Wafer alignment device

Abstract

The utility model discloses a wafer aligning device, which is characterized in that a first supporting rotating shaft is matched with a limiting rotating shaft to support a wafer of which a gap does not clamp the limiting rotating shaft, and the limiting rotating shaft rotates to drive the wafer which does not clamp the limiting rotating shaft to rotate, so that one side of the wafer is lowered; and then the second supporting rotating shaft and the limiting rotating shaft are matched to support the wafer of the notch clamping the limiting rotating shaft, the wafer of which the notch clamps the limiting rotating shaft does not rotate any more, and the wafer of which the notch does not clamp the limiting rotating shaft continues to rotate until the notches of the wafers clamp the limiting rotating shaft, so that the notches of the wafers are aligned on the same horizontal plane, and the wafer alignment efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the field of wafer cleaning, in particular to a wafer alignment device. Background Art

[0002] In semiconductor manufacturing, wafer production and processing are crucial. With the continuous advancement of technology, the quality and performance requirements for wafers are becoming increasingly stringent. During wafer production, to meet the requirements of subsequent processes, it is often necessary to cut the same edge of the wafer to create notches with specific functions. These notches not only serve as positioning markers and prevent confusion, but also effectively reduce edge defects, prevent edge warping, and ensure good process compatibility. These notches enable subsequent processing equipment to easily and precisely position the wafer, significantly improving production efficiency and product quality.

[0003] During the wafer cleaning process, a robotic arm is responsible for lifting the wafers and placing them sequentially into the cleaning solution for cleaning. However, before the robotic arm can move the wafers, a critical step is to align the wafers, ensuring that the notches on the wafers are on the same horizontal plane. This prevents the robotic arm from clamping the wafers at the notches and causing them to fall. Traditional wafer alignment methods rely primarily on manual operation. While this method can achieve wafer alignment to a certain extent, it suffers from problems such as low precision, low efficiency, and susceptibility to contamination. Utility Model Content

[0004] In order to solve the technical problem of low wafer alignment efficiency in the above-mentioned prior art, the utility model provides a wafer alignment device.

[0005] The technical solution adopted in this utility model is:

[0006] The utility model proposes a wafer alignment device, comprising:

[0007] A driving module is provided below a plurality of wafers parallel to each other, and includes a limiting shaft matching the shape of the notches of the wafers and a driving shaft provided below the limiting shaft for driving the limiting shaft to rotate by friction;

[0008] A first supporting module includes at least one first supporting shaft, and when the notch of the wafer does not catch the limiting shaft, the first supporting shaft and the limiting shaft jointly support the wafer;

[0009] The second supporting module includes at least one second supporting shaft. When the notch of the wafer clamps the limiting shaft, the second supporting shaft and the limiting shaft jointly support the wafer.

[0010] Furthermore, the first supporting module further includes a supporting shaft, referred to as a third supporting shaft.

[0011] Furthermore, the first supporting module includes: a first supporting rotating shaft and a third supporting rotating shaft, and the third supporting rotating shaft is located between the first supporting rotating shaft and the limiting rotating shaft.

[0012] Furthermore, the first supporting shaft and the limiting shaft rotate in the same direction.

[0013] Furthermore, when the wafer is supported by the limiting rotation shaft, the third supporting rotation shaft and the first supporting rotation shaft, the distance between the wafer and the second supporting rotation shaft is 0.75 mm.

[0014] Furthermore, when the wafer is supported by the limiting rotation shaft and the second supporting rotation shaft, the distance between the bottom edge of the wafer and the third supporting rotation shaft is 0.1-0.15 mm.

[0015] Furthermore, the height of the first supporting rotating shaft>the height of the second supporting rotating shaft>the height of the limiting rotating shaft>the height of the third supporting rotating shaft>the height of the driving rotating shaft.

[0016] Furthermore, the outer frame includes side plates, a lower support plate and connecting rods;

[0017] The two side panels are parallel and spaced apart. The bottom end of each side panel is provided with a lower support plate perpendicular to the side panel. The connecting rod connects one side of the two side panels. The limiting strip is provided at the top end of the side panel.

