Heating pad

Abstract

The utility model provides a heating pad, comprising a heating control circuit used for generating heat after being electrified; the heating control circuit and the interlayer are positioned in the cushion body; wherein the pad body is provided with a channel for connecting the inside and the outside of the pad body; due to the fact that the automatic inflation layer is arranged in the cushion body, the automatic inflation layer can restore to the original shape after the external force applied to the automatic inflation layer disappears, the automatic inflation layer can restore to the original shape after the external force applied to the automatic inflation layer disappears, the size in the cushion body is increased, and the air pressure in the cushion body is reduced. External air can automatically enter the pad body through the channel, and finally automatic inflation of the heating pad is achieved. The heating pad which is stored is small in occupied space. The heating pad can also realize free switching between direct-current power supply and alternating-current power supply.

Description

Technical Field

[0001] The utility model relates to a heating and warming product, in particular to a heating pad. Background Art

[0002] Existing heating pads are typically only powered by AC power, not DC power, which can be inconvenient for users. Furthermore, most existing heating pads are inflated using mechanical pressure (e.g., repeatedly pressing an airbag). This inflation method requires considerable effort and time from the user.

[0003] Therefore, it is necessary to improve the deficiencies in the prior art. Utility Model Content

[0004] The main technical problem solved by the utility model is how to realize automatic inflation of a heating pad. The utility model provides a heating pad which can realize automatic inflation.

[0005] According to the first aspect, an embodiment provides a heating pad, comprising: a heating control circuit for generating heat when powered on; a sealed pad body, wherein the heating control circuit and the partition are both located within the pad body; wherein the pad body is provided with a passage connecting the interior and exterior of the pad body; and an automatic inflating layer is provided between the pad body and at least part of the partition layer, wherein the automatic inflating layer can return to its original shape after the external force applied to the automatic inflating layer disappears.

[0006] In one embodiment, the automatic inflatable layer is made of an elastic material; wherein the elastic material includes any one of sponge, 3D plant ecological cotton, latex, memory foam and 3D material.

[0007] In one embodiment, an air nozzle is provided on the pad body, and the air nozzle is used to open or close the channel.

[0008] In one embodiment, the heating pad further includes: an insulation layer for at least partially wrapping the heating control circuit to prevent the heating control circuit from burning; wherein the insulation layer includes a first sub-insulator layer and a second sub-insulator layer, the heating control circuit is arranged between the first sub-insulator layer and the second sub-insulator layer, and the first sub-insulator layer and the second sub-insulator layer at least partially wrap the heating control circuit.

[0009] In one embodiment, the self-inflating layer is located between the second sub-layer and the inner wall of the cushion body, and / or between the first sub-layer and the inner wall of the cushion body.

[0010] In one embodiment, the heating control circuit includes a DC heating circuit and a control circuit; wherein the DC heating circuit includes a first heating element and a first relay; the two ends of the first heating element are electrically connected to the first DC power supply and the first contact of the contact switch of the first relay, and the second contact of the contact switch of the first relay is grounded; the control circuit includes an external switch unit, an MCU, a first drive unit and a fifth diode, and the drive unit has a control end, a first end and a second end; one end of the external switch unit is electrically connected to the MCU, and the other end of the external switch unit is grounded; the MCU is electrically connected to the control end of the drive unit, the first end of the drive unit is grounded, and the second end of the drive unit is respectively connected to the The positive pole of the fifth diode is electrically connected to the second end of the coil of the third relay, and the negative pole of the fifth diode is electrically connected to the first DC power supply and the first end of the coil of the third relay, respectively; the MCU is used to receive the signal sent by the external switching unit and control the first end and the second end of the driving unit to be turned on and off according to the signal, wherein, when the first end and the second end of the driving unit are turned on, the coil of the first relay is energized, so that the contact switch of the first relay is closed, so that the first heating element starts to heat; when the first end and the second end of the driving unit are turned off, the coil of the first relay is de-energized, so that the contact switch of the first relay is disconnected, so that the first heating element stops heating.

[0011] In one embodiment, the first driving unit is a first transistor, the control end of the first driving unit is the base of the first transistor, the second end of the first driving unit is the collector of the first transistor, and the first end of the first driving unit is the emitter of the first transistor; the heating control circuit also includes a voltage stabilizing filter circuit, and the voltage stabilizing filter circuit includes a first diode, a first three-terminal voltage regulator, a first capacitor, a third capacitor, and a second capacitor; wherein, the input end of the first diode is electrically connected to the positive electrode of the first DC power supply, the output end of the first diode is electrically connected to the input end of the first three-terminal voltage regulator and the input end of the first capacitor respectively, the output end of the first capacitor is grounded, the ground end of the first three-terminal voltage regulator is grounded, the output end of the first three-terminal voltage regulator is electrically connected to the input end of the third capacitor and one end of the second capacitor respectively, and the other end of the second capacitor is grounded.

[0012] In one embodiment, the heating control circuit also includes an AC heating circuit, which includes a second heating element and a thyristor switch; wherein, one end of the second heating element is electrically connected to the first end of the AC power supply, the other end of the second heating element is electrically connected to the input end of the thyristor switch, the output end of the thyristor switch is electrically connected to the third output end of the first relay, the control end of the thyristor switch is respectively electrically connected to one end of the forty-fourth resistor and one end of the forty-fifth resistor, the other end of the forty-fifth resistor is grounded, the other end of the forty-fourth resistor is electrically connected to the sixth pin of the MCU, the MCU is electrically connected to the first end of the AC power supply, and the second end of the AC power supply is grounded.

