Wafer processing and clamping mechanism

By designing the wafer processing and card loading mechanism, using negative pressure adsorption components and arc airways to achieve uniform support of the wafer, mechanical deformation and damage problems are solved, and wafer processing of different specifications is adapted to wafer processing, which improves processing accuracy.

CN223245593UActive Publication Date: 2025-08-19NONFERROUS METALLIC OF HEBEI NEW LIZHONG GRP CO LTD
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Patent Information

Application Number
CN202422056425.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-23
Publication Date
2025-08-19
Estimated Expiration
2034-08-23

AI Technical Summary

Technical Problem

The existing wafer processing and card loading methods are prone to mechanical deformation, stress concentration, wafer surface wear and damage, making it difficult to meet the requirements of wafer processing of different specifications.

Method used

A wafer processing and card loading mechanism is designed, including a device fixing seat, a vacuum chamber, a wafer fixing seat, a support member and a wafer support seat. The negative pressure adsorption assembly and arc airway are used to achieve uniform adsorption and support, prevent wafer deformation, and adapt to wafers of different specifications through a removable tool retractor.

Benefits of technology

It achieves uniform support and anti-deformation of wafers, improves processing accuracy, reduces wafer damage, and adapts to wafer processing needs of different specifications.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of wafer processing, and particularly relates to a wafer processing and clamping mechanism, which comprises an equipment fixing seat arranged at the center of wafer processing equipment; the vacuum chamber is formed in the top surface of the equipment fixing base, and the vacuum chamber communicates with a negative pressure adsorption assembly; the wafer fixing seat is arranged on the equipment fixing seat and is in sealing fit with the vacuum chamber; the bottom end of the supporting piece is fixedly connected with the inner wall of the bottom of the vacuum chamber, and the top end of the supporting piece abuts against the bottom of the wafer fixing seat; the wafer supporting seat is detachably connected in the wafer fixing seat, a plurality of arc-shaped air passages are arranged on the wafer supporting seat from the circle center to the outside, and the arc-shaped air passages are communicated with the vacuum chamber; and the tool retracting part is coaxially arranged on the outer side of the wafer supporting seat in a sleeving manner, and the tool retracting part is arranged on the wafer fixing seat. The supporting rods of the device can support the wafer fixing base to prevent the wafer fixing base from deforming, the machining precision is improved, the multiple arc-shaped air channels can evenly adsorb wafers, and the wafers are prevented from deforming.
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Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing, and in particular relates to a wafer processing clamping mechanism. Background Art

[0002] In recent years, with the rapid development of the semiconductor and integrated circuit industries, wafer processing and manufacturing technology has also advanced significantly, with increasingly stringent quality requirements for wafers of varying specifications. However, commonly used clamping methods and fixtures can cause mechanical deformation, stress concentration, and defects such as wafer surface wear, damage, and cracking. Therefore, it is necessary to develop a fixture that can process wafers of varying specifications, maintain uniform clamping force, and minimize damage to wafers. Utility Model Content

[0003] The purpose of the utility model is to provide a wafer processing clamping mechanism to solve the above problems.

[0004] To achieve the above purpose, the present invention provides the following solutions:

[0005] A wafer processing clamping mechanism, comprising:

[0006] An equipment fixing seat, the equipment fixing seat being installed in the center of the wafer processing equipment;

[0007] A vacuum chamber is provided on the top surface of the equipment fixing seat, and the vacuum chamber is connected to a negative pressure adsorption component;

[0008] A wafer holder, mounted on the device holder and sealingly matched with the vacuum chamber;

[0009] A support member, the bottom end of which is fixedly connected to the bottom inner wall of the vacuum chamber, and the top end of which is in contact with the bottom of the wafer fixing seat;

[0010] A wafer support seat is detachably connected to the wafer fixing seat, and a plurality of arc-shaped air channels are arranged on the wafer support seat from the center to the outside, and the arc-shaped air channels are connected to the vacuum chamber;

[0011] The knife-retracting portion is coaxially sleeved on the outer side of the wafer support seat, and the knife-retracting portion is opened on the wafer fixing seat.

[0012] Preferably, both ends of the equipment fixing seat are respectively provided with a fixing part, and the fixing part includes two pressure plate grooves, and the two pressure plate grooves are symmetrically arranged on the front and back sides of the equipment fixing seat, and the equipment fixing seat is fixed to the wafer processing equipment through the pressure plate grooves.

[0013] Preferably, the vacuum chamber is connected to one end of a vacuum hole, the other end of the vacuum hole is connected to the negative pressure adsorption component, and the vacuum hole is opened on the side wall of the equipment fixing seat.

