Positioning tool, wafer positioning device and wafer edge trimming equipment

Abstract

The utility model provides a positioning tool, a wafer positioning device and wafer edge trimming equipment, and the positioning tool is characterized in that the positioning tool comprises a positioning surface used for positioning a wafer, and side walls oppositely arranged on two sides of the positioning surface, the connecting surface is connected with the positioning surface and the side wall; the connecting surface comprises a first surface and a second surface, the first surface is connected with the positioning surface and the second surface, the second surface is connected with the first surface and the side wall, the first surface is an arc surface, and the positioning surface is an elliptical arc surface. According to the positioning tool provided by the utility model, the safety of the wafer entering the wafer positioning device is improved, and the offset allowable value is improved.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing, in particular to a positioning tool, a wafer positioning device and wafer edge trimming equipment. Background Art

[0002] In the semiconductor manufacturing process, wafer edge trimming is a crucial step, directly impacting the quality and performance of the wafer in subsequent processes. However, accurate wafer positioning is a pressing issue during this process. Common wafer edge trimming equipment can cause a misalignment between the wafer feed direction and the center of the equipment during wafer alignment. When a wafer enters the trimming equipment with this misalignment, its edge can easily collide with the equipment's positioning fixtures. This collision not only causes the wafer to deviate from the center of the alignment table but also damages the wafer's edge, impacting its overall quality.

[0003] Traditional wafer positioning devices based on a 300mm diameter do not fully consider the problem of wafer feed direction deviation in their design. When the wafer center is not accurately positioned, a series of serious problems will arise. For example, the offset of the wafer position will prevent it from being stably fixed by the vacuum adsorption equipment, causing the equipment to alarm abnormally. This not only interrupts the production process but also increases the maintenance cost of the equipment. In addition, due to inaccurate wafer positioning, workers often need to manually remove or reposition the wafer frequently. This operation is not only time-consuming and labor-intensive, but also increases the risk of wafer damage during transportation. More importantly, frequent shutdowns for wafer removal will significantly reduce production efficiency and affect the smooth operation of the entire semiconductor manufacturing process. Therefore, it is particularly urgent to correct the problem of inaccurate alignment of wafer edge trimming equipment. Utility Model Content

[0004] In view of the above-mentioned problem of inaccurate wafer alignment in the prior art, the present application provides a positioning tool, a wafer positioning device, and a wafer edge trimming device.

[0005] On the one hand, the utility model provides a positioning tool for positioning a wafer in a wafer positioning device.

[0006] The positioning tool includes a positioning surface for positioning the wafer, side walls arranged on both sides of the positioning surface, and a connecting surface connecting the positioning surface and the side walls;

[0007] The connecting surface includes a first surface and a second surface, the first surface connects the positioning surface and the second surface, the second surface connects the first surface and the side wall, and the first surface is formed into an arc surface.

[0008] Optionally, the protruding direction of the first surface is a direction away from the positioning surface.

[0009] Optionally, the arc radius of the arc surface forming the first surface is between 10 mm and 30 mm.

[0010] Optionally, the direction in which the wafer enters the wafer positioning device is defined as the X-axis, the direction perpendicular to the X-axis in the normal plane of the positioning surface is defined as the Y-axis direction, the positioning surface is formed as an elliptical arc surface, the major axis of the ellipse in which the elliptical arc surface is located is parallel to the Y-axis, and the major axis is greater than or equal to the diameter of the wafer.

[0011] Optionally, the major axis of the ellipse where the elliptical arc surface is located is between 301 mm and 305 mm.

[0012] Optionally, the second surface is formed as a rectangular or arc surface.

[0013] Optionally, the height of the positioning tool along the X-axis direction is less than or equal to 1 / 3 of the diameter of the wafer.

[0014] Optionally, the height of the positioning tool along the X-axis direction is between 80 mm and 100 mm.

[0015] Another aspect of the present invention provides a wafer positioning device having a working surface for preventing and adsorbing a wafer, the wafer positioning device comprising:

[0016] a wafer adsorption device, located in the middle area of the working surface;

[0017] A positioning tool, wherein the positioning tool comprises any one of the positioning tools described above, the positioning tool is located in the edge area of the working surface, and the positioning surface of the positioning tool faces the wafer adsorption device.

