Low-wire-consumption diamond wire take-up device for wafer cutting

By designing the supporting plate, round rod, screw and other structures in the diamond wire collection device, the uniform contraction of the diamond wire is achieved, and through the coordination of the rotating rod and other structures, the problems of uneven and uneven lines of the diamond wire collection are solved, and the space utilization rate and safety and work efficiency of staff are improved.

CN223239457UActive Publication Date: 2025-08-19JIANGYIN JINJING NEW MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202422407425.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-08
Publication Date
2025-08-19
Estimated Expiration
2034-10-08

AI Technical Summary

Technical Problem

The existing diamond wire retraction device causes diamond wire to be uneven and uneven when retraction, low space utilization, and lack of limit structure, which affects the safety and work efficiency of staff.

Method used

A diamond wire retraction device for low-line consumption wafer cutting is designed. Through the combination of support plates, round rods, screw rods, movable blocks, concave plates, limit wheels, semicircular plates and movable wheels, the uniform retraction rollers are achieved, and the rapid disassembly and installation of the wire retraction rollers are achieved through the cooperation of rotary rods, retraction rollers, pad plates, nuts, motors and belts.

Benefits of technology

The uniform beam closing of the diamond wire is achieved, the space utilization and use safety are improved, and the efficiency of disassembling and installing the wire closing roller is improved, and the stability and wire closing efficiency of the device are enhanced.

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Abstract

The utility model discloses a low-wire-consumption diamond wire take-up device for wafer cutting, which comprises a mounting plate, the top of the mounting plate is movably connected with a support plate, one side of the support plate is movably connected with a round rod, and one side of the support plate is movably connected with a screw rod. According to the device, a supporting plate, a round rod, a lead screw, a movable block, a concave plate, a limiting wheel, a semicircular plate and a movable wheel are arranged and used in cooperation, so that a diamond wire can be collected when a worker uses the device, and the diamond wire can be uniformly collected when the worker uses the device; according to the diamond wire bundling device, the diamond wires can be neater and more attractive when bundled, meanwhile, the space is more fully utilized, the practicability of a worker using the device is improved, when the worker uses the device to bundle the diamond wires, the diamond wires can be limited through the limiting wheels, the device is more stable when used by the worker, and the working efficiency of the worker is improved. And the safety of workers using the device is improved.
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Description

Technical Field

[0001] The utility model belongs to the field of diamond wire take-up, and specifically relates to a diamond wire take-up device for low-line-consumption wafer cutting. Background Art

[0002] Diamond wire is short for diamond cutting wire, sometimes also called diamond cutting wire or just diamond wire. Many things in industry are cut using cutting wire, such as polycrystalline silicon wafers in the photovoltaic industry. The material of the cutting wire is very important. The mainstream silicon wafer cutting wire used in the photovoltaic industry is ultra-fine steel wire with a diameter of approximately 100 microns.

[0003] Nowadays, diamond wire is used more and more in industrial cutting, so the use of wire take-up devices is also increasing. However, the general wire take-up device will cause the diamond wire to be entangled in one place when taking up the wire, making the diamond wire wound on the wire take-up roller uneven and flat, resulting in low space utilization. In addition, the general wire take-up device has no limiting structure when in use, which reduces the safety of the staff. In addition, the general wire take-up device is difficult to disassemble when in use, which makes the work efficiency of the staff low.

[0004] Therefore, how to provide a low-line-consumption diamond wire take-up device for wafer cutting has become a problem that needs to be solved urgently by people in this field. Summary of the Invention

[0005] The purpose of the utility model is to provide a low-line-consumption diamond wire take-up device for wafer cutting in accordance with the existing device, so as to solve the problems raised in the above-mentioned background technology.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: a diamond wire take-up device for low-line-consumption wafer cutting, comprising a mounting plate, the top of the mounting plate is movably connected to a support plate, and one side of the support plate is movably connected to a round rod, one side of the support plate is movably connected to a screw rod, and the outer wall of the screw rod is movably connected to a movable block.