[0018] Furthermore, the wafer alignment device also includes a supporting base plate, and the bottom surface of the lower support plate is connected to the top surface of the supporting base plate.

[0019] Furthermore, the wafer alignment device further includes a support frame arranged in the outer frame, the support frame including: a bottom plate connected to the upper surface of the lower support plate of the outer frame, a first fixing plate vertically connected to one side of the bottom plate, a U-shaped second fixing plate vertically connected to the side opposite to the first fixing plate, and a third fixing plate vertically connected to the bottom plate near the second fixing plate;

[0020] One end of the second supporting shaft is connected to the first fixed plate, and the other end is connected to the U-shaped second fixed plate; one end of the limiting shaft, driving shaft, third supporting shaft and first supporting shaft are rotatably connected to the first fixed plate, and the other end is rotatably connected to the third fixed plate.

[0021] Furthermore, the wafer alignment device also includes: a second limit bar, which is arranged on the base plate and located between the second support shaft and the limit shaft. The second limit bar is provided with multiple upward-facing latches, which cooperate with the limit bar to limit the position of the wafer.

[0022] Furthermore, the wafer alignment device also includes a double-headed motor, and the two rotors of the double-headed motor are respectively provided with driving heads, and the ends of the first supporting shaft and the driving shaft are provided with driven heads. The two driving heads are respectively connected to the driven heads through belts to drive the first supporting shaft and the driving shaft to rotate.

[0023] Compared with the prior art, the wafer alignment device proposed in the present invention cooperates with the first supporting shaft and the limiting shaft to support the wafer whose notch is not stuck on the limiting shaft. The limiting shaft rotates to drive the wafer that is not stuck on the limiting shaft to rotate, so that one side of the wafer is lowered. Then the second supporting shaft cooperates with the limiting shaft to support the wafer whose notch is stuck on the limiting shaft. The wafer whose notch is stuck on the limiting shaft no longer rotates, and the wafer whose notch is not stuck on the limiting shaft continues to rotate until the notch of the wafer is stuck on the limiting shaft, so that the notches of the wafer are aligned on the same horizontal plane, which greatly improves the efficiency of wafer alignment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0025] Figure 1 This is a schematic diagram of the three-dimensional structure of an embodiment of the utility model;

[0026] Figure 2 A top view of an embodiment of the present utility model;

[0027] Figure 3 This is a schematic diagram of the three-dimensional structure of an embodiment of the utility model from another perspective;

[0028] Figure 4 This is a schematic diagram of the distribution of the first supporting shaft, the second supporting shaft, the third supporting shaft, the driving shaft, and the limiting shaft in an embodiment of the present utility model;

[0029] 1. First supporting shaft; 2. Second supporting shaft; 3. Third supporting shaft; 4. Driving shaft; 5. Limiting shaft;

[0030] 6. Limit strip; 61. Second limit strip;

[0031] 7. Driving head; 71. Driven head; 72. Belt;

[0032] 8. Double-head motor;

[0033] 9. Outer frame; 91. Lower support plate; 92. Side plate; 93. Connecting rod;

[0034] 10. Support frame; 101. Bottom plate; 102. First fixing plate; 103. Second fixing plate; 104. Third fixing plate;

[0035] 11. Support the bottom plate. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0037] The principle and structure of the present invention are described in detail below with reference to the accompanying drawings and embodiments.

[0038] In semiconductor manufacturing, wafer production and processing are crucial. With the continuous advancement of technology, the quality and performance requirements for wafers are becoming increasingly stringent. During wafer production, to meet the requirements of subsequent processes, it is often necessary to cut the same edge of the wafer to create notches with specific functions. These notches not only serve as positioning markers and prevent confusion, but also effectively reduce edge defects, prevent edge warping, and ensure good process compatibility. These notches enable subsequent processing equipment to easily and precisely position the wafer, significantly improving production efficiency and product quality.

