Wafer moving device
By setting corresponding wafer-accommodating blind grooves and blind holes to fix support columns in the wafer wafer shifting device, the scratch or damage caused by the tilt of the wafer during the wafer shifting process is solved, and a more stable wafer transfer is achieved.
Patent Information
- Application Number
- CN202421770763.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-07-24
AI Technical Summary
During the handling process of existing wafer transfer devices, the wafer is prone to tilt due to too large moving space, resulting in misalignment or card, which can lead to scratches or damage.
A wafer wafer shifting device is designed, by setting a wafer containing blind grooves on the push plate corresponding to the wafer slot in the wafer casing on the wafer casing, and setting a blind hole on the operating table to fix the support column, ensuring that the wafer shifting mechanism and the wafer casing are balanced and avoiding tilt.
It effectively reduces the inclination and misalignment of the wafer during the wafer shifting process, reduces the risk of wafer scratches or damage, and improves the stability and safety of wafer shifting operation.
Smart Images
Figure CN223245572U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor testing, in particular to a wafer moving device. Background Art
[0002] Wafer testing accounts for a significant portion of semiconductor testing. Wafers are inherently expensive and fragile, requiring extreme care when handling and moving them. Currently, after testing, wafers are placed in wafer cassettes. A wafer transfer device then transfers wafers between cassettes in preparation for the next stage of testing.
[0003] However, because the recesses in the wafer cassettes leave too much room for the wafers to move, the wafer transfer mechanism, particularly for thinned wafers, can easily cause them to tilt upward or downward when transferring them between cassettes. This can lead to misalignment or jamming, which can cause scratches or breakage. Furthermore, the wafer transfer mechanism's operating table is bar-shaped, making it difficult for the support columns to align with the surface. This prevents the mechanism from maintaining balance during transfer operations, exacerbating the upward or downward tilt of the wafer, causing misalignment or jamming, which can lead to scratches or breakage. Utility Model Content
[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a wafer moving device to solve the problem in the prior art that during wafer moving operations, the wafer is easily tilted upward or downward, resulting in misalignment or jamming, thereby causing scratches or damage to the wafer.
[0005] To achieve the above-mentioned and other related purposes, the present invention provides a wafer moving device for moving wafers in a front wafer cassette to a wafer cassette behind the wafer cassette to be loaded with wafers. The outer peripheral edge of the inner side of the wafer cassette is sequentially provided with wafer slots along the vertical direction of space for carrying wafers. The wafer moving device includes: a moving mechanism and an operating table;
[0006] The wafer transfer mechanism includes a carrier, a push plate, a push rod and a support column; the push plate is placed above the carrier, and a plurality of wafer accommodating blind grooves are provided on the side of the push plate close to the front wafer cassette, and the arrangement of the wafer accommodating blind grooves corresponds in sequence to the arrangement of the wafer slots in the wafer cassette, so that during the wafer transfer process, all the wafer accommodating blind grooves are aligned one by one with the wafers in the front wafer cassette; the push rod is fixedly connected to the push plate, and the push rod can push the push plate to reciprocate on the carrier;
[0007] The upper end of the support column is fixed below the carrier. The operating table is provided with a plurality of blind holes. The lower end of the support column is seamlessly embedded in the corresponding blind holes, so that the sheet moving mechanism is fixed to the operating table through the support column.
[0008] Optionally, the longitudinal section of the wafer accommodating blind groove is V-shaped to accommodate wafers of different thicknesses.
[0009] Furthermore, the minimum longitudinal width of the wafer accommodating blind groove is greater than 3 mm.
[0010] Optionally, the longitudinal section of the blind hole on the operating table is arc-shaped; the support column is conical with a larger upper portion and a smaller lower portion, and the longitudinal section of the lower end of the support column is arc-shaped; the size of the blind hole on the operating table is adapted to the size of the lower end of the support column, so that the lower end of the support column is seamlessly embedded in the blind hole.
[0011] Optionally, the sheet moving mechanism is provided with four support columns, and the upper ends of the four support columns are fixed to the four corner areas below the carrier.
[0012] Optionally, the number of the blind holes provided on the operating table is four or more, and the positions of the blind holes correspond to the positions of the support columns, so that the lower ends of all the support columns can be seamlessly embedded in the blind holes.