[0018] Another aspect of the present invention provides a wafer edge trimming device, wherein the wafer edge trimming device comprises the wafer positioning device.

[0019] As described above, the positioning tool, wafer positioning device, and wafer edge trimming equipment provided by the present invention have at least the following beneficial technical effects:

[0020] In the positioning tooling of the utility model, the positioning surface is set as an elliptical arc surface, and the connecting surface connecting the positioning surface and the side wall is set as a circular arc surface, thereby avoiding collision between the wafer and the sharp corners of the positioning tooling, improving the deviation tolerance of the wafer when entering the positioning device from the X direction, improving the fault tolerance and overall efficiency of the production line, and enhancing the stability of positioning. The smooth transition characteristic helps the wafer to gradually slow down and stabilize when contacting the positioning surface, thereby avoiding damage to the wafer due to collision.

[0021] The overall height of the positioning tooling has been reduced, which reduces the spatial constraints on the wafer when entering the positioning device, helps the wafer to enter the positioning area more smoothly through the transmission system, optimizes the layout and efficiency of the production line, and brings important technological progress to the field of semiconductor manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It shows a schematic structural diagram of a wafer positioning device in the prior art.

[0023] Figure 2 Shown is a structural schematic diagram of a positioning tool in the prior art.

[0024] Figure 3 Display as Figure 2 A front view of the positioning fixture is shown.

[0025] Figure 4 Shown is a structural schematic diagram of the positioning tooling provided by the utility model.

[0026] Figure 5 Display as Figure 4 A front view of the positioning fixture is shown.

[0027] Figure 6 Display as Figure 4 A schematic diagram of the ellipse on which the positioning surface of the positioning tool is located is shown.

[0028] Figure 7 Display as Figure 4 An enlarged view of the first surface of the positioning tool is shown.

[0029] Figure 8 Display as Figure 4 A side view of the positioning fixture is shown.

[0030] Figure 9 Display as Figure 4 An enlarged view of the second surface of the positioning fixture is shown.

[0031] Figure 10 Display as Figure 4 A top view of the positioning fixture is shown.

[0032] Figure 11 Display as Figure 4 Bottom view of the positioning fixture shown.

[0033] Figure 12 Shown is a structural schematic diagram of a wafer positioning device provided in the second embodiment of the present utility model.

[0034] Reference numerals

[0035] 00. Wafer positioning device; 01. Positioning tooling; 011. Positioning surface; 012. Sidewall; 013. Top surface; 02. Wafer; 03. Circle.

[0036] 11. Positioning tool; 111. Positioning surface; 112. Side wall; 113. First surface; 114. Second surface; 115. Ellipse; 116. Circle; 117. Circle; 118. Bottom surface; 119. Side surface.

[0037] 20. Wafer positioning device; 21. Working surface; 22. Wafer adsorption device; 23. Positioning tooling; 24. Fixing plate; 25. Sensor; 26. Bolt. DETAILED DESCRIPTION

[0038] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0039] It should be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Although the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation, the form, quantity, positional relationship and proportion of each component in actual implementation can be changed at will under the premise of realizing the technical solution of this party, and the component layout form may also be more complicated.

[0040] Provide a common wafer edge trimming equipment wafer positioning device, such as Figure 1 As shown in FIG, it is a schematic diagram showing the structure of a wafer positioning device 00 in the prior art. Figure 1 It can be seen that the wafer positioning device 00 includes a positioning tool 01. The positioning tool 01 is used to position the wafer 02. The direction in which the wafer 02 enters the wafer positioning device 00 is defined as the X-axis, and the direction in the normal plane of the positioning surface 011 and perpendicular to the X-axis is defined as the Y-axis. Figure 2 The figure shows the structure diagram of the positioning tool 01 in the prior art. Figure 2 As can be seen in the figure, the positioning tool 01 includes a positioning surface 011 for positioning the wafer 02, side walls 012 located on both sides of the positioning surface 011 and opposite to each other, and a top surface 013 connecting the positioning surface 011 and the side walls 012. The positioning surface 011 is an arc surface, and the side walls 012 and the top surface 013 are rectangular. Figure 3 As shown, it is shown as Figure 2 The front view of the positioning tool 01 is shown. Figure 3It can be seen that the projection contour line of the positioning surface 011 on the XY plane is a portion of the circle 03. Specifically, the projection contour line of the positioning surface 011 on the XY plane is 1 / 3 of the circle 03. Since the side wall 012 and the top surface 013 are rectangular, the corresponding contact edges of the arc surface of the positioning surface 011 and the top surface 013 form an angular contact at the contact point, and the contact point between the top surface 013 and the side wall 012 also forms an angular contact. Figure 1 It can be seen that the height of the positioning tool 01 is greater than or equal to 1 / 3 of the diameter of the wafer 02.

