Wafer moving machine

Abstract

The utility model discloses a wafer moving machine, which comprises a rack, a jacking mechanism, a clamping assembly and a material loading assembly, the material loading assembly comprises a material loading driving part, a full material loading frame and an empty material loading frame, and the driving end of the material loading driving part is connected with the full material loading frame and the empty material loading frame so as to drive the full material loading frame and the empty material loading frame to move; the jacking mechanism is used for synchronously jacking the wafer to a high position or synchronously driving the wafer at the high position into the empty material carrying frame; the clamping assembly comprises a clamping driving part, a first rotating arm and a second rotating arm, and the clamping driving part is used for driving the first rotating arm and the second rotating arm to get close to each other or get away from each other; when the wafer moving machine works, the clamping driving piece drives the first rotating arm and the second rotating arm to be far away from each other to place a wafer on the jacking mechanism, the jacking mechanism returns to place the wafer in the empty material carrying frame, the wafer in the full material carrying frame is moved into the empty material carrying frame through the two rotating arms, the design is ingenious, and the working efficiency is high. And the sheet moving stability is obviously improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing, and in particular relates to a wafer moving machine. Background Art

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form a cylindrical single crystal. The silicon ingot is then ground, polished, and sliced to form a silicon wafer, also known as a wafer.

[0003] As we all know, during the wafer processing, all wafers in a fully loaded wafer box need to be transferred to an empty wafer box at one time. This inevitably requires the use of a special carrying device to lift and fix the wafers. Most existing carrying devices use cantilever lifting. During the specific wafer transfer process, due to the instability of the cantilever, the wafer is very likely to fall, causing damage to the wafer. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer transfer machine to solve the problem in the prior art that conventional cantilever lifting easily causes wafer damage during transfer.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] A wafer mover comprises a frame, a lifting mechanism, a clamping assembly and a loading assembly, wherein;

[0007] The frame is provided with a material shifting station, the loading assembly includes a loading drive, a full material loading frame and an empty material loading frame, a plurality of full wafers are placed at intervals in the full material loading frame, the fixed end of the loading drive is installed on the frame, the driving end of the loading drive is connected to the full material loading frame and the empty material loading frame, and the loading drive is configured to drive the full material loading frame and the empty material loading frame to reciprocate along a first direction, so as to drive the full material loading frame and the empty material loading frame to pass through the material shifting station in sequence;

[0008] The lifting mechanism is arranged below the material transfer station, and is configured to synchronously lift the multiple wafers in the full material loading frame to a high position at the material transfer station, or is configured to synchronously drive the multiple wafers located at a high position into the empty material loading frame at the material transfer station;

[0009] The clamping assembly includes a clamping drive, a first rotating arm and a second rotating arm. The fixed end of the clamping drive is installed on the frame, and the driving end of the clamping drive is connected to the first rotating arm and / or the second rotating arm. The clamping drive is configured to drive the first rotating arm and the second rotating arm to move closer to or away from each other so as to synchronously clamp or lower the multiple wafers located at a high position.

[0010] Furthermore, the clamping assembly further includes a first transmission assembly, and the driving end of the clamping drive member is connected to the first rotating arm and the second rotating arm through the first transmission assembly.

[0011] Furthermore, the first transmission assembly includes a first articulated arm and a second articulated arm, the first ends of the first articulated arm and the second articulated arm are both hingedly connected to the clamping drive member through an articulated seat, the second end of the first articulated arm is connected to the first rotating arm, and the second end of the second articulated arm is connected to the second rotating arm, and the clamping drive member drives the articulated seat to rise and fall, so as to drive the first rotating arm and the second rotating arm to move closer to or away from each other through the first articulated arm and the second articulated arm.

[0012] Furthermore, a plurality of clamping slots are arranged on the first rotating arm and the second rotating arm at intervals along the second direction, each of the clamping slots corresponds to one of the wafers, and when the clamping drive member drives the first rotating arm and the second rotating arm closer to each other, each of the wafers is located in the corresponding clamping slot, and the first direction and the second direction are perpendicular.

[0013] Furthermore, the lifting mechanism includes a lifting drive, a second transmission assembly, a lifting seat and a lifting member. The lifting seat can be lifted and lowered on the frame. The lifting member is installed on the lifting seat through a connecting rod. The lifting member has a plurality of fixed slots for carrying and fixing wafers. The fixed end of the lifting drive is installed on the frame. The movable end of the lifting drive is connected to the first end of the second transmission assembly. The second end of the second transmission assembly is connected to the lifting seat. The lifting drive drives the lifting seat to rise and fall through the second transmission assembly, so as to drive the multiple wafers to rise and fall synchronously at the material transfer station.

