Circuit board with waterproof coating film on surface
By spraying the waterproof coating layer on the circuit board and chip surface and setting a waterproof sealing structure with U-shaped clip strips, the short circuit problem caused by water seepage after spraying the circuit board with waterproof coating is solved, and higher waterproof performance and safety are achieved.
Patent Information
- Application Number
- CN202422722016.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-11-08
AI Technical Summary
After the existing circuit board is sprayed with waterproof coating, the gap between the chip and the surface of the circuit board is prone to seep water, resulting in short circuit, especially large chip components.
The main body of the circuit board and the chip surface are sprayed with a waterproof coating layer, and a U-shaped card strip is set around the chip. The U-shaped card strip is made of magnetic card strips, which are connected and fixed through magnetic adsorption to form a waterproof sealing structure, combining the waterproof performance of the nano-silicon dioxide film layer to prevent moisture penetration.
Effectively prevent moisture from penetrating into the gap between the chip and the circuit board, avoiding short circuit, and improving the waterproof effect and safety of the circuit board.
Smart Images

Figure CN223246772U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of circuit boards, in particular to a circuit board with a waterproof coating on the surface. Background Art
[0002] A circuit board refers to an electronic circuit board with a chip installed. At present, in order to achieve the waterproof effect of the chip, a layer of waterproof paint is usually sprayed on the circuit board with the chip installed, so that the surface of the circuit board is coated with a waterproof film.
[0003] However, because the circuit board has chips on its surface, when spraying waterproof coating, a gap will exist where the chips contact the circuit board surface (especially for large chip components. Small chip components have a smaller contact area with the circuit board surface, so there will not be a large gap and the probability of water seepage is smaller). This gap is prone to water seepage, which can easily cause short circuits in the circuit board or chips. To address this problem, a circuit board with a waterproof coating on its surface is proposed. Utility Model Content
[0004] In view of the above problems existing in the existing circuit boards, the present utility model is proposed.
[0005] Therefore, the purpose of the present invention is to provide a circuit board with a waterproof coating on the surface, which solves the problems raised by the background technology.
[0006] In order to achieve the above purpose, the present invention provides the following technical solutions:
[0007] A circuit board having a waterproof coating on its surface comprises a circuit board body and a chip arranged on the surface of the circuit board body, wherein the surface of the circuit board body and the surface of the chip are both sprayed with a waterproof coating layer; a waterproof sealing mechanism is provided on the upper surface of the circuit board body and located at the periphery of the chip, wherein the waterproof sealing mechanism comprises two U-shaped clips, which wrap around the chip, and the two U-shaped clips are both magnetic clips, and the two ends of the two U-shaped clips are connected to each other by magnetic adsorption, and the two U-shaped clips are adhesively fixedly connected to the surface of the circuit board body.
[0008] Preferably, the waterproof coating layer is a nano-silicon dioxide film layer.
[0009] Preferably, the U-shaped clip is a rubber waterproof strip with magnetic powder inside.
[0010] Preferably, an adhesive sheet is fixedly provided on the side wall of the U-shaped clip, and a glue injection hole is provided in the middle of the adhesive sheet.
[0011] Furthermore, mounting holes are provided at the four corners of the circuit board body.
[0012] Preferably, a reinforcing protective plate is fixedly provided on the bottom of the circuit board body, and the reinforcing protective plate is made of fiberboard.
[0013] In the above technical solution, the technical effects and advantages provided by the utility model are:
[0014] 1. The present invention has a U-shaped clip that is arranged around the chip. The U-shaped clip can seal the contact area between the chip and the circuit board body, preventing water from seeping through the gap between the chip and the circuit board body, thereby avoiding short circuits in the chip or the circuit board body and improving safety in use.
[0015] 2. The present invention provides an adhesive sheet on the side wall of the U-shaped card strip. When it is necessary to fix the two U-shaped card strips to the circuit board body, glue can be injected into the glue injection hole of the adhesive sheet so that the adhesive sheet can be fixed to the circuit board body, thereby fixing the U-shaped card strip. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.
[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;
[0018] Figure 2 For the utility model Figure 1 Schematic diagram of the three-dimensional structure of the connection between the circuit board body and the chip;
[0019] Figure 3 For the utility model Figure 1 Schematic diagram of the three-dimensional structure of the middle U-shaped card strip.
[0020] Description of reference numerals:
[0021] 1. Circuit board body; 2. Chip; 3. Waterproof coating layer; 4. U-shaped card strip; 5. Adhesive sheet; 6. Glue injection hole; 7. Mounting hole; 8. Reinforced protective plate. DETAILED DESCRIPTION
[0022] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.
