Circuit board and electronic equipment

Abstract

The utility model discloses a circuit board and electronic equipment, and belongs to the field of electronic products. The circuit board comprises a substrate, a conductive layer, a protective film and an electronic element. The orthographic projection of the first hollow area and the orthographic projection of the second hollow area in the protective film on the substrate are overlapped with the orthographic projection of the first bonding pad in the conductive layer on the substrate, and the electronic element in the circuit board can be welded with the first bonding pad through the first hollow area. Therefore, compared with the mode that the first bonding pad is only arranged in the first hollow area, the area of the first bonding pad is larger after the first bonding pad extends to the second hollow area. The first bonding pad with the increased area can absorb and disperse heat generated by the electronic component more effectively, and local overheating of the electronic component is avoided.

Description

Technical Field

[0001] The present application relates to the field of electronic products, and in particular to a circuit board and electronic equipment. Background Art

[0002] With the advancement of technology, electronic devices are becoming increasingly versatile, and solder pads are an indispensable component. Solder pads are metal connection points designed on circuit boards for soldering the pins of electronic components. Solder pads not only provide a secure mechanical connection between electronic components and circuit boards, but also ensure the effective transmission of electrical signals, thereby enabling the diverse functions of electronic components.

[0003] Generally speaking, electronic components generate a lot of heat during operation. This heat is conducted to the pads through their pins and diffused inside the pads and in the larger copper foil layer connecting the pads to the circuit board, thereby reducing the risk of local overheating of the electronic components.

[0004] However, as existing manufacturers reduce costs and increase efficiency, the area of pads is getting smaller and smaller, resulting in poor heat dissipation performance of electronic components. Utility Model Content

[0005] The present invention provides a circuit board and electronic device. This invention can solve the problem of poor heat dissipation performance of electronic components in the prior art. The technical solution is as follows:

[0006] In one aspect, a circuit board is provided, comprising:

[0007] Substrate, conductive layer, protective film and electronic components;

[0008] The conductive layer is located on one side of the substrate, and the conductive layer includes: a first pad;

[0009] The protective film is located on the side of the conductive layer away from the substrate, and the protective film has a first hollow area and a second hollow area that are separately arranged.

[0010] The orthographic projections of the first hollow area and the second hollow area on the substrate both overlap with the orthographic projection of the first pad on the substrate;

[0011] The electronic component is welded to the first pad through the first hollow area.

[0012] Optionally, the orthographic projections of the first hollow area and the second hollow area on the substrate are both located within the orthographic projection of the first pad on the substrate.

[0013] Optionally, the orthographic projection of the electronic component on the substrate overlaps with the orthographic projection of the first hollow area on the substrate, and does not overlap with the orthographic projection of the second hollow area on the substrate.

[0014] Optionally, the protection film has a protection insulating portion respectively between the first hollow area and the second hollow area.

[0015] Optionally, the first hollow area and the second hollow area are arranged sequentially along a first direction, and in the first direction, the width of the protective insulating portion ranges from 0.5 mm to 1.0 mm.

[0016] Optionally, in a second direction intersecting with the first direction, the width of the first hollow area is less than or equal to the width of the second hollow area, and the width of the second hollow area is less than or equal to the width of the electronic component.

[0017] Optionally, the circuit board further includes: a first solder paste and a second solder paste;

[0018] The first solder paste is located in the first hollow area, and the electronic component is soldered to the first pad through the first solder paste;

[0019] The second solder paste is located in the second hollow area, and the second solder paste is separated from the first solder paste.

[0020] Optionally, the protective film further has a plurality of third hollow areas located on a side of the first hollow area away from the second hollow area;

[0021] The conductive layer further includes: a plurality of second pads corresponding one-to-one to the plurality of third hollow areas, wherein an orthographic projection of each second pad on the substrate overlaps with an orthographic projection of a corresponding third hollow area on the substrate;

[0022] The electronic component has a plurality of pins corresponding to the plurality of third hollow areas one by one, and each of the pins is soldered to the corresponding second pad through the corresponding third hollow area.

