Display module and display device

Abstract

The utility model relates to the technical field of display, and discloses a display module and a display device. The display module can comprise a display panel, a second chip on film, at least two first chip on films and at least two rigid circuit boards, connecting a first chip on film between each rigid circuit board and the display panel; the second chip on film is connected between at least part of two adjacent rigid circuit boards. According to the display module, signal attenuation of at least part of signals on the connector and the flexible circuit board can be reduced, and the eye pattern quality of a large-size high-resolution display panel can be improved; the cost can be reduced by replacing a connector and a flexible circuit board with the second chip-on-film, and the thickness and the size of the second chip-on-film are small, so that the ultrathin design of the display device is facilitated; the second chip-on-film and the first chip-on-film can be subjected to a binding process at the same time, productivity improvement is facilitated, compared with manual insertion, the binding process is higher in precision, and product yield improvement is facilitated.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display module and a display device. Background Art

[0002] In the display industry, whether it is TFT-LCD (thin-film transistor liquid crystal display) or OLED (organic light-emitting diode display), external circuits are required to realize display driving, and external circuits are inseparable from printed circuit boards (PCBs).

[0003] The current method for installing flexible printed circuits (FPCs) involves soldering a clamshell connector onto the PCB, which is then manually plugged into the connector by production line workers. However, in actual production, manual operations can easily lead to errors such as slanted or reverse insertion, causing lighting errors and repetitive work. This manual operation consumes a significant amount of time, impacting product yield and reducing production capacity. Furthermore, signals are severely attenuated after passing through the FPC and connector, resulting in poor eye diagram quality.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Utility Model Content

[0005] The purpose of the present disclosure is to overcome the above-mentioned deficiencies of the prior art and to provide a display module and a display device.

[0006] According to one aspect of the present disclosure, there is provided a display module, comprising:

[0007] Display panel;

[0008] at least two first chip-on-films;

[0009] at least two rigid circuit boards, wherein the first chip-on-film is connected between each of the rigid circuit boards and the display panel;

[0010] The second chip-on-film is connected between at least a portion of the two adjacent rigid circuit boards.

[0011] In an exemplary embodiment of the present disclosure, the second chip-on-film includes:

[0012] A first part is connected to one of the two adjacent rigid circuit boards;

[0013] a second portion connected to the other of the two adjacent rigid circuit boards;

[0014] The connecting portion is connected between the first portion and the second portion.

[0015] In an exemplary embodiment of the present disclosure, a first connecting binding pin is provided at the end of the connecting portion close to the display panel, and a panel binding pin is provided at the end of the display panel close to the second chip-on-film, and the first connecting binding pin is bound and connected to the panel binding pin.

[0016] In an exemplary embodiment of the present disclosure, both the first connection binding pin and the panel binding pin are dummy binding pins.

[0017] In an exemplary embodiment of the present disclosure, a corner portion formed by connecting the first portion and the connecting portion is provided with a chamfer, and a corner portion formed by connecting the second portion and the connecting portion is provided with a chamfer.

[0018] In an exemplary embodiment of the present disclosure, differential signal traces are provided on the second flip chip film.

[0019] In an exemplary embodiment of the present disclosure, the display panel is provided with connection traces, and the second chip-on-film includes:

[0020] A first portion is connected between one of the two adjacent rigid circuit boards and the display panel, and is bound to one end of the connecting wire;

[0021] The second part is connected between the other of the two adjacent rigid circuit boards and the display panel, and is bound to the other end of the connecting wire.

[0022] In an exemplary embodiment of the present disclosure, the first portion and the adjacent first COF are configured as an integrated structure to form an integrated COF, and / or the second portion and the adjacent first COF are configured as an integrated structure to form an integrated COF.

[0023] In an exemplary embodiment of the present disclosure, the end of the integrated chip-on-film connected to the display panel is the first end, and the end of the integrated chip-on-film connected to the rigid circuit board is the second end. The width of the first end along the first direction is smaller than the width of the second end along the first direction. The first direction intersects with the second direction. The second direction is the connection direction of the display panel, the first chip-on-film and the rigid circuit board.

[0024] In an exemplary embodiment of the present disclosure, a plurality of first binding pins are provided at the first end portion, and a plurality of second binding pins are provided at the second end portion; a plurality of third binding pins are provided on the display panel, the third binding pins are bound and connected to the first binding pins, and the pitch and width of the third binding pins are the same as the pitch and width of the first binding pins; a plurality of fourth binding pins are provided on the rigid circuit board, the fourth binding pins are bound and connected to the second binding pins, and the pitch and width of the fourth binding pins are the same as the pitch and width of the second binding pins; the pitch of the first binding pins is smaller than the pitch of the second binding pins, and the width of the first binding pins is smaller than the width of the second binding pins.

[0025] In an exemplary embodiment of the present disclosure, the connecting trace includes a first differential signal trace.

[0026] In an exemplary embodiment of the present disclosure, at least two first chip-on-chip films are connected between the same rigid circuit board and the display panel, the first chip-on-chip film closest to the adjacent rigid circuit board is an integrated chip-on-chip film, one integrated chip-on-chip film and the first part of the second chip-on-chip film are configured as an integral structure, and the other integrated chip-on-chip film and the second part of the second chip-on-chip film are configured as an integral structure.

[0027] In an exemplary embodiment of the present disclosure, the display module further includes:

[0028] The central control board is electrically connected to two adjacent rigid circuit boards, and the second flip chip film is not connected between the two adjacent rigid circuit boards connected to the central control board; or the central control board is electrically connected to one rigid circuit board.

[0029] In an exemplary embodiment of the present disclosure, the one of the two adjacent rigid circuit boards closer to the central control board is a first rigid circuit board, and the one farther from the central control board is a second rigid circuit board; the first portion is connected between the first rigid circuit board and the display panel, and the second portion is connected between the second rigid circuit board and the display panel;

[0030] A second differential signal line is provided on the first portion, and a third differential signal line is provided on the second portion, wherein the second differential signal line and the third differential signal line are connected to opposite ends of the first differential signal line;

[0031] A fourth differential signal trace is provided on the first rigid circuit board, and one end of the fourth differential signal trace is connected to the central control board;

[0032] A fifth differential signal trace is provided on the second rigid circuit board, one end of the fifth differential signal trace is connected to the third differential signal trace, and the other end of the fifth differential signal trace is connected to the first chip-on-film connected to the second rigid circuit board.

[0033] In an exemplary embodiment of the present disclosure, the display module further includes:

[0034] At least two connectors are provided on at least two rigid circuit boards in a one-to-one correspondence;

[0035] The flexible circuit board is connected between two adjacent connectors.

[0036] In an exemplary embodiment of the present disclosure, the flexible circuit board does not extend beyond the rigid circuit board in a second direction, and the second direction is a connection direction of the display panel, the first COF, and the rigid circuit board.