[0013] Optionally, the push rod and the push plate are fixedly connected by bolts.
[0014] Optionally, a groove is provided on the carrier so that the wafer box can be fixedly mounted on the carrier and can be easily disassembled.
[0015] Optionally, the sheet moving mechanism has a length of 30cm to 50cm, a width of 10cm to 30cm, and a height of 10cm to 30cm.
[0016] Optionally, the operating table has a length of 70cm to 110cm, a width of 40cm to 80cm, and a height of 50cm to 100cm.
[0017] As described above, the wafer moving device of the present invention has the following beneficial effects: the wafer moving device of the present invention sets a plurality of wafer accommodating blind grooves on the side of the push plate close to the front wafer box, and the arrangement of the wafer accommodating blind grooves corresponds in sequence to the arrangement of the wafer card slots in the wafer box, so that during the wafer moving process, all the wafer accommodating blind grooves are aligned one by one with the wafers in the front wafer box. When performing the wafer moving operation, the push rod pushes the push plate to reciprocate on the carrier, and the push plate clamps and fixes the wafer through the wafer accommodating blind grooves, moving the wafer from the front wafer box to the rear wafer box. This can reduce or even avoid the problem of the wafer being tilted due to the excessive activity space of the wafer card slots in the wafer box when moving in the wafer box, thereby causing the wafer to be scratched or damaged. In addition, by providing a number of blind holes on the operating table, the lower end of the support column of the wafer moving mechanism is seamlessly embedded in the blind holes on the operating table, so that the shaking of the support column can be reduced or even avoided during the wafer moving operation, and the wafer moving mechanism and the wafer box can always remain balanced. The wafer will not be misaligned or stuck due to tilting upward or downward, thereby further reducing or even avoiding the problem of wafer scratches or breakage caused by the operating table. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 Shown is a schematic cross-sectional structural diagram of the wafer moving device of the present invention and the wafer cassette placed thereon.
[0019] Figure 2 Shown is a schematic cross-sectional structure diagram of the wafer cassette of the present invention.
[0020] Figure 3 Shown is a schematic cross-sectional structure diagram of a wafer cassette and wafers accommodated in the wafer cassette according to the present invention.
[0021] Figure 4 Shown is a schematic top view of the structure of the operating table of the wafer transfer device of the present invention.
[0022] Component number description
[0023] 1. Film transfer mechanism
[0024] 10 Carrier
[0025] 11. Putting
[0026] 12 Push Plate
[0027] 120 wafer accommodating blind groove
[0028] 13 Support Columns
[0029] 2 operating table
[0030] 20 blind holes
[0031] 3 Wafer cassettes
[0032] 30 wafer slots
[0033] 4 wafers DETAILED DESCRIPTION
[0034] The following describes the implementation of the present invention through specific embodiments. People familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
[0035] See also Figures 1 to 4 . It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of this utility model. Therefore, they have no substantive technical significance. Any modification of the structure, change in the proportional relationship or adjustment of the size should still fall within the scope of the technical content disclosed by this utility model without affecting the efficacy and purpose that can be achieved by this utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of this utility model. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this utility model without substantially changing the technical content.
[0036] like Figures 1 to 4 As shown, the present invention provides a wafer moving device for moving wafers 4 in a front wafer cassette 3 to a wafer cassette 3 behind the wafer cassette 3 to be loaded with wafers 4. Wafer slots 30 are sequentially arranged along the vertical direction of the inner peripheral edge of the wafer cassette 3 for carrying the wafers 4. The wafer moving device includes: a moving mechanism 1 and an operating table 2;
[0037] The wafer transfer mechanism 1 includes a carrier 10, a push plate 12, a push rod 11 and a support column 13; the push plate 12 is placed above the carrier 10, and a plurality of wafer accommodating blind grooves 120 are provided on the side of the push plate 12 close to the front wafer cassette 3, and the arrangement of the wafer accommodating blind grooves 120 corresponds in sequence to the arrangement of the wafer clamping slots 30 in the wafer cassette 3, so that during the wafer transfer process, all the wafer accommodating blind grooves 120 are aligned one by one with the wafers 4 in the front wafer cassette 3; the push rod 11 is fixedly connected to the push plate 12, and the push rod 11 can push the push plate 12 to reciprocate on the carrier 10;
[0038] The upper end of the support column 13 is fixed below the carrier 10 , and a plurality of blind holes 20 are provided on the operating table 2 . The lower end of the support column 13 is seamlessly embedded in the corresponding blind holes 20 , so that the sheet moving mechanism 1 is fixed on the operating table 2 through the support column 13 .
