Clip type semiconductor material sheet feeding mechanism

Abstract

The utility model belongs to the technical field of semiconductor production, and discloses a clip type semiconductor material sheet feeding mechanism which comprises a material bin positioning assembly, a material bin clamping assembly, a transferring assembly and a material pushing assembly, and the material bin positioning assembly is provided with a tidying station used for storing and positioning a full-load material bin; the stock bin clamping assembly is used for clamping a full-load stock bin; the transferring assembly is used for driving the stock bin clamping assembly to transfer the full-load stock bins from the tidying station to the discharging position. The pushing assembly is located on one side of the discharging position, and the pushing assembly is used for pushing the semiconductor material sheets in the full-load bin located at the discharging position to the connection equipment located on the other side of the discharging position one by one. According to the cartridge clip type semiconductor material sheet feeding mechanism, ordered feeding of semiconductor material sheets is achieved, the feeding requirement of the semiconductor material sheets is met, the overall structure is compact, the occupied space is small, maintenance is convenient, and the feeding efficiency of the semiconductor material sheets is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a clip-type semiconductor chip feeding mechanism. Background Art

[0002] Existing semiconductor wafers are mostly loaded in clip-type hoppers with different external dimensions. When loading semiconductor wafers, most of them are completed manually or with a single functional mechanism. Therefore, the efficiency is low, the versatility is poor, and it is difficult to meet the high-speed production needs of the semiconductor industry. Utility Model Content

[0003] In order to solve the above problems, the purpose of the present invention is to provide an economical, efficient and widely applicable clip-type semiconductor wafer feeding mechanism.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A clip-type semiconductor wafer feeding mechanism, comprising:

[0006] The silo positioning assembly is provided with regular stations for storing and positioning fully loaded silos;

[0007] Silo clamping assembly, used to clamp a fully loaded silo;

[0008] The transfer assembly is used to drive the silo clamping assembly to transfer the fully loaded silo from the regular station to the discharge position;

[0009] The pushing assembly is located on one side of the discharge position and is used to push the semiconductor sheets in the fully loaded hopper at the discharge position one by one to the docking equipment located on the other side of the discharge position.

[0010] As an optional solution, the silo positioning assembly includes a base platform for placing the fully loaded silo, the regularization workstation is arranged on the base platform, the upper surface of the base platform is in sliding contact with the bottom of the fully loaded silo, and the base platform is provided with baffles for limiting the two ends of the fully loaded silo, a front stop block for limiting the front side of the fully loaded silo, and a return plate for applying pressure to the back side of the fully loaded silo.

[0011] As an optional solution, a first guide rail and a first driving member are provided on the lower surface of the reference table, a first mounting seat is slidingly provided on the first guide rail, a driving plate is provided on the first mounting seat that passes through the reference table and is connected to the correction plate, and the output end of the first driving member is fixedly connected to the first mounting seat.

[0012] As an optional solution, the silo positioning assembly is installed on the base plate, the transfer assembly is installed on the base plate and is located on one side of the silo positioning assembly, the transfer assembly includes a second guide rail and a second driving member arranged on the base plate, a second mounting seat is slidingly arranged on the second guide rail, the second mounting seat is driven by the second driving member to move horizontally back and forth relative to the regular workstation, a vertical plate is provided on the second mounting seat, a third guide rail and a third driving member are provided on the vertical plate, a third mounting seat is slidingly arranged on the third guide rail, and the third mounting seat is driven by the third driving member to move up and down relative to the regular workstation.

[0013] As an optional solution, the silo clamping assembly includes a lower support plate and an upper pressure plate located above the lower support plate, the lower support plate is mounted on a third mounting seat, the lower support plate is used to extend into the regular work station and support the bottom of the fully loaded silo, the upper pressure plate is slidably set on the third guide rail through a fourth mounting seat, and the third mounting seat is provided with a fourth driving member for driving the upper pressure plate close to or away from the lower support plate, and the upper pressure plate is used to cooperate with the lower support plate to clamp the fully loaded silo.

[0014] As an optional solution, a guide column connected to the upper pressure plate is provided on the fourth mounting seat, and a spring is sleeved on the guide column. The spring is used to provide buffering when the upper pressure plate contacts a fully loaded silo.

[0015] As an optional solution, an avoidance gap for inserting the lower support plate is opened on the base platform.

[0016] As an optional solution, the pushing assembly includes a fifth mounting seat facing the discharge position, and the fifth mounting seat is provided with a fourth guide rail and a fifth driving member. A first slider is slidingly provided on the fourth guide rail, and a push rod is provided on the first slider. The push rod is driven by the fifth driving member to extend into the fully loaded silo and push a single semiconductor sheet toward the docking device.

