Flatness adjusting mechanism and wafer detection carrying platform

Through the combination of reference components and adjustment components, the problem of position offset in the wafer detection stage during leveling is solved, high-precision optical imaging and defect detection are achieved, and the accuracy of detection is improved.

CN223244331UActive Publication Date: 2025-08-19창추안 테크놀로지 (수저우) 컴퍼니 리미티드
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Patent Information

Application Number
CN202421971184.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-14
Publication Date
2025-08-19
Estimated Expiration
2034-08-14

AI Technical Summary

Technical Problem

In the prior art, the wafer detection stage is prone to positional shifts in the X-direction and Y-direction during the leveling process, which affects the accuracy of optical imaging and defect detection.

Method used

The reference component and the adjustment component are used to connect the reference component to the mounting substrate. The adjustment component drives the mounting substrate to cause an offset in the vertical direction to ensure that the original position is maintained in the X-direction and Y-direction. The connection between the reference component and the mounting substrate is used to achieve the horizontal adjustment of the mounting substrate by using the setting of the adjustment component.

Benefits of technology

It effectively avoids position deviation after leveling, improves the accuracy of optical imaging and defect detection, simplifies the leveling process, and maintains the accuracy of detection.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of wafer testing, and provides a flatness adjusting mechanism and a wafer detection platform deck. The flatness adjusting mechanism comprises a mounting substrate, a reference assembly and an adjusting assembly, wherein the reference assembly is connected to the mounting substrate; the adjusting assembly is connected to the mounting base plate, is spaced from the reference assembly and is used for driving the mounting base plate to generate offset in the vertical direction. According to the planeness adjusting mechanism, on the basis that planeness adjustment is achieved, it is guaranteed that the leveled position cannot deviate from the original reference in the X direction and the Y direction.
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Description

Technical Field

[0001] The present application relates to the field of wafer testing technology, and in particular to a flatness adjustment mechanism and a wafer inspection platform. Background Art

[0002] The wafer is placed on the inspection stage, and a camera scans and images the wafer surface to identify defects. During the inspection process, flatness errors between the inspection stage and the visual mounting platform will affect the accuracy of optical imaging and defect detection. Therefore, the inspection stage needs to be adjusted for flatness to improve the accuracy and efficiency of defect detection.

[0003] In the related art, horizontal adjustment is mostly achieved by combining bolts and nuts, and locking the bolts with setscrews to achieve leveling. Therefore, the setscrews and leveling nuts must be loosened for each leveling adjustment. Due to the installation gap between the bolts and the setscrews, the position after leveling is easily offset, making it impossible to maintain the original position of the platform in the X and Y directions within the plane. Utility Model Content

[0004] Based on this, it is necessary to provide a flatness adjustment mechanism that, on the basis of achieving flatness adjustment, ensures that the position after leveling does not deviate from the original reference in the X and Y directions.

[0005] A flatness adjustment mechanism includes a mounting base, a reference component and an adjustment component: the reference component is connected to the mounting base; the adjustment component is connected to the mounting base and is arranged at a distance from the reference component, and is used to drive the mounting base to generate an offset in the vertical direction.

[0006] In other words, the base plate's installation base is secured by the datum assembly, and the adjustment assembly allows for a vertical offset of the base plate, achieving horizontal adjustment. This ensures the base plate remains in its original X and Y positions during leveling, preventing any shifting after leveling.

[0007] In some embodiments, the reference assembly includes a reference column, a limiting portion and a locking seat: the reference column is passed through the mounting base plate; the limiting portion is connected to the reference column; the locking seat is connected to the reference column and is spaced apart from the limiting portion in the vertical direction; the mounting base plate is clamped between the locking seat and the limiting portion.

[0008] In some embodiments, the reference column includes a large diameter section and a small diameter section connected to one end of the large diameter section, the end surface of the large diameter section facing one end of the small diameter section forms the limiting portion, and the small diameter section passes through the mounting base plate and is connected to the locking seat.

[0009] In some embodiments, the locking seat is threadedly connected to the reference column.

[0010] In some embodiments, the adjustment assembly includes an adjustment column and an adjustment seat: the adjustment column is passed through the mounting substrate; the adjustment seat is connected to the adjustment column and abuts against the lower surface of the mounting substrate; the adjustment seat can move back and forth in the vertical direction relative to the adjustment column to drive the mounting substrate to move.