[0014] Furthermore, the second transmission assembly includes a driving wheel, a transmission wheel, a transmission belt and a transmission rod. The lifting seat can be lifted and lowered on the transmission rod. The driving wheel is fixedly mounted on the driving end of the jacking drive member. The transmission wheel is fixedly mounted on the bottom end of the transmission rod. The transmission belt is sleeved on the driving wheel and the transmission wheel. The jacking drive member drives the driving wheel to rotate, and drives the transmission wheel to rotate through the transmission belt, thereby cooperating with the transmission rod to drive the lifting seat to rise and fall.

[0015] Furthermore, the second transmission assembly further includes a guide rail, which is laid on the frame along the height direction. The lifting seat is slidably arranged on the guide rail, and when the transmission rod drives the lifting seat to rise and fall, the lifting seat slides on the guide rail.

[0016] Furthermore, the loading drive component includes a loading cylinder and a loading platform, the loading platform is provided with a first notch and a second notch, the full loading frame and the empty loading frame are both arranged on the loading platform and are located at the first notch and the second notch respectively.

[0017] Furthermore, a sensing component is provided on the frame, and the sensing component is configured to sense whether the first rotating arm and the second rotating arm are clamping the wafer.

[0018] Compared with the prior art, the beneficial effects of the wafer mover are as follows: the loading drive drives the full loading frame to move to the material transfer station, the lifting mechanism synchronously lifts the multiple wafers in the full loading frame to a high position, the clamping drive drives the first rotating arm and the second rotating arm to approach each other, and synchronously clamps the multiple wafers located at the high position, the loading drive drives the empty loading frame to move to the material transfer station, the clamping drive drives the first rotating arm and the second rotating arm to move away from each other to place the multiple wafers on the lifting mechanism, the lifting mechanism returns to its position to place the multiple wafers in the empty loading frame, and the multiple wafers in the full loading frame are moved to the empty loading frame through the two rotating arms. The design is ingenious and significantly improves the stability of the wafer transfer; the first rotating arm and the second rotating arm are driven to move through the first articulated arm and the second articulated arm, the structure is compact, and the transmission efficiency is further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate and understand the technical solutions in the embodiments of the present invention, a brief introduction is given below to the background technology of the present invention and the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0020] Figure 1 This is a schematic diagram of the three-dimensional structure of a wafer mover provided by an embodiment of the present utility model;

[0021] Figure 2 This is another schematic diagram of the three-dimensional structure of the wafer mover provided by an embodiment of the present utility model;

[0022] Figure 3 It is a side view schematic diagram of the wafer mover provided by an embodiment of the present utility model. DETAILED DESCRIPTION

[0023] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0024] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of the present invention. It should be noted that when a component is referred to as being "fixed to" another component, it can be directly attached to the other component or there can be a central component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there can be a central component. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the relevant listed items.

[0025] See also Figures 1 to 3 As shown, in this embodiment, a wafer moving machine includes a frame 1, a lifting mechanism 2, a clamping assembly 3 and a loading assembly 4, wherein; a material moving station is provided on the frame 1, the loading assembly 4 includes a loading drive 40, a full loading frame 41 and an empty loading frame 42, a plurality of full wafers 5 are placed in the full loading frame 41 at intervals, the fixed end of the loading drive 40 is installed on the frame 1, the driving end of the loading drive 40 is connected to the full loading frame 41 and the empty loading frame 42, and the loading drive 40 is configured to drive the full loading frame 41 and the empty loading frame 42 along a first direction ( Figure 1 The jacking mechanism 2 is provided below the material shifting station, and the jacking mechanism 2 is configured to synchronously lift the multiple wafers 5 in the full material loading frame 41 to a high position at the material shifting station, or to synchronously drive the multiple wafers 5 at a high position into the empty material loading frame 42 at the material shifting station; the clamping assembly 3 includes a clamping drive 30, a first rotating arm 31 and a second rotating arm 32, the fixed end of the clamping drive 30 is mounted on the frame 1, and the driving end of the clamping drive 30 is connected to the first rotating arm 31 and the second rotating arm 32, and the clamping drive 30 is configured to drive the first rotating arm 31 and the second rotating arm 32 to move closer to or away from each other, so as to synchronously clamp or put down the multiple wafers 5 at a high position.

[0026] It can be seen that the loading drive 40 drives the full loading frame 41 to move to the material transfer station, and the lifting mechanism 2 synchronously lifts the multiple wafers 5 in the full loading frame 41 to a high position, and the clamping drive 30 drives the first rotating arm 31 and the second rotating arm 32 to approach each other, and synchronously clamps the multiple wafers 5 located at the high position, and the loading drive 40 drives the empty loading frame 42 to move to the material transfer station, and the clamping drive 30 drives the first rotating arm 31 and the second rotating arm 32 to move away from each other to place the multiple wafers 5 on the lifting mechanism 2, and the lifting mechanism 2 returns to its position to place the multiple wafers 5 in the empty loading frame 42, and the multiple wafers 5 in the full loading frame 41 are moved to the empty loading frame 42 through the two rotating arms. The design is ingenious and significantly improves the stability of the wafer transfer.