[0014] Preferably, the negative pressure adsorption component includes a gas tank, the top of the gas tank is connected to the negative pressure part, the middle of the gas tank is connected to the air extraction hole through a fourth pipeline, and the bottom of the gas tank is connected to the drainage and pressure relief part.

[0015] Preferably, the negative pressure part includes a vacuum generator, the air inlet end of the vacuum generator is connected to the top of the gas tank through a second pipeline, and the air outlet end of the vacuum generator is connected to the first pipeline.

[0016] Preferably, one end of the fourth pipeline is fixed to the air extraction hole through an air pipe joint, and the other end of the fourth pipeline is connected to a vacuum port, and the vacuum port is opened in the middle of the gas tank.

[0017] Preferably, the water drainage and pressure relief portion includes an exhaust hole, which is opened on one side of the bottom of the gas tank, and the exhaust hole is connected to a third pipeline.

[0018] Preferably, through holes are provided at the four corners of the wafer fixing seat, and positioning screws are provided in the through holes. The wafer fixing seat is fixed to the center of the equipment fixing seat through the positioning screws. The tightness of the positioning screws is used to adjust the tightness between the wafer fixing seat and the equipment fixing seat to adjust the sealing of the vacuum chamber.

[0019] Preferably, the tool withdrawal portion includes a tool withdrawal groove, the tool withdrawal groove is coaxially sleeved on the outer side of the wafer support seat, and the tool withdrawal groove is opened on the wafer fixing seat.

[0020] Compared with the prior art, the present invention has the following advantages and technical effects:

[0021] During use, the wafer is placed on the wafer support seat. There are evenly distributed arc-shaped air channels on the wafer support seat from the center to the outer edge. When the negative pressure adsorption component generates negative pressure suction in the vacuum chamber, several support rods are used to support the wafer fixing seat to prevent the wafer fixing seat from deformation. The arc-shaped air channel is connected to the vacuum chamber so that the wafer is adsorbed on the wafer support seat. The arc-shaped air channel on the wafer support seat is evenly adsorbed on the bottom of the wafer. At the same time, the side wall of the wafer support seat can provide uniform support for the wafer to prevent the wafer from deformation. The design of the knife retraction part can meet the needs of wafer outer circumference rounded corner processing. The replaceable design of the wafer support seat can also be adaptively adjusted according to wafers of different specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive work:

[0023] Figure 1 This is a schematic diagram of the structure of the utility model;

[0024] Figure 2 This is a schematic diagram of the structure of the wafer fixing seat of the utility model;

[0025] Figure 3 This is a schematic diagram of the structure of the fixed seat of the utility model;

[0026] Among them, 1. First pipeline; 2. Vacuum generator; 3. Second pipeline; 4. Gas tank; 5. Vacuum port; 6. Exhaust hole; 7. Third pipeline; 8. Fourth pipeline; 9. Gas pipe joint; 10. Equipment fixing seat; 11. Positioning screw; 12. Support rod; 13. Pressure plate groove; 14. Exhaust hole; 15. Vacuum chamber; 16. Wafer fixing seat; 17. Knife back groove; 18. Wafer support seat; 19. Wafer. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0029] Reference Figure 1-3 The utility model discloses a wafer processing clamping mechanism, comprising:

[0030] Equipment fixing base 10, the equipment fixing base 10 is installed in the center of the wafer processing equipment;

[0031] The vacuum chamber 15 is provided on the top surface of the equipment fixing base 10, and the vacuum chamber 15 is connected to the negative pressure adsorption component;

[0032] The wafer holder 16 is mounted on the device holder 10 and is sealed with the vacuum chamber 15;

[0033] The bottom end of the support member 12 is fixedly connected to the bottom inner wall of the vacuum chamber 15, and the top end of the support member 12 abuts against the bottom of the wafer fixing seat 16;

[0034] The wafer support seat 18 is detachably connected to the wafer fixing seat 16. A plurality of arc-shaped air channels are arranged on the wafer support seat 18 from the center to the outside, and the arc-shaped air channels are connected to the vacuum chamber 15;

[0035] The knife-retracting portion is coaxially sleeved on the outer side of the wafer support seat 18 , and is opened on the wafer fixing seat 16 .