[0011] In some embodiments, the adjustment assembly further includes a base; and one end of the adjustment column facing away from the mounting substrate is rotatably connected to the base.

[0012] In some embodiments, the base has a central axis arranged in a vertical direction, and the offset of the adjustment column relative to the central axis is less than or equal to 8 degrees.

[0013] In some embodiments, one of the adjusting column and the base is configured with a mounting hole, and the other is configured with an inserting end, the inserting end is inserted into the mounting hole and cooperates with a spherical surface of a hole wall of the mounting hole.

[0014] In some embodiments, the reference components and a plurality of groups of the adjustment components are arranged at intervals along the circumference of the mounting substrate.

[0015] The present application also provides a wafer inspection platform, including the above-mentioned flatness adjustment mechanism.

[0016] The flatness adjustment mechanism 100 can be used to adjust the flatness error between the wafer and the visual mounting platform, improving the accuracy of optical imaging and defect detection. Due to the provision of the reference assembly, the original X and Y positions can be maintained during the adjustment process, preventing positional deviation after leveling, further improving detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1This is a first schematic diagram of the flatness adjustment mechanism provided in this application;

[0019] Figure 2 A second schematic diagram of the flatness adjustment mechanism provided in this application;

[0020] Figure 3 A top view of the flatness adjustment mechanism provided in this application;

[0021] Figure 4 for Figure 3 Cross-section of the middle AA;

[0022] Figure 5 for Figure 4 A magnified view of the connection between the reference assembly and the mounting base plate is provided;

[0023] Figure 6 for Figure 4 A detailed enlarged view of the connection between the adjustment assembly and the mounting base plate is provided.

[0024] Figure markings: 10, mounting base plate; 20, reference assembly; 21, reference column; 22, limiting portion; 23, locking seat; 30, adjustment assembly; 31, adjustment column; 32, adjustment seat; 33, base; 100, flatness adjustment mechanism; 101, top angle; 102, avoidance gap; 103, adjustment hole; 104, reference hole; 211, large diameter section; 212, small diameter section; 301, insertion end; 302, mounting hole; 331, assembly protrusion. DETAILED DESCRIPTION

[0025] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0026] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0028] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0030] See also Figures 1 to 4 One embodiment of the present application provides a flatness adjustment mechanism 100, comprising a mounting substrate 10, a reference assembly 20, and an adjustment assembly 30. Both the reference assembly 20 and the adjustment assembly 30 are connected to the mounting substrate 10 and spaced apart. The adjustment assembly 30 is configured to drive the mounting substrate 10 to generate a vertical offset.

[0031] It can be understood that the setting of the adjustment assembly 30 is used to cause the mounting substrate 10 to produce a certain amount of vertical offset, thereby achieving horizontal adjustment of the mounting substrate 10. During this process, it is precisely because of the connection between the reference assembly 20 and the mounting substrate 10 that the installation reference of the mounting substrate 10 can be maintained. Regardless of whether the mounting substrate 10 is offset upward or downward in the vertical direction relative to its original position under the action of the adjustment assembly 30, the connection between the mounting substrate 10 and the reference assembly 20 maintains the original reference. Moreover, it is precisely because of the spaced arrangement of the reference assembly 20 and the adjustment assembly 30 that the two can be arranged without interfering with each other, that is, the reference is guaranteed, facilitating flatness adjustment. In this way, it can be ensured that the mounting substrate 10 can maintain its original position on the X-axis and Y-axis during the leveling process, making it difficult for the overall position after leveling to shift.

[0032] The reference assembly 20 and the adjustment assembly 30 are described in detail below.