[0039] During the wafer cleaning process, a robotic arm is responsible for lifting the wafers and placing them sequentially into the cleaning solution for cleaning. However, before the robotic arm can move the wafers, a critical step is to align the wafers, ensuring that the notches on the wafers are on the same horizontal plane. This prevents the robotic arm from clamping the wafers at the notches and causing them to fall. Traditional wafer alignment methods rely primarily on manual operation. While this method can achieve wafer alignment to a certain extent, it suffers from problems such as low precision, low efficiency, and susceptibility to contamination.

[0040] like Figure 1-3 As shown, the utility model proposes a wafer alignment device, which can realize fast and accurate alignment of wafers, including: a driving module, a first supporting module and a second supporting module.

[0041] The drive module is arranged below multiple parallel wafers and includes a limiting shaft 5 and a driving shaft 4. The limiting shaft 5 and the driving shaft 4 are arranged along the length of the wafers. The limiting shaft 5 matches the notch of the wafer so that the notch of the wafer can clamp the limiting shaft 5. Specifically, the notch of the wafer is semicircular or V-shaped (the notch of the wafer has different shapes depending on the process requirements), and the cross-section of the limiting shaft 5 is circular. The limiting shaft 5 is arranged below the wafer so that the notch of the wafer can clamp the upper edge of the limiting shaft 5.

[0042] The driving shaft 4 is arranged below the limiting shaft 5 and drives the limiting shaft 5 to rotate by friction. Specifically, gears are provided at the ends of the driving shaft 4 and the ends of the limiting shaft 5, respectively. The gears of the driving shaft 4 and the gears of the limiting shaft 5 are meshed, and the rotation of the driving shaft 4 drives the limiting shaft 5 to rotate.

[0043] The first support module includes at least one first support shaft 1, which is arranged along the length of the wafer and is parallel to the limiting shaft 5 and drive shaft 4 of the drive module. The first support shaft 1 and the limiting shaft 5 jointly support the wafer whose notch is not engaged by the limiting shaft 5.

[0044] The second support module includes at least one second support shaft 2, which is arranged below the wafer along the length direction of the wafer, and the second support shaft 2 is parallel to the first support shaft 1. The second support shaft 2 and the limiting shaft 5 jointly support the wafer with the notch clamping the limiting shaft 5.

[0045] The wafer whose notch is not stuck with the limiting shaft 5 is supported by the first supporting shaft 1 and the limiting shaft 5, driving the shaft 4 to rotate, driving the limiting shaft 5 to rotate. The limiting shaft 5 supports the wafer, so when the limiting shaft 5 rotates, it will drive the supported wafer to rotate until the notch of the wafer rotates and the limiting shaft 5 is stuck, and the wafer stops rotating. Due to the notch, after the notch of the wafer is stuck with the limiting shaft 5, the height of one side is reduced, causing it to deflect to the side that is stuck with the limiting shaft 5, that is, the side of the second supporting shaft 2. It is supported by the second supporting shaft 2 and the limiting shaft 5, and at the same time, the driving shaft 4 is in contact with the wafer to assist in supporting the wafer, and the wafer is no longer in contact with the first supporting shaft 1. The wafer whose notch is not stuck with the limiting shaft 5 continues to be driven to rotate by the limiting shaft 5 until the notch is stuck with the limiting shaft 5.

[0046] The device can quickly and accurately align wafers and ensure that the notches on the wafers are on the same level. Using this device can significantly improve the efficiency and quality of wafer cleaning operations, reduce production costs, and meet the semiconductor manufacturing industry's demand for high-quality wafers.

[0047] The first support module includes a rotating shaft, called the third support shaft 3. The third support shaft 3 is fixed by a rotation connection and is not driven by a driving device. It rotates only with the rotation of the wafer, which can reduce friction between the third support shaft and the wafer.

[0048] The first supporting module includes a first supporting shaft 1 and a third supporting shaft 3 . The third supporting shaft 3 is located between the first supporting shaft 1 and the limiting shaft 5 .

[0049] In this embodiment, viewed from the side of the device, from left to right are the second support shaft 2, the drive module, the third support shaft 3, and the first support shaft 1. When the wafer's notch is not engaged with the limiting shaft 5, it is supported by the first support shaft 1, the third support shaft 3, and the limiting shaft 5. Once the wafer's notch engages the limiting shaft 5, one side of the wafer lowers, causing it to deflect to the side engaged with the limiting shaft 5, i.e., the second support shaft 2, where it is then supported by the second support shaft 2 and the limiting shaft 5.