[0013] In one embodiment, the heating control circuit further includes a second relay, a third diode, an eleventh resistor, a sixth capacitor, a fifth electrolytic capacitor, a fourth electrolytic capacitor, and a second three-terminal voltage regulator; the first input end of the second relay is electrically connected to one end of the eleventh resistor and the output end of the third diode, the second input end of the second relay is electrically connected to the input end of the third diode, the second input end signal of the second relay is grounded, the third output end of the second relay is electrically connected to the negative electrode of the first DC power supply, one end of the electric shock switch of the second relay is electrically connected to the second end of the AC power supply, the other end of the eleventh resistor is electrically connected to one end of the sixth capacitor, , the input end of the fifth capacitor and the output end of the second three-terminal regulator are electrically connected, the input end of the second three-terminal regulator is electrically connected to the input end of the fourth capacitor and the positive electrode of the first DC power supply respectively, the other end of the sixth capacitor, the other end of the fifth capacitor, the ground end of the second three-terminal regulator and the output end of the fourth capacitor are all signal grounded; the MCU is electrically connected to the first end of the AC power supply, and the ground end of the MCU is grounded; wherein, only when the first DC power supply is connected to the heating control circuit, the contact switch of the second relay is closed; and when the first DC power supply is not connected to the heating control circuit, the contact switch of the second relay is disconnected.

[0014] In one embodiment, the DC heating circuit further includes a third heating element and a third relay; the two ends of the third heating element are electrically connected to the second DC power supply and the first contact of the contact switch of the third relay, and the second contact of the contact switch of the third relay is grounded; the control circuit includes a second drive unit and a sixth diode, the second drive unit having a control end, a first end, and a second end; the MCU is electrically connected to the control end of the second drive unit, the first end of the second drive unit is grounded, the second end of the second drive unit is electrically connected to the anode of the sixth diode and the second end of the coil of the third relay, respectively, and the sixth diode The negative pole is electrically connected to the second DC power supply and the first end of the coil of the third relay respectively; wherein the MCU is also used to receive a signal sent by the external switching unit and control the first end and the second end of the second driving unit to be turned on and off according to the signal, wherein, when the first end and the second end of the second driving unit are turned on, the coil of the third relay is energized, so that the contact switch of the third relay is closed, so that the third heating element starts to heat; when the first end and the second end of the second driving unit are turned off, the coil of the third relay is de-energized, so that the contact switch of the third relay is disconnected, so that the third heating element stops heating.

[0015] The beneficial effects of this application are:

[0016] The heating pad includes: a heating control circuit for generating heat after being energized; a sealed pad body, wherein the heating control circuit and the interlayer are both located within the pad body; wherein the pad body is provided with a channel connecting the interior and exterior of the pad body; since an automatic inflation layer is provided between the pad body and at least a portion of the interlayer, the automatic inflation layer can return to its original shape after the external force applied to the automatic inflation layer disappears, therefore, when the gas in the pad needs to be discharged, an external force (such as squeezing, etc.) can be applied to the automatic inflation layer to discharge the gas, and the automatic inflation layer returns to its original shape after the external force applied to the automatic inflation layer disappears, so that the volume inside the pad body increases, the air pressure inside the pad body decreases, and the external air can automatically enter the pad body through the above-mentioned channel, ultimately realizing automatic inflation of the heating pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of a top view of a heating pad according to an embodiment;

[0018] Figure 2 Schematic diagram of the cross-sectional structure of a heating pad according to an embodiment;

[0019] Figure 3 1 is a schematic structural diagram of a control circuit according to an embodiment;

[0020] Figure 4 Schematic diagram of the structure of a control circuit in another embodiment. DETAILED DESCRIPTION

[0021] The present invention is further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted under different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail. They can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0022] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various embodiments. Furthermore, the steps or actions in the method description may be reordered or adjusted in a manner readily apparent to those skilled in the art. Therefore, the various sequences in the specification and drawings are provided solely for the purpose of clearly describing a particular embodiment and are not intended to be mandatory, unless otherwise specified.

[0023] The serial numbers assigned to components herein, such as "first," "second," etc., are used solely to distinguish the objects being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings).

[0024] The technical solution of the present application will be described in detail below with reference to embodiments.

[0025] The present application provides a heating pad, comprising: a heating control circuit for generating heat when powered on; a pad body, wherein the heating control circuit and the interlayer are both located within the pad body; wherein the pad body is provided with a passage connecting the interior and exterior of the pad body; and wherein an automatic inflating layer is provided between the pad body and at least a portion of the interlayer; wherein the automatic inflating layer can return to its original shape after the external force applied to the automatic inflating layer disappears.

[0026] In some embodiments, the heating control circuit may be powered by a DC power supply and / or an AC power supply. Those skilled in the art may directly adopt an existing heating control circuit according to actual needs.

[0027] In some embodiments, an opening may be provided on the pad body. The opening serves as a passage connecting the interior and exterior of the pad body. The opening is used to connect the interior of the pad body with the outside air. It is understandable that when the heating pad is delivered to the user, the automatic inflatable layer is usually in a compressed state; since the automatic inflatable layer can return to its original state after the external force applied to the automatic inflatable layer (such as the pressure applied by the user when storing the heating pad) disappears, after the user takes out the heating pad, the automatic inflatable layer begins to return to its original state, the volume of the heating pad increases, the air pressure inside the heating pad decreases, and the outside air enters the heating pad through the above-mentioned opening, thereby realizing automatic inflation of the heating pad. After the user has finished using the heating pad, the user can press the heating pad to discharge the air in the automatic inflatable layer from the above-mentioned opening, and the volume of the automatic inflatable layer is reduced, thereby facilitating storage.