[0023] Optionally, the circuit board further includes: a colloid portion, the orthographic projection of the colloid portion on the substrate being located between the orthographic projection of the first hollow area on the substrate and the orthographic projection of the plurality of third hollow areas on the substrate, and the colloid portion being respectively bonded to the protective film and the electronic component.

[0024] On the other hand, an electronic device is provided, comprising: a housing, and a circuit board located in the housing, wherein the circuit board is any of the circuit boards described above.

[0025] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0026] A circuit board comprises: a substrate, a conductive layer, a protective film and electronic components. Since the orthographic projections of the first hollow area and the second hollow area in the protective film on the substrate overlap with the orthographic projections of the first solder pad in the conductive layer on the substrate, and the electronic components in the circuit board can be soldered to the first solder pad through the first hollow area. Therefore, compared with only providing the first solder pad in the first hollow area, the area of the first solder pad extending to the second hollow area is larger. The first solder pad with an increased area can more effectively absorb and disperse the heat generated by the electronic components, avoiding local overheating of the electronic components. In addition, soldering can be performed at the point where the first solder pad extends to the second hollow area, which can further increase the surface area of the first solder pad in contact with the air, thereby further improving the heat conduction efficiency, so that the heat generated by the electronic components can better contact the outside air through the solder of the first solder pad in the second hollow area, thereby achieving better heat dissipation. In addition, since the first hollow area and the second hollow area are not connected together, after soldering the first pad at the second hollow area, the solder of the first pad on the first hollow area and the second hollow area will not be connected together. Therefore, after the electronic component is soldered to the first pad through the first hollow area, the electronic component will not be affected by the solder on the first pad at the second hollow area, so that the function of the electronic component will not be affected, thereby improving the reliability of the entire circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] Figure 1 is a cross-sectional view of a circuit board provided in an embodiment of the present application;

[0029] Figure 2 is a top view of a conductive layer provided in an embodiment of the present application;

[0030] Figure 3 is a top view of a protective film provided in an embodiment of the present application;

[0031] Figure 4 is a top view of a conductive layer and a protective film provided in an embodiment of the present application;

[0032] Figure 5 is a top view of an electronic component and a protective film provided in an embodiment of the present application;

[0033] Figure 6 is a top view of another electronic component and protective film provided in an embodiment of the present application;

[0034] Figure 7 is a top view of another electronic component and protective film provided in an embodiment of the present application;

[0035] Figure 8 is a top view of another conductive layer provided in an embodiment of the present application;

[0036] Figure 9 This is a top view of another electronic component and protective film provided in an embodiment of the present application. DETAILED DESCRIPTION

[0037] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0038] Please refer to Figure 1 , Figure 1 1 is a cross-sectional view of a circuit board provided in an embodiment of the present application. The circuit board 000 may include: a substrate 100, a conductive layer 200, a protective film 300 and an electronic component 400.

[0039] The conductive layer 200 in the circuit board 000 is located on one side of the substrate 100. In order to more clearly see the structure of the conductive layer 200 in the circuit board 000, please refer to Figure 2 , Figure 2 2 is a top view of a conductive layer provided in an embodiment of the present application. The conductive layer 200 in the circuit board 000 may include: a first solder pad 201 .

[0040] In the present application, the first solder pad 201 can be used as a part of the conductive layer 200, which can not only provide a mechanical connection fulcrum for the electronic component 400, so that the electronic component 400 can be firmly fixed on the circuit board 000 through the first solder pad 201, but the first solder pad 201 can also serve as a channel for signal transmission, and through effective electrical connection with the electronic device, the diversified functions of the electronic component 400 can be realized.

[0041] The protective film 300 in the circuit board 000 is located on the side of the conductive layer 200 facing away from the substrate 100. That is, the conductive layer 200 in the circuit board 000 is located between the substrate 100 and the protective film 300. The protective film 300 can cover the side of the conductive layer 200 facing away from the substrate 100, thereby forming a stable structure between the substrate 100, the conductive layer 200, and the protective film 300. For example, the protective film 300 in the circuit board 000 can be green oil with insulating properties.