[0041] The diameter of the arc of the arc surface of the positioning surface 011 in the traditional positioning tool 01 is the same as the diameter of the wafer 02 that needs to be edge trimmed. Generally, for a wafer 02 with a diameter of 300mm, the arc diameter of the arc surface of the positioning surface 011 in the wafer positioning device 00 of the wafer edge trimming equipment is 300mm, and the height of the positioning tool 01 is 120mm. When positioning the wafer, there is a deviation between the feeding direction of the wafer 02 and the center of the positioning tool 01, which will cause the wafer 02 to collide with the corners of the positioning tool 01 and further deviate from the center of the wafer positioning device 00, which will not only cause the wafer positioning to fail but also cause the wafer to break. When the wafer positioning fails, it is still necessary to manually adjust the wafer position, which reduces production efficiency.

[0042] In order to solve the above problems, the present application provides a positioning tool, a wafer positioning device, and a wafer edge trimming device, which will be described in detail in conjunction with the following embodiments and drawings.

[0043] Example 1

[0044] This embodiment provides a positioning tool 11 for positioning in a wafer positioning device. Figure 4 As shown in FIG, it is a schematic structural diagram of the positioning tool 11 provided in this embodiment. Figure 4 It can be seen that the positioning tool 11 includes a positioning surface 111 for positioning the wafer, sidewalls 112 arranged on both sides of the positioning surface 111, and connecting surfaces connecting the positioning surface 111 and the sidewalls 112. The connecting surfaces include a first surface 113 and a second surface 114. The first surface 113 connects the positioning surface 111 and the second surface 114, and the second surface 114 connects the first surface 113 and the sidewalls 112. The positioning surface 111 and the first surface 113 are both arc surfaces.

[0045] like Figure 5 As shown, it is a front view of the positioning tool 11. The direction in which the wafer enters the wafer positioning device is defined as the X-axis, and the direction perpendicular to the X-axis in the normal plane of the positioning surface 111 is defined as the Y-axis. Figure 6, which is a schematic diagram showing an ellipse where the positioning surface 111 of the positioning tool 11 is located, Figure 6 It can be seen that the projection of positioning surface 111 on the XY plane forms a portion of an ellipse 115, with the major axis of ellipse 115 parallel to the Y-axis and the minor axis parallel to the X-axis. Generally, the major axis of ellipse 115, where the elliptical arc of positioning surface 111 resides, is greater than or equal to the wafer diameter. Specifically, for a wafer with a diameter of 300 mm, the major axis of ellipse 115, where the elliptical arc of positioning surface 111 resides, is between 301 mm and 305 mm, and the minor axis of ellipse 115 is the same as the wafer diameter. Specifically, in this embodiment, the major axis of ellipse 115, where the elliptical arc of positioning surface 111 resides, is 302 mm, and the minor axis is 300 mm. Configuring positioning surface 111 as an elliptical arc effectively improves the accuracy of positioning. Even with some positional deviation, the wafer can be naturally guided to the correct position by the elliptical arc. This significantly increases the wafer positioning device's tolerance for deviation, reduces positioning failures caused by minor deviations, and improves work efficiency.

