CAN board card integrated with IO-Link master station transceiver chip

Abstract

The utility model relates to the field of communication, and discloses a CAN board card integrated with an IO-Link master station transceiver chip, which comprises an SoC chip and the IO-Link master station transceiver chip. The SoC chip comprises a CAN interface and an Ethernet interface, and the CAN interface is connected with CAN equipment to obtain CAN network data; the IO-Link master station transceiver chip comprises an IO-Link interface, and the IO-Link interface is connected with the IO-Link slave station equipment so as to acquire data of the IO-Link slave station equipment; and the SoC chip is used for transmitting CAN network data and IO-Link slave station equipment data to the industrial Ethernet through the Ethernet interface. According to the utility model, the IO-Link master station transceiver chip is integrated into the CAN board card, so that the CAN board card has the CAN gateway function and the IO-Link master station transceiver function at the same time, and the device cost is saved for the overall application environment.

Description

Technical Field

[0001] The utility model relates to the field of communications, in particular to a CAN board card integrated with an IO-Link master station transceiver chip. Background Art

[0002] Existing IO-Link masters and gateways are two separate devices. Generally speaking, there are IO-Link masters with multiple interfaces (such as an 8-interface IO-Link master) and gateways with multiple interfaces (such as a 2-interface CAN gateway). However, using both a gateway and an IO-Link master to meet requirements can result in high overall system costs. Utility Model Content

[0003] In view of this, in order to solve the technical problem in the prior art that the overall system usage cost is very high when a gateway device and an IO-Link master station are used at the same time, the utility model provides a CAN board with an integrated IO-Link master station transceiver chip.

[0004] In a first aspect, the utility model provides a CAN board with an integrated IO-Link master transceiver chip, comprising a SoC chip and an IO-Link master transceiver chip;

[0005] The SoC chip includes several CAN interfaces and several Ethernet interfaces, each of the CAN interfaces is used to connect to one or more CAN devices via a CAN bus to obtain CAN network data; each of the Ethernet interfaces is used to access industrial Ethernet;

[0006] The IO-Link master transceiver chip includes a plurality of IO-Link interfaces, each of which is used to connect to one or more IO-Link slave devices to obtain IO-Link slave device data;

[0007] The SoC chip and the IO-Link master transceiver chip are connected via a serial peripheral interface; the SoC chip is used to transmit the CAN network data and the IO-Link slave device data to the industrial Ethernet through any of the Ethernet interfaces.

[0008] In an optional embodiment, the SoC chip further includes a CAN interface control unit;

[0009] The CAN interface control unit is used to control each of the CAN interfaces to connect to the CAN bus through each of the CAN interfaces to receive CAN network data from each of the CAN devices, process the CAN network data and output it, and send corresponding data to each of the IO-LINK slave devices through each of the CAN interfaces and the CAN bus.

[0010] In an optional embodiment, the SoC chip further includes an Ethernet control unit;

[0011] The Ethernet control unit is used to control each of the Ethernet interfaces so as to connect to the industrial Ethernet through each of the Ethernet interfaces.

[0012] In an optional embodiment, the SoC chip further includes a serial peripheral control unit;

[0013] The serial peripheral control unit is used to control the serial peripheral interface to receive the IO-Link slave device data output by the IO-Link master transceiver chip through the serial peripheral interface, and process the IO-Link slave device data before outputting it.

[0014] In an optional embodiment, the IO-Link master transceiver chip further includes an IO-Link interface control unit;

[0015] The IO-Link interface control unit is used to control each of the IO-Link interfaces to receive IO-Link slave device data sent by each of the IO-Link slave devices through each of the IO-Link interfaces, and process and output the IO-Link slave device data, or send corresponding configuration data to the IO-Link slave devices through each of the IO-Link interfaces.

[0016] In an optional embodiment, the SoC chip further includes a storage unit for storing the CAN network data and the IO-Link slave device data;

[0017] The storage unit is a storage unit with a double data transmission rate.

