Semiconductor dehumidifier

Abstract

The utility model discloses a semiconductor dehumidifier which comprises a machine shell, a semiconductor refrigerator, a cold end heat exchanger and a hot end heat exchanger, the cold end heat exchanger and the hot end heat exchanger are arranged at the cold end and the hot end of the semiconductor refrigerator respectively, and the machine shell comprises two first side faces arranged oppositely and two second side faces arranged oppositely. The two first side faces are provided with a first air inlet and an air outlet respectively, a second side face, opposite to the cold-end heat exchanger, of the machine shell is provided with a second air inlet, the cold-end heat exchanger comprises a cold-end flow channel, the cold-end flow channel and the second side face of the machine shell form a cold-flow air channel, and the second air inlet is communicated with the cold-flow air channel. Air enters the cold-flow air channel from the first air inlet and the second air inlet and is discharged from the air outlet; the hot-end heat exchanger comprises a hot-end flow channel, the hot-end flow channel and the other second side face of the machine shell form a hot-flow air channel, and air enters the hot-flow air channel from the first air inlet and exits the hot-flow air channel from the air outlet. The problems that an existing semiconductor dehumidifier is large in size and poor in dehumidification effect are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor dehumidification, in particular to a semiconductor dehumidifier. Background Art

[0002] A semiconductor dehumidifier utilizes semiconductor thermoelectric cooling technology, exploiting the Peltier effect of semiconductor materials to achieve cooling or heating. Typically, it consists of several pairs of p- and n-type semiconductor thermocouples connected in series, forming a semiconductor refrigeration element (usually in the form of a sheet). When connected to a DC power source, the temperature at one end of the element drops, becoming the cold end. Simultaneously, the temperature at the other end rises, becoming the hot end. Common drawbacks of semiconductor dehumidifiers currently on the market are their relatively large size and poor dehumidification performance. Therefore, the development of a more compact, efficient dehumidifier suitable for smaller spaces is urgently needed. Utility Model Content

[0003] In view of the above defects in the existing technology, the present invention provides a semiconductor dehumidifier to solve the problems of large size and poor dehumidification effect of the existing semiconductor dehumidifier.

[0004] The utility model is implemented by the following technical solutions:

[0005] A semiconductor dehumidifier comprises a casing, a semiconductor refrigerator, a cold-end heat exchanger and a hot-end heat exchanger, the cold-end heat exchanger and the hot-end heat exchanger being respectively arranged at the cold end and the hot end of the semiconductor refrigerator, the casing comprising two first side surfaces and two second side surfaces arranged opposite to each other, the two first side surfaces being respectively provided with a first air inlet and an air outlet, a second side surface of the casing opposite to the cold-end heat exchanger being provided with a second air inlet, the cold-end heat exchanger comprising a cold-end flow channel, the cold-end flow channel and a second side surface of the casing constituting a cold flow duct, the second air inlet being connected to the cold flow duct, the cold flow duct taking in air from the first air inlet and the second air inlet respectively and both discharging air from the air outlet; the hot-end heat exchanger comprising a hot-end flow channel, the hot-end flow channel and another second side surface of the casing constituting a hot flow duct, the hot flow duct taking in air from the first air inlet and discharging air from the air outlet

[0006] Furthermore, the air inlet direction of the second air inlet is perpendicular to the air inlet direction of the first air inlet.

[0007] Furthermore, a second side surface of the casing opposite to the cold end heat exchanger is provided with a plurality of evenly distributed second air inlets extending along its length direction, the cold end heat exchanger has a plurality of cold end flow channels, and each second air inlet is connected to a cold end flow channel.

[0008] Furthermore, the plurality of second air inlets are in an elongated shape, and the elongated second air inlets extend along the width direction of the housing.

[0009] Furthermore, the housing further includes two third side surfaces that are arranged opposite to each other, wherein a third air inlet is formed on one of the third side surfaces, and the third air inlet is communicated with the cold end flow channel.