[0037] In an exemplary embodiment of the present disclosure, a solder resist film is disposed on the first COF and the second COF.

[0038] According to another aspect of the present disclosure, there is provided a display device, comprising:

[0039] The display module is any one of the display modules described above.

[0040] The display module disclosed in the present invention realizes data transmission between two adjacent rigid circuit boards through the second chip-on-chip film, reducing the use of flexible circuit boards and connectors. On the one hand, it can reduce the signal attenuation of at least part of the signal on the connector and the flexible circuit board, improve the eye diagram quality of large-size high-resolution display panels, and enhance the reliability of signal connection; on the other hand, using the second chip-on-chip film to replace the connector and the flexible circuit board can reduce costs. The thickness and volume of the second chip-on-chip film are relatively small, which is conducive to the ultra-thin design of the display device and meets the design trend of client products; on the other hand, the second chip-on-chip film and the first chip-on-chip film can be simultaneously bound to the rigid circuit board, eliminating the steps of soldering connectors and manually plugging in flexible circuit boards, which is conducive to improving production capacity. Compared with manual plugging, the binding process has higher precision, which is conducive to improving product yield.

[0041] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0043] Figure 1 Schematic diagram of the area division structure of the display panel in the display module disclosed in the present invention.

[0044] Figure 2 It is a structural diagram of a first exemplary embodiment of the display module disclosed herein.

[0045] Figure 3 It is a partial structural diagram of a second exemplary embodiment of the display module disclosed herein.

[0046] Figure 4 It is a partial structural diagram of a third exemplary embodiment of the display module disclosed herein.

[0047] Figure 5 It is a partial structural diagram of a fourth exemplary embodiment of the display module disclosed herein.

[0048] Figure 6 It is a partial structural diagram of a fifth exemplary embodiment of the display module disclosed herein.

[0049] Figure 7 It is a partial structural diagram of a sixth exemplary embodiment of the display module disclosed herein.

[0050] Figure 8 It is a partial structural diagram of a seventh exemplary embodiment of the display module disclosed herein.

[0051] Figure 9 It is a partial structural diagram of an eighth exemplary embodiment of the display module disclosed herein.

[0052] Figure 10 It is a structural diagram of a ninth exemplary embodiment of the display module disclosed herein.

[0053] Description of reference numerals:

[0054] Panel, display panel; Panel-Lead, panel binding pin;

[0055] PCBA, rigid circuit board; PCBA1, first rigid circuit board; PCBA2, second rigid circuit board;

[0056] COF1, first chip-on-film;

[0057] COFZ, integrated chip-on-film; COFZ1, first end; COFZ2, middle part; COFZ3, second end;

[0058] COF2, second chip-on-film; COF21, first part; COF22, second part; COF23, connection part; COF23-Lead, first connection binding pin;

[0059] CNT, connector; CNT1, first connector; CNT2, second connector;

[0060] FPC, flexible circuit board;

[0061] ZX, connection wiring;

[0062] DS1, first differential signal trace; DS2, second differential signal trace; DS3, third differential signal trace; DS4, fourth differential signal trace;

[0063] TCON, central control panel;

[0064] X, first direction; Y, second direction. DETAILED DESCRIPTION

[0065] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent identical or similar structures, and thus their detailed descriptions will be omitted. Furthermore, the figures are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0066] Although relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used herein for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It will be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0067] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express open-ended inclusion and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0068] In this application, unless otherwise specified or limited, the term "connected" should be understood broadly. For example, "connected" can mean fixed, removable, or integrated; it can be directly connected or indirectly connected through an intermediary. "And / or" simply describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, or B exists alone. Additionally, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0069] The exemplary embodiment of the present disclosure provides a display module, referring to Figures 1-10 As shown, the display module may include a display panel Panel, a second chip-on-film COF2, at least two rigid circuit boards PCBA and at least two first chip-on-film COF1; the first chip-on-film COF1 is connected between each rigid circuit board PCBA and the display panel Panel; the second chip-on-film COF2 is connected between at least part of two adjacent rigid circuit boards PCBA.

[0070] The display module disclosed in the present invention realizes data transmission between two adjacent rigid circuit boards PCBA through the second chip-on-chip film COF2, reducing the use of flexible circuit boards FPC and connectors CNT. On the one hand, it can reduce the signal attenuation of at least part of the signal on the connector CNT and the flexible circuit board FPC, improve the eye diagram quality of the large-size high-resolution display panel Panel, and enhance the signal connection reliability; on the other hand, replacing the connector CNT and the flexible circuit board FPC with the second chip-on-chip film COF2 can reduce costs. The thickness and volume of the second chip-on-chip film COF2 are relatively small, which is conducive to the ultra-thin design of the display device and meets the design trend of client products; on the other hand, the second chip-on-chip film COF2 and the first chip-on-chip film COF1 can be simultaneously bound to the rigid circuit board PCBA, eliminating the steps of soldering the connector CNT and manually plugging the flexible circuit board FPC, which is conducive to improving production capacity. Compared with manual plugging, the binding process has higher precision, which is conducive to improving product yield.

[0071] In some example embodiments of the present disclosure, the display panel Panel may be a liquid crystal display (LCD), an OLED (Organic Electroluminescence Display, organic light-emitting semiconductor) display panel Panel, a QLED (Quantum Dot Light Emitting Diodes, quantum dot light-emitting diode) display panel Panel, a micro-LED (micro-Light Emitting Diode, micro light-emitting diode) display panel Panel, a mini-LED (mini-Light Emitting Diode, sub-millimeter light-emitting diode) display panel Panel, and the like.

[0072] Reference Figure 1 As shown, the display panel Panel has a display area and an AA (Active Area) and a non-display area NAA. Specifically, the non-display area NAA can be arranged around the display area AA. The display panel Panel can be configured as a rectangle, and the display area AA can be configured as a rectangle, so that the non-display area NAA is configured as a rectangular frame.

[0073] For a liquid crystal display panel, the non-display area NAA may include a data binding side DP (Data Pad), a data binding opposite side DPO (Data Pad Opposite), a gate signal output left side GPL (Gate Pad Left), and a gate signal output right side GPR (Gate Pad Left). A gate driver circuit (GOA: Gate Driver On Array) is provided on the gate signal output left side GPL and the gate signal output right side GPR. The gate signal output left side GPL and the gate signal output right side GPR are arranged relative to each other in a first direction X. The gate signal output left side GPL generally corresponds to the coverage area of the left frame, and the gate signal output right side GPR generally corresponds to the coverage area of the right frame. The data binding side DP generally corresponds to the coverage area of the lower frame. The data binding side DP and the data binding opposite side DPO are arranged relative to each other in a second direction Y. The data binding opposite side DPO generally corresponds to the coverage area of the upper frame.

