Helium detection device for semiconductor ceramic piece

Abstract

The utility model discloses a helium detection device for a semiconductor ceramic piece, which belongs to the field of sealing performance detection and comprises a bottom plate, a helium detection device and a helium detection device, the cover plate is used for being matched with the other end of the semiconductor ceramic piece; one end of the pipeline is used for being communicated with the semiconductor ceramic piece; the sucking pump is communicated with the other end of the pipeline; the detection end of the barometer is located in the pipeline; the helium supply assembly is used for being located on one side of the semiconductor ceramic piece. The utility model has the technical effects that the sealing performance of the semiconductor ceramic piece can be conveniently and directly judged, misjudgment is not easy to occur, and the cost is low.

Description

Technical Field

[0001] The utility model relates to sealing detection, in particular to a helium detection device for semiconductor ceramic parts. Background Art

[0002] Semiconductor ceramics are ceramics that have semiconductor properties and whose electrical conductivity changes with external conditions (temperature, light, electric field, temperature, etc.).

[0003] Since semiconductor ceramic parts have high requirements for sealing, a roughness meter is generally used to detect the roughness of the sealing surface of semiconductor ceramic parts, thereby indirectly judging the sealing performance, which is prone to misjudgment. Utility Model Content

[0004] Purpose of the utility model: The purpose of the utility model is to provide a helium detection device for semiconductor ceramic parts, which is convenient for directly judging the sealing of semiconductor ceramic parts, is not easy to misjudge, and has low cost.

[0005] Technical solution: A helium detection device for semiconductor ceramic parts, comprising:

[0006] A base plate for cooperating with one end of a semiconductor ceramic member;

[0007] a cover plate for cooperating with the other end of the semiconductor ceramic member;

[0008] a pipe, one end of which is connected to the semiconductor ceramic member;

[0009] an air pump connected to the other end of the pipeline;

[0010] a barometer, wherein a detection end of the barometer is located in the pipeline;

[0011] A helium supply assembly is provided on one side of the semiconductor ceramic member.

[0012] Optionally, it further comprises two clips connected to the base plate via a first fastener, and the two clips are respectively used to clamp on two sides of the semiconductor ceramic component.

[0013] Optionally, the two buckles are arranged axially symmetrically with respect to the cover plate.

[0014] Optionally, also include:

[0015] a fixing block, one end of which is connected to the two buckles via a second fastener, and the other end of which is connected to one end of the pipe;

[0016] A channel is provided in the fixed block, one end of the channel is used to communicate with the semiconductor ceramic component, and the other end of the channel is communicated with one end of the pipeline.

[0017] Optionally, also include:

[0018] a first sealing ring, wherein one end of the first sealing ring is used to contact the semiconductor ceramic member, and the other end of the first sealing ring is in contact with one end of the fixing block;

[0019] A second sealing ring is located between the other end of the fixing block and one end of the pipeline.

[0020] Optionally, the pipeline includes a tail pipe and a bellows that are connected to each other, an end of the tail pipe away from the bellows is used to be connected to the semiconductor ceramic component, and an end of the bellows away from the tail pipe is connected to the vacuum pump.

[0021] Optionally, a third sealing ring is further included, one end of the third sealing ring is used to contact the other end of the semiconductor ceramic component, and the other end of the third sealing ring is in contact with the cover plate.

[0022] Optionally, a groove is further provided on the bottom plate, and the groove is used to cooperate with one end of the semiconductor ceramic component.

[0023] Beneficial effects:

[0024] 1) During the inspection, the vacuum pump is first turned on to evacuate the interior of the semiconductor ceramic component, and the vacuum pump is operated for a period of time until the barometer reading remains unchanged. Then, helium is sprayed onto the surface of the semiconductor ceramic component using the helium supply assembly, and the barometer reading is observed to see whether it changes. If it does not change, it indicates that the sealing of the semiconductor ceramic component is good. If it changes, it indicates that the helium generated by the helium supply assembly has entered the semiconductor ceramic component, thereby indicating that the sealing of the semiconductor ceramic component is poor. In summary, the helium inspection device for semiconductor ceramic components of the present application directly determines the sealing of the semiconductor ceramic component by determining whether the helium from the helium supply assembly has entered the semiconductor ceramic component, and is less likely to make a misjudgment.