[0007] The top of the movable block is movably connected to a concave plate, and the inner side of the concave plate is movably connected to a limiting wheel. The top of the movable block is movably connected to a semicircular plate, and one side of the semicircular plate is movably connected to a movable wheel.

[0008] The utility model further illustrates that the inner side wall of the movable block is movably connected to the outer wall of the round rod, the top of the mounting plate is movably connected to the fixed plate, and the outer walls of the limiting wheel and the movable wheel are movably connected with diamond wires.

[0009] The present invention further describes that one side of the fixed plate is movably connected to a rotating rod, and the outer wall of the rotating rod is provided with a thread line, and one end of the rotating rod passes through one side of the fixed plate and is movably connected to one end of the first rotating wheel.

[0010] The utility model further describes that the outer wall of the rotating rod is movably connected to the take-up roller, and the outer wall of the take-up roller is movably connected to the outer wall of the diamond wire, the outer wall of the rotating rod is movably connected to the pad, and the outer wall of the rotating rod is movably connected to the nut.

[0011] The utility model further describes that one side of the support plate is movably connected to a motor, and the output shaft of the motor passes through one side of the support plate and is movably connected to one end of the active rotor, and one end of the screw rod passes through one side of the support plate and is movably connected to one end of the second rotor.

[0012] The utility model further illustrates that the outer wall of the driving wheel is movably connected to a belt, and the driving wheel is movably connected to the first wheel and the second wheel through the belt.

[0013] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0014] (1) By arranging the supporting plate, the round rod, the screw rod, the movable block, the concave plate, the limiting wheel, the semicircular plate and the movable wheel for coordinated use, the device can be used by the staff to gather the diamond wire, so that the device can be used to gather the diamond wire evenly when the staff is using it, so that the device can be more neat and beautiful when gathering the diamond wire, and at the same time, the space can be used more fully, thereby improving the practicality of the device for the staff, and when the staff uses the device to gather the diamond wire, the limiting wheel can be used to limit the diamond wire, so that the device can be used more stably by the staff, thereby improving the safety of the staff when using the device.

[0015] (2) By providing a rotating rod, a take-up roller, a pad, a nut, a motor, an active wheel and a belt, the device can quickly disassemble and install the take-up roller after the diamond wire is bundled, so that the staff can quickly disassemble and install the take-up roller when using the device, thereby improving the work efficiency of the staff in disassembling and installing the take-up roller. Moreover, by using the first wheel and the second wheel in coordination, the device can be rotated synchronously by the motor and the active wheel, thereby improving the stability and take-up efficiency of the device during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a diagram showing the connection structure between the concave plate and the limiting wheel of the utility model;

[0019] Figure 3 This is a diagram showing the connection structure between the rotating rod and the thread line of the utility model;

[0020] Figure 4 This is a diagram showing the connection structure between the take-up roller and the pad of the utility model;

[0021] Figure 5 This is a diagram showing the connection structure between the second rotating wheel and the belt of the utility model;

[0022] In the figure: 1. Mounting plate; 2. Support plate; 3. Round rod; 4. Screw rod; 5. Movable block; 6. Concave plate; 7. Limiting wheel; 8. Semicircular plate; 9. Movable wheel; 10. Fixed plate; 11. Rotating rod; 12. Threaded wire; 13. Take-up roller; 14. Pad; 15. Nut; 16. Diamond wire; 17. Motor; 18. Driving pulley; 19. First pulley; 20. Second pulley; 21. Belt. DETAILED DESCRIPTION

[0023] The following is a non-limiting detailed description of the technical solution of the present invention in conjunction with preferred embodiments and their accompanying drawings. Obviously, the described embodiments are only a portion of the embodiments of the present invention, and not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention. Example 1

[0024] See also Figure 1-5 As shown, a diamond wire take-up device for low-line-consumption wafer cutting includes a mounting plate 1, the top of the mounting plate 1 is movably connected to a support plate 2, one side of the support plate 2 is movably connected to a round rod 3, one side of the support plate 2 is movably connected to a screw rod 4, and the outer wall of the screw rod 4 is movably connected to a movable block 5.