[0074] The data binding side DP may include a fan-out area Fanout and a binding area BOD, and the display area AA and the binding area BOD are connected to opposite sides of the second direction Y of the fan-out area Fanout, that is, the fan-out area Fanout is connected between the display area AA and the binding area BOD, specifically, the fan-out area Fanout is connected to the display area AA, and the binding area BOD is connected to the side of the fan-out area Fanout away from the display area AA; various routings are arranged in the fan-out area Fanout; a plurality of binding pins are arranged in the binding area BOD, some of the binding pins are used to bind the driver integrated circuit IC, and the other part of the binding pins are used to bind the first cover chip film COF1.

[0075] For other display panels, the non-display area NAA may include a data pad (DP) side, a data pad opposite side (DPO) side, and a first area and a second area opposite to each other in the first direction X.

[0076] It should be noted that in the present disclosure, the first direction X and the second direction Y are both parallel to the display surface of the display panel Panel, and the second direction Y is the connection direction of the display panel Panel, the first chip-on-film COF1, and the rigid circuit board PCBA. The first direction X intersects with the second direction Y. For example, the first direction X is perpendicular to the second direction Y.

[0077] The display panel Panel may include a base substrate, and a driving circuit layer group is provided on one side of the base substrate; the material of the base substrate may include an inorganic material, for example, the inorganic material may be glass, quartz or metal. The material of the base substrate may also include an organic material, for example, the organic material may be a resin material such as polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate and polyethylene naphthalate. The base substrate may be formed by multiple material layers, for example, the base substrate may include multiple base material layers, and the material of the base material layer may be any of the above materials. Of course, the base substrate may also be set as a single layer, which may be any of the above materials. The driving circuit layer group may include a plurality of transistors arranged in an array.

[0078] For liquid crystal display panels, they may also include a first electrode layer, an insulating layer, and a second electrode layer stacked in sequence. For OLED display panels, they may also include a first electrode layer, a pixel definition layer, a light-emitting layer group, a second electrode layer, an encapsulation layer group, and so on stacked in sequence.

[0079] Reference Figure 2As shown, at least two rigid circuit boards (PCBAs) can be provided, for example, two, three, or more rigid circuit boards (PCBAs); at least two first chip-on-film (COFs) (COFs) can also be provided, for example, two, three, or more first chip-on-film (COFs) can be provided. A first chip-on-film (COF) 1 is connected between each rigid circuit board (PCBA) and the display panel (Panel). Specifically, one end of the first chip-on-film (COF) 1 is bonded to the data-binding side DP of the display panel (Panel), and the other end of the first chip-on-film (COF) 1 is bonded to the rigid circuit board (PCBA), such that the first chip-on-film (COF) 1 is electrically connected between the rigid circuit board (PCBA) and the display panel (Panel). Signals can be transmitted between the rigid circuit board (PCBA) and the display panel (Panel) via the first chip-on-film (COF) 1.

[0080] The first chip-on-film COF1 can be bent so that the rigid circuit board PCBA can be located on the non-display side of the display panel Panel, thereby reducing the width of the non-display area NAA of the display panel Panel, which is conducive to achieving a narrow frame setting.

[0081] Rigid circuit boards (PCBAs) can provide support, interconnection, and signal transmission functions for various electronic components. The entire process of mounting a blank printed circuit board (PCB) through SMT (Surface Mount Technology) or DIP (Dual Inline-pin Package) plug-in is referred to as PCBA (Printed Circuit Board Assembly), which can also be called assembly.

[0082] Because printed circuit board (PCB) manufacturers, component assembly plants, and display panel module bonding processes are all unable to handle extra-long PCBs, related technologies require at least two rigid PCBs (PCBAs) to be installed on large display panels. Flexible PCBs (FPCs) are then used to connect adjacent rigid PCBs for data transmission. A flexible PCB (FPC) consists of a base material, copper foil, and a cover layer. The base material is typically made of flexible materials such as polyimide (PI) or polyester film, offering bendability, foldability, and lightweight properties. The copper foil serves as a conductive layer, forming the circuit pattern through processes such as etching. The thickness of the copper foil can be selected based on application requirements. The cover layer is typically an insulating material, providing circuit protection and insulation. It can be polyimide film, polyester film, or other insulating materials. When installing electronic components on the flexible PCB, they must be soldered to the FPC. The commonly used FPC installation method involves soldering a flip-top connector (CNT) onto the PCB, which is then manually plugged into the connector by production line workers. However, in the actual production process, production line workers are prone to errors such as oblique insertion and reverse insertion during manual operations, which can cause abnormal lighting and repetitive operations. Manual operations also consume a lot of working hours, which not only affects product yield but also reduces production capacity.

[0083] In addition, as display panels develop towards ultra-large sizes and higher refresh rates, the signal transmission distance is getting longer and longer, and the transmission rate requirements are getting higher and higher. The attenuation of the transmission signal on the connector CNT and the flexible circuit board FPC is also getting larger and larger, resulting in the deterioration of the product eye diagram quality, seriously affecting the client's product certification schedule and affecting product quality.

[0084] Furthermore, with the trend toward thinner products from OEMs, more and more OEMs are requiring a reverse-insertion design for flexible printed circuits (FPCs). This means that before the first COF1 is bent, the main body of the FPC is positioned closer to the display panel relative to the connector. Furthermore, the FPC is required to not extend beyond the edge of the rigid PCBA. This results in a narrower FPC, limiting the space for traces, and typically necessitating a multi-layer design. As resolutions increase, and pixel density increases, the number of traces on the FPC increases, putting increasing pressure on the FPC's trace space. Some even require a 4- or 6-layer design, or extreme compression of trace width and spacing to meet customer requirements for the FPC to not extend beyond the edge of the rigid PCBA after reverse insertion. This significantly increases product cost and the FPC's impedance, impacting product performance.

[0085] In this example embodiment, referring to Figure 2 As shown, a second COF2 is connected between at least some adjacent rigid circuit boards (PCBAs). For example, no second COF2 is provided between two adjacent rigid circuit boards (PCBAs) connected to the central control board (TCON), but a second COF2 is provided between other adjacent rigid circuit boards (PCBAs). Of course, in another exemplary embodiment of the present disclosure, a second COF2 may be provided between all adjacent rigid circuit boards (PCBAs).

