Single-shaft full-automatic thinning machine

Abstract

The utility model discloses a single-shaft full-automatic thinning machine which comprises a device body and a thinning mechanism arranged on one side of the device body. A transferring assembly is arranged in the device body, and a conveying module is arranged below the transferring assembly; a feeding clamping plug is arranged in the device body, the feeding clamping plug is arranged on one side of the transferring assembly, and a wafer is arranged in the feeding clamping plug; the transferring assembly is used for grabbing the wafer and placing the wafer to the conveying module, and the conveying module drives the wafer to move into the thinning mechanism for wafer thinning. The edge searching mechanism, the cleaning mechanism and the thinning mechanism are integrated together, so that multifunctional integration of equipment is realized, the wafer thinning efficiency is improved, and meanwhile, automation of wafer thinning is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer thinning, and more specifically to a single-axis fully automatic wafer thinning machine. Background Art

[0002] The wafer manufacturing process places very high demands on the dimensional accuracy, geometric accuracy, surface cleanliness and surface microlattice structure of the wafer. Therefore, thinner wafers cannot be used in hundreds of process flows, and only wafers of a certain thickness can be used for transfer and wafer taping during the process. Usually, before integrated circuit packaging, a certain thickness of excess substrate material on the back of the wafer needs to be removed. The existing wafer thinning mechanism is unable to integrate the multi-functions of edge finding, cleaning and thinning for the wafer, resulting in a single function of the wafer thinning machine and a low degree of wafer thinning automation. Utility Model Content

[0003] In order to solve at least one of the above technical problems, the present invention proposes a single-axis fully automatic thinning machine.

[0004] A first aspect of the present invention provides a single-axis fully automatic thinning machine, comprising: a device body and a thinning mechanism arranged on one side of the device body;

[0005] A transfer assembly is provided inside the device body, and a conveying module is provided below the transfer assembly;

[0006] A loading plug is provided inside the device body, the loading plug is provided on one side of the transfer assembly, and a wafer is provided inside the loading plug;

[0007] The transfer assembly is used to grab the wafer and place it on the conveying module, and the conveying module drives the wafer to move to the inside of the thinning mechanism for wafer thinning.

[0008] In a preferred embodiment of the present invention, a control mechanism is provided inside the device body.

[0009] In a preferred embodiment of the present invention, an edge-finding mechanism is provided on one side of the feeding plug.

[0010] In a preferred embodiment of the present invention, the transfer assembly includes a gantry and a horizontal transfer guide rail installed on one side of the gantry, one side of the horizontal transfer guide rail is connected to a vertical transfer guide rail, one side of the vertical transfer guide rail is connected to a transfer slide, and a transfer robot is provided at the bottom of the transfer slide.

[0011] In a preferred embodiment of the present invention, a cleaning mechanism is further included. The cleaning mechanism is arranged on one side of the conveying module, and a material unloading plug is provided on one side of the cleaning mechanism.

[0012] In a preferred embodiment of the present invention, a transfer platform is provided on one side of the conveying module.

[0013] In a preferred embodiment of the present invention, a display screen and a plurality of control buttons are provided on one side of the device body, and the plurality of control buttons are provided above the display screen.

[0014] In a preferred embodiment of the present invention, the four corners of the bottom of the device body are provided with supporting feet and rollers.

[0015] The above technical solution of the utility model has the following advantages compared with the prior art:

[0016] The present application integrates an edge-finding mechanism, a cleaning mechanism and a thinning mechanism to achieve multifunctional integration of the equipment, improve the efficiency of wafer thinning, and realize the automation of wafer thinning. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, some of the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of a single-axis fully automatic thinning machine according to an embodiment of the present utility model;

[0019] Figure 2 This is a front view of a single-axis fully automatic thinning machine according to an embodiment of the present utility model;

[0020] Figure 3 This is a schematic diagram of the internal structure of a single-axis fully automatic thinning machine according to an embodiment of the present utility model;

[0021] Figure 4 It is a top view of a single-axis fully automatic thinning machine according to an embodiment of the present utility model.

[0022] In the figure: 1. Device body, 2. Support legs, 3. Control mechanism, 4. Display screen, 5. Control button, 6. Thinning mechanism, 7. Roller, 8. Transfer assembly, 801. Horizontal transfer guide rail, 802. Vertical transfer guide rail, 803. Transfer slide, 804. Transfer robot, 9. Cleaning mechanism, 10. Unloading jam, 11. Transfer platform, 12. Loading jam, 13. Edge-finding mechanism, 14. Conveying module. DETAILED DESCRIPTION

[0023] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the present invention is further described in detail below in conjunction with specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features therein can be combined with each other.