[0027] As an embodiment, the clamping assembly 3 further includes a first transmission assembly, and the driving end of the clamping driving member 30 is connected to the first rotating arm 31 and the second rotating arm 32 through the first transmission assembly.

[0028] As an embodiment, the first transmission assembly includes a first articulated arm 33 and a second articulated arm 34. The first ends of the first articulated arm 33 and the second articulated arm 34 are both hingedly connected to the clamping drive member 30 through a hinge seat 35. The second end of the first articulated arm 33 is connected to the first rotating arm 31, and the second end of the second articulated arm 34 is connected to the second rotating arm 32. The clamping drive member 30 drives the articulated seat 35 to rise and fall, so as to drive the first rotating arm 31 and the second rotating arm 32 to move closer to or away from each other through the first articulated arm 33 and the second articulated arm 34.

[0029] It can be seen that the first hinged arm 33 and the second hinged arm 34 drive the first rotating arm 31 and the second rotating arm 32 to move, resulting in a compact structure and further improving the transmission efficiency.

[0030] As an embodiment, the first rotating arm 31 and the second rotating arm 32 are arranged along the second direction ( Figure 1 A plurality of clamping slots 330 are arranged at intervals (in the Y direction), each clamping slot 330 corresponds to a wafer, and when the clamping driving member 30 drives the first rotating arm 31 and the second rotating arm 32 to approach each other, each wafer is located in the corresponding clamping slot 330.

[0031] As an embodiment, the lifting mechanism 2 includes a lifting drive 20, a second transmission assembly, a lifting seat 21 and a lifting member 22. The lifting seat 21 can be raised and lowered on the frame 1. The lifting member 22 is installed on the lifting seat 21 through a connecting rod 23. The lifting member 22 has a plurality of fixed slots 220 for carrying and fixing wafers. The fixed end of the lifting drive 20 is installed on the frame 1, and the movable end of the lifting drive 20 is connected to the first end of the second transmission assembly. The second end of the second transmission assembly is connected to the lifting seat 21. The lifting drive 20 drives the lifting seat 21 to rise and fall through the second transmission assembly, so as to drive multiple wafers 5 to rise and fall synchronously at the material transfer station.

[0032] As an embodiment, the second transmission assembly includes a driving wheel 24, a transmission wheel 25, a transmission belt 26 and a transmission rod 27. The lifting seat 21 can be lifted and lowered on the transmission rod 27. The driving wheel 24 is fixedly mounted on the driving end of the jacking drive 20, and the transmission wheel 25 is fixedly mounted on the bottom end of the transmission rod 27. The transmission belt 26 is sleeved on the driving wheel 24 and the transmission wheel 25. The jacking drive 20 drives the driving wheel 24 to rotate, and drives the transmission wheel 25 to rotate through the transmission belt 26, thereby cooperating with the transmission rod 27 to drive the lifting seat 21 to rise and fall.

[0033] As an embodiment, the second transmission assembly further includes a guide rail 28, which is laid on the frame 1 along the height direction. The lifting seat 21 is slidably disposed on the guide rail 28. When the transmission rod 27 drives the lifting seat 21 to rise and fall, the lifting seat 21 slides on the guide rail 28.

[0034] As an embodiment, the loading drive 40 includes a loading cylinder 6 and a loading platform 7, and a first notch and a second notch are opened on the loading platform 7. The full loading frame 41 and the empty loading frame 42 are both arranged on the loading platform 7 and are respectively located at the first notch and the second notch.

[0035] As an embodiment, a sensing component 8 is provided on the frame 1 , and the sensing component 8 is configured to sense whether the first rotating arm 31 and the second rotating arm 32 clamp the wafer.

[0036] When the wafer mover is working: the loading cylinder 6 drives the loading platform 7 to move, moves the full loading frame 41 to the material moving station, the lifting drive 20 drives the lifting member 22 to rise, and passes through the first notch to place each wafer on the corresponding fixed card slot 220, and the lifting member 22 drives multiple wafers 5 to rise to a high position; the clamping drive 30 drives the articulated seat 35 to rise, driving the first articulated arm 33 and the second articulated arm 34 to rotate, at this time the first rotating arm 31 and the second rotating arm 32 approach each other, and each clamping card slot 330 is clamped on the corresponding wafer to complete the clamping; the lifting drive 20 drives the lifting member 22 Return to position; the loading cylinder 6 drives the loading platform 7 to move, and moves the empty material loading frame 42 to the material transfer station. The lifting drive 20 drives the lifting member 22 to rise, and continues to rise after passing through the second notch until each fixed slot 220 is clamped on the corresponding wafer; the clamping drive 30 drives the articulated seat 35 to descend, and under the hinged action of the first articulated arm 33 and the second articulated arm 34, the first rotating arm 31 and the second rotating arm 32 are driven away from each other, and multiple wafers 5 are placed on the lifting member 22; the lifting drive 20 drives the lifting member 22 to descend, and multiple wafers 5 are placed in the empty material loading frame 42 to complete the wafer transfer.

