Wafer jacking and adsorbing mechanism and wafer processing equipment

Abstract

The utility model relates to a wafer jacking and adsorbing mechanism and wafer processing equipment. The wafer jacking and adsorbing mechanism comprises a driving assembly, a lifting assembly and a driving assembly, the eccentric roller is connected with the driving assembly; the jacking assembly comprises a mounting plate, a plurality of guide rods, a jacking plate and a plurality of ejector pins connected with the jacking plate, the jacking plate is located above the eccentric roller, and the driving assembly can drive the eccentric roller to rotate so as to drive the jacking plate to move up and down, so that the ejector pins are driven to move up and down; and the adsorption heating assembly is located above the jacking plate, a plurality of through holes are formed in the adsorption heating assembly, and the ejector pins penetrate through the through holes. Due to the fact that the rotation center of the eccentric roller is located on the non-geometric center, the acting force generated by the eccentric roller is not instantaneous and constant but changes along with the change of the rotation angle, the deceleration is reduced and the speed is slowed down when the eccentric roller rotates to the position close to the up-down movement limit position, and therefore impact and abrasion to the ejector pin can be reduced, and a certain buffering effect is achieved; and the stability of the wafer on the ejector pin is ensured.

Description

Technical field

[0001] The present application relates to a wafer lifting and adsorption mechanism and wafer processing equipment, belonging to the field of wafer processing technology. [Background Technology]

[0002] In semiconductor manufacturing equipment, wafers need to be fixed on a carrier during production and testing. Common wafer fixing methods are basically suction-based, including vacuum suction and electrostatic suction. Vacuum suction creates a vacuum in the contact area between the wafer and the suction cup surface, relying on the pressure difference between the two sides of the wafer to firmly fix the wafer on the vacuum suction cup.

[0003] In the existing technology, the carrier is usually driven up and down by a cylinder to cooperate with the robot to complete the wafer placement. The carrier supports the wafer and is driven up and down by the cylinder. When it reaches the limit stroke of the cylinder, the carrier produces a certain vibration due to the sudden stop of the cylinder, which causes the wafer on the carrier to be unstable, such as offset or fragmentation.

[0004] Therefore, it is necessary to improve the prior art to overcome the above defects. [Utility Model Content]

[0005] In view of this, an embodiment of the present application provides a wafer lifting and adsorption mechanism to solve at least one problem existing in the background technology, including:

[0006] Drive components;

[0007] An eccentric roller comprises an eccentric shaft, wherein the eccentric shaft is connected to the driving assembly;

[0008] A jacking assembly includes a mounting plate, a plurality of guide rods mounted on the mounting plate, a jacking plate adapted to the guide rods, and a plurality of ejector pins connected to the jacking plate, wherein the jacking plate is located above the eccentric roller, and the driving assembly is capable of driving the eccentric roller to rotate to drive the jacking plate to move up and down, thereby driving the ejector pins to move up and down;

[0009] The adsorption heating component is located above the lifting plate and is used to receive the adsorbed wafer. The adsorption heating component is provided with a plurality of through holes, and a plurality of the ejector pins are provided through the plurality of through holes.

[0010] Optionally, in the above-mentioned wafer lifting and adsorption mechanism, the guide plate is provided with a guide hole adapted to the guide rod.

[0011] Optionally, in the above-mentioned wafer lifting and adsorption mechanism, the adsorption and heating component includes a suction cup with a plurality of adsorption ports and a heating plate located below the suction cup, and the plurality of adsorption ports are connected to a negative pressure source.

[0012] The present application also provides a wafer processing device, which at least includes a wafer lifting and adsorption mechanism as described in any one of the above.

[0013] Optionally, the above-mentioned wafer processing equipment further includes a mounting frame and a transfer robot installed on the mounting frame, wherein the transfer robot can support the wafer and drive the wafer to contact with or move away from the ejector pin.

[0014] Optionally, in the above-mentioned wafer processing equipment, the transfer robot has an avoidance space, and when the transfer robot is located above the adsorption heating component, the plurality of ejectors are located in the avoidance space.