[0018] In an optional embodiment, the CAN device includes one or more of a single chip microcomputer, a modem, an electric meter, and an encoder.

[0019] In an optional embodiment, the IO-Link slave device includes one or more of a temperature sensor, a humidity sensor, a pressure sensor, and a flow sensor.

[0020] In a second aspect, the present invention provides a CAN gateway device with an integrated IO-Link master station, including a SoC chip and an IO-Link master station transceiver chip;

[0021] The SoC chip includes several CAN interfaces and several Ethernet interfaces, each of the CAN interfaces is used to connect to one or more CAN devices via a CAN bus to obtain CAN network data; each of the Ethernet interfaces is used to access industrial Ethernet;

[0022] The IO-Link master transceiver chip includes a plurality of IO-Link interfaces, each of which is used to connect to one or more IO-Link slave devices to obtain IO-Link slave device data;

[0023] The SoC chip and the IO-Link master transceiver chip are connected via a serial peripheral interface; the SoC chip is used to transmit the CAN network data and the IO-Link slave device data to the industrial Ethernet through any of the Ethernet interfaces.

[0024] In an optional embodiment, it further comprises a housing;

[0025] The housing is used to cover the SoC chip and the IO-Link master transceiver chip.

[0026] The utility model has the following beneficial effects:

[0027] The utility model provides a CAN board with an integrated IO-Link master transceiver chip, the CAN board including a SoC chip and an IO-Link master transceiver chip; the SoC chip including a plurality of CAN interfaces and a plurality of Ethernet interfaces, each CAN interface being used to connect to one or more CAN devices via a CAN bus to obtain CAN network data; each Ethernet interface being used to access an industrial Ethernet; the IO-Link master transceiver chip including a plurality of IO-Link interfaces, each IO-Link interface being used to connect to one or more IO-Link slave devices to obtain IO-Link slave device data; the SoC chip and the IO-Link master transceiver chip being connected via a serial peripheral interface; the SoC chip being used to transmit CAN network data and IO-Link slave device data to the industrial Ethernet via any Ethernet interface. The utility model integrates the IO-Link master transceiver chip into the same CAN board, that is, simultaneously integrating the functions of a CAN gateway and an IO-Link master transceiver chip into a single CAN board, thereby improving the integration of the device, saving corresponding device costs for the overall application environment, and facilitating installation and maintenance of the device during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 A first structural diagram of a CAN board with an integrated IO-Link master transceiver chip in an embodiment of the present application is shown;

[0030] Figure 2 A second structural diagram of a CAN board with an integrated IO-Link master transceiver chip in an embodiment of the present application is shown;

[0031] Figure 3 A structural schematic diagram of a CAN gateway device integrated with an IO-Link master station in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0032] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0035] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the utility model product is usually placed when in use, or are the orientation or position relationship commonly understood by those skilled in the art. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0036] Furthermore, the terms “first,” “second,” “third,” etc., are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0037] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0038] Currently, there is no device that integrates both the functionality of a CAN gateway device and the functionality of an IO-Link master.

[0039] Based on this, an embodiment of the present invention provides a CAN board with an integrated IO-Link master transceiver chip. By integrating the IO-Link master transceiver chip into the CAN board, the IO-Link master transceiver chip function and the CAN gateway function can be simultaneously implemented in the same CAN board, thereby improving the integration of the device. In terms of after-sales technical support, customers only need to connect with one equipment supplier during use, reducing communication costs.

[0040] For example, see Figure 1 and Figure 2The CAN board with integrated IO-Link master transceiver chip includes a SoC chip 100 and an IO-Link master transceiver chip 200. The SoC chip 100 includes a plurality of CAN interfaces and a plurality of Ethernet interfaces; each CAN interface is used to connect to one or more CAN devices through a CAN bus to obtain CAN network data; each Ethernet interface is used to access industrial Ethernet (i.e., Ethernet). The number of CAN interfaces and Ethernet interfaces can be set according to actual needs and is not limited here; for example, the number of CAN interfaces can be 4, 6, etc., and the number of Ethernet interfaces can be 2, 3, etc. In addition, different CAN interfaces can be connected to the same or different CAN devices, and can be set according to actual needs, which is not limited in this embodiment.