[0028] In some embodiments, the self-inflating layer is made of an elastic material; the elastic material includes any one of sponge, 3D plant-based eco-cotton, latex, memory foam, and 3D materials. 3D plant-based eco-cotton is a new, environmentally friendly, three-dimensional non-woven material with high resilience and high compressive strength. The fiber mesh structure of 3D plant-based eco-cotton enables it to quickly recover to its original shape after being subjected to pressure, with a rebound rate of over 90%. It also has high compressive strength. The latex has ultra-high elasticity and conformability. The memory foam has a slow recovery property. This is due to its open cell structure, which allows air to flow through it. When pressure is applied, some air is squeezed out. Once the pressure is removed, air is reinjected, and the material slowly returns to its original shape. The 3D materials also quickly recover after being subjected to pressure. For example, 3D mesh fabric is made using a three-dimensional weaving process, resulting in a three-dimensional honeycomb structure with excellent breathability, elasticity, and high wear resistance. This unique fiber structure and material properties enable the 3D mesh fabric to quickly recover to its original shape when subjected to pressure. Those skilled in the art may also adopt other elastic materials according to actual needs.

[0029] For some examples, please refer to Figure 1 The heating pad includes: a pad body 100 and a heating control circuit 200. The heating control circuit 200 is arranged in the pad body 100. An air nozzle 300 is provided at one end of the pad body 100, and the air nozzle 300 is used to open or close the channel connecting the inside and the outside of the pad body. People in this field can directly use the existing air nozzle. The pad body can be made of a material with good air tightness. For example, the pad body can be made of PVC leather (Danny leather). Preferably, the sponge is a high-resilience full-fat sponge. The channel connecting the inside and the outside of the pad body can be opened or closed by rotating the air nozzle.

[0030] In some embodiments, the air nozzle is integrally connected to the cushion body.

[0031] In some embodiments, the air nozzle is detachably connected to the cushion body.

[0032] For some examples, please refer to Figure 1 The heating control circuit 200 includes an external switch unit SW4 . The external switch unit SW4 is disposed outside the pad body 100 .

[0033] It is understandable that when the heating pad is delivered to the user, the automatic inflation layer is usually in a compressed state. When the user needs to use the heating pad, the user can open the above-mentioned air nozzle, and the automatic inflation layer can return to its original state after the external force applied to the automatic inflation layer (such as the pressure applied by the user when storing the heating pad) disappears. In the process of the automatic inflation layer returning to its original state, the volume of the heating pad increases, the air pressure inside the heating pad decreases, and the outside air enters the heating pad through the above-mentioned air nozzle, thereby realizing the automatic inflation of the heating pad. After the user has finished using the heating pad, the user can press the heating pad to discharge the air in the automatic inflation layer from the above-mentioned air nozzle, and the volume of the automatic inflation layer is reduced, which is convenient for storage. In addition, the user can control the flow rate or volume of the air entering the heating pad through the above-mentioned air nozzle according to actual needs, and ultimately control the volume of the heating pad after automatic inflation.

[0034] It can be seen that in some embodiments, since an automatic inflation layer is provided within the pad, when the user needs to use it, they can open the air nozzle, and the automatic inflation layer within the pad will automatically rebound and return to its original shape, thereby gradually filling the pad with air and allowing the heating pad to automatically expand without the user having to press to inflate the heating pad, thereby saving the user's physical effort; after the heating pad has completely expanded on its own, the air nozzle is closed, and the air is sealed within the pad, allowing the user to use the heating pad normally. When the user has finished using the heating pad or needs to store the heating pad, they can first open the air nozzle, then squeeze the heating pad to expel the air from the pad. After the air in the pad is basically expelled, the air nozzle is closed and the heating pad is folded, thereby reducing the space occupied by the heating pad and completing the storage work.

[0035] In some embodiments, the heating pad further comprises an insulation layer. The insulation layer is used to at least partially wrap the heating control circuit to prevent the heating control circuit from burning and damaging other components of the heating pad (such as the automatic inflation layer and the pad body, etc.). Figure 2 The heating pad's interlayer is disposed within the pad body 100. The interlayer includes a first sub-interlayer 410 and a second sub-interlayer 420. The heating control circuit 200 is disposed between the first sub-interlayer 410 and the second sub-interlayer 420. The interlayer 400 is used to prevent the heating control circuit 200 from burning. The plane on which the automatic inflation layer is located can be parallel to the plane on which the interlayer is located. Those skilled in the art can determine the specific layout of the interlayer based on actual needs.

[0036] In some embodiments, the interlayer is made of non-woven fabric. Those skilled in the art may also determine the specific material of the interlayer based on actual needs. The size and shape of the first and second sub-interlayers are not specifically limited herein. Preferably, the first and second sub-interlayers are capable of completely enclosing the heating control circuit.

[0037] For some examples, please refer to Figure 2 The first sub-layer 410 is located on the side of the heating control circuit 200 facing away from gravity, and the second sub-layer 420 is located on the side of the heating control circuit 200 facing toward gravity. The automatic inflation layer 500 is located between the second sub-layer 420 and the inner wall of the cushion body 100. In this way, the second sub-layer 420 separates the automatic inflation layer 500 from the heating control circuit 200, thereby preventing the high temperature generated by the heating control circuit when powered on from burning the automatic inflation layer.

[0038] In some embodiments, the self-inflating layer 500 may be disposed between the first sub-interlayer 410 and the inner wall of the cushion body 100 .