[0037] The above embodiments merely illustrate the basic principles and features of the present invention. The present invention is not limited to the above embodiments. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer moving machine, characterized in that: The wafer mover includes a frame, a lifting mechanism, a clamping assembly and a loading assembly, wherein; The frame is provided with a material shifting station, the loading assembly includes a loading drive, a full material loading frame and an empty material loading frame, a plurality of full wafers are placed at intervals in the full material loading frame, the fixed end of the loading drive is installed on the frame, the driving end of the loading drive is connected to the full material loading frame and the empty material loading frame, and the loading drive is configured to drive the full material loading frame and the empty material loading frame to reciprocate along a first direction, so as to drive the full material loading frame and the empty material loading frame to pass through the material shifting station in sequence; The lifting mechanism is arranged below the material transfer station, and is configured to synchronously lift the multiple wafers in the full material loading frame to a high position at the material transfer station, or is configured to synchronously drive the multiple wafers located at a high position into the empty material loading frame at the material transfer station; The clamping assembly includes a clamping drive, a first rotating arm and a second rotating arm. The fixed end of the clamping drive is installed on the frame, and the driving end of the clamping drive is connected to the first rotating arm and / or the second rotating arm. The clamping drive is configured to drive the first rotating arm and the second rotating arm to move closer to or away from each other so as to synchronously clamp or lower the multiple wafers located at a high position.

2. The wafer mover according to claim 1, wherein: The clamping assembly further includes a first transmission assembly, and the driving end of the clamping driving member is connected to the first rotating arm and the second rotating arm through the first transmission assembly.

3. The wafer mover according to claim 2, wherein: The first transmission assembly includes a first articulated arm and a second articulated arm, the first ends of the first articulated arm and the second articulated arm are both hingedly connected to the clamping drive member through an articulated seat, the second end of the first articulated arm is connected to the first rotating arm, and the second end of the second articulated arm is connected to the second rotating arm, and the clamping drive member drives the articulated seat to rise and fall, so as to drive the first rotating arm and the second rotating arm to move closer to or away from each other through the first articulated arm and the second articulated arm.

4. The wafer mover according to claim 3, wherein: A plurality of clamping slots are arranged on the first rotating arm and the second rotating arm at intervals along the second direction, each of the clamping slots corresponds to one of the wafers. When the clamping drive member drives the first rotating arm and the second rotating arm to approach each other, each of the wafers is located in the corresponding clamping slot, and the first direction and the second direction are perpendicular.

5. The wafer mover according to claim 1, wherein: The lifting mechanism includes a lifting drive, a second transmission assembly, a lifting seat and a lifting member. The lifting seat can be lifted and lowered on the frame. The lifting member is installed on the lifting seat through a connecting rod. The lifting member has a plurality of fixed slots for carrying and fixing wafers. The fixed end of the lifting drive is installed on the frame. The movable end of the lifting drive is connected to the first end of the second transmission assembly. The second end of the second transmission assembly is connected to the lifting seat. The lifting drive drives the lifting seat to rise and fall through the second transmission assembly, so as to drive the multiple wafers to rise and fall synchronously at the material transfer station.

6. The wafer mover according to claim 5, characterized in that: The second transmission assembly includes a driving wheel, a transmission wheel, a transmission belt and a transmission rod. The lifting seat is movably arranged on the transmission rod. The driving wheel is fixedly mounted on the driving end of the jacking drive member. The transmission wheel is fixedly mounted on the bottom end of the transmission rod. The transmission belt is sleeved on the driving wheel and the transmission wheel. The jacking drive member drives the driving wheel to rotate, and drives the transmission wheel to rotate through the transmission belt, thereby cooperating with the transmission rod to drive the lifting seat to move up and down.

7. The wafer mover according to claim 6, wherein: The second transmission assembly further includes a guide rail, which is laid on the frame along the height direction. The lifting seat is slidably arranged on the guide rail. When the transmission rod drives the lifting seat to rise and fall, the lifting seat slides on the guide rail.

8. The wafer mover according to claim 1, wherein: The loading drive component includes a loading cylinder and a loading platform, the loading platform is provided with a first notch and a second notch, the full loading frame and the empty loading frame are both arranged on the loading platform and are located at the first notch and the second notch respectively.

9. The wafer mover according to claim 1, wherein: The frame is provided with a sensing component, and the sensing component is configured to sense whether the first rotating arm and the second rotating arm clamp the wafer.

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