[0017] As an optional solution, the pushing assembly also includes a mounting bracket located on one side of the discharge position, and the mounting bracket is provided with a swing block that can swing back and forth toward the discharge position, the fifth mounting seat is located above the swing block, and an adjustment block is provided between the fifth mounting seat and the swing block, the bottom of the adjustment block is provided with a fifth guide rail, and the swing block is provided with a second slider that slides with the fifth guide rail, the bottom of the fifth mounting seat is provided with a sixth guide rail arranged vertically with the fifth guide rail, and the adjustment block is provided with a third slider that slides with the sixth guide rail.

[0018] As an optional solution, the mounting bracket is provided with a first locking member for locking the swing angle of the swing block, and the adjustment block is provided with a second locking member for locking with the swing block and a third locking member for locking with the fifth mounting seat.

[0019] The beneficial effects of the present invention are as follows: the clip-type semiconductor wafer loading mechanism regularly positions the fully loaded silo through the silo positioning assembly, and then drives the silo clamping assembly to move the fully loaded silo to the discharge position through the transfer assembly, and then pushes the semiconductor wafers in the fully loaded silo located at the discharge position one by one to the docking device located on the other side of the discharge position through the pushing assembly, thereby realizing orderly loading of semiconductor wafers, wherein the silo positioning assembly and the silo clamping assembly can be adaptively clamped according to different fully loaded silo sizes, have good versatility, and the transfer assembly and the pushing assembly move accurately, meeting the requirements for semiconductor wafer loading, the overall structure is compact, occupies little space, is easy to maintain, and effectively improves the efficiency of semiconductor wafer loading. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a structural diagram of a clip-type semiconductor wafer feeding mechanism provided by an embodiment of the present utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the silo positioning assembly involved in the embodiment of the utility model Figure 1 ;

[0022] Figure 3 This is a schematic diagram of the structure of the silo positioning assembly involved in the embodiment of the utility model Figure 2 ;

[0023] Figure 4 This is a schematic diagram of the structure of the transfer assembly and the silo clamping assembly involved in the embodiment of the utility model Figure 1 ;

[0024] Figure 5 This is a schematic diagram of the structure of the transfer assembly and the silo clamping assembly involved in the embodiment of the utility model Figure 2 ;

[0025] Figure 6 This is a schematic diagram of the structure of the pusher assembly involved in the embodiment of the utility model Figure 1 ;

[0026] Figure 7 This is a schematic diagram of the structure of the pusher assembly involved in the embodiment of the utility model Figure 2 .

[0027] In the attached figure:

[0028] 100. Bin positioning assembly; 101. Regularization station; 102. Reference platform; 103. Baffle; 104. Front stopper; 105. Alignment plate; 106. First guide rail; 107. First mounting seat; 108. Drive plate; 109. Cylinder; 110. Avoidance gap;

[0029] 200, transfer assembly; 201, second guide rail; 202, second mounting seat; 203, vertical plate; 204, third guide rail; 205, third mounting seat; 206, first screw rod; 207, first motor; 208, second screw rod; 209, second motor;

[0030] 300, silo clamping assembly; 301, lower support plate; 302, upper pressure plate; 303, fourth mounting seat; 304, guide post; 305, spring; 306, third screw rod; 307, third motor;

[0031] 400, pusher assembly; 401, fifth mounting base; 402, fourth guide rail; 403, first slider; 404, push rod; 405, fourth motor; 406, transmission belt; 407, mounting bracket; 408, swing block; 409, adjustment block; 410, fifth guide rail; 411, second slider; 412, sixth guide rail; 413, third slider; 414, first locking member; 415, second locking member; 416, third locking member;

[0032] 500. Substrate. DETAILED DESCRIPTION

[0033] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0034] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0035] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0036] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0037] See also Figures 1 to 7 As shown, this preferred embodiment provides a clip-type semiconductor wafer loading mechanism, including a bin positioning assembly 100, a bin clamping assembly 300, a transfer assembly 200 and a push assembly 400, wherein:

[0038] The silo positioning assembly 100 is provided with a regular station 101 for storing and positioning a fully loaded silo;

[0039] The silo clamping assembly 300 is used to clamp a fully loaded silo;

[0040] The transfer assembly 200 is used to drive the silo clamping assembly 300 to transfer the fully loaded silo from the tidying station 101 to the discharge position;

[0041] The pushing assembly 400 is located on one side of the discharge position, and is used to push the semiconductor sheets in the fully loaded bin at the discharge position one by one to the docking device at the other side of the discharge position.