[0039] For some examples, please refer to Figure 3The heating control circuit includes a DC heating circuit and a control circuit; wherein the DC heating circuit includes a first heating element W1 and a first relay J1 driven by the control circuit; the two ends of the first heating element W1 are electrically connected to the first DC power supply and the first contact 4 of the contact switch of the first relay J1, respectively, and the second contact (3) of the contact switch of the first relay J1 is grounded; the control circuit includes an external switch unit SW4, an MCU (such as U4), a first drive unit Q2 and a fifth diode D5, the drive unit having a control end, a first end and a second end; one end of the external switch unit SW4 is electrically connected to the MCU (such as U4), and the other end of the external switch unit SW4 is grounded; the MCU is electrically connected to the control end B of the drive unit, the first end E of the drive unit is grounded, the second end C of the drive unit is electrically connected to the positive electrode of the fifth diode D5 and the second end (2) of the coil of the third relay, respectively, and the negative electrode of the fifth diode D5 is electrically connected to the first DC power supply and the first end (1) of the coil of the third relay, respectively. The MCU is used to receive a signal from the external switch unit SW4 and control the first and second ends of the drive unit (such as Q2) to turn on and off according to the signal. When the first and second ends of the first drive unit (such as Q2) are turned on, the coil of the first relay J1 is energized, causing the contact switches (such as 3 and 4) of the first relay J1 to close, thereby starting to heat the first heating element W1. When the first and second ends of the first drive unit (such as Q2) are turned off, the coil of the first relay J1 is de-energized, causing the contact switches (such as 3 and 4) of the first relay J1 to open, thereby stopping the heating of the first heating element W1. The external switch unit SW4 can be a touch switch.

[0040] For some examples, please refer to Figure 3 The first driving unit Q2 is electrically connected to the MCU (eg, U4) via the sixth resistor R6. The cathode of the fifth diode D5 is electrically connected to the first DC power supply via the fourth resistor R4.

[0041] In some embodiments, the first heating element W1 is electrically connected to the positive electrode DC+ of the first DC power supply and one end (4) of the electric contact switch of the first relay J1.

[0042] In some embodiments, the first heating element may be a heating wire. Persons skilled in the art may determine the specific material and shape of the first heating element according to actual needs.

[0043] In some embodiments, the third output terminal (3) of the first relay J1 is grounded via a temperature-controlled switch (such as K1 and K2), and the negative electrode signal of the first DC power supply DC is grounded. The temperature-controlled switch is used to control the temperature of the first heating element and / or the second heating element.

[0044] In some embodiments, one end of the external switch unit SW4 is electrically connected to the 13th pin 13 of the MCU (e.g., U4) via a 67th resistor R67, and the other end of the external switch unit SW4 is grounded. The 67th resistor R67 is used for current limiting. The MCU is a microcontroller unit. Those skilled in the art can select the model of the MCU based on actual needs.

[0045] In some embodiments, the fourteenth pin (14) of the MCU is grounded.

[0046] In some embodiments, the MCU can control the temperature of the first heating element by using existing temperature control technology (such as temperature control by time adjustment). Since the temperature control technology is an existing technology, it will not be described in detail here.

[0047] In some embodiments, the fourth pin (4) of the MCU is electrically connected to one end of a ninth resistor R9, the other end of the ninth resistor R9 is electrically connected to one end of a seventh resistor R7 and one end of an eighth resistor R8, respectively, the other end of the seventh resistor R7 is electrically connected to the positive electrode of the first DC power supply, and the other end of the eighth resistor R8 is grounded. The MCU can detect the voltage of the first DC power supply through the seventh resistor R7, the eighth resistor R8, and the ninth resistor R9. Those skilled in the art can select the first DC power supply according to actual needs. For example, the first DC power supply can be a 24V DC power supply, a 12V DC power supply, etc.

[0048] In some embodiments, the fourth pin (4) of the MCU is electrically connected to the positive electrode of the first DC power supply, the fifth pin (5) of the MCU (such as U4) is electrically connected to the control terminal B of the drive unit, one end of the first heating element W1 is electrically connected to the positive electrode DC+ of the first DC power supply, and the other end of the first heating element W1 is electrically connected to one end (4) of the electric shock switch of the first relay J1.

[0049] It can be seen that in some embodiments, please refer to Figure 3 In the case where the heating control circuit only includes a DC heating circuit and a control circuit, the MCU (such as U4) detects the DC voltage through its fourth pin (4). For example, if the DC voltage detected by the fourth pin (4) is a first DC voltage (such as 2.1V), the MCU determines that the DC heating circuit has been connected to a 12V DC power supply; at this time, the user can output a first switching signal through the external switch unit SW4. After receiving the first switching signal, the MCU sends a first control signal to the first drive unit Q2, thereby causing the first drive unit Q2 to turn on or off one end (4) and the other end (3) of the electric switch and control the contact switch of the first relay J1 to turn on or off, so that the first heating element W1 starts heating or stops heating.

[0050] In some embodiments, the driving unit may be a first transistor Q2 , wherein the control terminal of the driving unit is the base of the first transistor Q2 , the second terminal of the driving unit is the collector of the first transistor Q2 , and the first terminal of the driving unit is the emitter of the first transistor Q2 .

[0051] In some embodiments, the driving unit may also be a MOS transistor or the like.

[0052] In some embodiments, the heating control circuit further includes a voltage stabilizing filter circuit, which further includes a first diode D1, a first three-terminal voltage regulator U5, a first capacitor C1, a third capacitor C3, and a second capacitor C2, wherein the input end of the first diode D1 is electrically connected to the positive electrode of the first DC power supply DC, the output end of the first diode D1 is electrically connected to the input end (1) of the first three-terminal voltage regulator U5 and the input end of the first capacitor C1, the output end of the first capacitor C1 is grounded, the ground end (3) of the first three-terminal voltage regulator U5 is grounded, the output end (2) of the first three-terminal voltage regulator U5 is electrically connected to the input end of the third capacitor C3 and one end of the second capacitor C2, and the other end of the second capacitor C2 is grounded.