[0046] Please continue reading Figure 4 It can be seen that the convex direction of the arc surface of the first surface 113 is away from the positioning surface 111. Figure 7 As shown, it is shown as Figure 4 The enlarged view of the projection of the first surface 113 of the positioning tool 11 on the XY plane is shown. Figure 7 It can be seen that the projection contour line of the first surface 113 on the XY plane is a part of the circle 116. Generally, the radius R of the circle 116 forming the arc surface of the first surface 113 is between 10 mm and 50 mm. Specifically, in this embodiment, the radius R of the circle 116 is 48 mm. The first surface 113 is set as an arc surface with the convex direction away from the positioning surface 111 to ensure that the wafer can gradually slow down and stabilize when contacting the positioning tool 11, so that the wafer can smoothly transition to the correct position, reduce the collision between the wafer and the sharp corners of the positioning tool 11, and further reduce the risk of fragmentation.

[0047] Specifically, see Figure 8 , displayed as Figure 4 The side view of the positioning tool 11 shown. Figure 8It can be seen that the height of the positioning tool 11 is less than or equal to 1 / 3 of the wafer diameter. Specifically, the overall height h of the positioning tool 11 is between 80mm and 100mm. In this embodiment, the height h of the positioning tool 11 is 99.7mm. The height of the positioning tool 11 is reduced by 20mm to 40mm on the basis of the height of the positioning tool in the prior art. The reduction in the height of the positioning tool 11 reduces the spatial restriction of the wafer when entering the wafer positioning device, and further increases the allowable value of the wafer entering the wafer positioning device from the X direction; in addition, the reduction in the height of the positioning tool 11 makes the layout of the wafer positioning device on the production line more flexible, and makes the integration of the wafer positioning device higher, which is crucial to maintaining the stability of wafer positioning.

[0048] Generally, the second surface 114 connecting the first surface 113 and the side wall 112 is a rectangular or arc surface. Specifically, in this embodiment, the second surface 114 is set to be an arc surface. Figure 9 As shown, it is shown as Figure 4 An enlarged view of the projection of the second surface 114 on the XY plane. Figure 9 It can be seen that the projection contour line of the second surface 114 on the XY plane is a part of the circle 117. Generally, the radius R of the circle 117 is between 2 mm and 10 mm. Specifically, in this embodiment, the radius R of the circle 117 where the arc shape of the second surface 114 is located is 5 mm. Setting the second surface 114 as an arc surface ensures that the wafer avoids collision with the positioning tool 11 when entering the wafer positioning device, further reducing the risk of damage to the wafer; in addition, setting the second surface 114 as an arc surface can enhance the structural strength of the positioning tool 11. Compared with the right-angle edge, the arc surface can better resist external stress and impact force, thereby improving the durability and reliability of the positioning tool 11.

[0049] Generally, the size of the positioning fixture 11 in the Y direction and the thickness of the positioning fixture 11 can be set according to the actual size of the wafer positioning device. Generally, the size of the positioning fixture 11 in the Y direction is greater than or equal to the major axis of the ellipse 115 forming the arc surface of the positioning surface 111. Specifically, Figure 10 As shown, it is shown as Figure 4 The top view of the positioning tool 11 is shown. Figure 10 It can be seen that in this embodiment, the size L of the positioning tool 11 in the Y direction is 302 mm, and the thickness h of the positioning tool 11 is 30 mm.

[0050] Generally, see Figure 4 The positioning fixture 11 also includes a lower surface fixedly connected to the wafer positioning device and an upper surface away from the side of the wafer positioning device. Figure 11 As shown, it is shown as Figure 4 Bottom view of the positioning tool shown. Figure 11 It can be seen that the positioning fixture 11 further includes a bottom surface 118 disposed opposite to the positioning surface 111, and a side surface 119 connecting the side wall 112 and the bottom surface 118. Specifically, the side surface 119 is an inclined surface. The bottom surface 118 is fixedly connected to the wafer positioning device.

