Smooth adhesive layer release film

Abstract

The utility model belongs to the technical field of release films, and particularly relates to a smooth adhesive layer release film which comprises a base material, a first rubberizing layer is arranged on one side of the base material and comprises a plurality of heat-conducting partition walls; the plurality of heat-conducting partition walls are mutually staggered to form a plurality of adhesive partition areas; a heat insulation layer is arranged on the inner side wall of the adhesion partition area; the adhesion separation area is filled with a release type adhesion block, and the release type adhesion block has viscosity. The outer side surface of the release sticky block is flush with the outer side edge of the heat conduction partition wall, so that the outer side surface of the first rubberizing layer is flat; according to the heat conduction partition wall, heat conduction is achieved, and meanwhile the multiple release type adhesive blocks can be arranged in a partitioned mode so as to be shaped; the heat is transferred through the heat-conducting partition wall instead of the release type sticky block, so that the release type sticky block is not easy to be heated and melted, and residual glue is not left after release; the adhesive block on one side of the adhesive surface of the first adhesive layer is flush with the heat conduction partition wall, so that the outer side surface of the first adhesive layer is smooth and flat and can be completely attached to the surface of an object conveniently.

Description

Technical Field

[0001] The utility model belongs to the technical field of release films, in particular to a release film with a smooth adhesive layer. Background Art

[0002] Release film is a film with a release function. This release function makes the release film have low adhesion and not easily stuck to other substances, or easy to separate after being stuck.

[0003] During use, existing release films can cause the adhesive on the film to melt due to excessively high surface temperatures, leaving adhesive residue when the film is removed. To address this issue, Chinese invention patent application CN109468083A discloses a solvent-resistant release film with dot-shaped protrusions at the vertices and center of the release agent layer to reduce adhesive residue after peeling. However, in this solution, the dot-shaped protrusions make the release film surface less smooth, creating gaps between the release agent layer adjacent to the dot-shaped protrusions and the surface, impairing adhesion. Utility Model Content

[0004] The purpose of the utility model is to provide a release film with a smooth adhesive layer, aiming to solve the technical problems of poor adhesion of thermally conductive release films in the prior art and the adhesive easily melting and adhering to the surface of an object after high-temperature heat conduction.

[0005] To achieve the above-mentioned purpose, an embodiment of the present invention provides a smooth adhesive layer release film, including a substrate; a first adhesive layer and a second adhesive layer are respectively provided on both sides of the substrate, and a heat-conducting layer is provided between the first adhesive layer and the second adhesive layer; the first adhesive layer includes a plurality of heat-conducting partition walls; the plurality of heat-conducting partition walls are staggered with each other to form a plurality of adhesive separation areas, and the two ends of the adhesive separation areas respectively extend to the two sides of the first adhesive layer; the inner side wall of the adhesive separation area is provided with a heat-insulating layer; the interior of the adhesive separation area is filled with a release adhesive block, and the release adhesive block is used to make the first adhesive layer adhere to an external object; the outer side surface of the release adhesive block is flush with the outer edge of the heat-conducting partition wall, so that the outer side surface of the first adhesive layer is flat.

[0006] Optionally, there are at least two heat-conducting layers; the two heat-conducting layers are respectively arranged on the left and right side surfaces of the substrate.

[0007] Optionally, a third adhesive layer is provided on a side of the first adhesive layer close to the substrate; one end of the release adhesive block passes through one side of the adhesive separation area to be integrated with the third adhesive layer.

[0008] Optionally, the heat-conducting partition wall is arranged perpendicular to the plane where the substrate is located.

[0009] Optionally, the cross-sectional shape of the adhesive separation area cut along a plane parallel to the substrate is set to be a triangle.

[0010] Optionally, the substrate is provided with a plurality of cutting guide lines; the cutting guide lines separate the substrate into a plurality of adhesive blocks; and the cutting guide lines are used to guide a cutting direction of the substrate.

[0011] Optionally, the cutting guide line is composed of a plurality of cutting holes arranged at intervals, and two ends of the cutting holes extend to two side surfaces of the substrate respectively so that the two side surfaces penetrate each other.

[0012] Optionally, one end of the cutting hole extends to the surface of the first adhesive layer, and the other end of the cutting hole extends to the surface of the second adhesive layer.