[0041] In one example, each CAN interface within the SoC chip 100 is used to connect to a CAN device through a CAN network, and then the CAN device converts the CAN device data into CAN network data through the CAN network and transmits it to the SoC chip 100. The SoC chip 100 then transmits the CAN network data to Ethernet through the Ethernet interface, thereby realizing the interconnection between the CAN network and the industrial Ethernet and the data conversion and transmission between two different network protocols.

[0042] Optionally, the CAN device includes one or more devices such as a single chip microcomputer, a modem, an electric meter, an encoder, etc. The CAN device can be selected for connection according to actual needs, and this embodiment does not limit this.

[0043] It can be understood that any one or more CAN interfaces of the SoC chip 100 can be connected to one or more CAN devices via the CAN bus. That is, each CAN interface can be connected to one or more CAN devices, and then obtain corresponding CAN device data. The CAN device data is converted into protocol via the CAN bus and input into the SoC chip 100 in the form of CAN network data for processing by the SoC chip 100.

[0044] Furthermore, the IO-Link master transceiver chip 200 includes a plurality of IO-Link interfaces, each of which is used to connect to one or more IO-Link slave devices to obtain IO-Link slave device data. The number of IO-Link interfaces can be set based on actual needs and is not limited herein; for example, the number of IO-Link interfaces can be 4, 6, or other. Furthermore, different IO-Link interfaces can be connected to the same or different slave devices, and the number can be set based on actual needs and is not limited in this embodiment.

[0045] Optionally, the IO-Link slave device includes one or more of sensors, gateways, actuators, and other devices, such as temperature sensors, humidity sensors, pressure sensors, and flow sensors. The required IO-Link slave device can be selected according to actual needs, and this embodiment does not limit this.

[0046] It can be understood that any one or more IO-Link interfaces of the IO-Link master transceiver chip 200 are connected to one or more IO-Link slave devices, that is, each IO-Link interface can be connected to one or more IO-Link slave devices, and corresponding IO-Link slave device data can be obtained according to the type of the IO-Link slave device for processing by the SoC chip 100.

[0047] Furthermore, the SoC chip 100 and the IO-Link master transceiver chip 200 are connected via a serial peripheral interface (SPI interface). The SoC chip 100 is used to transmit the received CAN network data and IO-Link slave device data to the industrial Ethernet through any Ethernet interface.

[0048] It can be understood that the IO-Link master transceiver chip 200 obtains IO-Link slave device data through the IO-Link interface, and then communicates with the SoC chip 100 through the serial peripheral interface to transmit the IO-Link slave device data to the SoC chip 100 through the serial peripheral interface.

[0049] Furthermore, the SoC chip 100 obtains CAN network data through the CAN interface and obtains IO-Link slave device data through the IO-Link interface, and then transmits the CAN network data and IO-Link slave device data to the industrial Ethernet through the Ethernet interface. On the one hand, it can realize the interconnection between different networks and the protocol conversion and transmission of different network data. On the other hand, it can also realize the communication and data transmission of IO-Link slave devices through Ethernet.

[0050] In one embodiment, the SoC chip 100 also includes a CAN interface control unit; wherein the CAN interface control unit is used to control each CAN interface to connect to the CAN bus through each CAN interface to receive CAN network data from each CAN device, and process the CAN network data and output it, as well as send corresponding data to each CAN device through each CAN interface and the CAN bus.