[0015] Optionally, in the above-mentioned wafer processing equipment, the transfer robot includes a connecting portion and a fork connected to the connecting portion, and the avoidance space is formed on the fork;

[0016] The blade fork is provided with supporting grooves of at least two radii, and the supporting grooves of at least two radii are arranged up and down.

[0017] Optionally, the above-mentioned wafer processing equipment further includes a guide rail arranged on the mounting frame and a slider cooperating with the guide rail, and the slider is connected to the transfer robot.

[0018] Optionally, the wafer processing equipment further comprises a box having an opening and a baffle capable of opening or closing the opening, wherein the opening is for the transfer robot to pass through;

[0019] The wafer lifting and adsorption mechanism is located in the box.

[0020] Optionally, the above-mentioned wafer processing equipment further includes a driving cylinder connected to the baffle, and the driving cylinder can drive the baffle to move relative to the box to open or close the opening.

[0021] Compared with the prior art, the present application has the following beneficial effects: by providing an eccentric roller, a driving assembly connected to the eccentric shaft of the eccentric roller, and a lifting plate located above the eccentric roller, and a lift pin passing through the adsorption heating assembly is provided on the lifting plate, the eccentric roller can be driven to rotate by the driving assembly, and the rotational motion of the driving assembly is converted into linear motion in the up and down directions of several lift pins. Since the rotation center of the eccentric roller is located on a non-geometric center, the force generated by it is not instantaneous and constant, but varies with the change of the rotation angle. When it rotates to near its up and down motion limit position, the deceleration decreases and the speed slows down, thereby reducing the impact and wear on the lift pin, having a certain buffering effect, and thus ensuring the stability of the wafer on the lift pin.

Brief Description of the Drawings

[0022] Figure 1 It is a structural schematic diagram of the wafer processing equipment of the present application;

[0023] Figure 2 for Figure 1 A partial schematic diagram of a wafer processing device is shown;

[0024] Figure 3 for Figure 2 A schematic cross-sectional view of a wafer processing apparatus is shown;

[0025] Figure 4 for Figure 1 A cross-sectional view of the wafer processing equipment shown in another direction;

[0026] Figure 5 for Figure 1 A partial schematic diagram of the wafer processing equipment shown.

[0027] in,

[0028] 1- Install the frame;

[0029] 2-transfer manipulator, 21-avoidance space, 22-connecting part, 23-fork, 231-supporting slot;

[0030] 3-wafer lifting and adsorption mechanism, 31-driving assembly, 32-eccentric roller, 321-eccentric shaft, 33-lifting assembly, 331-mounting plate, 332-guide rod, 333-lifting plate, 334-thrust pin, 34-adsorption and heating assembly, 341-suction cup, 3411-adsorption port, 342-heating plate;

[0031] 4-Guide rails;

[0032] 5- Slider;

[0033] 6-box, 61-opening, 62-baffle;

[0034] 7- Driving cylinder. [Specific implementation method]

[0035] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It will be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some, rather than all, structures related to the present application are shown in the accompanying drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0036] As used herein, the terms "comprise," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0037] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0038] See also Figures 1 to 5 As shown, a wafer processing device shown in a preferred embodiment of the present application is used to heat the wafer to facilitate the subsequent other processes of the wafer. The wafer processing device includes a mounting frame 1, a transfer robot 2 installed on the mounting frame 1, and a wafer lifting and adsorption mechanism 3. The transfer robot 2 can support the wafer and drive the wafer to move toward or away from the wafer lifting and adsorption mechanism 3, so that the wafer that needs to be heated is placed on the wafer lifting and adsorption mechanism 3 for heating, or the wafer that has been heated is removed from the wafer lifting and adsorption mechanism 3.