[0042] In this case, the protective film 300 in the circuit board 000 can serve as a barrier, which can not only effectively protect the conductive layer 200 and prevent dust and other pollutants from invading the conductive layer 200, but also effectively enhance the corrosion resistance of the conductive layer 200, thereby keeping the performance of the conductive layer 200 from being affected by the external environment; at the same time, the protective film 300 adopts green oil material with insulating properties, so that the protective film 300 can be used as an insulating layer to ensure the insulation between the layers of the circuit board 000, providing a guarantee for the long-term reliable operation of the circuit board 000.

[0043] In order to see the structure of the protective film 300 in the circuit board 000 more clearly, please refer to Figure 3 , Figure 3 3 is a top view of a protective film provided in an embodiment of the present application. The protective film 300 in the circuit board 000 has a first hollow area K1 and a second hollow area K2 that are separately provided. In other words, the first hollow area K1 and the second hollow area K2 are not connected.

[0044] Among them, please refer to Figure 4 , Figure 4 The orthographic projections of the first hollow area K1 and the second hollow area K2 in the protective film 300 on the substrate 100 overlap with the orthographic projections of the first pad 201 in the conductive layer 200 on the substrate 100.

[0045] In this case, the first hollow area K1 and the second hollow area K2 are provided on the protective film 300, so that the first pad 201 is connected to the outside through the first hollow area K1 and the second hollow area K2. In this way, the electronic component 400 can be directly soldered to the first pad 201 through the hollow area.

[0046] In this application, please refer to Figure 5 , Figure 5 The electronic component 400 in the circuit board 000 can be soldered to the first solder pad 201 through the first hollow area K1.

[0047] In this way, at the first hollow area K1, the first pad 201 can serve as a fixing point for welding the electronic component 400, so that the electronic component 400 is firmly fixed on the first pad 201. Moreover, by expanding to the second hollow area K2, the total area of the first pad 201 can be effectively increased. Compared with only providing the first pad 201 in the first hollow area K1, the area of the first pad 201 after extending to the second hollow area K2 is larger. In one possible implementation, the electronic component 400 generates heat during operation, and this heat can be absorbed and dissipated by the first pad 201. The first pad 201 with an increased area can more effectively absorb and disperse the heat generated by the electronic component 400, thereby preventing local overheating of the electronic component 400.

[0048] In addition, soldering can be performed by extending the first soldering pad 201 to the second hollow area K2, which can further increase the surface area of the first soldering pad 201 in contact with the air, thereby further improving the heat conduction efficiency, so that the heat generated by the electronic component 400 can better contact the outside air through the solder of the first soldering pad 201 in the second hollow area K2, thereby achieving better heat dissipation.

[0049] In addition, since the first hollow area K1 and the second hollow area K2 are not connected together, after soldering the first solder pad 201 at the second hollow area K2, the solder on the first solder pad 201 in the first hollow area K1 and the second hollow area K2 will not be connected together. Therefore, after the electronic component 400 is soldered to the first solder pad 201 through the first hollow area K1, the electronic component 400 will not be affected by the solder on the first solder pad 201 at the second hollow area K2, so that the function of the electronic component 400 will not be affected, thereby improving the reliability of the entire circuit board 000.

[0050] In summary, the present application proposes a circuit board, comprising: a substrate, a conductive layer, a protective film and electronic components. Since the orthographic projections of the first hollow area and the second hollow area in the protective film on the substrate overlap with the orthographic projections of the first pad in the conductive layer on the substrate, and the electronic components in the circuit board can be soldered to the first pad through the first hollow area. Therefore, compared with only setting the first pad in the first hollow area, the area of the first pad after extending to the second hollow area is larger. The first pad with an increased area can more effectively absorb and disperse the heat generated by the electronic components, avoiding local overheating of the electronic components. In addition, soldering can be performed at the point where the first pad extends to the second hollow area, which can further increase the surface area of the first pad in contact with the air, thereby further improving the heat conduction efficiency, so that the heat generated by the electronic components can better contact the outside air through the solder of the first pad at the second hollow area, thereby achieving better heat dissipation. In addition, since the first hollow area and the second hollow area are not connected together, after soldering the first pad at the second hollow area, the solder of the first pad on the first hollow area and the second hollow area will not be connected together. Therefore, after the electronic component is soldered to the first pad through the first hollow area, the electronic component will not be affected by the solder on the first pad at the second hollow area, so that the function of the electronic component will not be affected, thereby improving the reliability of the entire circuit board.