[0010] Furthermore, the air inlet direction of the third air inlet is perpendicular to the air inlet direction of the first air inlet.

[0011] Furthermore, the first air inlet extends linearly along the thickness direction of the housing, so that the first air inlet is connected to the cold flow duct and the hot flow duct on the same straight line.

[0012] Furthermore, a plurality of the first air inlets are provided, and the plurality of first air inlets extend uniformly along the length direction of the housing.

[0013] Furthermore, a fan is included, which is arranged at a side end of the casing and adopts a suction or blowing method.

[0014] Furthermore, a water receiving box is provided at one end of the cold end heat exchanger close to the first air inlet, and the water receiving box is provided with a drainage pipe extending to the outside of the casing.

[0015] Compared with the prior art, the beneficial effects of the present invention include at least:

[0016] The cold end flow channel of the cold end heat exchanger and the hot end flow channel of the hot end heat exchanger of the utility model respectively form independent cold flow duct and hot flow duct with the side wall of the casing, so that the cold and hot air flows in the cold flow duct and the hot flow duct have the same flow direction, and the air is taken in from the first air inlet and discharged from the air outlet at both the inlet and outlet ends of the cold flow duct and the hot flow duct, so that a straight-in and straight-out air flow structure is formed inside the casing, which reduces the flow resistance of the gas and the cross-sectional size of the air flow at the same time, so that the thickness of the casing perpendicular to the air flow direction is further compressed, thereby having The overall thickness or height of the dehumidifier is effectively reduced, thereby achieving the effect of reducing the overall volume of the dehumidifier. In addition, compared with the traditional dehumidifier with cold-end air inlet and hot-end air outlet, the dehumidifier of the utility model has small air resistance and large air volume in the one-way air duct. The semiconductor refrigerator is used as the boundary, and the cold-end and hot-end air flows are separated. The cold and hot air flows flow in their respective air ducts in the vertical direction of cooling and heat production, reducing the thermal short circuit of the cold and hot air flows, greatly improving the cooling capacity of the refrigeration system, and under the condition that the cooling capacity of the refrigeration system is large enough, the dehumidification capacity is significantly greater than that of the traditional dehumidifier with the same cooling capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1This is an exploded view of a semiconductor dehumidifier according to an embodiment of the present utility model;

[0018] Figure 2 It is a simple schematic diagram of the airflow direction of the semiconductor dehumidifier of the embodiment of the utility model;

[0019] Figure 3 Schematic diagram of a semiconductor dehumidifier according to an embodiment of the present invention;

[0020] In the figure: 1. Casing; 11. First side; 110. First air inlet; 111. Air outlet; 12. Second side; 120. Second air inlet; 13. Third side; 130. Third air inlet; 2. Semiconductor refrigerator; 3. Cold-end heat exchanger; 4. Hot-end heat exchanger; 5. Fan; 6. Water collecting box; 7. Drain pipe. DETAILED DESCRIPTION

[0021] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make this disclosure more comprehensive and complete and to fully convey the concepts of the example embodiments to those skilled in the art. Identical reference numerals in the figures denote identical or similar structures, and thus repeated descriptions thereof will be omitted.

[0022] The words expressing positions and directions described in this utility model are all explained with reference to the accompanying drawings as examples, but they can be changed as needed, and all such changes are included in the protection scope of this utility model.