[0086] Specifically, one end of the second chip-on-film COF2 is bound to a rigid circuit board PCBA, and the other end of the second chip-on-film COF2 is bound to another rigid circuit board PCBA; signal transmission between two adjacent rigid circuit boards PCBA is realized through the second chip-on-film COF2, reducing the use of flexible circuit boards FPC and connectors CNT. On the one hand, the signal attenuation of at least part of the signal on the connector CNT and the flexible circuit board FPC can be reduced, the eye diagram quality of the large-size high-resolution display panel Panel can be improved, and the signal connection reliability is improved; on the other hand, replacing the connector CNT and the flexible circuit board FPC with the second chip-on-film COF2 can reduce costs. The thickness and volume of the second chip-on-film COF2 are small, which is conducive to the ultra-thin design of the display device and meets the client product design trend; on the other hand, the second chip-on-film COF2 and the first chip-on-film COF1 can be simultaneously bound to the rigid circuit board PCBA, eliminating the steps of soldering the connector CNT and manually plugging the flexible circuit board FPC, which is conducive to improving production capacity. Compared with manual plugging, the binding process has higher accuracy and is less likely to cause errors such as oblique insertion and reverse insertion, which is conducive to improving product yield.

[0087] The bonding process involves thermal bonding using various conditions (temperature, pressure, and time) using ACF (Anisotropic Conductive Film). Specifically, anisotropic conductive adhesive is applied to the rigid circuit board PCBA. The first COF1 and the second COF2 are then aligned and placed on the rigid circuit board PCBA where the anisotropic conductive adhesive is applied. The first COF1 and the second COF2 are then pressed onto the rigid circuit board PCBA using a bonding device, and the pressure is maintained for a set period of time under set temperature conditions.

[0088] Chip On Flex (COF) is a chip-on-film packaging technology that fixes a drive integrated circuit (Drive IC) on a flexible printed circuit board. It uses a flexible additional circuit board as a carrier for packaging the chip to combine the chip with the flexible substrate circuit, or specifically refers to the flexible additional circuit board without a packaged chip. Specifically, a COF usually consists of a substrate, metal lines, and a drive chip. The substrate generally uses flexible materials such as polyimide (PI), which has good flexibility, heat resistance, and insulation, and can adapt to various complex shapes and bending requirements. The metal lines usually use metal materials with good electrical conductivity such as copper, and form tiny circuit patterns on the substrate through fine manufacturing techniques. The drive chip is the core component of the COF, responsible for controlling functions such as image display and signal processing of the display screen. The drive chip is directly installed on the film through flip chip technology. Compared with the traditional wire bonding technology, it has a higher connection density and a smaller package size, meeting the development trend of thinner and lighter electronic products; moreover, the flip chip technology can provide a more stable connection, reduce interference and loss in signal transmission, and improve the reliability of the product; the fine metal lines and advanced manufacturing techniques can achieve high-resolution signal transmission and improve the image display quality of the display screen.

[0089] The first COF1 uses a flexible additional circuit board as a carrier for packaging the chip to combine the chip with the flexible substrate circuit. The second COF2 specifically refers to the flexible additional circuit board without a packaged chip.

[0090] In some exemplary embodiments of the present disclosure, referring to Figure 3 and Figure 4 as shown, the second COF2 may include a first part COF21, a second part COF22, and a connecting part COF23; the first part COF21 is connected to one of two adjacent rigid circuit boards PCBA. Specifically, one end of the first part COF21 is bonded to one of two adjacent rigid circuit boards PCBA; the second part COF22 is connected to the other of two adjacent rigid circuit boards PCBA. Specifically, one end of the second part COF22 is bonded to the other of two adjacent rigid circuit boards PCBA. The connecting part COF23 is connected between the first part COF21 and the second part COF22. Specifically, the connecting part COF23 is connected between one end of the first part COF21 far from the rigid circuit board PCBA and one end of the second part COF22 far from the rigid circuit board PCBA, so that the second COF2 forms a structure roughly like a "冂".

[0091] The corner formed by connecting the first portion COF21 and the connecting portion COF23 is provided with a chamfer, and the corner formed by connecting the second portion COF22 and the connecting portion COF23 is provided with a chamfer. Figure 3 and Figure 4 As shown, the corner formed by the connection between the first COF 21 and the connection COF 23, which is close to the second COF 22, is configured as a rounded chamfer; the edge of the side away from the second COF 22 after the first COF 21 and the connection COF 23 are configured as a straight line. The corner formed by the connection between the second COF 22 and the connection COF 23, which is close to the first COF 21, is configured as a rounded chamfer; the edge of the side away from the first COF 21 after the second COF 22 and the connection COF 23 are configured as a straight line. Such a configuration increases the connection length between the first portion COF21 and the connecting portion COF23, and avoids the formation of sharp corners, thereby increasing the connection strength between the first portion COF21 and the connecting portion COF23, and avoiding tearing between the first portion COF21 and the connecting portion COF23 during transportation and testing; similarly, the connection length between the second portion COF22 and the connecting portion COF23 is increased, and avoids the formation of sharp corners, thereby increasing the connection strength between the second portion COF22 and the connecting portion COF23, and avoiding tearing between the second portion COF22 and the connecting portion COF23 during transportation and testing.

[0092] Alternatively, refer to Figure 3 As shown, a first connecting binding pin COF23-Lead is provided at the end of the connecting portion COF23 close to the display panel Panel, and a panel binding pin Panel-Lead is provided at the end of the display panel Panel close to the second chip-on-chip film COF2. The first connecting binding pin COF23-Lead is bound and connected to the panel binding pin Panel-Lead, so that the end of the connecting portion COF23 close to the display panel Panel is bound and connected to the display panel Panel, thereby fixing both ends of the second chip-on-chip film COF2, so that after the display panel Panel is installed on the display device, the second chip-on-chip film COF2 can be bent together with the first chip-on-chip film COF1, so that the display device is more stable in structure.

[0093] The first connection binding pin COF23-Lead and the panel binding pin Panel-Lead can be unconnected. In other words, both the first connection binding pin COF23-Lead and the panel binding pin Panel-Lead are dummy binding pins that have no electrical connection and do not require power. This configuration allows the display panel to be fabricated by simply adding the panel binding pin Panel-Lead to the substrate without changing the design of other mask plates. On the rigid circuit board PCBA, only the binding pins required for bonding the second COF2 need to be added to the existing ones.

[0094] In terms of process technology, the second chip-on-chip film COF2 can be directly mechanically bound to the first chip-on-chip film COF1 without adding additional process technology, and there will be no interference with devices during binding. The operation of manual plug-in of flexible circuit boards FPC is eliminated, which is conducive to improving production capacity. Compared with manual plug-in, the binding accuracy is higher, which is conducive to improving product yield. Compared with the connector CNT and the flexible circuit board FPC, the use of the second chip-on-chip film COF2 greatly saves costs.

[0095] Of course, in some other exemplary embodiments of the present disclosure, Figure 2 and Figure 4 As shown, the end portion of the connection portion COF23 close to the display panel Panel may not be bound and connected to the display panel Panel. In this case, the lengths of the first portion COF21 and the second portion COF22 may be set to be smaller.