[0039] It should be noted here that the positional relationship between the front wafer cassette 3 and the rear wafer cassette 3 as “front” and “rear” is based on the position of the push plate 12 in the wafer transfer mechanism 1 .
[0040] The wafer moving device of this embodiment sets a plurality of wafer accommodating blind grooves on the side of the push plate close to the front wafer box, and the arrangement of the wafer accommodating blind grooves corresponds in sequence to the arrangement of the wafer card slots in the wafer box, so that during the wafer moving process, all the wafer accommodating blind grooves are aligned one by one with the wafers in the front wafer box. When performing the wafer moving operation, the push rod pushes the push plate to move back and forth on the carrier, and the push plate clamps and fixes the wafer through the wafer accommodating blind grooves, and moves the wafer from the front wafer box to the rear wafer box. This can reduce or even avoid the problem of the wafer being tilted due to the excessive movement space of the wafer card slots in the wafer box when moving in the wafer box, thereby causing scratches or damage to the wafer. In addition, by providing a number of blind holes on the operating table, the lower end of the support column of the wafer moving mechanism is seamlessly embedded in the blind holes on the operating table, so that the shaking of the support column can be reduced or even avoided during the wafer moving operation, and the wafer moving mechanism and the wafer box can always remain balanced. The wafer will not be misaligned or stuck due to tilting upward or downward, thereby further reducing or even avoiding the problem of wafer scratches or breakage caused by the operating table.
[0041] like Figures 1 to 3 As shown, before the wafer shifting device performs the wafer shifting operation, the two wafer boxes 3 are placed opposite to each other on the carrier 10, the wafer 4 is loaded in the wafer box 3 near the front of the push plate 2, and the wafer 4 is not loaded in the wafer box 3 away from the rear of the push plate 2. When performing the wafer shifting operation, the push rod 11 pushes the push plate 12 to move from front to back on the carrier 10, and the push plate 12 passes through the inside of the wafer box 3, so that the wafer accommodating blind groove 120 on the push plate 12 clamps and fixes the wafer 4 in the front wafer box 3, and moves the wafer 4 from the front wafer box 3 to the rear wafer box 3, and carries it on the wafer card slot 30 of the rear wafer box 3 for subsequent processes.
[0042] like Figure 1As shown, as an example, the longitudinal section of the wafer accommodating blind groove 120 can be right-angled or V-shaped, and the minimum longitudinal width of the wafer accommodating blind groove 120 is set to be at least greater than the thickness of the wafer 4. Preferably, the minimum longitudinal width of the wafer accommodating blind groove 120 is set to be more than 3 mm, so that the wafer 4 can be accommodated inside the wafer accommodating blind groove 120. Preferably, the longitudinal section of the wafer accommodating blind groove 120 selected in this embodiment is V-shaped, so that the wafer accommodating blind groove 120 can be clamped and fixed by the wafers 4 of different thicknesses; the longitudinal minimum width of the wafer accommodating blind groove 120 selected in this embodiment is set to 3 mm, so that the thinned wafer 4 can be clamped and fixed inside the wafer accommodating blind groove 120. When performing the wafer moving operation, the wafer accommodating blind groove 120 on the push plate 12 can clamp and fix the wafer 4 in the wafer box 3 in front, so as to reduce or even avoid the problem that when the wafer 4 moves in the wafer box 3, the wafer 4 tilts due to the excessive movement space of the wafer card slot 30 in the wafer box, thereby causing the wafer 4 to be scratched or damaged.