[0053] In some embodiments, the first capacitor C1 and the third capacitor C3 may both be electrolytic capacitors. The first three-terminal voltage regulator U5 may be a model such as 7805, and the second three-terminal voltage regulator U1 may be a model such as 7812.

[0054] In some embodiments, the fourth pin (4) of the MCU is electrically connected to the positive electrode of the first DC power supply, the fifth pin (5) of the MCU is electrically connected to the base B of the first transistor Q2, the collector E of the first transistor Q2 is grounded, the emitter C of the first transistor Q2 is electrically connected to the input end of the fifth diode D5 and one input end of the third relay respectively, and the output end of the fifth diode D5 is electrically connected to the other input end of the third relay.

[0055] In some embodiments, the heating control circuit further includes an AC heating circuit, the AC heating circuit including a second heating element W2 and a thyristor switch T1; wherein one end of the second heating element W2 is electrically connected to the first end AC1 of the AC power supply, the other end of the second heating element W2 is electrically connected to the input end of the thyristor switch T1, the first output end of the thyristor switch T1 is electrically connected to the third output end of the first relay J1, the second output end of the thyristor switch T1 is electrically connected to one end of the forty-fourth resistor R44 and one end of the forty-fifth resistor R45, respectively, the other end of the forty-fifth resistor R45 is grounded, the other end of the forty-fourth resistor R44 is electrically connected to the sixth pin (6) of the MCU, the seventh pin (7) of the MCU is electrically connected to the first end AC1 of the AC power supply, and the second end AC2 of the AC power supply is grounded. The user can control the MCU (such as U4) through the external switch unit SW4, thereby enabling the MCU to control whether the thyristor switch T1 is turned on or off, and then control the second heating element W2 to start heating or stop heating through the thyristor switch T1. For example, the user can switch gears by pressing the external switch unit SW4. In different gears, the MCU controls the conduction time of the thyristor switch T1, thereby controlling the heating time of the second heating element W2, thereby achieving different temperatures of the second heating element W2. In some embodiments, those skilled in the art can also determine the number of AC heating circuits in the heating control circuit. For example, the heating control circuit can include multiple identical AC heating circuits, and the voltage of the AC power supply in each AC heating circuit is different.

[0056] In some embodiments, the seventh pin (7) of the MCU is electrically connected to one end of a second resistor R2, and the other end of the second resistor R2 is electrically connected to the first end AC1 of the AC power supply via the first resistor R1. The MCU can detect the voltage and frequency of the AC power supply via the first resistor R1 and the second resistor R2.

[0057] In some embodiments, the second heating element may also be a heating wire. Those skilled in the art may determine the specific material and shape of the second heating element based on actual needs. The first heating element is powered by a first DC power supply, the second heating element is powered by an AC power supply, and the resistance values of the first heating element and the second heating element are different.

[0058] In some embodiments, the heating pad may include a plurality of first heating elements and a plurality of second heating elements. The first heating element and the second heating element may be packaged as a heating wire. The heating core may be in a preset shape, such as an S shape. The first heating element may be parallel to the second heating element. The first heating element and the second heating element may also be separated from each other by a certain distance. For example, the heating pad may include a first heating element W1 powered by a first DC power supply and two second heating elements W2 powered by an AC power supply, wherein the first heating element and the two second heating elements may be packaged as a heating wire.

[0059] For some examples, please refer to Figure 3 The heating control circuit further includes a second relay J2, a third diode D3, an eleventh resistor R11, a sixth capacitor C6, a fifth capacitor C5, a fourth capacitor C4 and a second three-terminal voltage regulator U1; wherein the first input terminal (1) of the second relay J2 is electrically connected to one end of the eleventh resistor R11 and the output terminal of the third diode D3 respectively, the second input terminal (2) of the second relay J2 is electrically connected to the input terminal of the third diode D3, the second input terminal (2) of the second relay J2 is signal-grounded, and the third output terminal (3) of the second relay J2 is electrically connected to the first DC power supply DC The negative electrode of the first DC power supply is electrically connected, one end (4) of the contact switch of the second relay J2 is electrically connected to the second end AC2 of the AC power supply, the other end of the eleventh resistor R11 is electrically connected to one end of the sixth capacitor C6, the input end of the fifth capacitor C5, and the output end of the second three-terminal voltage regulator U1, respectively. The input end of the second three-terminal voltage regulator U1 is electrically connected to the input end of the fourth capacitor C4 and the positive electrode DC+ of the first DC power supply, and the other end of the sixth capacitor C6, the other end of the fifth capacitor C5, the ground end of the second three-terminal voltage regulator U1 and the output end of the fourth capacitor C4 are all signal-grounded. Only when the first DC power supply is connected to the heating control circuit, the contact switch of the second relay J2 is closed; when the first DC power supply is not connected to the heating control circuit, the contact switch of the second relay J2 is disconnected. The external switch unit SW4 can be used to start the DC heating circuit or start the AC heating circuit. The second three-terminal voltage regulator U1 can power the first relay J1 and the second relay J2.

[0060] For some examples, please refer to Figure 4The DC heating circuit further comprises a third heating element W3 and a third relay J3; the two ends of the third heating element W3 are electrically connected to the second DC power supply and the first contact (4) of the contact switch of the third relay J3, respectively, and the second contact (3) of the contact switch of the third relay J3 is grounded; the control circuit comprises a second drive unit Q3 and a sixth diode D6, the second drive unit having a control end, a first end, and a second end; the MCU is electrically connected to the control end B of the second drive unit Q3, the first end E of the second drive unit Q3 is grounded, the second end C of the second drive unit Q3 is electrically connected to the anode of the sixth diode D6 and the second end (2) of the coil of the third relay, respectively, and the cathode of the sixth diode D6 is electrically connected to the cathode of the sixth diode D6. The first and second terminals of the second drive unit Q3 are electrically connected to the second DC power supply and the first terminal (1) of the coil of the third relay J3 respectively; the MCU is also used to receive a signal from the external switch unit SW4 and control the first and second terminals of the second drive unit Q3 to be turned on and off according to the signal, wherein when the first and second terminals of the second drive unit Q3 are turned on, the coil of the third relay J3 is energized, so that the contact switches (such as 3 and 4) of the third relay J3 are closed, so that the third heating element W3 starts to be heated; when the first and second terminals of the second drive unit Q3 are turned off, the coil of the third relay J3 is de-energized, so that the contact switches (such as 3 and 4) of the third relay J3 are opened, so that the third heating element W3 stops being heated.