[0051] It is understood that the CAN interface control unit can set and control the communication mechanism of the CAN interface, thereby obtaining CAN device data of the CAN device connected to it through the corresponding CAN interface, or sending corresponding data to the CAN device through the CAN interface. In other words, the SoC chip 100 can control the communication mechanism of the CAN interface through the CAN interface control unit, thereby controlling the sending and acquisition of CAN device data to achieve corresponding functions.

[0052] Optionally, the CAN bus between the CAN interface and the CAN device can use a twisted pair structure bus, which can be specifically divided into a high-order data line and a low-order data line, so that the data transmitted in the CAN bus is transmitted between the CAN interface and the CAN device in the form of differential signals.

[0053] In one example, the SoC chip 100 further includes an Ethernet control unit; the Ethernet control unit is configured to control each Ethernet interface to connect to the industrial Ethernet through each Ethernet interface.

[0054] Among them, the Ethernet interface in the CAN board with the integrated IO-Link master transceiver chip can be different types of interfaces to meet different transmission rate requirements; optionally, the Ethernet interface can be any one or more of a 1000BASE-TX Ethernet port, a 100BASE-TX Ethernet port, a 10BASE-TX Ethernet port and a 10G Ethernet port.

[0055] For example, at least one Ethernet interface in a CAN board with an integrated IO-Link master transceiver chip is a 1000BASE-TX Ethernet port, at least one Ethernet interface is a 100BASE-TX Ethernet port, at least one Ethernet interface is a 10BASE-TX Ethernet port, and at least one Ethernet interface is a 10G Ethernet port. In addition, only one, two, or three types of Ethernet interfaces may be provided, and different transmission rate requirements may be met accordingly through a combination of different types of Ethernet interfaces.

[0056] Similar to the CAN interface control unit, the Ethernet control unit accesses the industrial Ethernet through the Ethernet interface, and then processes the CAN network data and IO-Link slave device data received by the SoC chip 100, and then transmits it to the industrial Ethernet through the Ethernet interface to complete the data interaction between different network protocols.

[0057] It can be understood that the Ethernet control unit can set and control the communication mechanism of the Ethernet interface, and then obtain the device data of the Ethernet device in the same local area network to which it is connected through the corresponding Ethernet interface, or send corresponding data to the Ethernet device in the same local area network through the Ethernet interface.

[0058] In another example, the SoC chip 100 also includes a serial peripheral control unit; the serial peripheral control unit is used to control the serial peripheral interface to receive IO-Link slave device data output by the IO-Link master transceiver chip 200 through the serial peripheral interface, and process the IO-Link slave device data and output it.

[0059] Optionally, the structure of the serial peripheral control unit may include a register and a timing control logic circuit; wherein, the current register value of the register is used as a trigger instruction, and the trigger instruction is converted into a timing signal via the timing control logic circuit, and then the timing signal is used to control the current input and output status of the serial peripheral interface to realize the data transmission function between different devices.

[0060] Optionally, the IO-Link master transceiver chip 200 also includes an IO-Link interface control unit; the IO-Link interface control unit is used to control each IO-Link interface to receive IO-Link slave device data sent by each IO-Link slave device through each IO-Link interface, and process the IO-Link slave device data and output it, or send corresponding configuration data to the IO-Link slave device through each IO-Link interface.

[0061] It is understood that the IO-Link interface control unit can configure and manage the communication mechanism of the IO-Link interface, thereby obtaining IO-Link slave device data from the connected IO-Link slave device through the corresponding IO-Link interface, or sending corresponding data to the IO-Link slave device through the IO-Link interface. In other words, the IO-Link master transceiver chip 200 can control the communication mechanism of the IO-Link interface through the IO-Link interface control unit, thereby controlling the data exchange between Ethernet and the IO-Link slave device to achieve the corresponding function.