[0043] As an example, the support column 13 can be in the shape of a rectangle, a cylinder, or a cone with a larger upper part and a smaller lower part, etc. The longitudinal section of the lower end of the support column 13 can be rectangular or arc-shaped, etc., wherein the arc shape can be a semicircular arc or smaller than a semicircular arc, etc. Correspondingly, the size of the blind hole 20 on the operating table 2 is adapted to the size of the lower end of the support column 13, and the longitudinal section of the blind hole 20 on the operating table 2 can be rectangular or arc-shaped, etc., wherein the arc shape can also be a semicircular arc or smaller than a semicircular arc, etc., so that the lower end of the support column 13 can be seamlessly embedded in the blind hole 20. Preferably, the longitudinal section of the blind hole 20 on the operating table 2 in this embodiment is arc-shaped, the support column 13 is conical with a larger upper part and a smaller lower part, and the longitudinal section of the lower end of the support column 13 is arc-shaped, and the size of the blind hole 20 on the operating table 2 is adapted to the size of the lower end of the support column 13, and the lower end of the support column 13 is seamlessly embedded in the blind hole 20, so that when performing the film shifting operation, the shaking of the support column 13 can be reduced or even avoided, and the film shifting mechanism 1 and the wafer box 3 can also always maintain balance, and the wafer 4 will not tilt upward or downward due to the shaking of the support column 13, thereby causing misalignment or jamming, thereby reducing or even avoiding the problem of scratches or damage to the wafer 4 caused by the operating table 2.
[0044] The upper end of the support column 13 is fixed to the bottom of the carrier 10, and the support column 13 is used to support the carrier 10. As an example, the sheet moving mechanism 1 is provided with at least two support columns 13, and the support columns 13 are symmetrically fixed to the bottom of the carrier 10. Preferably, in this embodiment, the sheet moving mechanism 1 is provided with four support columns 13, and the upper ends of the four support columns 13 are fixed to the four corner areas below the carrier 10, which can improve the supporting ability of the support columns 13 to the sheet moving mechanism 1 and improve the stability of the sheet moving mechanism 1 during the sheet moving operation.
[0045] like Figure 4 As shown, as an example, the number of blind holes 20 provided on the operating table 2 is four or more, and the positions of the blind holes 20 correspond to the positions of the support pillars 13, so that the lower ends of all the support pillars 13 can be seamlessly embedded in the blind holes 20. This reduces or even eliminates the shaking of the support pillars 13 during wafer transfer operations, and the wafer transfer mechanism 1 and the wafer cassette 3 can also maintain balance at all times. The wafer 4 will not be misaligned or stuck due to upward or downward tilting, thereby reducing or even eliminating the problem of scratches or damage to the wafer 4 caused by the operating table 2.
[0046] As an example, the push rod 11 and the push plate 12 can be fixedly connected by connection methods including but not limited to welding, bolt connection, riveting or bonding. Preferably, in this embodiment, the push rod 11 and the push plate 12 are fixedly connected by bolt connection, so that the push rod 11 and the push plate 12 can be freely disassembled and moved, and it is convenient to replace parts, saving costs.
[0047] In different process flows, the wafers 4 are to be placed in the wafer cassettes 3 of a specified color. Therefore, a wafer transfer operation is required to transfer the wafers 4 to the wafer cassettes 3 of the specified color. During the transfer operation, the wafer cassette 3 needs to be fixed to the carrier 10 and not easily moved. After the transfer operation is completed, the wafer cassette 3 needs to be removed from the carrier 10 for subsequent processes. As an example, grooves or suction cups can be provided on the carrier 10 to secure the wafer cassette 3. Preferably, in this embodiment, grooves are provided on the carrier 10 to allow the wafer cassette 3 to be fixedly mounted on the carrier 10 and easily removed, thereby improving the efficiency of the transfer operation.
[0048] The sizes of the sheet moving mechanism 1 and the operating table 2 can be adjusted according to actual needs and are not limited here. As an example, the length of the sheet moving mechanism 1 is 30cm to 50cm, the width is 10cm to 30cm, and the height is 10cm to 30cm. The length of the operating table 2 is 70cm to 110cm, the width is 40cm to 80cm, and the height is 50cm to 100cm. Preferably, in this embodiment, the length of the sheet moving mechanism 1 is 40cm, the width is 17.8cm, and the height is 20.3cm. The length of the operating table 2 is 91cm, the width is 60cm, and the height is 72cm, so as to adapt to the size of the wafer box 3 and the wafer 4, and the design is relatively light and easy to move. It should be pointed out here that the size of the sheet moving mechanism 1 and the size of the operating table 2 refer to the maximum size extended to in three-dimensional space after all components in the corresponding structure are combined.
