Vacuum reflow soldering with positioning structure

Abstract

The utility model discloses a vacuum reflow soldering with a positioning structure, which belongs to the technical field of vacuum reflow soldering, and is characterized by comprising a soldering frame and a vacuum pump, two conveying belts are arranged in the soldering frame, a bent pipe and a positioning mechanism are arranged at the top of the soldering frame, a soldering disc is arranged between opposite sides of the two conveying belts, and the vacuum pump is arranged in the soldering disc. A heating disc and a circuit board are arranged in the welding disc, a positioning frame is arranged at the top of the welding disc, a sealing plate is fixedly connected to the top of the welding disc, and a fixing mechanism is arranged in the positioning frame; the positioning mechanism comprises a connecting pipe, a supporting plate, five positioning springs, a limiting plate and a positioning pipe, and the problems that when a welding area of a circuit board is vacuumized through an existing vacuum reflow soldering furnace working cavity for welding, due to the fact that most vacuum reflow soldering furnace working cavities are not internally provided with positioning structures, the efficiency is low during vacuumizing, and the welding efficiency is poor are solved. And the phenomenon of nonuniformity easily occurs, so that the welding quality is influenced, and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum reflow soldering, in particular to a vacuum reflow soldering with a positioning structure. Background Art

[0002] Vacuum reflow soldering is a soldering technique that introduces a vacuum environment during the reflow process. Reflow soldering remelts the solder paste pre-dispensed onto the pads of a printed circuit board (PCB) to create mechanical and electrical connections between the pins or terminals of surface mount components and the PCB pads. Vacuum reflow soldering, in addition to conventional reflow, involves evacuating the soldering area during a specific phase.

[0003] The vacuum reflow oven lacks process precision, resulting in suboptimal soldering quality. It lacks a formic acid deoxidation module suitable for low-temperature solders and lacks a smart and convenient Chinese graphical interface, making it difficult to operate.

[0004] The existing patent (publication number: CN220902130U) relates to a vacuum reflow oven, including a vacuum reflow oven working chamber, a touch screen, a touch screen bracket, a first start button, a power switch, an emergency stop switch, a second start button, a three-color buzzer, an exhaust gas outlet, a locking seat and a working chamber top cover. Pressing the first start button and the second start button at the same time can close the vacuum reflow oven working chamber. Pressing the emergency stop switch can stop the equipment process immediately. Turning the emergency stop switch clockwise can reset the switch and release the lock on the high-voltage components. The working chamber top cover can close the chamber and the locking seat can be fixed and locked. This enables the integrated design of the heating plate and the workpiece fixture to have fast and accurate temperature curve control, precise and automatic process gas flow control, and an easy-to-operate graphical interface.

[0005] In response to the above problems, existing patents have provided solutions. However, the above solutions have certain limitations during use. When the welding area of ​​the circuit board is vacuumed for welding through the working chamber of a vacuum reflow oven, since most vacuum reflow ovens do not have a positioning structure inside the working chamber, the efficiency of vacuuming is slow and unevenness is likely to occur, thereby affecting the quality of welding.

[0006] Therefore, a vacuum reflow soldering method with a positioning structure is proposed. Utility Model Content

[0007] The purpose of the utility model is to provide a vacuum reflow soldering with a positioning structure, which can solve the problem that when the welding area of ​​the circuit board is vacuumed for welding through the working chamber of the vacuum reflow soldering furnace, most vacuum reflow soldering furnaces do not have a positioning structure inside the working chamber, resulting in slow efficiency during vacuuming and prone to unevenness, thereby affecting the quality of welding.

[0008] To achieve the above-mentioned object, the present invention provides the following technical solution: a vacuum reflow soldering machine with a positioning structure, comprising a soldering frame and a vacuum pump, wherein two conveyor belts are provided inside the soldering frame, a bend pipe and a positioning mechanism are provided on the top of the soldering frame, a soldering plate is provided between opposite sides of the two conveyor belts, a heating plate and a circuit board are provided inside the soldering plate, a positioning frame is provided on the top of the soldering plate, a sealing plate is fixedly connected to the top of the soldering plate, and a fixing mechanism is provided inside the positioning frame;

[0009] The positioning mechanism includes a connecting tube, a support plate, five positioning springs, a limit plate and a positioning tube. The top of the connecting tube is fixedly connected to the bottom of the bent tube, the interior of the support plate is fixedly connected to the surface of the connecting tube, the top and bottom of the positioning spring are fixedly connected to the opposite sides of the support plate and the limit plate respectively, the interior of the limit plate is fixedly connected to the surface of the positioning tube, the surface of the positioning tube is slidably connected to the interior of the connecting tube, and the bottom of the positioning tube is fixedly connected to the top of the positioning frame.

