Lens assembly

Abstract

The utility model provides a lens assembly, which comprises a circuit board, a sensor chip arranged on the circuit board and electrically connected with the circuit board, a bracket supported on the circuit board, and an optical filter supported on the bracket and arranged at an interval with the sensor chip, a second conducting strip is arranged on the surface, facing the optical filter, of the sensor chip, and the first conducting strip and the second conducting strip are electrically connected through a conductive silver adhesive block. According to the lens assembly, the sensor chip and the circuit board are electrically connected through the solidified conductive silver adhesive block, the risk that wires are easy to break when being pulled during connection is avoided, and meanwhile the advantage that the overall height of the lens assembly is easy to control is achieved.

Description

Technical field

[0001] The utility model relates to the technical field of optical imaging, in particular to a lens assembly. [Background Technology]

[0002] Lens assemblies are essential components for electronic devices, such as mobile phones. In traditional lens assembly structures, the circuit board and sensor chip are electrically connected via gold wire (conductor) welding to achieve image signal transmission. However, this solution is prone to wiggling, and in extreme cases, electrical issues such as wire collapse and disconnection may occur.

[0003] In related technologies, there is also a method of setting solder balls under the sensor chip. The solder balls are melted at high temperature and connected between the sensor chip and the circuit board. However, this solution increases the overall height of the lens assembly due to the addition of solder balls, which is not conducive to the control of the overall height of the module.

[0004] Therefore, it is necessary to provide a new lens assembly to solve the above technical problems. [Utility Model Content]

[0005] The purpose of the present invention is to provide a lens assembly, aiming to solve the problems in the prior art that the lens assembly is difficult to control and the electrical connection is unstable.

[0006] In order to achieve the above-mentioned objectives, the present invention provides a lens assembly, which includes: a circuit board, a sensor chip arranged on the circuit board and electrically connected to the circuit board, a bracket supported on the circuit board, and a filter supported on the bracket and spaced apart from the sensor chip, the circuit board is provided with a first conductive sheet, and the surface of the sensor chip facing the filter is provided with a second conductive sheet, and the first conductive sheet and the second conductive sheet are electrically connected via a conductive silver glue block.

[0007] Preferably, the conductive silver glue block is formed by solidified conductive silver paste.

[0008] Preferably, the bracket is provided with a perfusion channel running through it, and the conductive silver paste is poured through the perfusion channel.

[0009] Preferably, the bracket includes an inner supporting portion, an outer supporting portion and a connecting portion connected between the inner supporting portion and the outer supporting portion, the inner supporting portion supports the filter, the outer supporting portion is supported on the circuit board, and the perfusion channel is arranged on the connecting portion.

[0010] Preferably, the connecting portion of the bracket is located above the sensor chip and spaced apart from the sensor chip.

[0011] Preferably, the inner support portion is arranged to form a through hole, and the filter covers the through hole.

[0012] Preferably, the conductive silver glue block includes a first part located in the perfusion channel, a second part connected to the first part and located on the surface of the sensor chip, and a third part connected to the second part and located on the surface of the circuit board, the second part is connected to the second conductive sheet, and the third part is connected to the first conductive sheet.

[0013] Preferably, the width of the first portion of the conductive silver paste block is equal to the width of the second portion, and the width of the third portion is smaller than the width of the second portion.

[0014] Preferably, the first conductive sheets are multiple and located on two opposite sides of the circuit board, the second conductive sheets are multiple and located on two opposite sides of the sensor chip, and the first conductive sheets and the second conductive sheets are arranged in a one-to-one correspondence.

[0015] Preferably, the conductive silver paste is cured by electricity to form the conductive silver glue block.