[0036] During use, the wafer 19 is placed on the wafer support seat 18. There are evenly distributed arc-shaped air channels on the wafer support seat 18 from the center to the outer edge. When the negative pressure adsorption component generates negative pressure suction in the vacuum chamber 15, several support rods 12 are used to support the wafer fixing seat 16 to prevent the wafer fixing seat 16 from deforming. The arc-shaped air channel is connected to the vacuum chamber 15 so that the wafer 19 is adsorbed on the wafer support seat 18. The arc-shaped air channel on the wafer support seat 18 is evenly adsorbed on the bottom of the wafer 19. At the same time, the side wall of the wafer support seat 18 can evenly support the wafer 19 to prevent the wafer 19 from deforming. The design of the backing part can meet the needs of outer circumferential corner processing of the wafer 19. The replaceable design of the wafer support seat 18 can also be adaptively adjusted according to wafers 19 of different specifications.

[0037] There are a number of support rods 12 , which are arranged in a matrix in the vacuum chamber 15 , providing uniform support for the wafer holder 16 , preventing the wafer holder 16 from deforming, and improving processing accuracy.

[0038] The wafer support seat 18 is circular, consistent with the shape of the wafer 19, and has arc-shaped air channels evenly distributed from the center to the outer edge. The adsorption force can be adjusted so that the wafer is evenly adsorbed by the air pressure. The wafer support seat 18 and the wafer fixing seat 16 are connected by a card slot. The wafer support seat 18 is detachable and can meet the processing needs of wafers 19 of different specifications such as 4 inches, 5 inches, 6 inches and 8 inches.

[0039] A further optimized solution is that a fixing part is provided at both ends of the equipment fixing seat 10, and the fixing part includes two pressure plate grooves 13. The two pressure plate grooves 13 are symmetrically arranged on the front and back sides of the equipment fixing seat 10, and the equipment fixing seat 10 is fixed to the wafer processing equipment through the pressure plate grooves 13.

[0040] The equipment fixing base 10 is of variable specifications and detachable, suitable for installation on different machining center equipment, and is fixed on the machining center table using the pressure plate groove 13.

[0041] To further optimize the solution, the vacuum chamber 15 is connected to one end of the exhaust hole 14 , and the other end of the exhaust hole 14 is connected to the negative pressure adsorption component. The exhaust hole 14 is opened on the side wall of the equipment fixing base 10 .

[0042] To further optimize the solution, the negative pressure adsorption component includes a gas tank 4, the top of the gas tank 4 is connected to a negative pressure part, the middle of the gas tank 4 is connected to the air extraction hole 14 through the fourth pipeline 8, and the bottom of the gas tank 4 is connected to a drainage and pressure relief part.

[0043] To further optimize the solution, the negative pressure part includes a vacuum generator 2, the air inlet end of the vacuum generator 2 is connected to the top of the gas tank 4 through the second pipeline 3, and the exhaust end of the vacuum generator 2 is connected to the first pipeline 1.

[0044] To further optimize the solution, one end of the fourth pipeline 8 is fixed to the air extraction hole 14 through an air pipe joint 9, and the other end of the fourth pipeline 8 is connected to the vacuum port 5, which is opened in the middle of the gas tank 4.

[0045] According to a further optimized solution, the drainage and pressure relief portion includes an exhaust hole 6 , which is opened on one side of the bottom of the gas tank 4 , and is connected to a third pipeline 7 .

[0046] The vacuum generator 2 is connected to the gas tank 4 through the second pipeline 3. The gas in the vacuum chamber 15 and the gas tank 4 is discharged through the vacuum generator 2 to form a negative pressure. A check valve is provided on the first pipeline 1 to maintain a negative pressure environment in the gas tank 4 and the vacuum chamber 15 during the working gap of the vacuum generator 2. A valve is provided at the end of the third pipeline 7. By opening and closing the valve, the connection and disconnection of the exhaust hole 6 with the outside world can be controlled, and then the negative pressure state in the gas tank 4 and the vacuum chamber 15 can be controlled to achieve negative pressure adsorption of the wafer 19. At the same time, moisture will also be sucked into the gas tank 4 during the negative pressure adsorption process. When the valve is opened, the exhaust hole 6 can be used for drainage.

[0047] To further optimize the solution, through holes are opened at the four corners of the wafer fixing seat 16, and positioning screws 11 are provided in the through holes. The wafer fixing seat 16 is fixed to the center of the equipment fixing seat 10 through the positioning screws 11. The tightness of the positioning screws 11 is used to adjust the tightness between the wafer fixing seat 16 and the equipment fixing seat 10 to adjust the sealing of the vacuum chamber 15.

[0048] There are positioning screws 11 around the equipment fixing seat 10, which can be used to fix the wafer fixing seat 16. At the same time, a torque wrench is used to apply different forces to change the sealing between the equipment fixing seat 10 and the wafer fixing seat 16. The connecting gas tank 4 plays the role of adjusting the negative pressure in the vacuum chamber 15 and the wafer support seat 18.