[0051] Exemplarily, the orthographic projections of the first hollow area K1 and the second hollow area K2 in the protective film 300 on the substrate 100 are both located within the orthographic projection of the first pad 201 on the substrate 100. In this way, the first hollow area K1 and the second hollow area K2 can be completely covered by the first pad 201. After the electronic component 400 in the circuit board 000 is soldered to the first pad 201 through the first hollow area K1, it can be ensured that the electronic component 400 is only in contact with the first pad 201, avoiding the solder flowing to the area outside the edge of the first pad 201 during the soldering process, thereby reducing welding defects such as short circuits and bridging, and improving the quality of welding. In addition, by precisely controlling the alignment of the first hollow area K1 and the second hollow area K2 with the projection of the first pad 201 on the substrate 100, the space of the circuit board 000 can be used more efficiently, which helps to reduce the size of the circuit board 000.

[0052] In the examples of this application, please refer to Figure 6 , Figure 6 This is a top view of another electronic component and protective film provided in an embodiment of the present application. The orthographic projection of the electronic component 400 in the circuit board 000 on the substrate 100 overlaps with the orthographic projection of the first hollow area K1 on the substrate 100, and does not overlap with the orthographic projection of the second hollow area K2 on the substrate 100.

[0053] In this case, the electronic component 400 in the circuit board 000 can be soldered to the first pad 201 only through the first hollow area K1. This allows the solder to be more concentrated on the first pad 201 in the first hollow area K1, reducing the risk of solder spreading to non-soldering areas, thereby improving the reliability of the solder connection and the stability of the circuit. Furthermore, this layout also ensures that the heat dissipation function of the second hollow area K2 is not affected.

[0054] In the embodiments of this application, Figure 6 As shown, the protection film 300 in the circuit board 000 has a protection insulating portion 301 between the first hollow area K1 and the second hollow area K2.

[0055] In this way, the first hollow area K1 and the second hollow area K2 can be isolated by the protective insulating portion 301. Subsequently, after soldering the first pad 201 at the second hollow area K2, the solder on the first pad 201 in the first hollow area K1 and the second hollow area K2 can be separated by the protective insulating portion 301. Therefore, after the electronic component 400 is soldered to the first pad 201 through the first hollow area K1, the electronic component 400 will not be affected by the solder on the first pad 201 in the second hollow area K2, so that the function of the electronic component 400 will not be affected, thereby improving the reliability of the entire circuit board 000.

[0056] In the embodiments of this application, Figure 6 As shown, the first hollow area K1 and the second hollow area K2 in the protective film 300 are arranged sequentially along the first direction. In the first direction, the width h1 of the protective insulating portion 301 ranges from 0.5 mm to 1.0 mm. For example, the width h1 of the protective insulating portion 301 ranges from 0.5 mm to 0.7 mm. For example, the width h1 of the protective insulating portion 301 is 0.6 mm. In this way, the protective insulating portion 301 can effectively isolate the first hollow area K1 from the second hollow area K2.

[0057] In the embodiments of this application, Figure 6 As shown, in a second direction intersecting the first direction, the width h2 of the first hollow area K1 in the protective film 300 is less than or equal to the width h3 of the second hollow area K2, and the width h2 of the second hollow area K2 is less than or equal to the width h4 of the electronic component 400. Thus, by designing a wider second hollow area K2, not only can the heat dissipation area of the electronic component 400 be increased, but it can also ensure that the second hollow area K2 does not affect the layout of surrounding components, maintaining the compactness of the circuit board 000 layout.

[0058] It should be noted that the intersecting first direction and second direction may be perpendicular to each other or have a smaller angle, for example, the angle between the first direction and the second direction may be 88°, 89° or 91°.

[0059] In the examples of this application, please refer to Figure 7 , Figure 7 This is a top view of another electronic component and protective film provided in an embodiment of the present application. The circuit board 000 also includes: a first solder paste 500 and a second solder paste 600. The first solder paste 500 is located in the first hollow area K1, and the electronic component 400 is soldered to the first pad 201 through the first solder paste 500. The second solder paste 600 is located in the second hollow area K2, and the second solder paste 600 is separated from the first solder paste 500. It should be noted that since the first hollow area K1 and the second hollow area K2 are separated, the first solder paste 500 and the second solder paste 600 on the first pad 201 can be separated during the soldering process of the electronic component 400.