[0062] In one example, the SoC chip 100 further includes a storage unit for storing relevant data. That is, the storage unit is used to store all data received by the SoC chip 100 or generated by the SoC chip 100 during operation, including but not limited to the above-mentioned CAN network data and IO-Link slave device data. Among them, the type and memory capacity of the storage unit can be set accordingly according to actual needs, and this embodiment does not limit this. Optionally, the storage unit can be a storage unit with a double data transmission rate. For example, the storage unit can be a double-rate synchronous dynamic random access memory (i.e., DDR) with 128MB of memory.

[0063] like Figure 2 As shown, the CAN board with integrated IO-Link master transceiver chip includes a SoC chip 100 and an IO-Link master transceiver chip 200, wherein the IO-Link master transceiver chip 200 includes two IO-Link interfaces (the two IO-Link interfaces can correspondingly form two IO-Link channels: IO-Link1, IO-Link2), and the SoC chip 100 includes two CAN interfaces (CAN1, CAN2); the IO-Link master transceiver chip 200 is connected to the SoC chip 100 via a serial peripheral interface (SPI0).

[0064] The IO-Link master transceiver chip 200 uses the IO-Link master transceiver chip 200 of model MAX14819, and the SoC chip 100 uses the SoC chip 100 of model nuc980dk71yc. The main frequency of the SoC chip 100 is 300MHz, and it has a built-in 128MB DDR.

[0065] For reference, the CAN board with integrated IO-Link master transceiver chip is connected to the industrial Ethernet via the Ethernet interface (ETH0 interface) using the Ethernet IP protocol in the north direction; it is connected to the corresponding equipment via the IO-Link interface or CAN interface (CAN / IO-Link interface) in the south direction to realize functions such as data collection or sending configuration parameters.

[0066] In an embodiment of the present utility model, by integrating the IO-Link master transceiver chip 200 into the CAN board, that is, integrating the functions of the IO-Link master transceiver chip 200 into a CAN board, the IO-Link master transceiver chip function and the CAN gateway function are simultaneously realized in the same CAN board, thereby realizing data interaction between different networks, so that different external devices (CAN devices and IO-Link slave devices) connected to the CAN board can communicate and collaborate efficiently, thereby extending the communication distance between different external devices.

[0067] For reference, such as Figure 3As shown, the utility model also provides a CAN gateway device with an integrated IO-Link master station, which includes a SoC chip 310 and an IO-Link master station transceiver chip 320; the SoC chip 310 includes several CAN interfaces and several Ethernet interfaces, each CAN interface is used to connect to one or more CAN devices through a CAN bus to obtain CAN network data; each Ethernet interface is used to access industrial Ethernet; the IO-Link master station transceiver chip 320 includes several IO-Link interfaces, each IO-Link interface is used to connect to one or more IO-Link slave devices to obtain IO-Link slave device data; the SoC chip 310 and the IO-Link master station transceiver chip 320 are connected through a serial peripheral interface; the SoC chip 310 is used to transmit CAN network data and IO-Link slave device data to the industrial Ethernet through any Ethernet interface.

[0068] Furthermore, the CAN gateway device integrated with the IO-Link master station further includes a housing, wherein the housing is used to cover the SoC chip 310 and the IO-Link master station transceiver chip 320 .

[0069] It can be understood that the structure of the SoC chip 310 and the IO-Link master transceiver chip 320 in the CAN gateway device with integrated IO-Link master is consistent with the structure of the corresponding devices in the CAN board with integrated IO-Link master transceiver chip 320 in the aforementioned embodiment, and thus any optional options in the aforementioned embodiment are also applicable to this embodiment, so they will not be elaborated here.

[0070] In this utility model, the SoC chip 310 and the IO-Link master transceiver chip 320 are integrated into the same CAN gateway device, enabling both CAN gateway functionality and data transmission between the CAN gateway device and IO-Link slave devices. Furthermore, since the IO-Link master transceiver chip 320 and the SoC chip 310 are integrated into the same CAN gateway device, the cost of components such as the housing can be reduced, saving installation space and facilitating subsequent operation and maintenance.

[0071] In all examples shown and described herein, any specific values should be interpreted as merely exemplary and not limiting, and thus other examples of the exemplary embodiments may have different values.