[0042] Thus, the fully loaded silo is regularly positioned by the silo positioning component 100, and then the fully loaded silo is moved to the discharge position by driving the silo clamping component 300 through the transfer component 200, and then the semiconductor sheets in the fully loaded silo at the discharge position are pushed one by one to the docking device located on the other side of the discharge position by the pushing component 400, so as to realize orderly loading of semiconductor sheets. Among them, the silo positioning component 100 and the silo clamping component 300 can be adaptively clamped according to different fully loaded silo sizes, with good versatility, and the transfer component 200 and the pushing component 400 have precise movements, which meet the requirements for semiconductor sheet loading. The overall structure is compact, occupies little space, is easy to maintain, and effectively improves the efficiency of semiconductor sheet loading.

[0043] Specifically, see Figure 2 and Figure 3The silo positioning assembly 100 herein includes a base 102 for placing a fully loaded silo. The aligning station 101 is positioned on the base 102. The upper surface of the base 102 is in sliding contact with the bottom of the fully loaded silo. The base 102 is provided with baffles 103 for limiting the ends of the fully loaded silo, a front block 104 for limiting the front side of the fully loaded silo, and a straightening plate 105 for applying pressure to the back side of the fully loaded silo. When the fully loaded silo is placed on the aligning station 101, when the ends of the fully loaded silo are in contact with the baffles 103 and the straightening plate 105 pushes the fully loaded silo against the front block 104, the position of the fully loaded silo on the base 102 is unified, allowing the subsequent silo clamping assembly 300 to accurately grasp the fully loaded silo.

[0044] Furthermore, a first guide rail 106 and a first driving member are provided on the lower surface of the base plate 102. A first mounting seat 107 is slidably provided on the first guide rail 106. A driving plate 108 is provided on the first mounting seat 107, passing through the base plate 102 and connected to the alignment plate 105. The output end of the first driving member is fixedly connected to the first mounting seat 107. Preferably, the first driving member is a cylinder 109 or a linear module, which drives the alignment plate 105 to cooperate with the front baffle 103 to achieve a clamping function. In this embodiment, the first driving member is exemplified as the cylinder 109.

[0045] Specifically, the silo positioning assembly 100 is mounted on the base plate 500, and the transfer assembly 200 is mounted on the base plate 500 and is located on one side of the silo positioning assembly 100. Figure 4 and Figure 5 The transfer assembly 200 here includes a second guide rail 201 and a second driving member arranged on the base plate 500. A second mounting seat 202 is slidingly arranged on the second guide rail 201, and the second mounting seat 202 is driven by the second driving member to move horizontally back and forth relative to the regularization station 101. A vertical plate 203 is arranged on the second mounting seat 202, and a third guide rail 204 and a third driving member are arranged on the vertical plate 203. A third mounting seat 205 is slidingly arranged on the third guide rail 204, and the third mounting seat 205 is driven by the third driving member to move up and down relative to the regularization station 101.

[0046] Furthermore, the second driving member includes a first screw rod 206 arranged parallel to the second guide rail 201, a first motor 207 for driving the first screw rod 206 to rotate is provided on the base plate 500, and a first nut cooperating with the first screw rod 206 is provided on the second mounting seat 202. The first screw rod 206 is driven to rotate by the first motor 207, so that the second mounting seat 202 is moved along the second guide rail 201, that is, the translation function of the silo clamping assembly 300 relative to the regular workstation 101 is realized.

[0047] Furthermore, the third driving member includes a second screw rod 208 arranged parallel to the third guide rail 204, and a second motor 209 for driving the second screw rod 208 to rotate is provided on the vertical plate 203, and a second nut cooperating with the second screw rod 208 is provided on the third mounting seat 205. The second screw rod 208 is driven to rotate by the second motor 209, so that the third mounting seat 205 is moved along the third guide rail 204, that is, the lifting function of the silo clamping assembly 300 relative to the regular workstation 101 is realized.

[0048] Specifically, see Figure 4 and Figure 5 The silo clamping assembly 300 here includes a lower support plate 301 and an upper pressure plate 302 located above the lower support plate 301. The lower support plate 301 is installed on the third mounting seat 205. The lower support plate 301 is used to extend into the regularization station 101 and support the bottom of the fully loaded silo. The upper pressure plate 302 is slidably set on the third guide rail 204 through the fourth mounting seat 303. The third mounting seat 205 is provided with a fourth driving member for driving the upper pressure plate 302 close to or away from the lower support plate 301. The upper pressure plate 302 is used to cooperate with the lower support plate 301 to clamp the fully loaded silo.

