Film sticking machine for sticking film on wafer

Abstract

The utility model relates to a film sticking machine for sticking a film on a wafer, which comprises a base, an outer layer plate and a working table top, the outer layer plate is arranged at the upper end of the base, the working table top is arranged on the inner side surface of the base, a rotating structure is arranged at the upper end part of the working table top, and a mounting structure is also arranged at the upper end of the working table top. A dust cleaning structure, a wafer film pasting structure and a curing structure are respectively mounted on the mounting structure; the dust cleaning structure, the wafer film pasting structure and the curing structure are arranged at the positions, close to the edge, of the upper end face of the mounting structure, the dust cleaning structure, the wafer film pasting structure and the curing structure correspond to the rotating structure, the rotating structure comprises a servo gear motor, a wafer containing plate and a rotating disc, and the servo gear motor of the rotating structure is mounted on the working table top. According to the utility model, the problem that the overall efficiency cannot be improved under the overall process of wafer film pasting due to the fact that the film pasting machine in the prior art cannot realize integrated processing of cleaning, film pasting and curing is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer film laminating machines, in particular to a film laminating machine used for laminating films to wafers. Background Art

[0002] The main function of a wafer laminator is to attach a thin film to the surface of the wafer to protect the wafer from the external environment and damage. The film can cover the surface of the wafer, effectively preventing the wafer from physical damage, chemical corrosion or contamination during manufacturing, transportation and storage, thereby ensuring the integrity and quality of the wafer. However, existing wafer laminators often require manual lamination, which affects the efficiency of lamination.

[0003] Therefore, in order to improve the efficiency of wafer lamination, Chinese patent CN220172085U, a wafer lamination machine points out that the feed box and the receiving box are used to place wafers, and the wafer insertion robot is used to insert the wafers in the feed box onto the wafer carrier to realize automatic wafer retrieval; the wafer carrier is located below the film material between the film supply roller and the film receiving roller, and is used to carry the wafer to lift it up so that the wafer is attached to the film material transmitted between the film supply roller and the film receiving roller; the film cutting mechanism is located above the film material between the film supply roller and the film receiving roller, and is opposite to the wafer carrier, and is used to cut the film material along the edge of the wafer on the wafer carrier so that the film material forms a film sheet that matches the outline of the wafer, thereby automatically realizing wafer lamination; film lamination The wafer on the wafer carrier is then inserted into the receiving box by the wafer insertion and placement robot to realize automatic receiving of the wafer after film pasting, thereby realizing the automation of the entire process from wafer loading to film pasting and then receiving. The above patent does achieve automatic film pasting and improves the efficiency of wafer film pasting, but the above patent still has certain technical problems. Generally, when the wafer is pasted with film, the surface of the wafer needs to be cleaned to prevent dust from being adsorbed on the surface of the wafer, and then the film is pasted. After film pasting, the film needs to be cured to make it become one with the wafer. However, the above patent cannot achieve one-time completion of the entire process. Therefore, in the overall process of wafer film pasting, its efficiency is still relatively low.

[0004] Therefore, in order to integrate wafer cleaning, film lamination and curing into one body and improve the efficiency of the wafer film lamination process as a whole, a film lamination machine for laminating wafers is proposed, thereby solving the technical problems in the existing technology. Utility Model Content

[0005] In response to the shortcomings of the existing technology, the utility model provides a film laminating machine for wafer laminating, which solves the problem that the film laminating machine in the existing technology cannot realize the processing of cleaning, film laminating and curing in one machine, and therefore cannot improve the overall efficiency of the overall process of wafer film laminating.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a film laminating machine for wafers, comprising a base, an outer plate, and a work table, the outer plate is mounted on the upper end of the base, and a work table is provided on the inner side surface of the base, a rotating structure is mounted on the upper end of the work table, and a mounting structure is also provided on the upper end of the work table, and a dust cleaning structure, a wafer laminating structure, and a curing structure are respectively mounted on the mounting structure; the dust cleaning structure, the wafer laminating structure, and the curing structure are respectively arranged at the edge of the upper end surface of the mounting structure, and the dust cleaning structure, the wafer laminating structure, and the curing structure all correspond to the rotating structure, wherein the rotating structure comprises a servo reduction motor, a wafer placing plate, and a rotating disk, the servo reduction motor is mounted on the work table, and a rotating disk is mounted on the output end of the servo reduction motor, and wafer placing plates are symmetrically distributed on the rotating disk, and wafers are placed on the wafer placing plate through a wafer loader, and the rotating disk is rotated counterclockwise by the servo reduction motor, and each rotation is 90°, corresponding to the dust cleaning structure, the wafer laminating structure, and the curing structure in sequence.