[0096] Alternatively, refer to Figure 4 As shown, differential signal lines can be set on the second cover chip film COF2. For example, only differential signal lines can be set on the second cover chip film COF2. In this case, the display module can also include a flexible circuit board FPC and at least two connectors CNT. The at least two connectors CNT are arranged on at least two rigid circuit boards PCBA in a one-to-one correspondence, that is, a connector CNT is arranged on a rigid circuit board PCBA. Taking two rigid circuit boards PCBA and two connectors CNT as an example, the two connectors CNT are a first connector CNT1 and a second connector CNT2. The first connector CNT1 is arranged on one of the two adjacent rigid circuit boards PCBA; the second connector CNT2 is arranged on the other of the two adjacent rigid circuit boards PCBA; the flexible circuit board FPC is connected between the two adjacent connectors CNT, that is, the flexible circuit board FPC is connected between the first connector CNT1 and the second connector CNT2; other lines are set on the flexible circuit board FPC, and the other lines may include GOA (Gate on Array) signal lines, Gamma signal lines, power signal lines and control signal lines, etc.

[0097] Since the differential signal has the greatest attenuation, this arrangement allows the differential signal with the greatest attenuation to be transmitted through the second chip-on-film COF2, thereby avoiding signal attenuation of the differential signal on the flexible circuit board FPC and the connector CNT, thereby improving the eye diagram quality; and this solution does not require changes to the mask plate design, which is conducive to quickly improving product quality.

[0098] In this case, the number of traces provided on the flexible circuit board FPC is reduced, so that the flexible circuit board FPC can be provided narrower, for example, the flexible circuit board FPC does not extend beyond the rigid circuit board PCBA in the second direction Y to meet customer requirements.

[0099] Of course, in some other example embodiments of the present disclosure, in addition to differential signal lines, control signal lines can be set on the second flip chip film COF2, and other lines can be set on the flexible circuit board FPC. The other lines may include GOA (Gate on Array) signal lines, Gamma signal lines, power signal lines, etc.

[0100] In some example embodiments of the present disclosure, reference is made to Figure 5-Figure 9 As shown, a connecting trace ZX may be provided on the display panel Panel, and the second cover chip film COF2 may include a first part COF21 and a second part COF22; the first part COF21 is connected between one of two adjacent rigid circuit boards PCBA and the display panel Panel, and is bound to one end of the connecting trace ZX; specifically, the first part COF21 has a first end and a second end that are relatively arranged, a first binding pin is provided at the first end, and a second binding pin is provided at the second end, the first binding pin is bound and connected to the rigid circuit board PCBA, and the second binding pin is bound to one end of the connecting trace ZX, so that the signal trace on the first part COF21 is electrically connected to the connecting trace ZX on the display panel Panel, and the signal trace on the first part COF21 is also electrically connected to the trace on a rigid circuit board PCBA.

[0101] The second part COF22 is connected between another rigid circuit board PCBA and the display panel Panel, and is bound to the other end of the connecting trace ZX; specifically, the second part COF22 has a third end and a fourth end arranged relatively to each other, a third binding pin is provided at the third end, and a fourth binding pin is provided at the fourth end. The third binding pin is bound and connected to the rigid circuit board PCBA, and the fourth binding pin is bound to the other end of the connecting trace ZX, so that the signal trace on the second part COF22 is electrically connected to the connecting trace ZX on the display panel Panel, and the signal trace on the second part COF22 is also conductively connected to the trace on another rigid circuit board PCBA, thereby realizing electrical connectivity between the two adjacent rigid circuit boards PCBA.

[0102] Reference Figure 5 As shown, the first portion COF21 and the first chip-on-film COF1 are separately provided, and the second portion COF22 and the first chip-on-film COF1 are also separately provided.

[0103] In this arrangement, both ends of the first portion COF21 and the second portion COF22 of the second chip-on-chip film COF2 are fixed, so that after the display panel Panel is installed on the display device, the first portion COF21 and the second portion COF22 of the second chip-on-chip film COF2 can be bent together with the first chip-on-chip film COF1, making the display device more structurally stable; moreover, the structure of the second chip-on-chip film COF2 is simpler; in terms of process flow, the second chip-on-chip film COF2 can also be bound together with the first chip-on-chip film COF1.

[0104] Generally, 60, 68, or 80 traces need to be provided on the second chip-on-film COF2. Therefore, 60, 68, or 80 connecting traces ZX are also provided on the display panel Panel. The connecting traces ZX can be formed on the display panel Panel by changing the structure of the mask plate. Moreover, providing the above number of connecting traces ZX on the display panel Panel is achievable.

[0105] Alternatively, refer to Figure 6-Figure 8 As shown, the first part COF21 and the adjacent first flip chip film COF1 can be set as an integrated structure to form a comprehensive flip chip film COFZ, that is, one first flip chip film COF1 is set larger, and a part of the first flip chip film COF1 is still used as the first flip chip film COF1, and a driver integrated circuit IC is set in the part used as the first flip chip film COF1; the other part of the first flip chip film COF1 is used as the first part COF21 of the second flip chip film COF2, and there is no need to set a driver integrated circuit IC in this part, and it only needs to be connected by wiring.

[0106] The second part COF22 and the adjacent first flip chip film COF1 can be set as an integrated structure to form an integrated flip chip film COFZ, that is, the other first flip chip film COF1 is set larger, and a part of the first flip chip film COF1 is still used as the first flip chip film COF1, and a driver integrated circuit IC is set in the part used as the first flip chip film COF1; the other part of the first flip chip film COF1 is used as the second part COF22 of the second flip chip film COF2, and there is no need to set a driver integrated circuit IC in this part, and it only needs to be connected by wiring.

[0107] Such a setting can ensure the uniformity of pre-shrinkage during the binding process; the structure of the integrated flip chip film COFZ in the present disclosure is basically the same as the structure of the first flip chip film COF1 in the related art, except that the integrated flip chip film COFZ in the present disclosure is larger and has more binding pins; and the alignment of the second flip chip film COF2 is reduced, making the binding process simpler.

[0108] Generally, the second chip-on-chip film COF2 actually requires 68 or 80 traces. Since the size of the chip-on-chip film COF raw material is fixed, for low-resolution display panel panels and display panel panels with a large number of integrated chip-on-chip films COFZ, for example: for a 720-channel display panel panel, there are 12 integrated chip-on-chip films COFZ. The raw material specifications of the existing integrated chip-on-chip film COFZ can meet the channel requirements of the integrated design of the first part COF21 and the first chip-on-chip film COF1 and the channel requirements of the integrated design of the second part COF22 and the first chip-on-chip film COF1. Therefore, there is no need to replace the existing first chip-on-chip film COF1, which reduces costs. It is also necessary to set a connecting trace ZX on the display panel Panel to realize the connection between the first part COF21 and the second part COF22.