[0023] like Figure 1-3 As shown, a semiconductor dehumidifier provided by the present invention includes a housing 1, a semiconductor refrigerator 2, a cold-end heat exchanger 3 and a hot-end heat exchanger 4. The cold-end heat exchanger 3 and the hot-end heat exchanger 4 are respectively arranged at the cold end and the hot end of the semiconductor refrigerator 2. The housing 1 includes two oppositely arranged first side surfaces 11 and two oppositely arranged second side surfaces 12. The two first side surfaces 11 are respectively provided with a first air inlet 110 and an air outlet 111. The second side surface 12 of the housing 1 opposite to the cold-end heat exchanger 3 is provided with a second air inlet 120. The cold-end heat exchanger 3 includes a cold-end flow channel, which forms a cold flow channel with a second side surface 12 of the casing 1. The second air inlet 120 is connected to the cold flow channel, and the cold flow channel takes in air from the first air inlet 110 and the second air inlet 120 respectively and discharges air from the air outlet 111; the hot-end heat exchanger 4 includes a hot-end flow channel, which forms a hot flow channel with another second side surface 12 of the casing 1. The hot flow channel takes in air from the first air inlet 110 and discharges air from the air outlet 111.

[0024] In this embodiment, reference Figure 2 , the direction indicated by arrow X is the airflow entering the interior of the casing 1 from the first air inlet 110, and the direction indicated by arrow Y is the airflow blowing out of the casing 1 from the air outlet 111. The airflow direction in the cold flow duct and the hot flow duct is shown by arrow F, wherein the cold end flow duct is formed by the adjacent two cold end heat exchange fins of the cold end heat exchanger 3 and the end face of the semiconductor refrigerator 2, and the hot end flow duct is formed by the adjacent two hot end heat exchange fins of the hot end heat exchanger 3 and the end face of the semiconductor refrigerator 2; since the cold end flow duct of the cold end heat exchanger 3 and the hot end flow duct of the hot end heat exchanger 4 are respectively connected to the side wall of the casing 1 Independent cold flow ducts and hot flow ducts are formed, so that the cold and hot air flows have the same flow direction in the cold flow duct and the hot flow duct, and the air enters from the first air inlet 110 and exits from the air outlet 111 at both the inlet and outlet ends of the cold flow duct and the hot flow duct, so that a straight-in and straight-out airflow structure is formed inside the casing 1, which reduces the flow resistance of the gas on the one hand and reduces the cross-sectional size of the airflow at the same time, so that the thickness of the casing 1 perpendicular to the airflow direction is further compressed, thereby effectively reducing the overall thickness or height of the dehumidifier, meeting the requirements of application scenarios with narrow installation space.

[0025] This embodiment is based on the premise that the thickness and width of the dehumidifier, that is, the height or width of the total air flow cross-section, are limited. In order to reduce the thickness of the dehumidifier while achieving optimal dehumidification performance, the utility model proposes a design in which the cold and hot ends of the semiconductor refrigerator 2 have a one-way shared air inlet 110 and air outlet 111. Compared with the traditional dehumidifier structure with air inlet at the cold end and air outlet at the hot end, the dehumidifier of this embodiment has low air resistance and large air volume in the one-way air duct. Under the condition that the cooling capacity of the refrigeration system is sufficiently large, the dehumidification capacity is significantly greater than that of a traditional dehumidifier of the same cooling capacity. In addition, the one-way air duct structure uses the semiconductor refrigerator 2 as the boundary, separating the cold end and hot end airflows. The cold and hot air flows in their respective air ducts in the perpendicular direction of cooling and heating production, reducing thermal short circuits of the cold and hot air flows and greatly improving the cooling capacity of the refrigeration system. In addition, this embodiment also takes into account that the dehumidification capacity is related to the air volume passing through the cold end. The greater the air volume, the greater the amount of water vapor condensed in the air, and the greater the dehumidification capacity, and vice versa. Due to the limitation of the thickness dimension of the dehumidifier, the one-way air outlet structure often easily causes insufficient cross-section of the cold flow duct, affecting the dehumidification capacity. For this reason, this embodiment utilizes the one-way airflow siphon characteristics without affecting the hot air flow rate, and sets a second air inlet 120 on the side of the casing 1, thereby forming a superimposed air supply structure in two directions in the cold flow duct, increasing the excess air volume of the cold end heat exchanger 3, and thereby improving the dehumidification capacity, thereby achieving a high-performance dehumidification effect.

[0026] As a preferred embodiment, the air inlet direction of the second air inlet 120 is perpendicular to the air inlet direction of the first air inlet 110 .