[0025] 2) The base plate and the cover plate are used to jointly support the semiconductor ceramic parts. When the size of the semiconductor ceramic parts to be tested changes, only the base plate and the cover plate need to be replaced. There is no need to replace the pipes, vacuum pumps, barometers, helium supply components, etc., and there is no need to purchase professional testing equipment, which makes it easy to reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is one of the structural schematic diagrams of a helium detection device for semiconductor ceramic parts of the present utility model;

[0027] Figure 2 This is the second structural diagram of a helium detection device for semiconductor ceramic parts of the utility model;

[0028] In the figure: 1. Base plate; 11. Groove; 2. Cover plate; 3. Pipe; 31. Tail pipe; 32. Bellows; 41. First fastener; 42. Second fastener; 5. Buckle; 6. Fixing block; 61. Channel; 71. First sealing ring; 72. Second sealing ring; 73. Third sealing ring; 8. Semiconductor ceramic part. DETAILED DESCRIPTION

[0029] In order to make the technical solution of the present invention clearer, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] Example 1

[0031] Combine Figure 1-2 This embodiment provides a helium detection device for a semiconductor ceramic component, comprising:

[0032] A base plate 1 for cooperating with one end of a semiconductor ceramic member 8;

[0033] A cover plate 2 for cooperating with the other end of the semiconductor ceramic member 8;

[0034] A pipe 3, one end of which is connected to a semiconductor ceramic member 8;

[0035] an air pump connected to the other end of the pipe 3;

[0036] A barometer, the detection end of which is located in the pipe 3;

[0037] Used for the helium supply assembly located on one side of the semiconductor ceramic member 8.

[0038] Specifically, during the inspection, the vacuum pump is first turned on to evacuate the interior of the semiconductor ceramic component 8, and the vacuum pump is operated for a period of time until the barometer reading remains unchanged. Then, the helium supply assembly is used to spray helium onto the surface of the semiconductor ceramic component 8, and the barometer reading is observed to see whether it changes. If it does not change, it indicates that the sealing performance of the semiconductor ceramic component 8 is good. If it changes, it indicates that the helium generated by the helium supply assembly has entered the semiconductor ceramic component 8, thereby indicating that the sealing performance of the semiconductor ceramic component 8 is poor. In summary, the helium inspection device for the semiconductor ceramic component 8 of the present application directly determines the sealing performance of the semiconductor ceramic component 8 by determining whether the helium from the helium supply assembly has entered the semiconductor ceramic component 8, and is less likely to make a misjudgment.

[0039] Among them, the base plate 1 and the cover plate 2 are used to jointly support the semiconductor ceramic part 8. When the size of the semiconductor ceramic part 8 to be tested changes, only the base plate 1 and the cover plate 2 need to be replaced, and there is no need to replace the pipeline 3, the vacuum pump, the barometer and the helium supply assembly, etc., and there is no need to purchase professional testing equipment, which makes the cost low; the pipeline 3 cooperates with the vacuum pump to facilitate the extraction of air from the inside of the semiconductor ceramic part 8; the barometer is used to detect the air pressure; and the helium supply assembly is used to spray helium into the semiconductor ceramic part 8.

[0040] Further, such as Figure 1 , and also includes two clips 5 connected to the base plate 1 through a first fastener 41, and the two clips 5 are respectively used to clamp on both sides of the semiconductor ceramic part 8.

[0041] Specifically, the two clips 5 are used to clamp the semiconductor ceramic component 8 on the base plate 1 .

[0042] Further, such as Figure 1 The two buckles 5 are arranged axially symmetrically with respect to the cover plate 2 .

[0043] Specifically, the axisymmetric arrangement facilitates increasing the symmetry of the force applied by the two buckles 5 to the semiconductor ceramic component 8 .

[0044] Further, such as Figure 1-2 , also includes:

[0045] A fixing block 6, one end of the fixing block 6 and the two buckles 5 are connected via a second fastener 42, and the other end of the fixing block 6 is connected to one end of the pipe 3;

[0046] A channel 61 is provided in the fixed block 6 , one end of the channel 61 is used to communicate with the semiconductor ceramic component 8 , and the other end of the channel 61 is communicated with one end of the pipe 3 .

[0047] Specifically, the fixing block 6 is used to connect the two clips 5 and the pipeline 3, wherein the other end of the fixing block 6 and one end of the pipeline 3 are sucked together by the negative pressure generated by the vacuum pump; the channel 61 is used to connect the pipeline 3 and the semiconductor ceramic part 8.