[0033] Please combine Figure 2 、 Figure 4 and Figure 5 Exemplarily, the reference assembly 20 includes a reference column 21, a limiting portion 22 and a locking seat 23. The reference column 21 is passed through the mounting substrate 10. The limiting portion 22 and the locking seat 23 are both connected to the reference column 21 and spaced apart in the vertical direction to clamp the mounting substrate 10 between the locking seat 23 and the limiting portion 22. The axial direction of the reference column 21 and the thickness direction of the mounting substrate 10 are both in the vertical direction. Specifically, the mounting substrate 10 is constructed with a reference hole 104 for the reference column 21 to pass through, and the reference hole 104 is set to pass through in the thickness direction of the mounting substrate 10. The limiting portion 22 can abut against the lower surface of the mounting substrate 10, and the locking seat 23 abuts against the upper surface of the mounting substrate 10, thereby realizing the connection between the reference assembly 20 and the mounting substrate 10, and ensuring the initial installation reference of the mounting substrate 10.

[0034] like Figure 5 As shown, in some specific embodiments, the locking seat 23 is threadedly connected to the reference post 21. This arrangement facilitates assembly and disassembly of the reference assembly 20 relative to the mounting base 10. For example, the locking seat 23 can be rotated clockwise relative to the reference post 21 to press against the upper surface of the mounting base 10, thereby locking the mounting base 10 relative to the reference assembly 20 in conjunction with the stopper 22, thereby securing the mounting base 10. The locking seat 23 can then be rotated counterclockwise to release the lock. Conversely, clockwise rotation releases the lock, while counterclockwise rotation locks the lock.

[0035] Alternatively, a U-shaped clamp may be fastened to the side of the limiting portion 22 and the locking seat 23 opposite to the mounting base 10 to clamp the locking seat 23 and the limiting portion 22 relative to the mounting base 10. Alternatively, when the mounting base 10 is clamped between the locking seat 23 and the limiting portion 22, a pin may be passed through the locking seat 23 to connect with the reference post 21 to achieve locking. Alternatively, a locking nut may be installed on the side of the locking seat 23 facing away from the mounting base 10. Alternatively, the locking seat 23 may be bonded to the mounting base 10 and the reference post 21. Any method is sufficient as long as the connection between the reference assembly 20 and the mounting base 10 is reliable.

[0036] Please continue to refer to Figure 5 In an optional embodiment, the reference column 21 includes a large diameter section 211 and a small diameter section 212 connected to one end of the large diameter section 211. The end surface of the large diameter section 211 facing the small diameter section 212 forms a limiting portion 22. The small diameter section 212 is passed through the mounting base plate 10 and connected to the locking seat 23. In this way, it is convenient to directly process the limiting portion 22 from the reference column 21, which is convenient for production and manufacturing; and such an arrangement reduces the number of assembly parts and simplifies the assembly process. The end of the small diameter section 212 away from the large diameter section 211 is constructed with an external thread for threaded connection with the locking seat 23. The end of the large diameter section 211 away from the small diameter section 212 can be used to connect to the mounting platform on which the mounting base plate 10 needs to be installed.

[0037] The outer wall of the portion of the small diameter section 212 passing through the reference hole 104 is smooth. Compared with a direct threaded connection with the mounting base 10, this arrangement prevents the mounting base 10 from being deformed due to the constraint of the reference assembly 20 during adjustment.

[0038] Alternatively, an annular mounting boss may be sleeved on the outside of the reference column 21 , and the mounting boss is fixedly connected to the reference column 21 to form a limiting portion 22 , so as to be supported on the lower surface of the mounting substrate 10 by the mounting boss.

[0039] Please combine Figure 1 、 Figure 2 、 Figure 4 and Figure 6 Exemplarily, the adjustment assembly 30 includes an adjustment column 31 and an adjustment seat 32. The adjustment column 31 is provided through the mounting base 10. The adjustment seat 32 is connected to the adjustment column 31 and abuts against the lower surface of the mounting base 10. The adjustment seat 32 can move back and forth in the vertical direction relative to the adjustment column 31 to drive the mounting base 10 to move. Specifically, the mounting base 10 is also constructed with an adjustment hole 103 that is provided along its thickness direction, and the adjustment column 31 is provided through the adjustment hole 103. The provision of the adjustment seat 32 can, on the one hand, satisfy the support of the mounting base 10, and on the other hand, the movement of the adjustment seat 32 relative to the adjustment column 31 can drive the mounting base 10 to shift in the vertical direction, thereby achieving horizontal adjustment.