[0010] Preferably, a mounting groove is provided on the top of the inner wall of the positioning frame, and a mounting frame is provided inside the mounting groove.

[0011] Preferably, three connecting columns are fixedly connected to the interior of the mounting frame, and a plurality of observation cameras are fixedly connected to the bottom of the mounting frame.

[0012] Preferably, a connecting sleeve is fixedly connected between opposite sides of the three connecting columns, and the top of the connecting sleeve extends to the inside of the positioning frame and is in close contact with the inside of the positioning tube.

[0013] Preferably, a protective pad is fixedly connected to the top of the limiting plate, and the top of the protective pad is in contact with the bottom of the connecting pipe.

[0014] Preferably, four sealing plugs are provided on the surface of the positioning tube, and the sealing plugs pass through the positioning tube on the side close to the positioning tube and extend to the interior of the connecting sleeve. The interior of the positioning tube is threadedly connected to the surface of the sealing plugs, and the surface of the positioning tube is fixedly connected to a thermal insulation pad, and the surface of the thermal insulation pad is in close contact with the interior of the positioning frame.

[0015] Preferably, six suction cups are fixedly connected to the bottom of the positioning frame, and the bottoms of the suction cups are in close contact with the tops of the welding discs.

[0016] Preferably, six positioning pins are fixedly connected to the bottom of the positioning frame, six positioning slots are opened on the top of the welding plate, and the bottoms of the positioning pins extend into the interior of the positioning slots and contact the interior of the positioning slots.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. This application enables the positioning tube to evacuate the interior of the positioning frame through the connecting tube. Under the action of vacuum suction, the positioning frame can easily drive the positioning tube to move inside the connecting tube, so that the connecting tube can limit the limit plate through the positioning spring, thereby facilitating the vacuuming of the interior of the welding plate.

[0019] 2. In this application, the connecting sleeve drives the mounting frame to move to the inside of the positioning tube through the connecting column, and the mounting frame drives the observation camera to move to the inside of the mounting groove for installation, so that it is fixed and installed through the sealing bolt, which makes it convenient to observe the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is the overall structural diagram of the vacuum reflow soldering with positioning structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the three-dimensional connection between the positioning frame and the welding plate in the utility model;

[0022] Figure 3 This is a schematic diagram of the three-dimensional connection between the positioning pin and the positioning groove in the present utility model;

[0023] Figure 4 This is a schematic diagram of the three-dimensional connection between the thermal insulation pad and the positioning tube in the utility model;

[0024] Figure 5 This is a three-dimensional connection diagram of the fixing mechanism in the present utility model;

[0025] Figure 6 For this utility model Figure 4 A partial enlarged view of point A in the middle.

[0026] In the figure, 1. welding frame; 2. vacuum pump; 3. conveyor belt; 4. bent pipe; 5. positioning mechanism; 501. connecting pipe; 502. support plate; 503. positioning spring; 504. limit plate; 505. positioning pipe; 6. positioning frame; 7. welding plate; 8. fixing mechanism; 801. mounting groove; 802. connecting sleeve; 803. mounting frame; 804. connecting column; 805. observation camera; 9. circuit board; 10. heating plate; 11. positioning pin; 12. positioning groove; 13. sealing plate; 14. thermal insulation pad; 15. suction cup; 16. sealing plug; 17. protective pad. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] See also Figure 1-6 , this utility model provides a technical solution:

[0029] A vacuum reflow soldering device with a positioning structure includes a soldering frame 1 and a vacuum pump 2. Two conveyor belts 3 are provided inside the soldering frame 1. A bend 4 and a positioning mechanism 5 are provided on the top of the soldering frame 1. A soldering plate 7 is provided between opposite sides of the two conveyor belts 3. A heating plate 10 and a circuit board 9 are provided inside the soldering plate 7. A positioning frame 6 is provided on the top of the soldering plate 7. A sealing plate 13 is fixedly connected to the top of the soldering plate 7. A fixing mechanism 8 is provided inside the positioning frame 6.