[0109] Of course, in some other example embodiments of the present disclosure, the first portion COF21 and the adjacent first chip-on-chip film COF1 may be configured as an integral structure, while the second portion COF22 and the adjacent first chip-on-chip film COF1 may be configured as a separate structure; or the second portion COF22 and the adjacent first chip-on-chip film COF1 may be configured as an integral structure, while the first portion COF21 and the adjacent first chip-on-chip film COF1 may be configured as a separate structure.

[0110] Alternatively, refer to Figure 7 and Figure 8As shown, the end of the integrated chip-on-film (COFZ) connected to the display panel is the first end COFZ1, and the end of the integrated chip-on-film (COFZ) connected to the rigid circuit board (PCBA) is the second end COFZ3. The width of the first end COFZ1 along the first direction X is smaller than the width of the second end COFZ3 along the first direction X. This configuration reduces the size of the integrated chip-on-film (COFZ) raw material, retaining only the required number of channels on the display panel end.

[0111] A plurality of first binding pins are provided at the first end COFZ1, and the pitch and width of the plurality of first binding pins are the same, that is, the pitch of the first binding pins used as the first chip-on-film COF1 is the same as the pitch of the first binding pins used as the second chip-on-film COF2, and the width of the first binding pins used as the first chip-on-film COF1 is the same as the width of the first binding pins used as the second chip-on-film COF2, thereby ensuring the uniformity of pre-shrinkage during binding.

[0112] A plurality of second binding pins are provided at the second end COFZ3, and the pitch and width of the plurality of second binding pins are the same, that is, the pitch of the second binding pins used as the first chip-on-film COF1 is the same as the pitch of the second binding pins used as the second chip-on-film COF2, and the width of the second binding pins used as the first chip-on-film COF1 is the same as the width of the second binding pins used as the second chip-on-film COF2, thereby ensuring the uniformity of pre-shrinkage during binding.

[0113] The display panel is provided with a plurality of third binding pins, which are bound and connected to the first binding pins. The plurality of third binding pins have the same pitch and width. Specifically, the pitch of the third binding pins bound to the first chip-on-film (COF) 1 is the same as the pitch of the third binding pins bound to the second chip-on-film (COF) 2, and the width of the third binding pins bound to the first chip-on-film (COF) 1 is the same as the width of the third binding pins bound to the second chip-on-film (COF) 2, thereby ensuring uniform pre-shrinkage during binding.

[0114] In order to ensure the uniformity of pre-shrinkage of the binding pins on the display panel Panel and the binding pins of the first end COFZ1 of the integrated chip-on-film COFZ during binding, the pitch (Pitch) of the binding pins on the display panel Panel is the same as the pitch (Pitch) of the binding pins of the first end COFZ1 of the integrated chip-on-film COFZ, and the width of the binding pins on the display panel Panel is also the same as the width of the binding pins of the first end COFZ1 of the integrated chip-on-film COFZ; that is, the pitch of the third binding pin is the same as the pitch of the first binding pin, that is, the width of the third binding pin is also the same as the width of the first binding pin.

[0115] A plurality of fourth binding pins are provided on the rigid circuit board PCBA, and are bonded to the second binding pins. The plurality of fourth binding pins have the same pitch and width. Specifically, the pitch of the fourth binding pins bonded to the first chip-on-film (COF) 1 is the same as the pitch of the fourth binding pins bonded to the second chip-on-film (COF) 2, and the width of the fourth binding pins bonded to the first chip-on-film (COF) 1 is the same as the width of the fourth binding pins bonded to the second chip-on-film (COF) 2, thereby ensuring uniform pre-shrinkage during bonding.

[0116] Similarly, in order to ensure the uniformity of pre-shrinkage of the binding pins COFZ3 at the second end of the integrated chip-on-film COFZ and the binding pins on the rigid circuit board PCBA during binding, the pitch (Pitch) of the binding pins on the rigid circuit board PCBA is the same as the pitch (Pitch) of the binding pins COFZ1 at the first end of the integrated chip-on-film COFZ, and the width of the binding pins on the rigid circuit board PCBA is also the same as the width of the binding pins COFZ1 at the first end of the integrated chip-on-film COFZ, that is, the pitch of the fourth binding pin is the same as the pitch of the second binding pin, that is, the width of the fourth binding pin is also the same as the width of the second binding pin.

[0117] However, since the pitch (Pitch) and width of the binding pins on the rigid circuit board PCBA cannot be made small enough, that is, the pitch of the fourth binding pin is larger than the pitch of the third binding pin, and the width of the fourth binding pin is larger than the width of the third binding pin; even if it can be made small enough, it requires a higher cost and a lower yield; therefore, the width of the first end COFZ1 along the first direction X is smaller than the width of the second end COFZ3 along the first direction X, so that the pitch (Pitch) and width of the binding pins of the first end COFZ1 on the integrated chip-on-film COFZ can be set smaller to match the binding pins on the display panel Panel, and the pitch (Pitch) and width of the binding pins of the second end COFZ3 on the integrated chip-on-film COFZ can be set larger to match the binding pins on the rigid circuit board PCBA, that is, the pitch of the first binding pin is smaller than the pitch of the second binding pin, and the width of the first binding pin is smaller than the width of the second binding pin.

[0118] Reference Figure 7As shown, the integrated chip-on-chip film COFZ can be set to a symmetrical structure, and the symmetry axis is the central axis of the integrated chip-on-chip film COFZ extending along the second direction Y, so that the integrated chip-on-chip film COFZ can be set to a roughly isosceles trapezoidal structure. Specifically, the integrated chip-on-chip film COFZ may include a first end COFZ1, a middle part COFZ2 and a second end COFZ3 connected in sequence. The first end COFZ1 and the second end COFZ3 can be set to a rectangle, and the middle part COFZ2 can be set to an isosceles trapezoid.

[0119] Reference Figure 8 As shown, the integrated chip-on-film COFZ can be set to an asymmetric structure. For example, the integrated chip-on-film COFZ can be set to a structure that is roughly a right-angled trapezoid. Specifically, the integrated chip-on-film COFZ can include a first end COFZ1, a middle part COFZ2 and a second end COFZ3 connected in sequence. The first end COFZ1 and the second end COFZ3 can be set to a rectangle, and the middle part COFZ2 can be set to a right-angled trapezoid.

[0120] Of course, in some other example embodiments of the present disclosure, the integrated chip-on-film COFZ can be set to a structure that is roughly a non-isosceles trapezoid. Specifically, the integrated chip-on-film COFZ may include a first end COFZ1, a middle part COFZ2, and a second end COFZ3 connected in sequence. The first end COFZ1 and the second end COFZ3 can be set to a rectangle, and the middle part COFZ2 can be set to a non-isosceles trapezoid.