[0060] In this case, the second solder paste 600 directly covers a portion of the first pad 201 within the second hollowed-out area K2, effectively expanding the surface area for heat conduction and significantly improving the heat dissipation efficiency of the electronic component 400. The first solder paste 500 not only secures the electronic component 400 to the first pad 201 but also serves as a signal transmission channel, effectively electrically connecting it to the electronic device to realize the diverse functions of the electronic component 400.

[0061] In the embodiments of this application, Figure 7 As shown, the protective film 300 in the circuit board 000 further comprises a plurality of third hollow areas K3 located on the side of the first hollow area K1 facing away from the second hollow area K2. The circuit board 000 also includes a third solder paste 700 located within the second hollow areas K3. This allows the electronic component 400 in the circuit board 000 to be soldered to the first pad 201 using the first solder paste 500 and the third solder paste 700.

[0062] Please refer to Figure 8 , Figure 8 This is a top view of another conductive layer provided in an embodiment of the present application. The conductive layer 200 in the circuit board 000 further includes: a plurality of second solder pads 202 corresponding one-to-one with the plurality of third hollow areas K3. The orthographic projection of each second solder pad 202 on the substrate 100 overlaps with the orthographic projection of the corresponding third hollow area K3 on the substrate 100.

[0063] In this application, if Figure 7As shown, the electronic component 400 in the circuit board 000 has a plurality of pins 401 corresponding to the plurality of third hollow areas K3 , and each pin 401 is soldered to the corresponding second soldering pad 202 through the corresponding third hollow area K3 .

[0064] In this case, by setting a plurality of third hollow areas K3 on the protective film 300 and correspondingly configuring a plurality of second solder pads 202 on the conductive layer 200, and the plurality of third hollow areas K3 correspond one-to-one to the plurality of second solder pads 202, direct soldering points can be provided for the plurality of pins 401 of the electronic component 400, ensuring that each pin 401 can be firmly connected to the circuit board 000, thereby improving the reliability of the soldering connection.

[0065] In the examples of this application, please refer to Figure 9 , Figure 9 1 is a top view of another electronic component and protective film provided in an embodiment of the present application. The circuit board 000 may further include: a colloid portion 800. For example, the colloid portion 800 may be red glue.

[0066] In the present application, the orthographic projection of the colloid portion 800 in the circuit board 000 on the substrate 100 is located between the orthographic projection of the first hollow area K1 on the substrate 100 and the orthographic projection of the plurality of third hollow areas K3 on the substrate 100, and the colloid portion 800 is bonded to the protective film 300 and the electronic component 400, respectively. In other words, the colloid portion 800 is disposed on the protective film 300. In this way, the colloid portion 800 will not affect the electrical performance of the electronic component 400, and the electronic component 400 can be firmly bonded to the circuit board 000. Thus, by directly disposing the colloid portion 800 on the protective film 300, not only can interference with the conductive layer 200 in the circuit board 000 be reduced, but the viscosity of the colloid portion 800 can also be utilized to achieve a secure binding of the electronic component 400, effectively preventing the electronic component 400 from detaching from the circuit board 000 during the subsequent soldering process.

[0067] In summary, the present application proposes a circuit board, comprising: a substrate, a conductive layer, a protective film and electronic components. Since the orthographic projections of the first hollow area and the second hollow area in the protective film on the substrate overlap with the orthographic projections of the first pad in the conductive layer on the substrate, and the electronic components in the circuit board can be soldered to the first pad through the first hollow area. Therefore, compared with only setting the first pad in the first hollow area, the area of the first pad after extending to the second hollow area is larger. The first pad with an increased area can more effectively absorb and disperse the heat generated by the electronic components, avoiding local overheating of the electronic components. In addition, soldering can be performed at the point where the first pad extends to the second hollow area, which can further increase the surface area of the first pad in contact with the air, thereby further improving the heat conduction efficiency, so that the heat generated by the electronic components can better contact the outside air through the solder of the first pad at the second hollow area, thereby achieving better heat dissipation. In addition, since the first hollow area and the second hollow area are not connected together, after soldering the first pad at the second hollow area, the solder of the first pad on the first hollow area and the second hollow area will not be connected together. Therefore, after the electronic component is soldered to the first pad through the first hollow area, the electronic component will not be affected by the solder on the first pad at the second hollow area, so that the function of the electronic component will not be affected, thereby improving the reliability of the entire circuit board.