[0048] Further, such as Figure 1 , also includes:

[0049] A first sealing ring 71, one end of the first sealing ring 71 is used to contact the semiconductor ceramic member 8, and the other end of the first sealing ring 71 is in contact with one end of the fixed block 6;

[0050] A second sealing ring 72 is located between the other end of the fixing block 6 and one end of the pipe 3 .

[0051] Specifically, the first sealing ring 71 is used to increase the sealing between the semiconductor ceramic part 8 and one end of the fixed block 6; the second sealing ring 72 is used to increase the sealing between the other end of the fixed block 6 and one end of the pipe 3; the material of the first sealing ring 71 and the second sealing ring 72 can be silicone rubber, fluororubber, etc.

[0052] Further, such as Figure 1 The pipeline 3 includes a tail pipe 31 and a bellows 32 that are connected to each other. The end of the tail pipe 31 away from the bellows 32 is used to communicate with the semiconductor ceramic part 8, and the end of the bellows 32 away from the tail pipe 31 is connected to the vacuum pump.

[0053] Specifically, the tail pipe 31 and the bellows 32 are both used to cooperate with the vacuum pump to facilitate the extraction of air from the inside of the semiconductor ceramic part 8, wherein the bellows 32 facilitates the adjustment of the position of the vacuum pump, and one end of the tail pipe 31 away from the bellows 32 is specifically connected to the other end of the fixed block 6 through the negative pressure generated by the vacuum pump.

[0054] Further, such as Figure 1 , further comprising a third sealing ring 73 , one end of the third sealing ring 73 being used to contact the other end of the semiconductor ceramic member 8 , and the other end of the third sealing ring 73 being in contact with the cover plate 2 .

[0055] Specifically, the third sealing ring 73 is used to increase the sealing between the other end of the semiconductor ceramic component 8 and the cover plate 2 . The material of the third sealing ring 73 can be silicone rubber, fluororubber, etc.

[0056] Further, such as Figure 1 , further comprising a groove 11 provided on the base plate 1 , the groove 11 being used to cooperate with one end of the semiconductor ceramic part 8 .

[0057] Specifically, the groove 11 is used to accommodate one end of the semiconductor ceramic member 8 to prevent the semiconductor ceramic member 8 and the base plate 1 from moving radially relative to each other.

[0058] The above embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the concept of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A helium detection device for semiconductor ceramic parts, characterized in that: include: A base plate for cooperating with one end of a semiconductor ceramic member; a cover plate for cooperating with the other end of the semiconductor ceramic member; a pipe, one end of which is connected to the semiconductor ceramic member; an air pump connected to the other end of the pipeline; a barometer, wherein a detection end of the barometer is located in the pipeline; A helium supply assembly is provided on one side of the semiconductor ceramic member.

2. The helium detection device for semiconductor ceramic parts according to claim 1, characterized in that: It also includes two clips that are connected to the base plate through a first fastener, and the two clips are respectively used to clamp on both sides of the semiconductor ceramic component.

3. The helium detection device for a semiconductor ceramic component according to claim 2, characterized in that: The two buckles are arranged axially symmetrically with respect to the cover plate.

4. The helium detection device for a semiconductor ceramic component according to claim 2, characterized in that: Also includes: a fixing block, one end of which is connected to the two buckles via a second fastener, and the other end of which is connected to one end of the pipe; A channel is provided in the fixed block, one end of the channel is used to communicate with the semiconductor ceramic component, and the other end of the channel is communicated with one end of the pipeline.

5. The helium detection device for semiconductor ceramic parts according to claim 4, characterized in that: Also includes: a first sealing ring, wherein one end of the first sealing ring is used to contact the semiconductor ceramic member, and the other end of the first sealing ring is in contact with one end of the fixing block; A second sealing ring is located between the other end of the fixing block and one end of the pipeline.

6. A helium detection device for a semiconductor ceramic component according to any one of claims 1 to 5, characterized in that: The pipeline includes a tail pipe and a bellows which are connected to each other. One end of the tail pipe away from the bellows is used to be connected to the semiconductor ceramic component, and one end of the bellows away from the tail pipe is connected to the air pump.

7. A helium detection device for a semiconductor ceramic component according to any one of claims 1 to 5, characterized in that: It also includes a third sealing ring, one end of the third sealing ring is used to contact the other end of the semiconductor ceramic component, and the other end of the third sealing ring is in contact with the cover plate.

8. A helium detection device for a semiconductor ceramic component according to any one of claims 1 to 5, characterized in that: It also includes a groove provided on the bottom plate, and the groove is used to cooperate with one end of the semiconductor ceramic component.

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