[0039] In this embodiment, the wafer processing equipment also includes a guide rail 4 arranged on the mounting frame 1 and a slider 5 cooperating with the guide rail 4. The slider 5 is connected to the transfer robot 2. The transfer robot 2 can move in a straight line relative to the mounting frame 1 under the action of the slider 5 and the guide rail 4. On the one hand, it can prevent the transfer robot 2 from shifting during the movement, and on the other hand, it can also reduce the friction between the transfer robot 2 and the mounting frame 1.

[0040] Specifically, the wafer lifting and adsorption mechanism 3 includes a driving component 31 , an eccentric roller 32 connected to the driving component 31 , a lifting component 33 located above the eccentric roller 32 , and an adsorption heating component 34 . Among them, the lifting assembly 33 includes a mounting plate 331, a plurality of guide rods 332 mounted on the mounting plate 331, a lifting plate 333 adapted to the guide rods 332, and a plurality of ejector pins 334 connected to the lifting plate 333, and the lifting plate 333 is located above the eccentric roller 32; the adsorption heating assembly 34 is located above the lifting plate 333, and is used to receive the adsorbed wafer. The adsorption heating assembly 34 is provided with a plurality of through holes, and a plurality of ejector pins 334 are provided through the plurality of through holes; the eccentric roller 32 includes an eccentric shaft 321 connected to the driving assembly 31, and the driving assembly 31 can drive the eccentric shaft 321 to drive the eccentric roller 32 to rotate, so as to convert the rotational motion of the driving assembly 31 into a linear motion in the up and down directions of the lifting assembly 33 above the eccentric roller 32, thereby driving the up and down movement of the plurality of ejector pins 334 on the lifting assembly 33, so as to place the wafer on the adsorption heating assembly 34, or remove the wafer from the adsorption heating assembly 34.

[0041] More specifically, the adsorption heating assembly 34 includes a suction cup 341 having a plurality of adsorption ports 3411 and a heating plate 342 located below the suction cup 341. The adsorption ports 3411 are connected to a negative pressure source. The negative pressure source is used to provide negative pressure, causing the adsorption ports 3411 to generate suction, thereby enhancing the stability of the wafer on the suction cup 341 and preventing the wafer from shifting while being heated by the heating plate 342.

[0042] It should be noted that, in this embodiment, a guide hole adapted to the guide rod 332 is provided on the guide plate to ensure that the lifting plate 333 can move in the up and down directions without being offset in the horizontal direction.

[0043] As described above, in this embodiment, the transfer robot 2 has an avoidance space 21. When the transfer robot 2 is located above the adsorption and heating component 34, the plurality of ejectors 334 are all located in the avoidance space 21 and will not interfere with the transfer robot 2. This makes it convenient for the transfer robot 2 to be located on the adsorption and heating component 34, and for the plurality of ejectors 334 to move up and down in the avoidance space 21.

[0044] More specifically, the transfer robot 2 includes a connecting portion 22 and a fork 23 connected to the connecting portion 22 . The connecting portion 22 is used to connect to the mounting frame 1 , and the fork 23 is used to support the wafer. The avoidance space 21 is formed on the fork 23 .

[0045] It is worth noting that in this embodiment, the wafer fork 23 is provided with supporting grooves 231 of at least two different radii, and the supporting grooves 231 of at least two different radii are arranged vertically. The provision of the supporting grooves 231 ensures that the wafer supported by the transfer robot 2 is more stable and does not shift out of the supporting grooves 231. Moreover, the provision of supporting grooves 231 of at least two different radii allows for the processing of wafers of various sizes, such as 4-inch, 6-inch, 8-inch, and 12-inch wafers.

[0046] In this embodiment, the heating plate 342 in the adsorption heating assembly 34 is a high-vacuum hot plate. Therefore, the wafer processing equipment further includes a housing 6 having an opening 61 for the transfer robot 2 to pass through, and a baffle 62 that can open or close the opening 61. The opening 61 allows the transfer robot 2 to pass through. The wafer lifting and adsorption mechanism 3 is located within the housing 6 to prevent external dust from entering the wafer lifting and adsorption mechanism 3 while ensuring that the high-vacuum hot plate operates in a sealed, high-vacuum environment during wafer processing.