[0013] Optionally, the cutting guide line includes a plurality of equally spaced transverse lines and a plurality of equally spaced longitudinal lines; the angle between the transverse lines and the longitudinal lines is °.

[0014] Compared with the prior art, the above one or more technical solutions in the smooth adhesive layer release film provided by the embodiment of the present invention have at least one of the following technical effects:

[0015] The first adhesive layer and the second adhesive layer arranged on both sides of the substrate are used to increase the viscosity, so that the substrate can be adhered to the surface of an object, or two objects can be bonded together; the thermal conductive layer between the first adhesive layer and the second adhesive layer is used to transfer heat, so that the heat of the object on one side can be transferred to the object on the other side, so as to facilitate coating on the surface of the thermal conductive silicone rubber; the first adhesive layer is composed of a thermal conductive partition wall and a release adhesive block. While achieving heat conduction, the thermal conductive partition wall can partition and set several release adhesive blocks, thereby shaping the release adhesive blocks, and heat is transferred through the thermal conductive partition wall rather than the release adhesive blocks, so that the release adhesive blocks are not easily melted by heat and leave residual adhesive after release; the adhesive block on the adhesive side of the first adhesive layer is flush with the thermal conductive partition wall, so that the outer side of the first adhesive layer is flat, which is convenient for completely adhering to the surface of the object to improve the bonding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0017] Figure 1 This is an exploded view of the present invention.

[0018] Figure 2 It is a cutaway view of the present invention.

[0019] Figure 3 Schematic diagram of the structure of the heat-conducting partition wall.

[0020] Figure 4 Schematic diagram of the structure of the substrate.

[0021] Among them, the reference numerals in the figures are:

[0022] 1. Base material; 2. First adhesive layer; 3. Second adhesive layer; 4. Third adhesive layer; 5. Thermal conductive layer;

[0023] 11. Cutting guide lines; 111. Cutting holes; 12. Sticking and dividing blocks;

[0024] 21. Thermal conductive partition wall; 211. Adhesive partition area; 22. Release adhesive block. DETAILED DESCRIPTION

[0025] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0026] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0028] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0029] In the first embodiment of the present invention, a smooth adhesive layer release film is provided. Figure 1-Figure 4 , including a substrate 1, which is used to provide support so that the shape of the smooth adhesive layer release film can be formed; the two sides of the substrate 1 are respectively provided with a first adhesive layer 2 and a second adhesive layer 3 for providing adhesion, so that the substrate 1 has double-sided adhesiveness, which is convenient for bonding and connecting two external objects; a heat-conducting layer 5 for transferring heat is provided between the first adhesive layer 2 and the second adhesive layer 3.

[0030] Furthermore, the first adhesive layer 2 includes a plurality of heat-conducting partition walls 21, and the plurality of heat-conducting partition walls 21 are staggered with each other to form a plurality of adhesive partition areas 211. The two ends of the adhesive partition area 211 extend to the two side surfaces of the first adhesive layer 2 respectively, so that the heat-conducting partition walls 21 support the overall shape of the first adhesive layer 2, and the first adhesive layer 2 is not easy to stick and deform after release; the inner side wall of the adhesive partition area 211 is provided with a heat-insulating layer, which is used to prevent the heat of the heat-conducting partition wall 21 from being easily transferred to the interior of the adhesive partition area 211.

[0031] Furthermore, the interior of the adhesive separation area 211 is filled with a release adhesive block 22 , and the release adhesive block 22 is used to make the first adhesive layer 2 adhere to an external object.

[0032] Furthermore, the outer side surface of the release adhesive block 22 facing away from the substrate 1 is flush with the outer edge of the heat-conducting partition wall 21 , so that the outer side surface of the first adhesive layer 2 is flat.

