Composite OCA (Optical Clear Adhesive) for laminating PC (Polycarbonate) material
By applying the PC OCA glue layer on the traditional OCA glue layer and combining a light release film, the degumming and bubble problems of OCA optical glue during the bonding of PC materials is solved, reducing costs and improving yield.
Patent Information
- Application Number
- CN202422256005.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-13
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-09-13
AI Technical Summary
Existing OCA optical glue is prone to degumming, bubbles and yellowing when bonding to PC materials, resulting in screen appearance problems and high-performance products are costly.
A thinner OCA glue layer for PC is applied on the traditional fully bonded/TP OCA glue layer, and a light release film is compounded on the outer surface to form a composite OCA optical glue, and the inner layer is protected by the OCA glue layer for PC and secondary coating is performed.
It reduces the glue cost, improves the yield rate, effectively covers the appearance defects on the light film side, maintains high bonding performance and prevents gas erosion.
Smart Images

Figure CN223240023U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of OCA optical adhesives, in particular to a composite OCA optical adhesive for bonding PC materials. Background Art
[0002] OCA optical adhesive is a key raw material for touch screens. It's a double-sided adhesive tape made by laminating optical acrylic adhesive to a base material without a substrate, then laminating a release film to the top and bottom layers. It's an optimal adhesive for touch screens, primarily used for bonding electronic paper, transparent devices, display assembly, lens assembly, resistive and capacitive touch screens, glass, and plastic materials like PC / PMMA. It's a specialty adhesive used for bonding transparent optical components (such as lenses).
[0003] Due to the propensity for PC panels to outgas, using traditional full-lamination / TP-specific OCA optical adhesives for lamination in applications such as P+G or P+F structures, automotive TP, e-books, industrial touchscreens, and home appliance touchscreens can lead to a certain degree of debonding, bubbles, and yellowing, affecting the screen's appearance. Therefore, to address these cover panel lamination issues, a higher performance OCA than traditional full-lamination / TP-specific OCA is required.
[0004] Existing OCA optical adhesives for PC organic cover sheets require high optical performance and weather resistance, including resistance to high temperatures and humidity, bubble rebound suppression, and low yellowing. These adhesives require adjustments to traditional OCA adhesives, such as acid-free, high elastic modulus, and high viscosity, offering a variety of high-performance properties. Consequently, the cost of these OCA adhesives remains high.
[0005] Therefore, in the social environment where the market for car screens, e-books, and home appliance touch screens is gradually expanding, it is particularly important to develop an OCA optical adhesive for PC organic cover panels that can maintain the original high performance but at a lower cost. Summary of the Invention
[0006] In order to overcome the deficiencies of the prior art, the utility model provides a composite OCA optical adhesive for bonding PC materials.
[0007] The technical solution adopted by the utility model to solve its technical problems is:
[0008] A composite OCA optical adhesive for bonding PC materials includes a heavy release film, on which is coated an OCA glue layer for full bonding / TP, and on the side adhesive surface of the OCA glue layer for full bonding / TP is coated an OCA glue layer for PC, and the outer surface of the OCA glue layer for PC is also composited with a light release film.
[0009] As described above, in the composite OCA optical adhesive for bonding PC materials, the thickness of the OCA adhesive layer for full bonding / TP is H1, wherein the value of H1 ranges from 50 to 175 μm.
[0010] As described above, in the composite OCA optical adhesive for bonding PC materials, the thickness of the OCA adhesive layer for PC is H2, wherein the value of H2 ranges from 22 to 28 μm.
[0011] As described above, the composite OCA optical adhesive for bonding PC materials has an H2 value of 25 μm.
[0012] In the composite OCA optical adhesive for bonding PC materials as described above, the thickness of the heavy release film is H3, wherein the value of H3 ranges from 75 to 100 μm.
[0013] In the composite OCA optical adhesive for bonding PC materials as described above, the thickness of the light release film is H4, wherein the H4 value ranges from 50 to 75 μm.