[0016] Compared to related technologies, the present invention provides a lens assembly comprising: a circuit board, a sensor chip disposed on and electrically connected to the circuit board, a bracket supported on the circuit board, and a filter supported on the bracket and spaced apart from the sensor chip. The circuit board is provided with a first conductive sheet, and the surface of the sensor chip facing the filter is provided with a second conductive sheet, the first and second conductive sheets being electrically connected via a conductive silver adhesive block. The present invention utilizes a cured conductive silver adhesive block to achieve an electrical connection between the sensor chip and the circuit board, avoiding the risk of wire breakage caused by pulling during connection. Furthermore, the lens assembly's overall height is easily controlled, making the overall structure more stable and reducing the risk of failure due to a drop.

Brief Description of the Drawings

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the lens assembly of the present invention.

[0018] Figure 2 For example Figure 1 Exploded view of the lens assembly shown.

[0019] Figure 3 For the Figure 1 Sectional view along line AA. [Specific implementation method]

[0020] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] The present invention provides a lens assembly 100. In practical applications, a lens including a lens is disposed above the lens assembly 100. Figures 1 to 3 As shown, the lens assembly 100 includes: a circuit board 1, a sensor chip 2 arranged on the circuit board 1 and electrically connected to the circuit board 1, a bracket 3 supported on the circuit board 1, a filter 4 supported on the bracket 3 and spaced apart from the sensor chip 2, and a conductive silver glue block 5.

[0022] The circuit board 1 is a flexible circuit board. The surface of the circuit board 1 facing the sensor chip 2 is provided with a plurality of first conductive pads 11. The first conductive pads 11 are arranged in two rows, and the two rows of first conductive pads 11 are located on opposite sides of the circuit board 1. The first conductive pads 11 can be arranged protruding from the surface of the circuit board 1, flush with the surface of the circuit board 1, or even lower than the surface of the circuit board 1.

[0023] The sensor chip 2 is attached to the surface of the circuit board 1. Two rows of first conductive pads 11 are located on either side of the sensor chip 2, meaning the sensor chip 2 does not cover the first conductive pads 11. The surface of the sensor chip 2 facing the optical filter 4 is provided with a plurality of second conductive pads 21. These second conductive pads 21 are arranged in two rows, and are located on opposite sides of the sensor chip 2. The second conductive pads 21 correspond one-to-one with the first conductive pads 11, and are electrically connected to the first conductive pads 11 and the second conductive pads 21 via the conductive silver adhesive block 5. The second conductive pads 21 may protrude from the surface of the sensor chip 2, be flush with the surface of the sensor chip 2, or even be lower than the surface of the sensor chip 2.

[0024] The bracket 3 has an annular structure and includes an inner support portion 31, an outer support portion 32, and a connecting portion 33 connecting the inner support portion 31 and the outer support portion 32. The inner support portion 31 supports the optical filter 4, and the outer support portion 32 supports the circuit board 1. The connecting portion 33 of the bracket 3 is partially located above the sensor chip 2 and spaced apart from the sensor chip 2. The inner support portion 31 is surrounded by a through hole 310, which is covered by the optical filter 4. The bracket 3 is also provided with a perfusion channel 34 extending therethrough, which is disposed on the connecting portion 33. The thickness of the inner support portion 31 and the connecting portion 33 is less than that of the outer support portion 32.

[0025] The conductive silver paste block 5 is formed from cured conductive silver paste, which is poured through the pouring channel 34 and then cured by electrical current. The conductive silver paste block 5 comprises a first portion 51 located within the pouring channel 34, a second portion 52 connected to the first portion 51 and located on the surface of the sensor chip 2, and a third portion 53 connected to the second portion 52 and located on the surface of the circuit board 1. The second portion 52 is connected to the second conductive pad 21, and the third portion 53 is connected to the first conductive pad 11, thereby electrically connecting the sensor chip 2 to the circuit board 1 and transmitting image signals. The width of the first portion 51 is equal to that of the second portion 52, while the width of the third portion 53 is smaller than that of the second portion 52. The second portion 52 and the third portion 53 form a step-like shape.

