the protective pad 17O2 is used to prevent the IC devices from colliding with the splint 17 to prevent the IC devices from being worn; when the tape is transmitted, the sponge block 25 pushes the tape toward the middle of the limiting shell 22 to reduce the friction between the tape and the limiting shell 22 to avoid defects in the tape.

[0035] The technical principles of the embodiments of the present invention have been described above in conjunction with specific embodiments. These descriptions are intended solely to explain the principles of the embodiments of the present invention and should not be construed in any way as limiting the scope of protection of the embodiments of the present invention. Based on the explanations herein, those skilled in the art will be able to conceive of other specific implementations of the embodiments of the present invention without inventive effort, and these implementations will fall within the scope of protection of the embodiments of the present invention.

Claims

1. A semiconductor IC device tape packaging equipment, comprising a packaging table (1), a connecting plate (2), a placement wheel I (3), a support table (4), an electric conveyor belt I (5), an electric conveyor belt II (6), a clamping component (7), a material unloading bin (8), a support seat I (9), a placement wheel II (10), a hot melt component (11), a support shell (12), a servo motor (13) and a winding wheel (14), wherein connecting plates (2) are installed on both sides of the packaging table (1), a placement wheel I (3) is rotatably provided on one connecting plate (2), and a support shell (12) is installed on the other connecting plate (2). A servo motor (13) is installed in (12), a winding wheel (14) is fixedly connected to the output shaft of the servo motor (13), a support platform (4) is installed on the packaging platform (1), an electric conveyor belt I (5) and an electric conveyor belt II (6) are provided on the support platform (4), a material unloading bin (8) is installed on the support platform (4), a transport clamping component (7) for clamping and transferring IC devices is provided on the support platform (4), a support seat I (9) is installed on the support platform (4), a placement wheel II (10) is rotatably provided on the support seat I (9), a hot melt component (11) is installed on one side of the support platform (4), and the invention is characterized in that: The support platform (4) further comprises a fixed seat (15), a bidirectional screw (16), a splint (17) and a guide rod (1701). Two fixed seats (15) are installed on both sides of the top surface of the support platform (4). The two fixed seats (15) on one side are provided with a bidirectional screw (16) in a rotatable manner. The two fixed seats (15) on the other side are provided with a guide rod (1701) in a fixed manner. Two splints (17) are provided on the guide rod (1701) in a slidable manner. Both splints (17) are threadedly connected to the bidirectional screw (16).

2. A semiconductor IC device taping packaging equipment according to claim 1, characterized in that: The clamping assembly (7) includes a mounting base (704) mounted on the support platform (4), the mounting base (704) spanning the electric transmission belt I (5) and the electric transmission belt II (6), an electric slide rail (703) mounted on the mounting base (704), an electric slider (702) slidably arranged on the electric slide rail (703), and a suction device (701) mounted on the electric slider (702).

3. The semiconductor IC device taping packaging equipment according to claim 1, characterized in that: The invention also includes two support seats II (18) installed on the support platform (4), one support seat II (18) is fixedly connected to a limit rod (19), a limit plate (20) is slidably provided on the limit rod (19), and the other support seat II (18) is rotatably provided with a threaded rod (21), the limit plate (20) and the threaded rod (21) are threadedly connected, a limit shell (22) is installed on one side of the support platform (4), and a plurality of transmission rollers (23) are rotatably provided on the upper and lower sides of the limit shell (22).

4. The semiconductor IC device taping packaging equipment according to claim 1, characterized in that: The device further comprises a support plate (26) mounted on a connecting plate (2), the support plate (26) being located directly below the reel (14), a start button (27) being mounted on the support plate (26), and an alarm (28) being mounted on the same connecting plate (2), the start button (27) being electrically connected to the alarm (28).

5. The semiconductor IC device taping packaging equipment according to claim 1, characterized in that: A glass plate (801) is embedded in the lower bin (8).

6. The semiconductor IC device taping packaging equipment according to claim 1, characterized in that: A protective pad (17O2) is installed on each side of the two splints (17) close to each other.

7. The semiconductor IC device taping packaging equipment according to claim 3, characterized in that: A plurality of mounting plates (24) are mounted on the limiting shell (22), and a sponge block (25) is mounted on each mounting plate (24).

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