[0033] Among them, the substrate 1 is made of epoxy resin material, which makes it heat-resistant and high-strength; the release adhesive block 22 and the second adhesive layer 3 have polyacrylate components to produce an adhesive effect; the thermal conductive layer 5 and the thermal conductive partition wall 21 are made of silicone resin material, and are mixed with one or more materials of oil polyimide, copper-tin alloy, and aluminum oxide to have good thermal conductivity; the thermal insulation layer of the inner wall of the sticky separation area 211 formed by the staggered formation of several thermal conductive partition walls 21 is made of polyphenylene sulfide material. Polyphenylene sulfide has good thermal stability and can be used in an environment of 200℃-220℃ for a long time and 260℃ for a short time, so that the heat of the thermal conductive partition wall 21 is not easily transferred to the interior of the sticky separation area 211, and the release adhesive block 22 is not easily melted by heat.

[0034] Compared with the prior art, the above-mentioned one or more technical solutions in the smooth adhesive layer release film provided by the embodiment of the present invention have at least one of the following technical effects: the first adhesive layer 2 and the second adhesive layer 3 provided on both sides of the substrate 1 are used to increase the adhesiveness, so that the substrate 1 can be adhered to the surface of an object, or two objects can be bonded together; the heat-conducting layer 5 between the first adhesive layer 2 and the second adhesive layer 3 is used to transfer heat, so that the heat of the object on one side can be transferred to the object on the other side, so as to facilitate coating on the surface of the thermally conductive silicone rubber; The first adhesive layer 2 is composed of a heat-conducting partition wall 21 and a release adhesive block 22. The heat-conducting partition wall 21 can partition a plurality of release adhesive blocks 22 while achieving heat conduction, thereby shaping the release adhesive blocks 22, and heat is transferred through the heat-conducting partition wall 21 rather than the release adhesive blocks 22, so that the release adhesive blocks 22 are not easily melted by heat and leave residual adhesive after release; the adhesive block on one side of the adhesive surface of the first adhesive layer 2 is flush with the heat-conducting partition wall 21, so that the outer side of the first adhesive layer 2 is flat, which is convenient for completely adhering to the surface of the object to improve the bonding effect.

[0035] In another embodiment of the present invention, Figure 1 and Figure 2 , the heat-conducting layer 5 is provided with at least two layers; the two heat-conducting layers 5 are respectively provided on the left and right sides of the substrate 1 to improve the heat conduction efficiency and reduce heat loss; in one usage scenario, the utility model can be used for the adhesive connection between the heating component and the heat-dissipating component, such as bonding the thermal conductive silicone and the heat sink to facilitate the heat on the thermal conductive silicone to be transferred to the heat sink for heat dissipation.

[0036] In another embodiment of the present invention, referring to 2, a third adhesive layer 4 is provided on the side of the first adhesive layer 2 close to the substrate 1; one end of the release adhesive block 22 passes through one side of the adhesive separation area 211 to be integrated with the third adhesive layer 4 to improve the connection stability between the first adhesive layer 2 and the thermal conductive layer 5; the thickness of the third adhesive layer 4 is less than that of the first adhesive layer 2, and the third adhesive layer 4 contains a thermal conductive material, such as aluminum nitride, so that the heat of the thermal conductive layer 5 can be transferred to the thermal conductive partition wall 21 through the third adhesive layer 4.

[0037] In another embodiment of the present invention, Figure 2 The heat-conducting partition wall 21 is vertically arranged on the plane where the substrate 1 is located, so that the adhesive partition area 211 is arranged vertically to the substrate 1, so that the glue passes through one end of the adhesive partition area 211 and enters the interior of the adhesive partition area 211 to form a plurality of release adhesive blocks 22, which is convenient for production and manufacturing, thereby improving production efficiency and reducing production costs.

[0038] In another embodiment of the present invention, Figure 3The cross-sectional shape of the adhesive separation area 211 cut along a plane parallel to the substrate 1 is set to be triangular. The triangular shape can improve the connection stability between the plurality of heat-conducting separation walls 21, making the adhesion and release of the first adhesive layer 2 more stable.

[0039] In another embodiment of the present invention, Figure 4 The substrate 1 is provided with a plurality of cutting guide lines 11 ; the cutting guide lines 11 separate the substrate 1 into a plurality of adhesive blocks 12 , and the cutting guide lines 11 are used to guide the cutting direction of the substrate 1 , so as to facilitate cutting during use.

[0040] Further, refer to Figure 2 The cutting guide line 11 is composed of a plurality of cutting holes 111 arranged at intervals, and the two ends of the cutting hole 111 extend to the two side surfaces of the substrate 1 respectively so that the two side surfaces penetrate each other.