[0050] The first supporting shaft 1 is driven to rotate in the same direction as the limiting shaft 5 , and together with the limiting shaft 5 , drives the wafer whose notch is not engaged with the limiting shaft 5 to rotate.

[0051] In order to better rotate the wafer whose notch is not engaged with the limiting shaft 5, the first supporting shaft 1 is driven to rotate. The first supporting shaft 1 rotates in the same direction as the limiting shaft 5, and cooperates to drive the rotation of the wafer whose notch is not engaged with the limiting shaft 5. The thickness of the limiting shaft 5, that is, the diameter of the circular cross section, is smaller to fit the notch of the wafer, so the contact area with the wafer is smaller. The first supporting shaft 1 does not need to fit the notch of the wafer, so the circular cross section diameter of the first supporting shaft 1 can be set larger, which can better drive the wafer to rotate and support the wafer.

[0052] When the wafer is supported by the limiting shaft 5 , the third supporting shaft 3 and the first supporting shaft 1 , the distance between the wafer and the second supporting shaft 2 is 0.75 mm.

[0053] When the wafer is supported by the limiting rotation shaft 5 and the second supporting rotation shaft 2 , the distance between the bottom edge of the wafer and the third supporting rotation shaft 3 is 0.1-0.15 mm.

[0054] The height of the first supporting shaft 1 is greater than the height of the second supporting shaft 2 , and the height of the limiting shaft 5 is greater than the height of the third supporting shaft 3 and the height of the driving shaft 4 .

[0055] Since the notch of the wafer is not stuck in the limiting shaft 5, it is supported by the limiting shaft 5, the first supporting shaft 1 and the third supporting shaft 3. After the limiting shaft 5 is stuck, the height of one side is lowered so that it is supported by the limiting shaft 5 and the second supporting shaft 2. Therefore, the height of the first supporting shaft 1 is greater than the height of the second supporting shaft 2.

[0056] The limiting shaft 5 is between the second supporting shaft 2 and the third supporting shaft 3. The limiting shaft 5 must cooperate with the second supporting shaft 2 and the third supporting shaft 3 to support the wafer whose notch is inserted into the limiting shaft 5. Therefore, the limiting shaft 5 and the second supporting shaft 2 must be above the lower edge of the wafer whose notch is inserted into the limiting shaft 5. The limiting shaft 5 is between the second supporting shaft 2 and the third supporting shaft 3, that is, on the arc of the wafer, so the height of the limiting shaft 5 is lower.

[0057] The wafer alignment device also includes an outer frame 9, with limit bars 6 provided on opposite sides of the outer frame 9. A plurality of limit positions are provided on the limit bars 6 at intervals. The limit positions at the same position of two limit bars 6 are used to limit a wafer.

[0058] The outer frame 9 includes: a lower support layer 91, two side panels 92 and a connecting rod 93. The two side panels 92 are parallel and spaced apart. The bottom end of each side panel 92 is provided with a lower support plate perpendicular to the side panel 92. The connecting rod 93 connects one side of the two side panels 92. The limit strip 6 is provided at the top of the side panel 92 along the length direction of the side panel 92. The outer frame 9 is provided with a limit strip 6 on opposite sides. The two limit strips 6 are respectively provided at the upper edges of the two side panels 92. There are multiple limit positions on the limit strip 6 at intervals. The limit positions at the same position of the two limit strips 6 are used to limit the position of a wafer and limit multiple wafers to be parallel to each other. Since the position of the wafer will change before and after alignment, the spacing between the two limit strips 6 should leave space for the position change of the wafer. The depth of the limit position can be set deeper so that the position of the wafer is limited by the limit strip 6 before and after alignment.

[0059] A supporting bottom plate 11 is further provided below the lower supporting plate, and the bottom surface of the lower supporting plate is connected to the top surface of the supporting bottom plate 11 .