[0027] refer to Figure 2 and Figure 3 The air inlet direction of the second air inlet 120 of this embodiment is as follows: Figure 2 Arrow Z indicates the direction, and the air flow mainly enters the cold flow duct from the first air inlet 110. Under the action of Bernoulli's principle, the external air will also enter the cold flow duct from the second air inlet 120. Since the air inlet direction of the second air inlet 120 is perpendicular to the cold flow duct, the air inlet direction of the first air inlet 110 is parallel to the cold flow duct, two superimposed air supply structures, axial (or forward) and radial (lateral), are formed in the cold flow duct, which greatly increases the air flow rate of the cold end heat exchanger 3, thereby improving the dehumidification effect.

[0028] As a preferred embodiment, a second side surface 12 of the casing 1 opposite to the cold-end heat exchanger 3 is provided with a plurality of evenly distributed second air inlets 120 extending along its length direction, and the cold-end heat exchanger 3 has a plurality of cold-end flow channels, and each of the second air inlets 120 is connected to a cold-end flow channel.

[0029] refer to Figure 1 and Figure 3 By setting up multiple second air inlets 120, the air volume in the cold flow duct is further increased; the cold end heat exchanger 3 has multiple cold end flow channels, which further increases the water vapor condensation amount and has a better dehumidification effect.

[0030] As a preferred embodiment, the plurality of second air inlets 120 are in a strip shape, and the strip-shaped second air inlets 120 extend along the width direction of the housing 1. Figure 3 The second air inlet 120 is long and can increase the air intake. In this way, the air flow entering the cold flow duct is larger, which makes the air water vapor condensation amount greater and the dehumidification amount greater.

[0031] As a preferred embodiment, the housing 1 further includes two opposing third side surfaces 13, one of which is provided with a third air inlet 130. The third air inlet 130 is connected to the cold-end flow channel. The provision of the third air inlet 130 allows air to enter the housing 1 from three directions, further increasing the airflow rate of the cold-end flow channel and thus further improving the dehumidification effect.

[0032] As a preferred embodiment, the air inlet direction of the third air inlet 130 is perpendicular to the air inlet direction of the first air inlet 110. This forms a three-directional superimposed air supply structure in the cold flow duct, increasing the air flow rate of the cold end heat exchanger 3 and further improving the dehumidification capacity.

[0033] As a preferred embodiment, the first air inlet 110 extends linearly along the thickness direction of the housing 1, so that the first air inlet 110 is connected to the cold air duct and the hot air duct on the same straight line. In this way, the cold air duct and the hot air duct share the same air inlet.

[0034] As a preferred embodiment, a plurality of first air inlets 110 are provided, and the plurality of first air inlets 110 are uniformly extended along the length direction of the housing 1. Providing a plurality of first air inlets 110 is conducive to increasing the air intake volume.

[0035] As a preferred embodiment, a fan 5 is further included. The fan 5 is arranged at one side end of the housing 1 and adopts a suction or blowing mode.

[0036] In this embodiment, the fan 5 can be set at the side end of the housing 1 near the first air inlet 110, and the fan 5 adopts a suction mode; of course, the fan 5 can also be set at the side end of the housing 1 near the air outlet 111, in which case the fan 5 adopts a blowing mode. In addition, to enhance the heat exchange air flow in the air duct and improve the heat dissipation effect of the heat exchanger, fans 5 can also be set at both side ends of the housing 1. The fans 5 at both ends adopt a suction and blowing mode in coordination with each other. The fan 5 at one end sucks air, and the corresponding fan 5 at the other end blows air, thereby superimposing the air volume and increasing the air flow. Since the heat flow direction of the fan 5 is consistent with that of the hot end heat exchanger 4, the wind resistance of the air duct is reduced, the heat exchange effect at the hot end is significantly enhanced, and it plays a positive role in increasing the cooling capacity of the cold end of the semiconductor refrigerator 2.