[0061] It should be noted that the specific control methods of the MCU, the external switch unit SW4, the control of the thyristor switch T1, the first relay J1, the second relay J2 and the third relay J3 in this application all belong to the existing technology in this field, and this application does not make any improvements to the above-mentioned specific control methods of the MCU, the external switch unit SW4, the control of the thyristor switch T1, the first relay J1, the second relay J2 and the third relay J3.

[0062] For some examples, please refer to Figure 4The second drive unit Q3 is electrically connected to the MCU via a fifteenth resistor R15. The cathode of the sixth diode D6 is electrically connected to one end of the thirteenth resistor R13. The other end of the thirteenth resistor R13 is electrically connected to the output terminal (e.g., pin 3) of the second three-terminal voltage regulator U1. The second three-terminal voltage regulator U1 is configured to output a specific regulated voltage (e.g., 12V regulated voltage) to power the first relay J1, the second relay J2, and the third relay J3. The voltage of the third relay J3 is provided by the output terminal (e.g., pin 3) of the second three-terminal voltage regulator U1. As above, when the MCU determines that the DC heating circuit has been connected to a 24V DC power supply; at this time, the user can output a second switch signal through the external switch unit SW4. After receiving the second switch signal, the MCU sends a second control signal to the second drive unit Q3, thereby causing the second drive unit Q3 to turn on or off one end (4) and the other end (3) of the electric switch and control the contact switch (such as 3 and 4) of the first relay J3 to turn on or off, so that the third heating element W3 starts heating or stops heating. In some embodiments, the voltages of the first DC power supply and the second DC power supply are different. For example, the voltages of the first DC power supply and the second DC power supply can be 12V and 24V respectively. The AC heating circuit can use a 120V AC power supply.

[0063] In some embodiments, the fifth capacitor C5 and the fourth capacitor C4 may both be electrolytic capacitors.

[0064] It can be seen that in some embodiments, please refer to Figure 3 In the case where the heating control circuit only includes a first heating element W1 powered by a first DC power supply and a second heating element W2 powered by an AC power supply, if the 7th pin of the MCU detects an AC voltage (such as AC120V), the AC heating circuit powered by the AC power supply starts to work; if the 4th pin of the MCU detects a DC voltage (such as 4 to 6V), the first heating element W1 powered by the first DC power supply (such as DC12V) starts to work. Only when a DC power supply (such as DC12 / DC24V) is connected to the heating control circuit will the second relay J2 be activated, that is, the contact switches (such as 3 and 4) of the second relay J2 will be closed, at which time the DC heating circuit and the AC heating circuit are connected together; and when the DC power supply (such as DC12 / DC24V) is not connected to the heating control circuit, the contact switches (such as 3 and 4) of the second relay J2 are disconnected, at which time the DC heating circuit and the AC heating circuit are completely isolated.

[0065] It can be seen that in some embodiments, please refer to Figure 4In the case where the heating control circuit includes a first heating element W1 powered by a first DC power supply, a third heating element W3 powered by a second DC power supply, and a second heating element W2 powered by an AC power supply, if the 7th pin of the MCU detects an AC voltage (such as AC120V), the AC heating circuit powered by the AC power supply starts to work; if the 4th pin of the MCU detects a DC voltage (such as 4-6V), the first heating element W1 powered by the first DC power supply (such as DC12V) starts to work; if the 4th pin of the MCU detects a DC voltage (such as 9-11V), the second heating element W2 powered by the second DC power supply (such as DC24V) starts to work.

[0066] For some examples, please refer to Figure 3 The AC heating circuit also includes a fuse F1, a seventh capacitor C7, a varistor CRZ, an eighth capacitor C8, a nineteenth resistor R19, a Zener diode ZD2, and a ninth diode D9, wherein one end of the fuse F1 is electrically connected to the first end AC1 of the AC power supply, the other end of the fuse F1 is respectively electrically connected to one end of the seventh capacitor C7, one end of the varistor CRZ, and one end of the eighth capacitor C8, the other end of the seventh capacitor C7, one end of the varistor CRZ, and the other end of the varistor CRZ are electrically connected to the second end AC2 of the AC power supply, the other end of the eighth capacitor C8 is electrically connected to one end of the nineteenth resistor R19, the other end of the nineteenth resistor R19 is respectively electrically connected to the input end of the ninth diode D9 and the output end of the Zener diode ZD2, the input end of the Zener diode ZD2 is grounded, and the output end of the ninth diode D9 is electrically connected to the output end of the first diode D1.

[0067] In some embodiments, the fuse F1 is used to protect the AC heating circuit. The varistor CRZ is used to prevent surge voltage.