[0049] In particular, the fourth mounting seat 303 is provided with a guide column 304 connected to the upper pressure plate 302, and the guide column 304 is provided with a spring 305. The spring 305 is used to provide buffering when the upper pressure plate 302 contacts the fully loaded silo to avoid damage or even deformation of the fully loaded silo during clamping.

[0050] It should be noted that in order to facilitate the lower support plate 301 to extend into the regularization station 101 for receiving, an avoidance gap 110 for the lower support plate 301 to be inserted is opened on the reference platform 102.

[0051] Furthermore, the fourth driving member includes a third screw rod 306 arranged parallel to the third guide rail 204, and the third mounting seat 205 is provided with a third motor 307 for driving the third screw rod 306 to rotate, and the fourth mounting seat 303 is provided with a third nut cooperating with the third screw rod 306. The third motor 307 drives the third screw rod 306 to rotate, so that the fourth mounting seat 303 is moved along the third guide rail 204, that is, the lifting function of the upper pressure plate 302 relative to the lower support plate 301 is realized, thereby meeting the clamping requirements of the fully loaded silo.

[0052] Specifically, see Figure 6 and Figure 7 The pushing assembly 400 here includes a fifth mounting seat 401 facing the discharge position, and the fifth mounting seat 401 is provided with a fourth guide rail 402 and a fifth driving member. A first slider 403 is slidingly provided on the fourth guide rail 402, and a push rod 404 is provided on the first slider 403. The push rod 404 is driven by the fifth driving member to extend into the fully loaded silo and push a single semiconductor sheet toward the docking device.

[0053] In particular, the fifth driving member includes a fourth motor 405 and a transmission belt 406 . The fourth motor 405 drives the transmission belt 406 to transport. The transmission belt 406 is fixedly connected to the first slider 403 , thereby driving the push rod 404 to feed.

[0054] Furthermore, the pusher assembly 400 also includes a mounting bracket 407 located on one side of the discharge position. The mounting bracket 407 can be fixed to the base plate 500. The mounting bracket 407 is provided with a swing block 408 that can swing back and forth toward the discharge position. The fifth mounting seat 401 is located above the swing block 408, and an adjustment block 409 is provided between the fifth mounting seat 401 and the swing block 408. The bottom of the adjustment block 409 is provided with a fifth guide rail 410. The swing block 408 is provided with a second slider 411 that slidably cooperates with the fifth guide rail 410. The bottom of the fifth mounting seat 401 is provided with a sixth guide rail 412 that is arranged perpendicular to the fifth guide rail 410. The adjustment block 409 is provided with a third slider 413 that slidably cooperates with the sixth guide rail 412. Therefore, the position of the fifth mounting seat 401 corresponding to the discharge position can be fine-tuned by the swing block 408 and the adjustment block 409, thereby improving the adaptability of the pusher.

[0055] Furthermore, the mounting bracket 407 is provided with a first locking member 414 for locking the swing angle of the swing block 408, and the adjusting block 409 is provided with a second locking member 415 for locking with the swing block 408 and a third locking member 416 for locking with the fifth mounting seat 401, so as to stabilize the position of the fifth mounting seat 401 and ensure that the pushing action is carried out reliably.

[0056] Usage process: 1) Place the fully loaded silo on the regularization station 101, and the silo positioning component 100 adjusts the fully loaded silo to the target position; 2) The transfer component 200 drives the silo clamping component 300 to move toward the regularization station 101 and clamp the fully loaded silo; 3) The transfer component 200 drives the silo clamping component 300 to lift and translate the fully loaded silo to the discharge position; 4) Fine-tune the position of the pusher component 400 so that the push rod 404 of the pusher component 400 is aligned with the port of the fully loaded silo at the discharge position. The pusher 404 extends to push the semiconductor wafers in the fully loaded silo one by one to the docking device on the other side of the discharge position, thereby enabling the semiconductor wafers to be loaded one by one from the clip-type silo to the rear-end docking device. After testing, it can achieve a maximum capacity of 30 pcs of wafer stacking in the fully loaded silo, and the fastest feeding time for a single wafer is 7s.

[0057] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A clip-type semiconductor wafer feeding mechanism, characterized in that: include: A silo positioning assembly (100), wherein the silo positioning assembly (100) is provided with a regular station (101) for storing and positioning a fully loaded silo; A silo clamping assembly (300) for clamping the fully loaded silo; A transfer assembly (200) is used to drive the silo clamping assembly (300) to transfer the fully loaded silo from the tidying station (101) to a discharge position; A pushing assembly (400) is located on one side of the discharge position, and is used to push semiconductor chips in the fully loaded bin at the discharge position one by one to a docking device located on the other side of the discharge position.