[0025] The top of the movable block 5 is movably connected to a concave plate 6, the inner side of the concave plate 6 is movably connected to a limiting wheel 7, the top of the movable block 5 is movably connected to a semicircular plate 8, and one side of the semicircular plate 8 is movably connected to a movable wheel 9, so that the device can be used to gather the diamond wire 16 when the staff is in use, so that the device can be used to gather the diamond wire 16 evenly when the staff is in use, so that the device can be more neat and beautiful when gathering the diamond wire 16, and at the same time, the space can be used more fully, thereby improving the practicality of the device when used by the staff.

[0026] In this embodiment, by setting the support plate 2, round rod 3, screw rod 4, movable block 5, concave plate 6, limiting wheel 7, semicircular plate 8 and movable wheel 9, the device can be used in conjunction with the staff to gather the diamond wire 16 when in use, so that the device can evenly gather the diamond wire 16 when in use by the staff, so that the device can be more neat and beautiful when gathering the diamond wire 16, and at the same time, the space can be more fully utilized, thereby improving the practicality of the device for the staff to use. When the staff uses the device to gather the diamond wire 16, the diamond wire 16 can be limited by the limiting wheel 7, so that the device is more stable when used by the staff, thereby improving the safety of the staff when using the device.

[0027] In this embodiment, the inner wall of the movable block 5 is movably connected to the outer wall of the round rod 3, the top of the mounting plate 1 is movably connected to the fixed plate 10, and the outer walls of the limiting wheel 7 and the movable wheel 9 are movably connected with the diamond wire 16. When the device is used to gather the diamond wire 16, the diamond wire 16 can be limited by the limiting wheel 7, so that the device is more stable when used by the staff, thereby improving the safety of the staff when using the device. Example 2

[0028] like Figure 1-5 As shown, based on Example 1, the utility model provides a technical solution, in which a rotating rod 11 is movably connected to one side of the fixed plate 10, and a threaded line 12 is provided on the outer wall of the rotating rod 11. One end of the rotating rod 11 passes through one side of the fixed plate 10 and is movably connected to one end of the first rotating wheel 19.

[0029] The outer wall of the rotating rod 11 is movably connected to the take-up roller 13, the outer wall of the take-up roller 13 is movably connected to the outer wall of the diamond wire 16, the outer wall of the rotating rod 11 is movably connected to the pad 14, and the outer wall of the rotating rod 11 is movably connected to the nut 15, so that the device can quickly disassemble and install the take-up roller 13 after the diamond wire 16 is bundled, so that the staff can quickly disassemble and install the take-up roller 13 when using the device, thereby improving the work efficiency of the staff in disassembling and installing the take-up roller 13.

[0030] In this embodiment, the rotating rod 11, the take-up roller 13, the pad 14, the nut 15, the motor 17, the active pulley 18 and the belt 21 are used in coordination with each other so that the device can quickly disassemble and install the take-up roller 13 after the diamond wire 16 is bundled, so that the staff can quickly disassemble and install the take-up roller 13 when using the device, thereby improving the work efficiency of the staff in disassembling and installing the take-up roller 13. Through the coordinated use of the first wheel 19 and the second wheel 20, the device can be rotated synchronously with the active pulley 18 through the motor 17, thereby improving the stability and take-up efficiency of the device during operation.