[0030] The positioning mechanism 5 includes a connecting tube 501, a support plate 502, five positioning springs 503, a limiting plate 504 and a positioning tube 505. The top of the connecting tube 501 is fixedly connected to the bottom of the bent tube 4, the interior of the support plate 502 is fixedly connected to the surface of the connecting tube 501, the top and bottom of the positioning spring 503 are fixedly connected to the opposite sides of the support plate 502 and the limiting plate 504 respectively, the interior of the limiting plate 504 is fixedly connected to the surface of the positioning tube 505, the surface of the positioning tube 505 is slidably connected to the interior of the connecting tube 501, and the bottom of the positioning tube 505 is fixedly connected to the top of the positioning frame 6.

[0031] In this embodiment: by fixing the bottom of the positioning tube 505 to the top of the positioning frame 6, the positioning tube 505 can be conveniently used to vacuum the interior of the positioning frame 6 through the connecting tube 501. Under the action of vacuum suction, the positioning frame 6 can conveniently drive the positioning tube 505 to move inside the connecting tube 501, so that the connecting tube 501 limits the limiting plate 504 through the positioning spring 503, so that the bottom of the positioning frame 6 extends to the top of the welding disk 7, thereby vacuuming the interior of the welding disk 7, and conveniently performing heating and welding through the heating disk 10, thereby improving the efficiency of welding the circuit board 9.

[0032] Specifically, such as Figure 5 As shown, a mounting groove 801 is provided at the top of the inner wall of the positioning frame 6 , and a mounting frame 803 is provided inside the mounting groove 801 .

[0033] Specifically, such as Figure 5As shown, three connecting columns 804 are fixedly connected inside the mounting frame 803, and a plurality of observation cameras 805 are fixedly connected to the bottom of the mounting frame 803.

[0034] Specifically, such as Figure 5 As shown, a connecting sleeve 802 is fixedly connected between opposite sides of the three connecting columns 804 , and the top of the connecting sleeve 802 extends to the inside of the positioning frame 6 and is in close contact with the inside of the positioning tube 505 .

[0035] In this embodiment, by making the surface of the connecting sleeve 802 in close contact with the interior of the positioning tube 505 , the connecting sleeve 802 can fix the observation camera 805 through the mounting bracket 803 , thereby achieving the effect of fixing the observation camera 805 .

[0036] Specifically, such as Figure 6 As shown, the top of the limiting plate 504 is fixedly connected to the protection pad 17 , and the top of the protection pad 17 contacts the bottom of the connecting pipe 501 .

[0037] Specifically, such as Figure 4 、 Figure 5 As shown, four sealing plugs 16 are provided on the surface of the positioning tube 505. The sealing plug 16 passes through the positioning tube 505 on the side close to the positioning tube 505 and extends to the interior of the connecting sleeve 802. The interior of the positioning tube 505 is threadedly connected to the surface of the sealing plug 16. The surface of the positioning tube 505 is fixedly connected to the thermal insulation pad 14, and the surface of the thermal insulation pad 14 is in close contact with the interior of the positioning frame 6.

[0038] In this embodiment, the interior of the positioning tube 505 is threadedly connected to the surface of the sealing plug 16 , so that the positioning tube 505 can fix the connecting sleeve 802 through the sealing plug 16 , thereby achieving the effect of fixing the connecting sleeve 802 .

[0039] Specifically, such as Figure 2 、 Figure 3 、 Figure 5 As shown, six suction cups 15 are fixedly connected to the bottom of the positioning frame 6 , and the bottom of the suction cup 15 is in close contact with the top of the welding plate 7 .

[0040] Specifically, such as Figure 2 、 Figure 3 、 Figure 5 As shown, six positioning pins 11 are fixedly connected to the bottom of the positioning frame 6, and six positioning slots 12 are opened on the top of the welding plate 7. The bottom of the positioning pins 11 extends to the inside of the positioning slot 12 and contacts the inside of the positioning slot 12.

[0041] In this embodiment, by making the surface of the positioning pin 11 contact the inside of the positioning groove 12, the positioning pin 11 can assist in positioning the positioning frame 6 through the positioning groove 12, thereby achieving the effect of assisting in positioning the positioning frame 6.