2. The clip-type semiconductor tablet feeding mechanism according to claim 1, characterized in that: The silo positioning assembly (100) includes a base platform (102) for placing the fully loaded silo, the regularization station (101) is arranged on the base platform (102), the upper surface of the base platform (102) is in sliding contact with the bottom of the fully loaded silo, and the base platform (102) is provided with baffles (103) for limiting the two ends of the fully loaded silo, a front block (104) for limiting the front side of the fully loaded silo, and a return plate (105) for applying pressure to the back side of the fully loaded silo.

3. The clip-type semiconductor tablet feeding mechanism according to claim 2, characterized in that: A first guide rail (106) and a first driving member are provided on the lower surface of the reference platform (102); a first mounting seat (107) is slidably provided on the first guide rail (106); a driving plate (108) passing through the reference platform (102) and connected to the alignment plate (105) is provided on the first mounting seat (107); and an output end of the first driving member is fixedly connected to the first mounting seat (107).

4. The clip-type semiconductor tablet feeding mechanism according to claim 2, characterized in that: The silo positioning assembly (100) is mounted on a base plate (500), the transfer assembly (200) is mounted on the base plate (500) and is located on one side of the silo positioning assembly (100), the transfer assembly (200) comprises a second guide rail (201) and a second driving member arranged on the base plate (500), a second mounting seat (202) is slidably arranged on the second guide rail (201), the second mounting seat (202) is driven by the second driving member to perform horizontal reciprocating movement relative to the regularization station (101), a vertical plate (203) is arranged on the second mounting seat (202), a third guide rail (204) and a third driving member are arranged on the vertical plate (203), a third mounting seat (205) is slidably arranged on the third guide rail (204), and the third mounting seat (205) is driven by the third driving member to perform lifting movement relative to the regularization station (101).

5. The clip-type semiconductor tablet feeding mechanism according to claim 4, characterized in that: The silo clamping assembly (300) includes a lower support plate (301) and an upper pressure plate (302) located above the lower support plate (301), the lower support plate (301) is mounted on the third mounting seat (205), the lower support plate (301) is used to extend into the regularization station (101) and support the bottom of the fully loaded silo, the upper pressure plate (302) is slidably arranged on the third guide rail (204) through the fourth mounting seat (303), and the third mounting seat (205) is provided with a fourth driving member for driving the upper pressure plate (302) to approach or move away from the lower support plate (301), and the upper pressure plate (302) is used to cooperate with the lower support plate (301) to clamp the fully loaded silo.

6. The clip-type semiconductor tablet feeding mechanism according to claim 5, characterized in that: The fourth mounting seat (303) is provided with a guide column (304) connected to the upper pressure plate (302), and the guide column (304) is sleeved with a spring (305), and the spring (305) is used for buffering when the upper pressure plate (302) contacts the fully loaded silo.

7. The clip-type semiconductor tablet feeding mechanism according to claim 5, characterized in that: The base platform (102) is provided with an avoidance notch (110) for inserting the lower supporting plate (301).

8. The clip-type semiconductor tablet feeding mechanism according to claim 1, characterized in that: The pushing assembly (400) includes a fifth mounting seat (401) facing the discharge position, a fourth guide rail (402) and a fifth driving member are provided on the fifth mounting seat (401), a first slider (403) is slidably provided on the fourth guide rail (402), a push rod (404) is provided on the first slider (403), and the push rod (404) is driven by the fifth driving member to extend into the fully loaded silo and push a single semiconductor sheet toward the docking device.

9. The clip-type semiconductor tablet feeding mechanism according to claim 8, characterized in that: The pusher assembly (400) further includes a mounting bracket (407) located on one side of the discharge position, a swing block (408) capable of swinging back and forth toward the discharge position is provided on the mounting bracket (407), the fifth mounting seat (401) is located above the swing block (408), and an adjustment block (409) is provided between the fifth mounting seat (401) and the swing block (408), a fifth guide rail (410) is provided at the bottom of the adjustment block (409), a second slider (411) that slides with the fifth guide rail (410) is provided on the swing block (408), a sixth guide rail (412) that is vertically arranged with the fifth guide rail (410) is provided at the bottom of the fifth mounting seat (401), and a third slider (413) that slides with the sixth guide rail (412) is provided on the adjustment block (409).

10. The clip-type semiconductor tablet feeding mechanism according to claim 9, characterized in that: The mounting bracket (407) is provided with a first locking member (414) for locking the swing angle of the swing block (408), and the adjusting block (409) is provided with a second locking member (415) for locking with the swing block (408) and a third locking member (416) for locking with the fifth mounting seat (401).

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