[0060] A support frame 10 is further provided in the outer frame 9 . The support frame 10 includes a bottom plate 101 , a first fixing plate 102 , a second fixing plate 103 , a third fixing plate 104 and a support plate.

[0061] The bottom plate 101 is connected to the top of the lower support plate of the outer frame 9. A rectangular first fixing plate 102 is vertically mounted on one side plate 92 of the bottom plate 101. The lower side of the first fixing plate 102 is connected to the edge of the bottom plate 101. A U-shaped second fixing plate 103 and a third fixing plate 104 are positioned in the middle of the U-shape on the side opposite the first fixing plate 102. The lower side of the second fixing plate 103 is connected to the edge of the bottom plate 101. The third fixing plate 104 is positioned near the second fixing plate 103. The second fixing plate 103 is rectangular, with its lower side connected to the bottom plate 101, and its plate surface is located in the middle of the second fixing plate 103. A support plate is connected between the first fixing plate 102 and one side of the second fixing plate 103. One end of the second support shaft 2 is connected to the first fixing plate 102, and the other end is connected to one side of the U-shaped second fixing plate 103. One end of the limiting rotating shaft 5 , the driving rotating shaft 4 , the third supporting rotating shaft 3 and the first supporting rotating shaft 1 is rotatably connected to the first fixing plate 102 , and the other end is rotatably connected to the third fixing plate 104 .

[0062] In a further embodiment, a second limiting bar 61 is vertically provided on the bottom plate 101 of the support frame 10. The second limiting bar 61 is provided with a plurality of upward-pointing latches at intervals, which cooperate with the limiting bar 6 to limit the position of the wafer. The latches and limiting positions at the same position are used to cooperate to limit the position of a wafer.

[0063] In a further embodiment, the first supporting shaft 1 and the driving shaft 4 are driven by a double-headed motor 8. The body of the double-headed motor 8 is fixed to the bottom plate 101 of the support frame 10, and the two rotors of the double-headed motor 8 are rotatably connected to the third fixed plate 104. The two rotors of the double-headed motor 8 are respectively provided with a driving head 7, and the ends of the first supporting shaft 1 and the driving shaft 4 are provided with a driven head 71. The driving head 7 and the driven head 71 are connected in a one-to-one manner by a belt 72, so that the rotor of the double-headed motor 8 drives the first supporting shaft and the driving shaft to rotate.

[0064] Compared with the prior art, the wafer alignment device proposed in the present invention cooperates with the first supporting shaft 1 and the limiting shaft 5 to support the wafer whose notch is not stuck on the limiting shaft 5. The limiting shaft 5 rotates to drive the wafer that is not stuck on the limiting shaft 5 to rotate, so that one side of the wafer is lowered. Then the second supporting shaft 2 cooperates with the limiting shaft 5 to support the wafer whose notch is stuck on the limiting shaft 5. The wafer whose notch is stuck on the limiting shaft 5 no longer rotates, and the wafer whose notch is not stuck on the limiting shaft 5 continues to rotate until the notch of the wafer is stuck on the limiting shaft 5, so that the notches of the wafer are aligned on the same horizontal plane, thereby greatly improving the efficiency of wafer alignment.

[0065] It should be noted that the terms used above are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0066] Unless otherwise specifically stated, the relative arrangement of the parts and steps, the numerical expressions and the numerical values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0067] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0068] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0069] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.

[0070] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A wafer alignment device, characterized in that: include: A driving module is arranged below a plurality of wafers that are parallel to each other, and comprises a limiting rotating shaft (5) that matches the shape of the notches of the wafers and a driving rotating shaft (4) that is arranged below the limiting rotating shaft (5) and drives the limiting rotating shaft (5) to rotate by friction; A first supporting module comprises at least one first supporting rotating shaft (1), wherein when the notch of the wafer does not catch the limiting rotating shaft (5), the first supporting rotating shaft (1) and the limiting rotating shaft (5) jointly support the wafer; The second supporting module comprises at least one second supporting rotating shaft (2). When the notch of the wafer is stuck on the limiting rotating shaft (5), the second supporting rotating shaft (2) and the limiting rotating shaft (5) jointly support the wafer.