[0023] The utility model provides Figure 1-3The circuit board shown has a waterproof coating on its surface, including a circuit board body 1 and a chip 2 arranged on the surface of the circuit board body 1. The surface of the circuit board body 1 and the surface of the chip 2 are sprayed with a waterproof coating layer 3. The waterproof coating layer 3 adopts a nano-silicon dioxide film layer. The surface energy of the nano-silicon dioxide film is very low, making it difficult for water droplets to adhere to its surface, forming a spherical shape and easily rolling off. This characteristic gives it excellent waterproof performance and can effectively prevent moisture from penetrating into the surface of the circuit board body 1 and the surface of the chip 2; a waterproof sealing mechanism is provided on the upper surface of the circuit board body 1 and on the periphery of the chip 2. The waterproof sealing mechanism includes two U-shaped clips 4. The two U-shaped clips 4 seal the chip 2 is wrapped around, and the two U-shaped clips 4 are both magnetic clips, and the two ends of the two U-shaped clips 4 are connected to each other by magnetic adsorption, and the two U-shaped clips 4 are bonded and fixed to the surface of the circuit board body 1. The U-shaped clips 4 can clamp and seal the contact area between the chip 2 and the circuit board body 1 to prevent water stains from penetrating through the gap between the chip 2 and the circuit board body 1, thereby avoiding the short circuit of the chip 2 or the circuit board body 1, and improving the safety of use. The above-mentioned waterproof sealing structure for the chip 2 is mainly for larger-sized chips 2. Since the small-sized chip 2 components have a smaller contact area with the surface of the circuit board body 1, there will be no large gap, and the probability of water seepage is smaller.
[0024] like Figure 3 As shown, the U-shaped card strip 4 is a rubber waterproof strip with magnetic powder inside. The effect of the magnetic powder makes the U-shaped card strip 4 have a magnetic adsorption function, so that the two U-shaped card strips 4 can be magnetically adsorbed together. The side wall of the U-shaped card strip 4 is fixed with an adhesive sheet 5, and the middle of the adhesive sheet 5 is provided with a glue injection hole 6. Glue can be injected into the glue injection hole 6 of the adhesive sheet 5. The glue falls on the surface of the circuit board body 1 and solidifies, so that the adhesive sheet 5 can be fixed between the circuit board body 1, thereby fixing the U-shaped card strip 4.
[0025] like Figure 1-2 As shown, mounting holes 7 are provided at the four corners of the circuit board body 1. Bolts can be inserted into the mounting holes 7 so that the circuit board body 1 can be fixedly installed. A reinforcing protective plate 8 is fixedly provided at the bottom of the circuit board body 1, and the reinforcing protective plate 8 is made of fiberboard. The fiber material has a small difference in longitudinal and transverse strength and is not easy to crack, which can improve the use strength of the circuit board body 1.
[0026] The above description is merely illustrative of certain exemplary embodiments of the present invention. It goes without saying that those skilled in the art will be able to modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A circuit board having a waterproof coating on its surface, comprising a circuit board body (1) and a chip (2) arranged on the surface of the circuit board body (1), characterized in that: The surface of the circuit board body (1) and the surface of the chip (2) are both sprayed with a waterproof coating layer (3); A waterproof sealing mechanism is provided on the upper surface of the circuit board body (1) and located on the periphery of the chip (2). The waterproof sealing mechanism comprises two U-shaped clips (4). The two U-shaped clips (4) are arranged to wrap around the chip (2). Both of the two U-shaped clips (4) are magnetic clips, and the two ends of the two U-shaped clips (4) are connected to each other by magnetic adsorption. The two U-shaped clips (4) are bonded and fixedly connected to the surface of the circuit board body (1).
2. The circuit board with a waterproof coating on the surface according to claim 1, characterized in that: The waterproof coating layer (3) is a nano silicon dioxide film layer.
3. The circuit board with a waterproof coating on the surface according to claim 1, characterized in that: The U-shaped clip strip (4) is a rubber waterproof strip with magnetic powder inside.
4. The circuit board with a waterproof coating on the surface according to claim 1, characterized in that: An adhesive sheet (5) is fixedly provided on the side wall of the U-shaped clip (4), and a glue injection hole (6) is provided in the middle of the adhesive sheet (5).
5. The circuit board with a waterproof coating on the surface according to claim 1, characterized in that: Mounting holes (7) are provided at the four corners of the circuit board body (1).
6. The circuit board with a waterproof coating on the surface according to claim 1, characterized in that: A reinforcing protective plate (8) is fixedly provided on the bottom of the circuit board body (1), and the reinforcing protective plate (8) is made of fiberboard.