[0072] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A CAN board with an integrated IO-Link master transceiver chip, characterized in that: Including SoC chip and IO-Link master transceiver chip; The SoC chip includes several CAN interfaces and several Ethernet interfaces, each of the CAN interfaces is used to connect to one or more CAN devices via a CAN bus to obtain CAN network data; each of the Ethernet interfaces is used to access industrial Ethernet; The IO-Link master transceiver chip includes a plurality of IO-Link interfaces, each of which is used to connect to one or more IO-Link slave devices to obtain IO-Link slave device data; The SoC chip and the IO-Link master transceiver chip are connected via a serial peripheral interface; the SoC chip is used to transmit the CAN network data and the IO-Link slave device data to the industrial Ethernet through any of the Ethernet interfaces.

2. The CAN board with integrated IO-Link master transceiver chip according to claim 1, characterized in that: The SoC chip also includes a CAN interface control unit; The CAN interface control unit is used to control each of the CAN interfaces to connect to the CAN bus through each of the CAN interfaces to receive CAN network data from each of the CAN devices, process the CAN network data and output it, and send corresponding data to each of the IO-Link slave devices through each of the CAN interfaces and the CAN bus.

3. The CAN board with integrated IO-Link master transceiver chip according to claim 1, characterized in that: The SoC chip also includes an Ethernet control unit; The Ethernet control unit is used to control each of the Ethernet interfaces so as to connect to the industrial Ethernet through each of the Ethernet interfaces.

4. The CAN board with integrated IO-Link master transceiver chip according to claim 1, characterized in that: The SoC chip also includes a serial peripheral control unit; The serial peripheral control unit is used to control the serial peripheral interface to receive the IO-Link slave device data output by the IO-Link master transceiver chip through the serial peripheral interface, and process the IO-Link slave device data before outputting it.

5. The CAN board with integrated IO-Link master transceiver chip according to claim 1, characterized in that: The IO-Link master transceiver chip also includes an IO-Link interface control unit; The IO-Link interface control unit is used to control each of the IO-Link interfaces to receive IO-Link slave device data sent by each of the IO-Link slave devices through each of the IO-Link interfaces, and process and output the IO-Link slave device data, or send corresponding configuration data to the IO-Link slave devices through each of the IO-Link interfaces.

6. The CAN board with integrated IO-Link master transceiver chip according to claim 1, characterized in that: The SoC chip further includes a storage unit for storing the CAN network data and the IO-Link slave device data; The storage unit is a storage unit with a double data transmission rate.

7. The CAN board with integrated IO-Link master transceiver chip according to claim 1, characterized in that: The CAN device includes one or more of a single chip microcomputer, a modem, an electric meter, and an encoder.

8. The CAN board with integrated IO-Link master transceiver chip according to claim 1, characterized in that: The IO-Link slave device includes one or more of a temperature sensor, a humidity sensor, a pressure sensor, and a flow sensor.

9. A CAN gateway device integrated with an IO-Link master station, characterized in that: Including SoC chip and IO-Link master transceiver chip; The SoC chip includes several CAN interfaces and several Ethernet interfaces, each of the CAN interfaces is used to connect to one or more CAN devices via a CAN bus to obtain CAN network data; each of the Ethernet interfaces is used to access industrial Ethernet; The IO-Link master transceiver chip includes a plurality of IO-Link interfaces, each of which is used to connect to one or more IO-Link slave devices to obtain IO-Link slave device data; The SoC chip and the IO-Link master transceiver chip are connected via a serial peripheral interface; the SoC chip is used to transmit the CAN network data and the IO-Link slave device data to the industrial Ethernet through any of the Ethernet interfaces.

10. The CAN gateway device integrated with an IO-Link master station according to claim 9, characterized in that: Also includes the housing; The housing is used to cover the SoC chip and the IO-Link master transceiver chip.

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