[0031] In this embodiment, a motor 17 is movably connected to one side of the support plate 2, and the output shaft of the motor 17 passes through one side of the support plate 2 and is movably connected to one end of the driving pulley 18. One end of the screw rod 4 passes through one side of the support plate 2 and is movably connected to one end of the second pulley 20. The outer wall of the driving pulley 18 is movably connected to a belt 21, and the driving pulley 18 is movably connected to the first pulley 19 and the second pulley 20 through the belt 21. Through the coordinated use of the first pulley 19 and the second pulley 20, the device can be rotated synchronously with the motor 17 and the driving pulley 18, thereby improving the stability and winding efficiency of the device during operation.

[0032] The following is a detailed description of the working principle of the diamond wire take-up device for low-line consumption wafer cutting.

[0033] The staff first passes the diamond wire 16 through the limiting wheel 7 and the movable wheel 9, and then connects it to the outer wall of the take-up roller 13. At this time, the staff starts the motor 17 to drive the active wheel 18 to rotate. The active wheel 18 rotates through the belt 21 to drive the first wheel 19 and the second wheel 20 to rotate synchronously. At this time, the screw rod 4 and the rotating rod 11 will drive the screw rod 4 and the take-up roller 13 to rotate. At the same time, the movable block 5 will reciprocate on the screw rod 4 to make the diamond wire 16 evenly wound. After the diamond wire 16 is wound, the staff can remove it by rotating the nut 15, and then remove the pad 14 and the take-up roller 13 together.

[0034] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only used to facilitate the description of the present invention, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0035] Finally, it should be pointed out that the above embodiments are intended only to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art will appreciate that modifications may be made to the technical solutions described in the above embodiments, or that some of the technical features may be replaced with equivalents. Such modifications or replacements do not deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A low-line-loss diamond wire take-up device for wafer cutting, comprising a mounting plate (1), characterized in that: The top of the mounting plate (1) is movably connected to a support plate (2), and one side of the support plate (2) is movably connected to a round rod (3); one side of the support plate (2) is movably connected to a screw rod (4), and the outer wall of the screw rod (4) is movably connected to a movable block (5); The top of the movable block (5) is movably connected to a concave plate (6), and the inner side of the concave plate (6) is movably connected to a limiting wheel (7). The top of the movable block (5) is movably connected to a semicircular plate (8), and one side of the semicircular plate (8) is movably connected to a movable wheel (9).

2. The low-line-loss diamond wire take-up device for wafer dicing according to claim 1, characterized in that: The inner side wall of the movable block (5) is movably connected to the outer wall of the round rod (3), the top of the mounting plate (1) is movably connected to the fixed plate (10), and the outer walls of the limiting wheel (7) and the movable wheel (9) are movably connected to a diamond wire (16).

3. The low-line-loss diamond wire take-up device for wafer dicing according to claim 2, characterized in that: One side of the fixed plate (10) is movably connected to a rotating rod (11), and a thread (12) is provided on the outer wall of the rotating rod (11), and one end of the rotating rod (11) passes through one side of the fixed plate (10) and is movably connected to one end of the first rotating wheel (19).

4. The low-line-loss diamond wire take-up device for wafer dicing according to claim 3, characterized in that: The outer wall of the rotating rod (11) is movably connected to a wire take-up roller (13), and the outer wall of the wire take-up roller (13) is movably connected to the outer wall of the diamond wire (16). The outer wall of the rotating rod (11) is movably connected to a pad (14), and the outer wall of the rotating rod (11) is movably connected to a nut (15).

5. The low-line-loss diamond wire take-up device for wafer dicing according to claim 1, characterized in that: One side of the support plate (2) is movably connected to a motor (17), and the output shaft of the motor (17) passes through one side of the support plate (2) and is movably connected to one end of the driving wheel (18), and one end of the screw rod (4) passes through one side of the support plate (2) and is movably connected to one end of the second wheel (20).

6. The low-line-loss diamond wire take-up device for wafer dicing according to claim 5, characterized in that: The outer wall of the driving rotating wheel (18) is movably connected to a belt (21), and the driving rotating wheel (18) is movably connected to the first rotating wheel (19) and the second rotating wheel (20) via the belt (21).