[0049] To sum up, the wafer moving device of the present invention sets a plurality of wafer accommodating blind grooves on the side of the push plate close to the front wafer box, and the arrangement of the wafer accommodating blind grooves corresponds in sequence to the arrangement of the wafer card slots in the wafer box, so that during the wafer moving process, all the wafer accommodating blind grooves are aligned one by one with the wafers in the front wafer box. When performing the wafer moving operation, the push rod pushes the push plate to move back and forth on the carrier, and the push plate clamps and fixes the wafer through the wafer accommodating blind grooves, and moves the wafer from the front wafer box to the rear wafer box. This can reduce or even avoid the problem of the wafer being tilted due to the excessive movement space of the wafer card slots in the wafer box when moving in the wafer box, thereby causing the wafer to be scratched or damaged. Furthermore, by providing a plurality of blind holes in the operating table, the lower ends of the support columns of the wafer transfer mechanism seamlessly fit into the blind holes of the operating table. This reduces or even eliminates any shaking of the support columns during wafer transfer operations. The wafer transfer mechanism and wafer cassette maintain constant balance, preventing wafer misalignment or jamming due to upward or downward tilting. This further reduces or even eliminates the problem of wafer scratches or breakage caused by the operating table. Therefore, this utility model effectively overcomes the various shortcomings of the prior art and possesses high industrial value.
[0050] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed in the present invention are intended to be covered by the claims of the present invention.
Claims
1. A wafer moving device for moving wafers from a front wafer cassette to a wafer cassette behind the wafer cassette to be loaded with wafers, wherein the outer peripheral edge of the inner side of the wafer cassette is sequentially provided with wafer slots along the vertical direction of space for carrying wafers, characterized in that: The wafer moving device comprises: a wafer moving mechanism and an operating table; The wafer transfer mechanism includes a carrier, a push plate, a push rod and a support column; the push plate is placed above the carrier, and a plurality of wafer accommodating blind grooves are provided on the side of the push plate close to the front wafer cassette, and the arrangement of the wafer accommodating blind grooves corresponds in sequence to the arrangement of the wafer slots in the wafer cassette, so that during the wafer transfer process, all the wafer accommodating blind grooves are aligned one by one with the wafers in the front wafer cassette; the push rod is fixedly connected to the push plate, and the push rod can push the push plate to reciprocate on the carrier; The upper end of the support column is fixed below the carrier. The operating table is provided with a plurality of blind holes. The lower end of the support column is seamlessly embedded in the corresponding blind holes, so that the sheet moving mechanism is fixed to the operating table through the support column.
2. The wafer moving device according to claim 1, wherein: The longitudinal section of the wafer accommodating blind groove is V-shaped to accommodate wafers of different thicknesses.
3. The wafer moving device according to any one of claims 1 to 2, characterized in that: The minimum longitudinal width of the wafer accommodating blind groove is greater than 3 mm.
4. The wafer moving device according to claim 1, wherein: The longitudinal section of the blind hole on the operating table is in the shape of an arc; the support column is in the shape of a cone with a larger upper portion and a smaller lower portion, and the longitudinal section of the lower end of the support column is in the shape of an arc; the size of the blind hole on the operating table is adapted to the size of the lower end of the support column so that the lower end of the support column can be seamlessly embedded in the blind hole.
5. The wafer moving device according to claim 1, wherein: The sheet moving mechanism is provided with four support columns, and the upper ends of the four support columns are fixed to the four corner areas below the carrier.
6. The wafer moving device according to claim 1, wherein: The number of the blind holes arranged on the operating table is four or more, and the positions of the blind holes correspond to the positions of the support columns, so that the lower ends of all the support columns can be seamlessly embedded in the blind holes.
7. The wafer moving device according to claim 1, wherein: The push rod is fixedly connected to the push plate by bolts.
8. The wafer moving device according to claim 1, wherein: The carrier is provided with a groove so that the wafer cassette can be fixedly mounted on the carrier and can be easily disassembled.
9. The wafer moving device according to claim 1, wherein: The dimensions of the sheet moving mechanism are 30cm to 50cm in length, 10cm to 30cm in width, and 10cm to 30cm in height.
10. The wafer moving device according to claim 1, wherein: The operating table has a length of 70cm to 110cm, a width of 40cm to 80cm, and a height of 50cm to 100cm.