[0026] Conductive silver glue 5 is used to electrically connect the sensor chip 2 and circuit board 1, eliminating the problem of increased overall height of the lens assembly 100 caused by solder balls and the problem of wire disconnection associated with soldering. The conductive silver glue 5 secures the first conductive sheet 11 and the second conductive sheet 21 in a one-to-one relationship, thereby securing the circuit board 1, bracket 3, and sensor chip 2 to form a single unit, further significantly enhancing the lens assembly 100's resistance to external forces.

[0027] The filter 4 can filter out non-visible light. The filter 4 can be an infrared filter, so that the lens assembly 100 can filter out infrared light, preventing infrared light from reaching the imaging surface of the lens assembly 100 and interfering with normal visible light imaging, thereby improving the imaging quality of the lens assembly 100.

[0028] Compared to related technologies, the present invention provides a lens assembly comprising: a circuit board, a sensor chip disposed on and electrically connected to the circuit board, a bracket supported on the circuit board, and a filter supported on the bracket and spaced apart from the sensor chip. The circuit board is provided with a first conductive sheet, and the surface of the sensor chip facing the filter is provided with a second conductive sheet, the first and second conductive sheets being electrically connected via a conductive silver adhesive block. The present invention utilizes a cured conductive silver adhesive block to achieve an electrical connection between the sensor chip and the circuit board, avoiding the risk of wire breakage caused by pulling during connection. Furthermore, the lens assembly's overall height is easily controlled, making the overall structure more stable and reducing the risk of failure due to a drop.

[0029] The above is only an embodiment of the present invention. It should be pointed out that those skilled in the art can make improvements without departing from the inventive concept of the present invention, but these improvements are all within the scope of protection of the present invention.

Claims

1. A lens assembly, characterized in that: The lens assembly includes: a circuit board, a sensor chip arranged on the circuit board and electrically connected to the circuit board, a bracket supported on the circuit board, and a filter supported on the bracket and spaced apart from the sensor chip. The circuit board is provided with a first conductive sheet, and the surface of the sensor chip facing the filter is provided with a second conductive sheet. The first conductive sheet and the second conductive sheet are electrically connected via a conductive silver glue block.

2. The lens assembly according to claim 1, wherein: The conductive silver paste block is formed by solidified conductive silver paste.

3. The lens assembly according to claim 2, wherein: The bracket is provided with a perfusion channel running through it, and the conductive silver paste is poured in through the perfusion channel.

4. The lens assembly according to claim 3, wherein: The bracket includes an inner supporting portion, an outer supporting portion, and a connecting portion connected between the inner supporting portion and the outer supporting portion. The inner supporting portion supports the filter, the outer supporting portion is supported on the circuit board, and the perfusion channel is provided on the connecting portion.

5. The lens assembly according to claim 4, wherein: The connecting portion of the bracket is located above the sensor chip and is spaced apart from the sensor chip.

6. The lens assembly according to claim 4, wherein: The inner support portion is arranged to form a through hole, and the filter covers the through hole.

7. The lens assembly according to claim 4, wherein: The conductive silver paste block includes a first part located in the perfusion channel, a second part connected to the first part and located on the surface of the sensor chip, and a third part connected to the second part and located on the surface of the circuit board, the second part is connected to the second conductive plate, and the third part is connected to the first conductive plate.

8. The lens assembly according to claim 7, wherein: The width of the first portion of the conductive silver paste block is equal to the width of the second portion, and the width of the third portion is smaller than the width of the second portion.

9. The lens assembly according to claim 1, wherein: There are multiple first conductive sheets located on two opposite sides of the circuit board, and there are multiple second conductive sheets located on two opposite sides of the sensor chip. The first conductive sheets and the second conductive sheets are arranged in a one-to-one correspondence.

10. The lens assembly according to claim 2, wherein: The conductive silver paste is energized and solidified to form the conductive silver paste block.

Images