[0037] As a preferred embodiment, a water receiving box 6 is provided at one end of the cold-end heat exchanger 3 near the first air inlet 110. The water receiving box 6 is provided with a drain pipe 7 extending to the outside of the housing 1. The water receiving box 6 is provided to receive condensed water generated by dehumidification of the semiconductor cooler 2, and the condensed water is easily discharged through the drain pipe 7.

[0038] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limiting the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the utility model without departing from the principles and purpose of the utility model. All of these changes should fall within the scope of protection of the claims of the present invention.

Claims

1. A semiconductor dehumidifier, characterized in that: The invention comprises a housing (1), a semiconductor refrigerator (2), a cold end heat exchanger (3) and a hot end heat exchanger (4), wherein the cold end heat exchanger (3) and the hot end heat exchanger (4) are respectively arranged at the cold end and the hot end of the semiconductor refrigerator (2), the housing (1) comprises two first side surfaces (11) and two second side surfaces (12) arranged opposite to each other, the two first side surfaces (11) are respectively provided with a first air inlet (110) and an air outlet (111), a second side surface (12) of the housing (1) opposite to the cold end heat exchanger (3) is provided with a second air inlet (120), and the cold end heat exchanger (3) and the hot end heat exchanger (4) are respectively provided with a second air inlet (120). The heat exchanger (3) includes a cold end flow channel, the cold end flow channel and a second side surface (12) of the housing (1) form a cold flow channel, the second air inlet (120) is connected to the cold flow channel, the cold flow channel takes in air from the first air inlet (110) and the second air inlet (120) respectively and discharges air from the air outlet (111); the hot end heat exchanger (4) includes a hot end flow channel, the hot end flow channel and another second side surface (12) of the housing (1) form a hot flow channel, the hot flow channel takes in air from the first air inlet (110) and discharges air from the air outlet (111).

2. The semiconductor dehumidifier according to claim 1, characterized in that The air inlet direction of the second air inlet (120) is perpendicular to the air inlet direction of the first air inlet (110).

3. The semiconductor dehumidifier according to claim 1, characterized in that A second side surface (12) of the casing (1) opposite to the cold-end heat exchanger (3) is provided with a plurality of evenly distributed second air inlets (120) extending along its length direction. The cold-end heat exchanger (3) has a plurality of cold-end flow channels, and each of the second air inlets (120) is connected to a cold-end flow channel.

4. The semiconductor dehumidifier according to claim 3, characterized in that The plurality of second air inlets (120) are in an elongated strip shape, and the elongated second air inlets (120) extend along the width direction of the housing (1).

5. The semiconductor dehumidifier according to claim 1, characterized in that The housing (1) further comprises two third side surfaces (13) arranged opposite to each other, wherein one of the third side surfaces (13) is provided with a third air inlet (130), and the third air inlet (130) is connected to the cold end flow channel.

6. The semiconductor dehumidifier according to claim 5, characterized in that: The air inlet direction of the third air inlet (130) is perpendicular to the air inlet direction of the first air inlet (110).

7. The semiconductor dehumidifier according to claim 1, characterized in that The first air inlet (110) extends linearly along the thickness direction of the housing (1), so that the first air inlet (110) is connected to the cold flow duct and the hot flow duct simultaneously on the same straight line.

8. The semiconductor dehumidifier according to claim 7, characterized in that: A plurality of the first air inlets (110) are provided, and the plurality of first air inlets (110) extend uniformly along the length direction of the housing (1).

9. The semiconductor dehumidifier according to claim 1, characterized in that It also includes a fan (5), which is arranged at a side end of the housing (1), and the fan (5) adopts a suction or blowing mode.

10. The semiconductor dehumidifier according to claim 1, characterized in that A water receiving box (6) is provided at one end of the cold end heat exchanger (3) close to the first air inlet (110), and the water receiving box (6) is provided with a drainage pipe (7) extending to the outside of the casing (1).

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