[0121] Reference Figure 2 and Figure 9 As shown, in some example embodiments of the present disclosure, the connection traces ZX provided on the display panel Panel may include first differential signal traces DS1 .

[0122] At least two first chip-on-films (COFs) 1 are provided between the same rigid circuit board PCBA and the display panel Panel. For example, three first chip-on-films (COFs) 1 may be provided between the same rigid circuit board PCBA and the display panel Panel. Of course, in some other exemplary embodiments of the present disclosure, four or more first chip-on-films (COFs) 1 may be provided between the same rigid circuit board PCBA and the display panel Panel.

[0123] The first COF1 closest to the adjacent rigid circuit board PCBA is a COFZ. The COFZ is integrated with the first portion COF21 of the second COF2, i.e., the COFZ includes the first COF1 and the first portion COF21, which are integrated into one structure. Another COFZ is integrated with the second portion COF22 of the second COF2, i.e., the COFZ includes the first COF1 and the second portion COF22, which are integrated into one structure.

[0124] The first chip on film COF1 away from the adjacent rigid circuit board PCBA is still the original first chip on film COF1 and is not combined with the first portion COF21 or the second portion COF22 of the second chip on film COF2 to form an integrated structure.

[0125] Reference Figure 2 As shown, the display module may also include a central control board TCON, which is electrically connected to two adjacent rigid circuit boards PCBA. Various display signals can be directly transmitted to the two adjacent rigid circuit boards PCBA via the central control board TCON. Therefore, the second flip film COF2 is not connected between the two adjacent rigid circuit boards PCBA connected to the central control board TCON. For example, the rigid circuit boards PCBA can be provided in four configurations. The two middle rigid circuit boards PCBA can be connected to the central control board TCON via an FFC (Flexible Flat Cable), the two rigid circuit boards PCBA on the left can be connected via the second flip film COF2, and the two rigid circuit boards PCBA on the right can be connected via the second flip film COF2.

[0126] Of course, in some other exemplary embodiments of the present disclosure, the central control board TCON is electrically connected to a rigid circuit board PCBA, for example, Figure 10 As shown, the rigid circuit board PCBA can be set to three, the middle rigid circuit board PCBA can be connected to the central control board TCON through an FFC (Flexible Flat Cable), the two rigid circuit boards PCBA on the left can be connected through the second chip-on-chip film COF2, and the two rigid circuit boards PCBA on the right can be connected through the second chip-on-chip film COF2.

[0127] In the case where two rigid circuit boards PCBA can be provided, one rigid circuit board PCBA can be connected to the central control board TCON via an FFC (Flexible Flat Cable), and the two rigid circuit boards PCBA can be connected via a second chip on film COF2.

[0128] In addition, the number of rigid circuit boards PCBAs can also be other numbers, and the specific connection methods are not described here one by one.

[0129] In this case, refer to Figure 2 and Figure 9 As shown, the one of the two adjacent rigid circuit boards PCBA that is close to the central control board TCON is the first rigid circuit board PCBA1, and the one that is far away from the central control board TCON is the second rigid circuit board PCBA2. The first part COF21 is connected between the first rigid circuit board PCBA1 and the display panel Panel, and the second part COF22 is connected between the second rigid circuit board PCBA2 and the display panel Panel.

[0130] A second differential signal line DS2 is provided on the first part COF21, and a third differential signal line DS3 is provided on the second part COF22. The second differential signal line DS2 and the third differential signal line DS3 are connected to the opposite ends of the first differential signal line DS1. Specifically, the second differential signal line DS2 and the third differential signal line DS3 are connected to the opposite ends of the first differential signal line DS1 through binding. Therefore, the number of the first differential signal lines DS1, the number of the second differential signal lines DS2, and the number of the third differential signal lines DS3 are the same.

[0131] A fourth differential signal trace DS4 is provided on the first rigid circuit board PCBA1, and one end of the fourth differential signal trace DS4 is connected to the central control board TCON.

[0132] A fifth differential signal trace DS5 is provided on the second rigid circuit board PCBA2. One end of the fifth differential signal trace DS5 is connected to the third differential signal trace DS3. The number of the fifth differential signal traces DS5 can be the same as the number of the third differential signal traces DS3. The other end of the fifth differential signal trace DS5 is connected to the first chip-on-film (COF) 1 connected to the second rigid circuit board PCBA2. Differential signals are sequentially transmitted through the fourth differential signal trace DS4, the second differential signal trace DS2, the first differential signal trace DS1, the third differential signal trace DS3, and the fifth differential signal trace DS5 to each first chip-on-film (COF) 1, and then transmitted to the display panel (Panel) through each first chip-on-film (COF) 1.

[0133] It should be noted that the differential signal traces are set in pairs. Figure 9 The lines in the figure represent a pair of differential signal traces. The structures of other signal traces connected through the first and second parts are basically the same as those of differential signal traces, so they are not described here in detail.

[0134] Optionally, the display module may further include a flexible circuit board FPC and at least two connectors CNT, and the at least two connectors CNT are arranged on at least two rigid circuit boards PCBA in a one-to-one correspondence, that is, a connector CNT is arranged on a rigid circuit board PCBA, and taking two rigid circuit boards PCBA and two connectors CNT as an example for explanation, the two connectors CNT are a first connector CNT1 and a second connector CNT2, the first connector CNT1 is arranged on one of the two adjacent rigid circuit boards PCBA, for example, the first connector CNT1 is arranged on the first rigid circuit board PCBA1; the second connector CNT is arranged on the other of the two adjacent rigid circuit boards PCBA, for example, the second connector CNT2 is arranged on the second rigid circuit board PCBA2; the flexible circuit board FPC is connected between the two adjacent connectors CNT, that is, the flexible circuit board FPC is connected between the first connector CNT1 and the second connector CNT2; other traces are arranged on the flexible circuit board FPC, and the other traces may include GOA (Gate on Array) signal traces, Gamma signal traces, power signal traces, control signal traces, etc.

[0135] Since the differential signal has the greatest attenuation, this arrangement allows the differential signal with the greatest attenuation to be transmitted through the second chip-on-film COF2, thereby avoiding signal attenuation of the differential signal on the flexible circuit board FPC and the connector CNT, thereby improving the eye diagram quality; and this solution does not require changes to the mask plate design, which is conducive to quickly improving product quality.

[0136] In this case, the number of traces provided on the flexible circuit board FPC is reduced, so that the flexible circuit board FPC can be provided narrower, for example, the flexible circuit board FPC does not extend beyond the rigid circuit board PCBA in the second direction Y to meet customer requirements.