[0014] In the composite OCA optical adhesive for bonding PC materials as described above, the heavy release film is a transparent PET release film.
[0015] In the composite OCA optical adhesive for bonding PC materials as described above, the heavy release film and the OCA adhesive layer for full bonding / TP are cured and formed by UV irradiation.
[0016] As described above, the composite OCA optical adhesive for bonding PC materials, wherein the OCA layer for full bonding / TP and the OCA adhesive layer for PC are formed by high-temperature drying and curing.
[0017] The beneficial effect of the present invention is: by coating a thinner OCA glue layer for PC on the original traditional full-bonding / TP OCA glue layer, a composite OCA optical adhesive is formed, and then the PC material cover is bonded to the side of the PC OCA glue layer, and the original traditional full-bonding / TP OCA glue layer is bonded to the internal protected display module. The PC OCA glue layer can not only maintain high bonding performance to the PC material panel but also protect the inner layer of the traditional full-bonding / TP OCA glue layer to avoid erosion by the gas released by the PC material cover; therefore, compared with the traditional single-layer structure of high-performance OCA optical adhesive for PC, the use of the full-bonding / TP OCA glue layer as the main structure can greatly reduce the cost of glue, and the thicker the thickness, the greater the reduction; and the secondary coating with the PC OCA glue layer can effectively cover the appearance defects on the light film side of the original OCA optical adhesive, which can effectively improve the final yield of the traditional full-bonding / TP OCA optical adhesive. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0019] Figure 1 This is a schematic structural diagram of a composite OCA optical adhesive for bonding PC materials according to an embodiment of the present invention. DETAILED DESCRIPTION
[0020] The technical solution of the present utility model is described in detail below with reference to the accompanying drawings and embodiments.
[0021] See Figure 1 As shown, an embodiment of the present application provides a composite OCA optical adhesive for bonding PC materials, including a heavy release film 3, on which is coated an OCA glue layer 1 for full bonding / TP, and on the side adhesive surface of the OCA glue layer 1 for full bonding / TP is coated an OCA glue layer 2 for PC, and the outer surface of the OCA glue layer 2 for PC is also composited with a light release film 4.
[0022] By applying a thinner PC OCA glue layer 2 on the original traditional full-lamination / TP OCA glue layer 1, a composite OCA optical adhesive is formed, and then the PC material cover is laminated with the PC OCA glue layer 2. The original traditional full-lamination / TP OCA glue layer 1 is laminated to the internally protected display module. The PC OCA glue layer 2 can not only maintain high bonding performance to the PC material panel but also protect the inner traditional full-lamination / TP OCA glue layer 1 from being corroded by the gas released by the PC material cover. Therefore, compared with the traditional single-layer structure of high-performance PC OCA optical adhesive, the use of the full-lamination / TP OCA glue layer 1 as the main structure can greatly reduce the cost of glue, and the thicker the thickness, the greater the reduction. Moreover, the secondary coating with the PC OCA glue layer can effectively cover the appearance defects on the light film side of the original OCA optical adhesive, which can effectively improve the final yield of the traditional full-lamination / TP OCA optical adhesive.
[0023] Furthermore, the thickness of the full lamination / TP OCA glue layer 1 is H1, wherein the value of H1 ranges from 50 to 175 μm.
[0024] In this embodiment, the OCA glue for full lamination / TP is a low-cost glue commonly used in the art and is a prior art, which will not be elaborated on here.
[0025] The thickness of the PC OCA glue layer 2 is H2, wherein the value of H2 ranges from 22 to 28 μm.
[0026] In this embodiment, preferably, the range of H2 value is 25 μm.
[0027] In this embodiment, the OCA glue for PC is a high-performance glue commonly used in the art and is a prior art, which will not be elaborated on here.
[0028] Furthermore, the thickness of the heavy release film 3 is H3, wherein the value of H3 ranges from 75 to 100 μm.
[0029] The thickness of the light release film 4 is H4, wherein the value of H4 ranges from 50 to 75 μm.