[0051] In summary, the positioning tool 11 provided in this embodiment has a positioning surface 111 with an arc surface, a first surface 113 with a protruding direction away from the positioning surface 111, and is provided with a specific height, which not only significantly improves the accuracy, stability and safety of positioning the wafer, but also optimizes the layout of the wafer positioning device and improves the efficiency of positioning the wafer; in addition, the second surface 114 of the positioning tool 11 provided in this embodiment is also an arc surface, which can further improve the accuracy and safety of wafer positioning and effectively enhance the structural strength of the positioning tool 11

[0052] Example 2

[0053] This embodiment provides a wafer positioning device, which is fixedly installed in a wafer edge trimming device and is used for wafer positioning. Figure 12 As shown in FIG, it is a schematic structural diagram of the wafer positioning device 20. Figure 12 It can be seen that the wafer positioning device 20 includes a working surface 21 for placing and adsorbing the wafer, a wafer adsorption device 22 fixedly installed in the working surface 21, and a positioning tool 23 for positioning the wafer 02. The wafer adsorption device 22 is used to adsorb and fix the wafer 02, and the positioning tool 23 is located at the edge of the positioning surface 21. Specifically, the positioning tool 23 provided in this embodiment is one or a combination of the positioning tools provided in Example 1. The positioning surface of the positioning tool 23 faces the wafer adsorption device 22, the bottom surface is fixedly connected to the side wall of the wafer positioning device 20, and the lower surface is fixedly connected to the working surface of the wafer positioning device 20.

[0054] Please continue reading Figure 11 The wafer positioning device also includes a fixing plate 24 for fixing the positioning fixture 23 and a sensor 25 for detecting the direction of the wafer. Generally, the methods for fixing and installing the positioning fixture 23 include: bonding, threaded connection, welding, riveting and other connection methods. Specifically, Figure 11 As shown, in this embodiment, the connection method for fixing the positioning fixture 23 is a threaded connection, and the fixing plate 24 fixes the positioning fixture 23 to the wafer positioning device 20 through bolts 26. The wafer positioning device 20 can achieve smooth and stable entry of the wafer 02 from the X-axis direction, reduce the risk of fragmentation, and improve the integration of the wafer positioning device 20.

[0055] Example 3

[0056] This embodiment provides a wafer edge trimming device, which includes the wafer positioning device provided in Example 2. The wafer edge trimming device significantly improves the accuracy and safety of wafer positioning, can effectively reduce the risk of wafer breakage, and improve production efficiency.

[0057] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed in the present invention are intended to be covered by the claims of the present invention.

Claims

1. A positioning tool for positioning a wafer in a wafer positioning device, characterized in that: The positioning tool includes a positioning surface for positioning the wafer, side walls arranged on both sides of the positioning surface, and a connecting surface connecting the positioning surface and the side walls; The connecting surface includes a first surface and a second surface, the first surface connects the positioning surface and the second surface, the second surface connects the first surface and the side wall, and the first surface is formed into an arc surface.

2. The positioning tool according to claim 1, characterized in that: The protrusion direction of the first surface is a direction away from the positioning surface.

3. The positioning tool according to claim 2, characterized in that: The arc radius of the arc surface of the first surface is between 10 mm and 30 mm.

4. The positioning tool according to claim 1, characterized in that: The direction in which the wafer enters the wafer positioning device is defined as the X-axis direction, the direction perpendicular to the X-axis in the normal plane of the positioning surface is defined as the Y-axis direction, the positioning surface is formed as an elliptical arc surface, the major axis of the ellipse in which the elliptical arc surface is located is parallel to the Y-axis, and the major axis is greater than or equal to the diameter of the wafer.

5. The positioning tool according to claim 4, characterized in that: The major axis of the ellipse where the elliptical arc surface is located is between 301 mm and 305 mm.

6. The positioning tool according to claim 1, characterized in that: The second surface is formed into a rectangular or arc surface.

7. The positioning tool according to claim 5, characterized in that: The height of the positioning tool along the X-axis direction is less than or equal to 1 / 3 of the diameter of the wafer.

8. The positioning tool according to claim 7, characterized in that: The height of the positioning fixture along the X-axis direction is between 80 mm and 100 mm.

9. A wafer positioning device having a working surface for placing and adsorbing a wafer, characterized in that: The wafer positioning device comprises: a wafer adsorption device, located in the middle area of the working surface; A positioning tool, wherein the positioning tool comprises the positioning tool according to any one of claims 1 to 8, the positioning tool is located in an edge area of the working surface, and the positioning surface of the positioning tool faces the wafer adsorption device.

10. A wafer edge trimming device, characterized in that: The wafer edge trimming equipment includes the wafer positioning device according to claim 9.

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