[0040] For example, when the adjustment seat 32 moves upward relative to the adjustment column 31 in the vertical direction, it can push up the mounting base 10; when the adjustment seat 32 moves downward relative to the adjustment column 31 in the vertical direction, the mounting base 10 can move downward under its own weight and overlap the adjustment seat 32. In this way, the horizontal adjustment can be achieved.

[0041] like Figure 6 As shown, in some specific embodiments, the adjustment seat 32 is threadedly connected to the adjustment column 31. Rotating the adjustment seat 32 can move along the axial direction of the adjustment column 31 to adjust the horizontality of the mounting substrate 10. Alternatively, the side of the adjustment seat 32 facing away from the mounting substrate 10 can be connected to a drive member such as a cylinder. As long as the adjustment seat 32 can be used to move the mounting substrate 10 in the vertical direction to achieve horizontal adjustment, it will be sufficient. After the adjustment is completed, a locking nut can be connected to the end of the adjustment column 31 that passes through the mounting substrate 10 to lock the adjustment assembly 30 relative to the mounting substrate 10.

[0042] like Figure 6As shown, in an optional embodiment, the adjustment assembly 30 further includes a base 33, to which the end of the adjustment column 31 facing away from the mounting substrate 10 is rotatably connected. On the one hand, the provision of the base 33 facilitates the assembly of the adjustment assembly 30 relative to the mounting platform on which the mounting substrate 10 is to be mounted, ensuring stability. On the other hand, the cooperation between the base 33 and the adjustment column 31 increases the degree of freedom at this location, avoiding problems such as poor adjustment or jamming caused by the fixation of the reference assembly 20 during adjustment. Furthermore, this arrangement not only increases the adjustment range but also reduces the risk of deformation of the mounting substrate 10 during adjustment.

[0043] Furthermore, the base 33 has a vertically extending central axis Z, and the adjustment column 31 has a rotational offset of less than or equal to 8 degrees relative to the central axis Z. A smaller rotational offset of the adjustment column 31 would reduce the degree of freedom, resulting in poor adjustment and a narrow adjustment range. A larger rotational offset of the adjustment column 31 would result in poor stability, making it difficult for the mounting base 10 to stably support other structures. Therefore, it is necessary to limit the rotational offset of the adjustment column 31 to ensure a safe degree of freedom, allowing for a wide range of adjustment and a high degree of freedom while maintaining the stability of the mounting base 10.

[0044] Optionally, the rotation offset of the adjustment column 31 relative to the central axis Z can be 5 degrees, 6 degrees, 7.5 degrees or 8 degrees.

[0045] like Figure 6 As shown, in actual use, one of the adjustment column 31 and the base 33 is constructed with a mounting hole 302, and the other is constructed with an insertion end 301. The insertion end 301 is inserted into the mounting hole 302 and spherically cooperates with the hole wall of the mounting hole 302. The spherical cooperation setting satisfies the rotation of the above-mentioned adjustment column 31. For example, the base 33 may be provided with a mounting hole 302 on a side facing the mounting substrate 10 in a vertical direction downward, and the adjustment column 31 may be constructed with an insertion end 301 to be inserted into the mounting hole 302; or, the base 33 may be provided with a protruding insertion end 301 on a side facing the mounting substrate 10, and the end of the adjustment column 31 may be provided with a mounting hole 302 on an upward vertical direction to satisfy the cooperation between the insertion end 301 and the mounting hole 302.

[0046] In some specific embodiments, the base 33 has a mounting protrusion 331 protruding from one side of the base 33 facing the mounting substrate 10. The mounting protrusion 331 has a mounting hole 302 recessed vertically downwardly therefrom. The bottom of the adjustment post 31 serves as the insertion end 301. Furthermore, the end surface of the insertion end 301 is spherical, and smaller than a hemisphere, to ensure a rotational offset of 8 degrees or less.

[0047] Please combine Figures 1 to 3For example, the mounting base 10 is circumferentially spaced apart with reference assemblies 20 and multiple sets of adjustment assemblies 30. This improves the support stability of the mounting base 10 while also allowing each set of adjustment assemblies 30 to be adjusted individually, enhancing adjustment precision. Because the adjustment posts 31 in each set of adjustment assemblies 30 have a certain degree of rotational offset, deformation of the mounting base 10 can be minimized during adjustment of each set of adjustment assemblies 30.