[0049] According to a further optimized solution, the tool withdrawal portion includes a tool withdrawal groove 17 , which is coaxially sleeved on the outer side of the wafer support seat 18 and is opened on the wafer fixing seat 16 .

[0050] The wafer holder 16 is provided with a tool-backing groove 17 , the depth of which is greater than that of the wafer 19 , and can meet the requirements of the outer circumference rounding processing of the wafer 19 , with the angle guaranteed to be 44°-46°.

[0051] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present invention.

[0052] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Without departing from the spirit of the present invention, various modifications and improvements to the technical solutions of the present invention made by ordinary technicians in this field should fall within the scope of protection determined by the claims of the present invention.

Claims

1. A wafer processing clamping mechanism, characterized in that: include: An equipment fixing seat (10), wherein the equipment fixing seat (10) is installed at the center of the wafer processing equipment; A vacuum chamber (15) is provided on the top surface of the device fixing seat (10), and the vacuum chamber (15) is connected to a negative pressure adsorption component; A wafer fixing seat (16) is mounted on the device fixing seat (10) and is sealed with the vacuum chamber (15); A support member (12), the bottom end of which is fixedly connected to the bottom inner wall of the vacuum chamber (15), and the top end of the support member (12) is in contact with the bottom of the wafer fixing seat (16); A wafer support seat (18) is detachably connected to the wafer fixing seat (16), and a plurality of arc-shaped air passages are arranged on the wafer support seat (18) from the center outward, and the arc-shaped air passages are connected to the vacuum chamber (15); The knife-retracting portion is coaxially sleeved on the outside of the wafer support seat (18), and the knife-retracting portion is opened on the wafer fixing seat (16).

2. The wafer processing clamping mechanism according to claim 1, characterized in that: The two ends of the equipment fixing seat (10) are respectively provided with fixing parts, and the fixing parts include two pressure plate grooves (13). The two pressure plate grooves (13) are symmetrically arranged on the front and back sides of the equipment fixing seat (10), and the equipment fixing seat (10) is fixed to the wafer processing equipment through the pressure plate grooves (13).

3. The wafer processing clamping mechanism according to claim 1, characterized in that: The vacuum chamber (15) is connected to one end of an air extraction hole (14), the other end of the air extraction hole (14) is connected to the negative pressure adsorption component, and the air extraction hole (14) is opened on the side wall of the equipment fixing seat (10).

4. The wafer processing clamping mechanism according to claim 3, characterized in that: The negative pressure adsorption assembly comprises a gas tank (4), the top of the gas tank (4) is connected to a negative pressure part, the middle of the gas tank (4) is connected to the air extraction hole (14) through a fourth pipeline (8), and the bottom of the gas tank (4) is connected to a drainage and pressure relief part.

5. The wafer processing clamping mechanism according to claim 4, characterized in that: The negative pressure part comprises a vacuum generator (2), the air inlet end of the vacuum generator (2) is connected to the top of the gas tank (4) through a second pipeline (3), and the air outlet end of the vacuum generator (2) is connected to the first pipeline (1).

6. The wafer processing clamping mechanism according to claim 4, characterized in that: One end of the fourth pipeline (8) is fixed to the air extraction hole (14) via an air pipeline joint (9), and the other end of the fourth pipeline (8) is connected to a vacuum port (5), which is opened in the middle of the gas tank (4).

7. The wafer processing clamping mechanism according to claim 4, characterized in that: The drainage and pressure relief portion comprises an exhaust hole (6), the exhaust hole (6) being opened on one side of the bottom of the gas tank (4), and the exhaust hole (6) being connected to a third pipeline (7).

8. The wafer processing clamping mechanism according to claim 1, characterized in that: The four corners of the wafer fixing seat (16) are provided with through holes, and positioning screws (11) are provided in the through holes. The wafer fixing seat (16) is fixedly connected to the center of the device fixing seat (10) through the positioning screws (11). The tightness of the positioning screws (11) is used to adjust the tightness between the wafer fixing seat (16) and the device fixing seat (10) to adjust the sealing of the vacuum chamber (15).

9. The wafer processing clamping mechanism according to claim 1, characterized in that: The tool withdrawal portion comprises a tool withdrawal groove (17), the tool withdrawal groove (17) is coaxially sleeved on the outer side of the wafer support seat (18), and the tool withdrawal groove (17) is opened on the wafer fixing seat (16).