[0007] Through the above technical solution, further, a mounting base is installed on the work table, a slide is installed on the inner side of the mounting base, a second cylinder is provided on the right side of the mounting base, the telescopic end of the second cylinder is connected to a triangular cone block and extends into the slide, and a supporting top block is provided at the upper end of the mounting base, the lower end of the supporting top block is in contact with the triangular cone block, and the upper end of the supporting top block is in contact with the lower end of the rotating disk.

[0008] Furthermore, connecting rods are distributed at 120 degrees on the work surface, and movable wheels are provided at the upper ends of the connecting rods, and the movable wheels are in contact with the lower end of the rotating disk.

[0009] As a preferred technical solution, the mounting structure includes a mounting frame and a square plate. The mounting frame is installed on the work surface. A square plate is installed on the upper end of the mounting frame and the square plate is located above the rotating disk. The dust cleaning structure, wafer film bonding structure, and curing structure are all installed on the upper end surface of the square plate.

[0010] Furthermore, the dust cleaning structure includes an X-axis guide rail, a first motor, a Y-axis guide rail, a second motor, a Z-axis guide rail, a third motor, a mounting plate, and a fan; the X-axis guide rail is installed on the upper end surface of the square plate, the first motor is installed on one side of the X-axis guide rail, the output end of the first motor is connected to a screw, the surface of the screw is provided with a threaded sleeve, the threaded sleeve is connected to the Y-axis guide rail, one side of the Y-axis guide rail is connected to the second motor, the output end of the second motor is connected to a screw, a threaded sleeve is movably installed on the surface of the screw, a connecting frame is installed on the threaded sleeve, the Z-axis guide rail is installed on the connecting frame, the upper end of the Z-axis guide rail is installed with the third motor, the output end of the third motor is connected to a screw, a threaded sleeve is provided on the surface of the screw, a mounting plate is installed on the threaded sleeve, and a fan is installed on the mounting plate.

[0011] As a preferred technical solution, the wafer film pasting structure includes a guide rail mounting frame, a first guide rail, and a fourth motor; the guide rail mounting frame is installed on the upper end of the square plate, the first guide rail is installed on one side of the guide rail mounting frame, and the fourth motor is installed on one side of the first guide rail. The output end of the fourth motor is connected to a lead screw, a threaded sleeve is provided on the surface of the lead screw, and a film pasting assembly is installed on the threaded sleeve.

[0012] Furthermore, the curing structure includes a second guide rail, a fifth motor, a movable frame, and a UV curing machine; the second guide rail is installed on the upper end of the square plate, the fifth motor is installed on one side of the second guide rail, a screw is connected to the output end of the fifth motor, a threaded sleeve is provided on the surface of the screw, a movable frame is installed on the surface of the threaded sleeve, and a UV curing machine is installed at the lower end of the movable frame.

[0013] As a preferred technical solution, the film-sticking assembly includes a mounting seat, a first cylinder, a connecting plate, a right connecting plate, a motor, a reel, a rubber pressure roller, and a left connecting plate; the mounting seat is installed on a threaded sleeve located in the first guide rail through a connecting frame, and the upper end of the first guide rail is installed with a first cylinder, the telescopic end of the first cylinder is connected to a connecting plate, a rubber pressure roller is movably installed in the connecting plate, a left connecting plate is provided on the left side of the connecting plate, a right connecting plate is provided on the right side of the connecting plate, a motor is installed on the surface of the right connecting plate, and a reel is connected to the output end of the motor.

[0014] Compared with the prior art, the present invention provides a film laminating machine for laminating wafers, which has the following beneficial effects:

[0015] 1. Place the wafer on the wafer loading device. Figure 1 The wafer is placed on the wafer placement plate shown in the figure, and then rotated by the rotating structure for each 90° rotation and then placed on the wafer placement plate, so that after the wafer is rotated 90° for the first time, it is rotated to the position shown in the figure. Figure 2 and combined Figure 4 It can be seen that the wafer is rotated to the dust cleaning structure to clean the dust on the wafer surface, and then rotated 90 degrees to the wafer film structure to process the wafer film, and then rotated 90 degrees to the curing structure to cure the film, and then rotated 90 degrees to complete the whole process. The wafer will be rotated to the following position. Figure 1 The wafer is placed on the wafer placement plate shown, and then the wafer is taken out by the wafer loading device, and the unfilmed wafer is put in again, and the above steps are repeated. Therefore, the cleaning, film pasting and curing can be completed by rotating the whole for one circle. The above method solves the problem that the film pasting machine in the prior art cannot realize the processing of cleaning, film pasting and curing as one, and therefore the overall efficiency cannot be improved under the overall process of wafer film pasting. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a schematic diagram of the utility model;