[0024] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0025] Example 1

[0026] See also Figure 1-Figure 4 As shown, the present invention proposes a single-axis fully automatic thinning machine, comprising: a device body 1 and a thinning mechanism 6 arranged on one side of the device body 1;

[0027] A transfer assembly 8 is provided inside the device body 1, and a conveying module 14 is provided below the transfer assembly 8;

[0028] A loading plug 12 is provided inside the device body 1 and is provided on one side of the transfer assembly 8. A wafer is provided inside the loading plug 12.

[0029] The transfer assembly 8 is used to grab the wafer and place it on the conveying module 14 . The conveying module 14 drives the wafer to move to the inside of the thinning mechanism 6 for wafer thinning.

[0030] According to an embodiment of the present invention, a control mechanism 3 is provided inside the device body 1 .

[0031] According to an embodiment of the present invention, an edge-finding mechanism 13 is provided on one side of the feeding plug 12 .

[0032] According to an embodiment of the present utility model, the transfer assembly 8 includes a gantry and a horizontal transfer guide rail 801 installed on one side of the gantry. One side of the horizontal transfer guide rail 801 is connected to a vertical transfer guide rail 802. One side of the vertical transfer guide rail 802 is connected to a transfer slide 803. A transfer robot 804 is provided at the bottom of the transfer slide 803.

[0033] According to an embodiment of the present invention, a cleaning mechanism 9 is further included. The cleaning mechanism 9 is arranged on one side of the conveying module 14 , and a blanking plug 10 is provided on one side of the cleaning mechanism 9 .

[0034] According to the embodiment of the present invention, a transfer platform 11 is provided on one side of the conveying module 14 .

[0035] According to an embodiment of the present invention, a display screen 4 and a plurality of control buttons 5 are provided on one side of the device body 1 , and the plurality of control buttons 5 are provided above the display screen 4 .

[0036] According to the embodiment of the present invention, the four corners of the bottom of the device body 1 are provided with supporting feet 2 and rollers 7 .

[0037] In summary, the present application integrates the edge-finding mechanism 13, the cleaning mechanism 9 and the thinning mechanism 6 to achieve multifunctional integration of the equipment, improve the wafer thinning efficiency, and realize the automation of wafer thinning.

[0038] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0039] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to the above embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein, but is intended to encompass the widest scope consistent with the principles and novel features disclosed herein.

[0040] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A single-axis fully automatic thinning machine, comprising: The device body and the thinning mechanism arranged on one side of the device body are characterized in that: A transfer assembly is provided inside the device body, and a conveying module is provided below the transfer assembly; A loading plug is provided inside the device body, the loading plug is provided on one side of the transfer assembly, and a wafer is provided inside the loading plug; The transfer assembly is used to grab the wafer and place it on the conveying module, and the conveying module drives the wafer to move to the inside of the thinning mechanism for wafer thinning.

2. A single-axis fully automatic thinning machine according to claim 1, characterized in that: A control mechanism is arranged inside the device body.

3. A single-axis fully automatic thinning machine according to claim 1, characterized in that: An edge-finding mechanism is provided on one side of the feeding plug.

4. A single-axis fully automatic thinning machine according to claim 1, characterized in that: The transfer assembly includes a gantry and a horizontal transfer guide rail installed on one side of the gantry. One side of the horizontal transfer guide rail is connected to a vertical transfer guide rail, and one side of the vertical transfer guide rail is connected to a transfer slide. A transfer robot is provided at the bottom of the transfer slide.

5. A single-axis fully automatic thinning machine according to claim 1, characterized in that: It also includes a cleaning mechanism, which is arranged on one side of the conveying module, and a material unloading plug is provided on one side of the cleaning mechanism.

6. A single-axis fully automatic thinning machine according to claim 1, characterized in that: A transfer platform is provided on one side of the conveying module.

7. The single-axis fully automatic thinning machine according to claim 1, characterized in that: A display screen and a plurality of control buttons are provided on one side of the device body, and the plurality of control buttons are arranged above the display screen.

8. The single-axis fully automatic thinning machine according to claim 1, characterized in that: The four corners of the bottom of the device body are all provided with supporting feet and rollers.

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