[0041] Further, refer to Figure 4 One end of the cutting hole 111 extends to the surface of the first adhesive layer 2, and the other end of the cutting hole 111 extends to the surface of the second adhesive layer 3, so that the direction of the cutting guide line 11 can be observed from the outside.

[0042] Further, refer to Figure 4 The cutting guide line 11 includes a number of equally spaced transverse lines and a number of equally spaced longitudinal lines; the angle between the transverse lines and the longitudinal lines is 90°, so that the adhesive blocks 12 form a rectangular shape to generally adapt to the bonding of various objects.

[0043] The rest of this embodiment is the same as that of the first embodiment. The features not explained in this embodiment are all based on the explanations of the first embodiment and will not be described in detail here.

[0044] The above description further details the present invention in conjunction with specific preferred embodiments, and should not be construed as limiting the specific implementation of the present invention to these descriptions. A person skilled in the art of the present invention will appreciate that its architecture is flexible and adaptable, allowing for the development of a series of products without departing from the present invention's concept. Simple deductions or substitutions should be considered within the scope of patent protection for the present invention as defined by the submitted claims.

Claims

1. A smooth adhesive layer release film, characterized in that: The invention comprises a substrate (1); a first adhesive layer (2) and a second adhesive layer (3) are respectively provided on two side surfaces of the substrate (1); a heat-conducting layer (5) is provided between the first adhesive layer (2) and the second adhesive layer (3); the first adhesive layer (2) comprises a plurality of heat-conducting partition walls (21); the plurality of heat-conducting partition walls (21) are interlaced to form a plurality of adhesive partition areas (211), and the two ends of the adhesive partition areas (211) respectively extend to the two side surfaces of the first adhesive layer (2); the inner side wall of the adhesive partition area (211) is provided with a heat-insulating layer; the interior of the adhesive partition area (211) is filled with a release adhesive block (22), and the release adhesive block (22) is used to make the first adhesive layer (2) adhere to an external object; the outer side surface of the release adhesive block (22) is flush with the outer side edge of the heat-conducting partition wall (21), so that the outer side surface of the first adhesive layer (2) is flat.

2. The smooth adhesive layer release film according to claim 1, characterized in that: The heat-conducting layer (5) is provided with at least two layers; the two heat-conducting layers (5) are respectively provided on the left and right side surfaces of the substrate (1).

3. The smooth adhesive layer release film according to claim 1 or 2, characterized in that: A third adhesive layer (4) is provided on the first adhesive layer (2) on a side close to the substrate (1); one end of the release adhesive block (22) passes through one side of the adhesive separation area (211) to be integrated with the third adhesive layer (4).

4. The smooth adhesive layer release film according to claim 1 or 2, characterized in that: The heat-conducting partition wall (21) is arranged vertically on the plane where the substrate (1) is located.

5. The smooth adhesive layer release film according to claim 1 or 2, characterized in that: The cross-sectional shape of the adhesive separation area (211) cut along a plane parallel to the substrate (1) is set to be a triangle.

6. The smooth adhesive layer release film according to claim 1 or 2, characterized in that: The substrate (1) is provided with a plurality of cutting guide lines (11); the cutting guide lines (11) separate the substrate (1) into a plurality of adhesive blocks (12); the cutting guide lines (11) are used to guide the cutting direction of the substrate (1).

7. The smooth adhesive layer release film according to claim 6, characterized in that: The cutting guide line (11) is composed of a plurality of cutting holes (111) arranged at intervals, and the two ends of the cutting holes (111) respectively extend to the two side surfaces of the substrate (1) so that the two side surfaces penetrate each other.

8. The smooth adhesive layer release film according to claim 7, characterized in that: One end of the cutting hole (111) extends to the surface of the first adhesive layer (2), and the other end of the cutting hole (111) extends to the surface of the second adhesive layer (3).

9. The smooth adhesive layer release film according to claim 6, characterized in that: The cutting guide line (11) comprises a plurality of equally spaced transverse lines and a plurality of equally spaced longitudinal lines; the angle between the transverse lines and the longitudinal lines is 90°.

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