[0068] In some embodiments, the heating control circuit further includes a plurality of light emitting diodes, each of which is electrically connected to the MCU; wherein the light emitting diodes are used to indicate the current temperature level of the first heating element or the second heating element. For example, please refer to Figure 3The heating control circuit further includes five light-emitting diodes. The positive electrode of the light-emitting diode L1 is electrically connected to the ninth pin (9) of the MCU through a resistor R10, and the negative electrode of the light-emitting diode L1 is grounded; the positive electrode of the light-emitting diode L2 and the negative electrode of the light-emitting diode L3 are electrically connected to the eleventh pin (11) of the MCU through a resistor R58, and the negative electrode of the light-emitting diode L2 and the positive electrode of the light-emitting diode L3 are electrically connected to the tenth pin (10) of the MCU; the positive electrode of the light-emitting diode L4 and the negative electrode of the light-emitting diode L5 are electrically connected to the twelfth pin (12) of the MCU through a resistor R3, and the negative electrode of the light-emitting diode L4 and the positive electrode of the light-emitting diode L5 are electrically connected to the tenth pin (10) of the MCU.

[0069] In some embodiments, the heating pad further includes a DC plug and an AC plug. One end of the first heating element W1 is electrically connected to one end (e.g., DC+) of a DC power source (e.g., a first DC power source) via the DC plug. One end of the second heating element W2 is electrically connected to the first end AC1 of the AC power source via the AC plug.

[0070] It can be seen that in some embodiments, the heating pad can use a DC power supply (such as DC12V / 24V, etc.) to power the first heating element in the DC heating circuit, and can also use an AC power supply (such as AC120V, AC220V, etc.) to power the second heating element in the AC heating circuit, thereby facilitating users to use it in various life scenarios.

[0071] It can be seen that in some embodiments, the heating pad may include a plurality of first heating elements and second heating elements. For example, please refer to Figure 4 The heating pad may include a first heating element W1 and a third heating element W3 powered by a DC power supply, and a second heating element W2 powered by an AC power supply, wherein the first heating element W1, the third heating element W3 and the second heating element W2 can be packaged together and merged into a heating line to facilitate free switching between a DC heating circuit powered by a DC power supply and an AC heating circuit powered by an AC power supply.

[0072] It can be seen that in some embodiments, since the automatic inflatable layer is provided in the above-mentioned pad body, when the user needs to use it, the air nozzle can be opened, and the automatic inflatable layer in the pad body will automatically rebound and return to its original shape, so that the pad body is gradually filled with air, and the heating pad is automatically unfolded without the user having to press to inflate the heating pad, thereby saving the user's physical strength; when the heating pad is not fully unfolded or fully unfolded, the air nozzle is closed, the air is trapped in the pad body, and the user can use the heating pad normally (such as starting heating); when the user has finished using the heating pad or needs to store the heating pad, the air nozzle can be opened first, and then the air in the pad body is discharged by squeezing the heating pad. After the air in the pad body is basically discharged, the air nozzle is closed. Since the air nozzle is in the closed state, the outside air cannot enter the pad body. At this time, the automatic inflatable layer in the pad body cannot automatically return to its original shape, so that the automatic inflatable layer remains in a compressed state, reducing the space occupied by the heating pad, and then completing the storage work. Therefore, the heating pad can be automatically inflated, reducing the user's physical exertion, and is easy to store. The heating pad occupies a small space after storage.

[0073] This document is described with reference to various exemplary embodiments. However, those skilled in the art will recognize that changes and modifications may be made to the exemplary embodiments without departing from the scope of this document. For example, the various operational steps and components used to perform the operational steps may be implemented in different ways (e.g., one or more steps may be deleted, modified, or incorporated into other steps) depending on the specific application or considering any number of cost functions associated with the operation of the system.

[0074] Although the principles of this invention have been shown in various embodiments, many modifications of structure, arrangement, proportion, elements, materials and components that are particularly suitable for specific environments and operational requirements can be used without departing from the principles and scope of this invention. The above modifications and other changes or amendments are intended to be included within the scope of this invention.

[0075] The foregoing detailed description has been described with reference to various embodiments. However, those skilled in the art will recognize that various modifications and changes can be made without departing from the scope of this disclosure. Therefore, the present disclosure will be considered in an illustrative rather than a restrictive sense, and all such modifications will be included within its scope. Similarly, the advantages, other advantages and solutions to the problems of the various embodiments have been described above. However, the benefits, advantages, solutions to the problems and any elements that can produce these, or make them more specific, should not be interpreted as critical, required or necessary. The term "comprising" and any other variants used in this article are all non-exclusive inclusions, so that a process, method, article or device that includes a list of elements includes not only these elements, but also other elements that are not explicitly listed or do not belong to the process, method, system, article or device. In addition, the term "coupled" and any other variants used in this article refer to physical connections, electrical connections, magnetic connections, optical connections, communication connections, functional connections and / or any other connections.

[0076] Those skilled in the art will appreciate that many changes can be made to the details of the above embodiments without departing from the basic principles of the present invention. Therefore, the scope of the present invention should be determined solely by the claims.

Claims

1. A heating pad, characterized in that: include: A heating control circuit, used for generating heat after being powered on; a sealed pad body, wherein the heating control circuit and the partition are both located within the pad body; in, The cushion body is provided with a passage connecting the interior and exterior of the cushion body; An automatic inflatable layer is provided between the cushion body and at least a portion of the interlayer. The automatic inflatable layer can return to its original shape after the external force applied to the automatic inflatable layer disappears.

2. The heating pad according to claim 1, wherein The automatic inflatable layer is made of an elastic material; wherein the elastic material includes any one of sponge, 3D plant ecological cotton, latex, memory cotton and 3D material.

3. The heating pad according to claim 1 or 2, characterized in that: The pad body is provided with an air nozzle, which is used to open or close the channel.

4. The heating pad according to claim 3, wherein: The heating pad also includes: an insulation layer, used for at least partially wrapping the heating control circuit to prevent the heating control circuit from burning; The partition layer includes a first sub-partition layer and a second sub-partition layer, the heating control circuit is arranged between the first sub-partition layer and the second sub-partition layer, and the first sub-partition layer and the second sub-partition layer at least partially wrap the heating control circuit.