[0137] Of course, in some other example embodiments of the present disclosure, in addition to differential signal lines, control signal lines can be set on the second flip chip film COF2, and other lines can be set on the flexible circuit board FPC. The other lines may include GOA (Gate on Array) signal lines, Gamma signal lines, power signal lines, etc.

[0138] Optionally, a solder resist (SR) film is provided on the first COF1 and the second COF2. Common solder resist materials include dry film and liquid film. Dry film solder resist is formed by covering the surface of the second COF2 with a prefabricated dry film layer and fusing it with the surface of the second COF2 under high temperature and pressure; liquid film solder resist is formed by coating the surface of the second COF2 with a liquid solder resist material and curing it on the surface of the second COF2 by thermal curing or ultraviolet irradiation. The solder resist can also increase the strength of the second COF2 and prevent the second COF2 from tearing during transportation and testing.

[0139] Based on the same inventive concept, an exemplary embodiment of the present disclosure provides a display device, which may include any of the display modules described above. The specific structure of the display module has been described in detail above, so it will not be repeated here.

[0140] The specific type of the display device is not particularly limited, and any type of display device commonly used in the field can be used, such as mobile devices such as mobile phones, wearable devices such as watches, VR devices, etc. Those skilled in the art can make corresponding choices based on the specific purpose of the display device, which will not be repeated here.

[0141] It should be noted that, in addition to the array substrate, the display device also includes other necessary components and components. Taking the display as an example, these include a housing, a circuit board, a power cord, etc. Those skilled in the art can make corresponding supplements based on the specific usage requirements of the display device, which will not be elaborated here.

[0142] Compared with the prior art, the beneficial effects of the display device provided by the exemplary embodiment of the present invention are the same as the beneficial effects of the array substrate provided by the above exemplary embodiment, and are not described in detail here.

[0143] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the utility model disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A display module, characterized in that: include: Display panel; at least two first chip-on-films; at least two rigid circuit boards, wherein the first chip-on-film is connected between each of the rigid circuit boards and the display panel; The second chip-on-film is connected between at least a portion of the two adjacent rigid circuit boards.

2. The display module according to claim 1, wherein: The second flip chip film includes: A first part is connected to one of the two adjacent rigid circuit boards; a second portion connected to the other of the two adjacent rigid circuit boards; The connecting portion is connected between the first portion and the second portion.

3. The display module according to claim 2, wherein: The end of the connecting portion close to the display panel is provided with a first connecting binding pin, the end of the display panel close to the second COF is provided with a panel binding pin, and the first connecting binding pin is bound and connected to the panel binding pin.

4. The display module according to claim 3, wherein: The first connection binding pin and the panel binding pin are both dummy binding pins.

5. The display module according to claim 2, wherein: A corner portion formed by connecting the first portion and the connecting portion is provided with a chamfer, and a corner portion formed by connecting the second portion and the connecting portion is provided with a chamfer.

6. The display module according to claim 2, wherein: Differential signal traces are arranged on the second flip chip film.

7. The display module according to claim 1, wherein: The display panel is provided with connection wiring, and the second flip chip film includes: A first portion is connected between one of the two adjacent rigid circuit boards and the display panel, and is bound to one end of the connecting wire; The second part is connected between the other of the two adjacent rigid circuit boards and the display panel, and is bound to the other end of the connecting wire.

8. The display module according to claim 7, wherein: The first portion and the adjacent first chip-on-film are configured as an integrated structure to form a comprehensive chip-on-film, and / or the second portion and the adjacent first chip-on-film are configured as an integrated structure to form a comprehensive chip-on-film.

9. The display module according to claim 8, wherein: The end of the integrated chip-on-film connected to the display panel is the first end, and the end of the integrated chip-on-film connected to the rigid circuit board is the second end. The width of the first end along the first direction is smaller than the width of the second end along the first direction. The first direction intersects with the second direction. The second direction is the connection direction of the display panel, the first chip-on-film and the rigid circuit board.

10. The display module according to claim 9, wherein: A plurality of first binding pins are provided at the first end portion, and a plurality of second binding pins are provided at the second end portion; a plurality of third binding pins are provided on the display panel, the third binding pins are bound and connected to the first binding pins, and the pitch and width of the third binding pins are the same as the pitch and width of the first binding pins; a plurality of fourth binding pins are provided on the rigid circuit board, the fourth binding pins are bound and connected to the second binding pins, and the pitch and width of the fourth binding pins are the same as the pitch and width of the second binding pins; the pitch of the first binding pins is smaller than the pitch of the second binding pins, and the width of the first binding pins is smaller than the width of the second binding pins.

11. The display module according to claim 8, wherein: The connecting traces include first differential signal traces.

12. The display module according to claim 11, wherein: At least two first chip-on-films are connected between the same rigid circuit board and the display panel. The first chip-on-film closest to the adjacent rigid circuit board is an integrated chip-on-film. One integrated chip-on-film and the first portion of the second chip-on-film are configured as an integral structure, and another integrated chip-on-film and the second portion of the second chip-on-film are configured as an integral structure.

13. The display module according to claim 12, wherein: The display module further includes: The central control board is electrically connected to two adjacent rigid circuit boards, and the second flip chip film is not connected between the two adjacent rigid circuit boards connected to the central control board; or the central control board is electrically connected to one rigid circuit board.

14. The display module according to claim 13, wherein: Of the two adjacent rigid circuit boards, the one closer to the central control board is a first rigid circuit board, and the one farther from the central control board is a second rigid circuit board, the first portion is connected between the first rigid circuit board and the display panel, and the second portion is connected between the second rigid circuit board and the display panel; A second differential signal line is provided on the first portion, and a third differential signal line is provided on the second portion, wherein the second differential signal line and the third differential signal line are connected to opposite ends of the first differential signal line; A fourth differential signal trace is provided on the first rigid circuit board, and one end of the fourth differential signal trace is connected to the central control board; A fifth differential signal trace is provided on the second rigid circuit board, one end of the fifth differential signal trace is connected to the third differential signal trace, and the other end of the fifth differential signal trace is connected to the first chip-on-film connected to the second rigid circuit board.

15. The display module according to claim 6 or 11, characterized in that: The display module further includes: At least two connectors are provided on at least two rigid circuit boards in a one-to-one correspondence; The flexible circuit board is connected between two adjacent connectors.

16. The display module according to claim 15, wherein: The flexible circuit board does not extend beyond the rigid circuit board in a second direction, and the second direction is a connection direction of the display panel, the first COF, and the rigid circuit board.

17. The display module according to any one of claims 1 to 14, characterized in that: A solder resist film is provided on the first COF and the second COF.

18. A display device, characterized in that: include: The display module is the display module according to any one of claims 1 to 17.

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