2. The wafer alignment device according to claim 1, wherein: The first supporting module further comprises a supporting shaft, referred to as a third supporting shaft (3).

3. The wafer alignment device according to claim 2, wherein: The first support module comprises: a first support rotating shaft (1) and a third support rotating shaft (3), wherein the third support rotating shaft (3) is located between the first support rotating shaft (1) and the limiting rotating shaft (5).

4. The wafer alignment device according to claim 3, wherein: The first supporting rotating shaft (1) and the limiting rotating shaft (5) rotate in the same direction.

5. The wafer alignment device according to claim 4, wherein: When the wafer is supported by the limiting rotating shaft (5), the third supporting rotating shaft (3) and the first supporting rotating shaft (1), the distance between the wafer and the second supporting rotating shaft (2) is 0.75 mm.

6. The wafer alignment device according to claim 5, wherein: When the wafer is supported by the limiting rotating shaft (5) and the second supporting rotating shaft (2), the distance between the bottom edge of the wafer and the third supporting rotating shaft (3) is 0.1-0.15 mm.

7. The wafer alignment device according to claim 6, wherein: The height of the first supporting rotating shaft (1) is greater than the height of the second supporting rotating shaft (2) and the height of the limiting rotating shaft (5) and the height of the third supporting rotating shaft (3) and the height of the driving rotating shaft (4).

8. The wafer alignment device according to any one of claims 1 to 7, wherein: The wafer alignment device further comprises an outer frame (9), and limiting strips (6) are respectively provided on opposite sides of the outer frame (9), and a plurality of limiting positions are provided on the limiting strips (6) at intervals, and the limiting positions at the same position of two limiting strips (6) are used to limit a piece of the wafer.

9. The wafer alignment device according to claim 8, wherein: The outer frame (9) includes side plates (92), a lower support plate and a connecting rod (93); The two side panels (92) are arranged in parallel and at intervals, and a lower support plate perpendicular to the side panel (92) is provided at the bottom end of each side panel (92). The connecting rod (93) connects one side of the two side panels (92), and the limiting strip (6) is arranged at the top end of the side panel (92) along the length direction of the side panel (92).

10. The wafer alignment device according to claim 9, wherein: The wafer alignment device further comprises a supporting base plate (11), and the bottom surface of the lower support plate is connected to the top surface of the supporting base plate (11).

11. The wafer alignment device according to claim 10, wherein: The wafer alignment device further comprises a support frame (10) arranged in the outer frame (9), the support frame (10) comprising: a bottom plate (101) connected to the upper surface of the lower support plate of the outer frame (9), a first fixing plate (102) vertically connected to one side of the bottom plate (101), a U-shaped second fixing plate (103) vertically connected to the side opposite to the first fixing plate (102), and a third fixing plate (104) vertically connected to the bottom plate (101) near the second fixing plate (103); One end of the second supporting shaft (2) is connected to the first fixed plate (102), and the other end is connected to the U-shaped second fixed plate (103); one end of the limiting shaft (5), the driving shaft (4), the third supporting shaft (3) and the first supporting shaft (1) are rotatably connected to the first fixed plate (102), and the other end is rotatably connected to the third fixed plate (104).

12. The wafer alignment device according to claim 11, wherein: The wafer alignment device further comprises: a second limiting bar (61), the second limiting bar (61) being arranged on the base plate (101) and being located between the second supporting shaft (2) and the limiting shaft (5), the second limiting bar (61) being provided with a plurality of upward-facing latching positions, cooperating with the limiting bar (6) to limit the position of the wafer.

13. The wafer alignment device according to claim 12, wherein: The wafer alignment device also includes a double-headed motor (8), wherein the two rotors of the double-headed motor (8) are respectively provided with a driving head (7), and the ends of the first supporting shaft (1) and the driving shaft (4) are provided with a driven head (71), and the two driving heads (7) are respectively connected to the driven heads (71) through a belt (72), driving the first supporting shaft (1) and the driving shaft (4) to rotate.

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