[0030] In this embodiment, specifically, the heavy release film 3 is a transparent PET release film.
[0031] The full lamination / TP OCA glue layer 1 is formed between the heavy release film 3 and the light release film 4 by curing through UV irradiation.
[0032] The full lamination / TP OCA layer 1 and the PC OCA glue layer 2 are formed by high-temperature drying and curing.
[0033] In order to further illustrate the embodiment of the present application, the specific production process is as follows:
[0034] First, a transparent PET release film is used as the heavy release film 3. Then, a traditional full lamination / TP OCA glue layer 1 is coated on the release surface of the heavy release film 3. The light release film 4 is then composited and sent into a UV light box for UV curing. The semi-finished product is then rolled up.
[0035] Next, before coating, the semi-finished product is removed from the light release film 4, and the PC OCA glue layer 2 is coated on the adhesive surface of the full bonding / TP OCA glue layer 1. After drying and curing in a high-temperature oven, the light release film 4 is re-laminated on the PC OCA glue layer 2 to form a composite OCA optical adhesive.
[0036] In summary, the present application provides a composite OCA optical adhesive for bonding PC materials. A thinner PC OCA glue layer 2 is coated on the original traditional full bonding / TP OCA glue layer 1 to form a composite OCA optical adhesive. The PC OCA glue layer 2 is then used to bond the PC material cover plate. The original traditional full bonding / TP OCA glue layer 1 is bonded to the internally protected display module. The PC OCA glue layer 2 can maintain high bonding performance to the PC material panel while protecting the inner transmission layer. The traditional full-lamination / TP OCA glue layer 1 avoids erosion by the gas released by the PC material cover plate; therefore, compared with the traditional single-layer structure of high-performance PC OCA optical adhesive, the use of the full-lamination / TP OCA glue layer 1 as the main structure can greatly reduce the cost of glue, and the thicker the thickness, the greater the reduction; and the secondary coating with the PC OCA glue layer can effectively cover the appearance defects on the light film side of the original OCA optical adhesive, which can effectively improve the final yield of the traditional full-lamination / TP OCA optical adhesive.
[0037] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure made using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, is also included in the patent protection scope of the present invention.
Claims
1. A composite OCA optical adhesive for bonding PC materials, characterized in that: The invention comprises a heavy release film (3), wherein the heavy release film (3) is coated with a full lamination / TP OCA glue layer (1), a PC OCA glue layer (2) is coated on the side glue surface of the full lamination / TP OCA glue layer (1), and a light release film (4) is further provided on the outer surface of the PC OCA glue layer (2).
2. The composite OCA optical adhesive for bonding PC materials according to claim 1, characterized in that: The thickness of the full lamination / TP OCA glue layer (1) is H1, wherein the value of H1 ranges from 50 to 175 μm.
3. The composite OCA optical adhesive for bonding PC materials according to claim 1, characterized in that: The thickness of the PC OCA glue layer (2) is H2, wherein the value of H2 ranges from 22 to 28 μm.
4. The composite OCA optical adhesive for bonding PC materials according to claim 3, characterized in that: The H2 value is 25μm.
5. The composite OCA optical adhesive for bonding PC materials according to claim 1, characterized in that: The thickness of the heavy release film (3) is H3, wherein the value of H3 ranges from 75 to 100 μm.
6. The composite OCA optical adhesive for bonding PC materials according to claim 1, characterized in that: The thickness of the light release film (4) is H4, wherein the value of H4 ranges from 50 to 75 μm.
7. The composite OCA optical adhesive for bonding PC materials according to claim 1, characterized in that: The heavy release film (3) is a transparent PET release film.
8. The composite OCA optical adhesive for bonding PC materials according to claim 1 or 7, characterized in that: The heavy release film (3) and the full lamination / TP OCA glue layer (1) are cured and formed by UV irradiation.
9. The composite OCA optical adhesive for bonding PC materials according to claim 1, characterized in that: The full lamination / TP OCA layer (1) and the PC OCA glue layer (2) are formed by high-temperature drying and curing.