5. The heating pad according to claim 4, wherein: The self-inflating layer is located between the second sub-layer and the inner wall of the cushion body, and / or between the first sub-layer and the inner wall of the cushion body.

6. The heating pad according to any one of claims 1 to 5, characterized in that: The heating control circuit includes a DC heating circuit and a control circuit; In which, the DC heating circuit includes a first heating element and a first relay; the two ends of the first heating element are electrically connected to the first DC power supply and the first contact of the contact switch of the first relay, and the second contact of the contact switch of the first relay is grounded; the control circuit includes an external switch unit, an MCU, a first drive unit and a fifth diode, and the drive unit has a control end, a first end and a second end; one end of the external switch unit is electrically connected to the MCU, and the other end of the external switch unit is grounded; the MCU is electrically connected to the control end of the drive unit, the first end of the drive unit is grounded, the second end of the drive unit is electrically connected to the positive electrode of the fifth diode and the second end of the coil of the third relay, respectively, and the negative electrode of the fifth diode is electrically connected to the first DC power supply and the first end of the coil of the third relay, respectively; The MCU is used to receive a signal sent by the external switching unit and control the first end and the second end of the driving unit to be turned on and off according to the signal, wherein when the first end and the second end of the driving unit are turned on, the coil of the first relay is energized, so that the contact switch of the first relay is closed, so that the first heating element starts to heat; when the first end and the second end of the driving unit are turned off, the coil of the first relay is de-energized, so that the contact switch of the first relay is opened, so that the first heating element stops heating.

7. The heating pad according to claim 6, wherein: The first driving unit is a first transistor, the control end of the first driving unit is the base of the first transistor, the second end of the first driving unit is the collector of the first transistor, and the first end of the first driving unit is the emitter of the first transistor; The heating control circuit further includes a voltage stabilizing and filtering circuit, and the voltage stabilizing and filtering circuit includes a first diode, a first three-terminal voltage regulator, a first capacitor, a third capacitor, and a second capacitor; The input end of the first diode is electrically connected to the positive electrode of the first DC power supply, the output end of the first diode is electrically connected to the input end of the first three-terminal regulator and the input end of the first capacitor, the output end of the first capacitor is grounded, the ground end of the first three-terminal regulator is grounded, the output end of the first three-terminal regulator is electrically connected to the input end of the third capacitor and one end of the second capacitor, and the other end of the second capacitor is grounded.

8. The heating pad according to claim 7, wherein: The heating control circuit further includes an AC heating circuit, and the AC heating circuit includes a second heating element and a thyristor switch; Among them, one end of the second heating element is electrically connected to the first end of the AC power supply, the other end of the second heating element is electrically connected to the input end of the thyristor switch, the output end of the thyristor switch is electrically connected to the third output end of the first relay, the control end of the thyristor switch is electrically connected to one end of the forty-fourth resistor and one end of the forty-fifth resistor respectively, the other end of the forty-fifth resistor is grounded, the other end of the forty-fourth resistor is electrically connected to the sixth pin of the MCU, the MCU is electrically connected to the first end of the AC power supply, and the second end of the AC power supply is grounded.

9. The heating pad according to claim 8, wherein: The heating control circuit further includes a second relay, a third diode, an eleventh resistor, a sixth capacitor, a fifth electrolytic capacitor, a fourth electrolytic capacitor and a second three-terminal voltage regulator; The first input end of the second relay is electrically connected to one end of the eleventh resistor and the output end of the third diode respectively, the second input end of the second relay is electrically connected to the input end of the third diode, the second input end of the second relay is signal-grounded, the third output end of the second relay is electrically connected to the negative electrode of the first DC power supply, one end of the electric contact switch of the second relay is electrically connected to the second end of the AC power supply, the other end of the eleventh resistor is electrically connected to one end of the sixth capacitor, the input end of the fifth capacitor, and the output end of the second three-terminal regulator respectively, the input end of the second three-terminal regulator is electrically connected to the input end of the fourth capacitor and the positive electrode of the first DC power supply respectively, the other end of the sixth capacitor, the other end of the fifth capacitor, the ground end of the second three-terminal regulator, and the output end of the fourth capacitor are all signal-grounded; the MCU is electrically connected to the first end of the AC power supply, and the ground end of the MCU is grounded; Among them, only when the first DC power supply is connected to the heating control circuit, the contact switch of the second relay is closed; and when the first DC power supply is not connected to the heating control circuit, the contact switch of the second relay is open.

10. The heating pad according to claim 9, wherein: The DC heating circuit also includes a third heating element and a third relay; Two ends of the third heating element are electrically connected to the second DC power supply and the first contact of the contact switch of the third relay respectively, and the second contact of the contact switch of the third relay is grounded; The control loop includes a second driving unit and a sixth diode, wherein the second driving unit has a control terminal, a first terminal, and a second terminal; The MCU is electrically connected to the control end of the second drive unit, a first end of the second drive unit is grounded, a second end of the second drive unit is electrically connected to the anode of the sixth diode and the second end of the coil of the third relay, respectively, and a cathode of the sixth diode is electrically connected to the second DC power supply and the first end of the coil of the third relay, respectively; In which, the MCU is also used to receive the signal sent by the external switching unit and control the first end and the second end of the second driving unit to be turned on and off according to the signal, wherein, when the first end and the second end of the second driving unit are turned on, the coil of the third relay is energized, so that the contact switch of the third relay is closed, so that the third heating element starts to heat; when the first end and the second end of the second driving unit are turned off, the coil of the third relay is de-energized, so that the contact switch of the third relay is disconnected, so that the third heating element stops heating.

Images