[0042] Working principle: When welding the circuit board 9, the connecting sleeve 802 drives the mounting frame 803 to move to the inside of the positioning tube 505 through the connecting column 804, and the mounting frame 803 drives the observation camera 805 to move to the inside of the mounting groove 801 for installation, so that it is fixed and installed through the sealing bolt 16, which makes it convenient to observe the circuit board 9, move the circuit board 9 to the inside of the welding plate 7, and support and limit the heating plate 10, so that it is moved to the inside of the working cavity of the welding frame 1 through the conveyor belt 3, and the vacuum pump 2 is used to extract pressure on the inside of the connecting pipe 501 through the bent pipe 4, so that the positioning tube 505 can be conveniently used to vacuum the inside of the positioning frame 6 through the connecting pipe 501. Under the action of vacuum suction, it is convenient to The positioning frame 6 drives the positioning tube 505 to move inside the connecting tube 501, and the connecting tube 501 limits the limiting plate 504 through the positioning spring 503, so that the positioning frame 6 drives the positioning pin 11 to move to the inside of the positioning groove 12, and is sealed by the sealing plate 13. The inside of the welding disk 7 is vacuumed, and heating and welding can be conveniently performed through the heating disk 10, thereby improving the efficiency of welding of the circuit board 9, and solving the problem that when the welding area of ​​the circuit board 9 is vacuumed for welding through the working chamber of the vacuum reflow oven, most vacuum reflow ovens do not have a positioning structure inside the working chamber, resulting in slow efficiency during vacuuming and prone to unevenness, thereby affecting the quality of welding.

[0043] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A vacuum reflow soldering device with a positioning structure, comprising a soldering frame (1) and a vacuum pump (2), characterized in that: Two conveyor belts (3) are provided inside the welding frame (1), a bend pipe (4) and a positioning mechanism (5) are provided on the top of the welding frame (1), a welding plate (7) is provided between opposite sides of the two conveyor belts (3), a heating plate (10) and a circuit board (9) are provided inside the welding plate (7), a positioning frame (6) is provided on the top of the welding plate (7), a sealing plate (13) is fixedly connected to the top of the welding plate (7), and a fixing mechanism (8) is provided inside the positioning frame (6); The positioning mechanism (5) comprises a connecting tube (501), a support plate (502), five positioning springs (503), a limiting plate (504) and a positioning tube (505); the top of the connecting tube (501) is fixedly connected to the bottom of the curved tube (4); the interior of the supporting plate (502) is fixedly connected to the surface of the connecting tube (501); the top and bottom of the positioning spring (503) are fixedly connected to the opposite sides of the supporting plate (502) and the limiting plate (504), respectively; the interior of the limiting plate (504) is fixedly connected to the surface of the positioning tube (505); the surface of the positioning tube (505) is slidably connected to the interior of the connecting tube (501); and the bottom of the positioning tube (505) is fixedly connected to the top of the positioning frame (6).

2. The vacuum reflow soldering device with a positioning structure according to claim 1, characterized in that: A mounting groove (801) is provided at the top of the inner wall of the positioning frame (6), and a mounting frame (803) is provided inside the mounting groove (801).

3. The vacuum reflow soldering method with a positioning structure according to claim 2, wherein: Three connecting columns (804) are fixedly connected inside the mounting frame (803), and a plurality of observation cameras (805) are fixedly connected to the bottom of the mounting frame (803).

4. The vacuum reflow soldering device with a positioning structure according to claim 3, characterized in that: A connecting sleeve (802) is fixedly connected between opposite sides of the three connecting columns (804), and the top of the connecting sleeve (802) extends to the inside of the positioning frame (6) and is in close contact with the inside of the positioning tube (505).

5. The vacuum reflow soldering method with a positioning structure according to claim 1, wherein: The top of the limiting plate (504) is fixedly connected to a protective pad (17), and the top of the protective pad (17) is in contact with the bottom of the connecting pipe (501).

6. The vacuum reflow soldering device with a positioning structure according to claim 4, characterized in that: Four sealing plugs (16) are provided on the surface of the positioning tube (505), and the sealing plugs (16) pass through the positioning tube (505) on the side close to the positioning tube (505) and extend to the interior of the connecting sleeve (802). The interior of the positioning tube (505) is threadedly connected to the surface of the sealing plugs (16), and the surface of the positioning tube (505) is fixedly connected to the surface of the thermal insulation pad (14), and the surface of the thermal insulation pad (14) is in close contact with the interior of the positioning frame (6).

7. The vacuum reflow soldering device with a positioning structure according to claim 1, characterized in that: Six suction cups (15) are fixedly connected to the bottom of the positioning frame (6), and the bottoms of the suction cups (15) are in close contact with the tops of the welding plates (7).

8. The vacuum reflow soldering device with a positioning structure according to claim 1, characterized in that: Six positioning pins (11) are fixedly connected to the bottom of the positioning frame (6), and six positioning slots (12) are opened on the top of the welding plate (7). The bottoms of the positioning pins (11) extend into the interior of the positioning slots (12) and contact the interior of the positioning slots (12).

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