[0048] In some specific embodiments, the vertical projection of the mounting substrate 10 is a quadrilateral with four corners 101. A reference assembly 20 can be mounted at one of the corners 101, and a set of adjustment assemblies 30 can be mounted at each of the remaining three corners 101. Furthermore, a central clearance notch 102 is provided in the mounting substrate 10. When a wafer is supported on the mounting substrate 10, the lower surface of the wafer can be exposed through the clearance notch 102, facilitating operations such as wafer backside inspection.

[0049] Alternatively, when a set of reference components 20 and a set of adjustment components 30 are provided on the mounting substrate 10 , the two can be arranged along opposite corners of the mounting substrate 10 .

[0050] like Figure 2 As shown, another embodiment of the present application provides a wafer detection platform, including the above-mentioned flatness adjustment mechanism 100, and the flatness adjustment mechanism 100 is equipped with a wafer fixing structure for fixing the wafer to meet the defect detection of the wafer. In addition, during detection, the flatness adjustment mechanism 100 can be used to adjust the flatness error between the wafer and the visual mounting platform to improve the accuracy of optical imaging and defect detection. Due to the setting of the reference component 20, it can be maintained in the original position in the X and Y directions during the adjustment process to avoid the position after leveling from being offset, further improving the detection accuracy. In addition, due to the setting of the avoidance notch 102 on the mounting substrate 10, the back of the wafer can also be detected from below the wafer, which is more convenient to operate.

[0051] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A flatness adjustment mechanism, characterized in that: The flatness adjustment mechanism (100) comprises: Mounting substrate (10); A reference assembly (20) connected to the mounting substrate (10); An adjustment component (30) is connected to the mounting substrate (10) and is spaced apart from the reference component (20), and is used to drive the mounting substrate (10) to generate an offset in a vertical direction.

2. The flatness adjustment mechanism according to claim 1, wherein: The reference assembly (20) comprises: A reference column (21) is provided through the mounting base plate (10); A limiting portion (22) connected to the reference column (21); A locking seat (23) is connected to the reference column (21) and is spaced apart from the limiting portion (22) in a vertical direction; The mounting substrate (10) is clamped between the locking seat (23) and the limiting portion (22).

3. The flatness adjustment mechanism according to claim 2, wherein: The reference column (21) comprises a large diameter section (211) and a small diameter section (212) connected to one end of the large diameter section (211); the end surface of the large diameter section (211) facing one end of the small diameter section (212) forms the limiting portion (22); the small diameter section (212) is provided through the mounting base (10) and is connected to the locking seat (23).

4. The flatness adjustment mechanism according to claim 2, wherein: The locking seat (23) is threadedly connected to the reference column (21).

5. The flatness adjustment mechanism according to claim 1, wherein: The adjustment assembly (30) comprises: An adjusting column (31) is provided through the mounting base plate (10); An adjustment seat (32) connected to the adjustment column (31) and abutting against the lower surface of the mounting substrate (10); The adjustment seat (32) can move back and forth in a vertical direction relative to the adjustment column (31) to drive the installation base plate (10) to move.

6. The flatness adjustment mechanism according to claim 5, characterized in that: The adjustment assembly (30) further includes a base (33); One end of the adjustment column (31) facing away from the mounting base plate (10) is rotatably connected to the base (33).

7. The flatness adjustment mechanism according to claim 6, wherein: The base (33) has a central axis (Z) arranged in a vertical direction, and the rotation offset of the adjustment column (31) relative to the central axis (Z) is less than or equal to 8 degrees.

8. The flatness adjustment mechanism according to claim 7, wherein: One of the adjusting column (31) and the base (33) is configured with a mounting hole (302), and the other is configured with an inserting end (301). The inserting end (301) is inserted into the mounting hole (302) and matches the spherical surface of the hole wall of the mounting hole (302).

9. The flatness adjustment mechanism according to any one of claims 1 to 8, characterized in that: The mounting substrate (10) is provided with the reference components (20) and a plurality of groups of the adjustment components (30) arranged at intervals along its circumference.

10. A wafer inspection stage, characterized in that: The flatness adjustment mechanism comprises the flatness adjustment mechanism according to any one of claims 1 to 9.