[0068] The embodiment of the present application further provides an electronic device, comprising: a housing, and a circuit board 000 located in the housing, wherein the circuit board 000 is any of the circuit boards 000 described above.

[0069] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0070] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A circuit board, characterized in that: include: A substrate (100), a conductive layer (200), a protective film (300), and an electronic component (400); The conductive layer (200) is located on one side of the substrate (100), and the conductive layer (200) comprises: a first pad (201); The protective film (300) is located on a side of the conductive layer (200) facing away from the substrate (100), and the protective film (300) has a first hollow area (K1) and a second hollow area (K2) that are separately arranged. The orthographic projections of the first hollow area (K1) and the second hollow area (K2) on the substrate (100) both overlap with the orthographic projection of the first solder pad (201) on the substrate (100); The electronic component (400) is welded to the first welding pad (201) through the first hollow area (K1).

2. The circuit board according to claim 1, wherein: The orthographic projections of the first hollow area (K1) and the second hollow area (K2) on the substrate (100) are both located within the orthographic projection of the first solder pad (201) on the substrate (100).

3. The circuit board according to claim 1, wherein: The orthographic projection of the electronic component (400) on the substrate (100) overlaps with the orthographic projection of the first hollow area (K1) on the substrate (100), and does not overlap with the orthographic projection of the second hollow area (K2) on the substrate (100).

4. The circuit board according to any one of claims 1 to 3, characterized in that: The protective film (300) has a protective insulating portion (301) respectively between the first hollow area (K1) and the second hollow area (K2).

5. The circuit board according to claim 4, characterized in that The first hollow area (K1) and the second hollow area (K2) are arranged in sequence along a first direction. In the first direction, the width of the protective insulating portion (301) ranges from 0.5 mm to 1.0 mm.

6. The circuit board according to claim 5, characterized in that In a second direction intersecting the first direction, the width of the first hollow area (K1) is less than or equal to the width of the second hollow area (K2), and the width of the second hollow area (K2) is less than or equal to the width of the electronic component (400).

7. The circuit board according to any one of claims 1-3, 5-6, characterized in that: The circuit board (000) further comprises: a first solder paste (500) and a second solder paste (600); The first solder paste (500) is located in the first hollow area (K1), and the electronic component (400) is soldered to the first solder pad (201) via the first solder paste (500); The second solder paste (600) is located in the second hollow area (K2), and the second solder paste (600) is separated from the first solder paste (500).

8. The circuit board according to any one of claims 1-3, 5-6, characterized in that: The protective film (300) further comprises a plurality of third hollow areas (K3) located on a side of the first hollow area (K1) away from the second hollow area (K2); The conductive layer (200) further comprises: a plurality of second pads (202) corresponding one-to-one to the plurality of third hollow areas (K3), wherein the orthographic projection of each second pad (202) on the substrate (100) overlaps with the orthographic projection of the corresponding third hollow area (K3) on the substrate (100); The electronic component (400) has a plurality of pins (401) corresponding one-to-one to the plurality of third hollow areas (K3), and each of the pins (401) is soldered to a corresponding second soldering pad (202) through the corresponding third hollow area (K3).

9. The circuit board according to claim 8, wherein: The circuit board further comprises: a colloid portion (800), wherein an orthographic projection of the colloid portion (800) on the substrate (100) is located between an orthographic projection of the first hollow area (K1) on the substrate (100) and an orthographic projection of the plurality of third hollow areas (K3) on the substrate (100), and the colloid portion (800) is respectively bonded to the protective film (300) and the electronic component (400).

10. An electronic device, characterized in that: The invention comprises: a shell, and a circuit board located in the shell, wherein the circuit board is the circuit board according to any one of claims 1 to 9.

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