[0047] Specifically, the wafer processing equipment also includes a driving cylinder 7 connected to the baffle 62. The driving cylinder 7 can drive the baffle 62 to move relative to the box 6 to open or close the opening 61. The automated structure improves the processing efficiency of the processing equipment and reduces labor costs.

[0048] In summary, the working process of the wafer processing equipment shown in this application is as follows: the transfer robot supports the wafer to move along the slide rail and enters the box from the opening of the box, the fork of the transfer robot moves to above the adsorption heating component, and the driving component drives the eccentric roller to rotate, so that the eccentric shaft located above moves downward, thereby driving the lifting plate located above the eccentric roller and several ejector pins on the lifting plate to move upward from the avoidance space to receive the wafer on the fork, and then the transfer robot moves out of the opening, and the driving cylinder drives the baffle to close the opening, and the driving component drives the eccentric roller to rotate again, so that the eccentric shaft located below moves upward, thereby driving the lifting plate located above the eccentric roller and several ejector pins on the lifting plate to move downward from the avoidance space, until the wafer is placed on the surface of the adsorption heating component and adsorbed by several adsorption ports, thereby realizing the heating of the wafer by the heating disk.

[0049] The above is only a specific implementation of the present application. Any other improvements made based on the concept of the present application are considered to be within the scope of protection of the present application.

Claims

1. A wafer lifting and adsorption mechanism, characterized in that: include: Drive components; An eccentric roller comprises an eccentric shaft, wherein the eccentric shaft is connected to the driving assembly; A jacking assembly includes a mounting plate, a plurality of guide rods mounted on the mounting plate, a jacking plate adapted to the guide rods, and a plurality of ejector pins connected to the jacking plate, wherein the jacking plate is located above the eccentric roller, and the driving assembly is capable of driving the eccentric roller to rotate to drive the jacking plate to move up and down, thereby driving the ejector pins to move up and down; The adsorption heating component is located above the lifting plate and is used to receive the adsorbed wafer. The adsorption heating component is provided with a plurality of through holes, and a plurality of the ejector pins are provided through the plurality of through holes.

2. The wafer lifting and adsorption mechanism according to claim 1, characterized in that: The lifting plate is provided with a guide hole adapted to the guide rod.

3. The wafer lifting and adsorption mechanism according to claim 1, characterized in that: The adsorption heating component includes a suction cup with a plurality of adsorption ports and a heating plate located below the suction cup, and the plurality of adsorption ports are connected to a negative pressure source.

4. A wafer processing device, characterized in that: At least includes the wafer lifting and adsorption mechanism according to any one of claims 1 to 3.

5. The wafer processing equipment according to claim 4, characterized in that: The wafer processing equipment further includes a mounting frame and a transfer robot mounted on the mounting frame. The transfer robot can support the wafer and drive the wafer to contact the ejector pin or move away from the ejector pin.

6. The wafer processing equipment according to claim 5, characterized in that: The transfer robot has an avoidance space. When the transfer robot is located above the adsorption heating component, the plurality of ejectors are located in the avoidance space.

7. The wafer processing equipment according to claim 6, characterized in that: The transfer robot comprises a connecting portion and a fork connected to the connecting portion, and the avoidance space is formed on the fork; The blade fork is provided with supporting grooves of at least two radii, and the supporting grooves of at least two radii are arranged up and down.

8. The wafer processing equipment according to claim 5, characterized in that: The wafer processing equipment also includes a guide rail arranged on the mounting frame and a slider matched with the guide rail, and the slider is connected to the transfer robot.

9. The wafer processing equipment according to claim 5, characterized in that: The wafer processing equipment further includes a box having an opening and a baffle capable of opening or closing the opening, wherein the opening is for the transfer robot to pass through; The wafer lifting and adsorption mechanism is located in the box.

10. The wafer processing equipment according to claim 9, characterized in that: The wafer processing equipment further includes a driving cylinder connected to the baffle, and the driving cylinder can drive the baffle to move relative to the box to open or close the opening.

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