[0017] Figure 2 This is a schematic diagram of the upper structure of the work surface of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the mounting frame of the utility model;

[0019] Figure 4 For this utility model Figure 3 Schematic diagram of the explosion structure;

[0020] Figure 5 This is a schematic diagram of the structure of the rotating disk of the utility model;

[0021] Figure 6 For this utility model Figure 5 Schematic diagram of the right side;

[0022] Figure 7 This is a schematic diagram of the dust cleaning structure of the utility model;

[0023] Figure 8 This is a schematic diagram of the film assembly of the utility model;

[0024] Figure 9 For this utility model Figure 6 A local enlarged structural diagram of point A;

[0025] Figure 10 This is a schematic diagram of the mounting base structure of the utility model.

[0026] Figure: 1. Base; 2. Outer plate; 3. Work surface; 4. Mounting frame; 5. Servo reduction motor; 6. Rotating plate; 7. Wafer placement plate; 8. Square plate; 9. Dust cleaning structure; 901. X-axis guide rail; 902. First motor; 903. Y-axis guide rail; 904. Second motor; 905. Z-axis guide rail; 906. Third motor; 907. Mounting plate; 908. Fan; 10. Wafer laminating structure; 1001. Guide rail mounting frame; 1002. First guide rail; 1003. Fourth motor; 11. Curing structure; 1101. Second guide rail; 1102. Fifth motor; 1103. Moving frame; 1104. UV curing machine; 12. Film laminating assembly; 1201. Mounting seat; 1202. First cylinder; 1203. Connecting plate; 1204. Right connecting plate; 1205. Motor; 1206. Reel; 1207. Rubber pressure roller; 1208. Left connecting plate; 13. Mounting base; 14. Support top block; 15. Slide; 16. Second cylinder; 17. Connecting rod; 18. Movable wheel. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] Example

[0029] See also Figure 1-10 The utility model provides the following technical solutions: a film laminating machine for wafer laminating, comprising a base 1, an outer plate 2, and a work table 3. The outer plate 2 is mounted on the upper end of the base 1, and a work table 3 is provided on the inner side of the base 1. A rotating structure is mounted on the upper end of the work table 3, and a mounting structure is also provided on the upper end of the work table 3. A dust cleaning structure 9, a wafer laminating structure 10, and a curing structure 11 are respectively mounted on the mounting structure; the dust cleaning structure 9, the wafer laminating structure 10, and the curing structure 11 are respectively arranged at the edge of the upper end surface of the mounting structure, and the dust cleaning structure The structure 9, the wafer film bonding structure 10, and the curing structure 11 all correspond to the rotating structure, wherein the rotating structure includes a servo reduction motor 5, a wafer placement plate 7, and a rotating disk 6. The servo reduction motor 5 is installed on the work table 3, and a rotating disk 6 is installed on the output end of the servo reduction motor 5. Wafer placement plates 7 are symmetrically distributed on the rotating disk 6. Wafers are placed on the wafer placement plate 7 through a wafer loader. The rotating disk 6 is rotated counterclockwise by the servo reduction motor 5, and each time it rotates 90°, corresponding to the dust cleaning structure 9, the wafer film bonding structure 10, and the curing structure 11, which are driven by the servo reduction motor 5.

[0030] In this embodiment, the specific working principle is as follows: in order to complete the overall process of cleaning, film application and curing in one rotation, shorten the time between each process and improve the efficiency of wafer film application, first, the wafer is placed on the wafer placement plate 7 (such as Figure 1As shown), it is then rotated 90 degrees by the rotating structure (note: each rotation places the wafer on the wafer placement plate 7 through the wafer loading device, until the processed wafer needs to be taken out and a new wafer is placed after one rotation). At this time, the wafer rotates to the dust cleaning structure 9 to clean the dust on the surface of the wafer to prevent unevenness during film application or air pockets caused by dust adsorption. After cleaning, the wafer is rotated another 90 degrees by the rotating structure and passed through the wafer film application structure 10 for film application. After film application is completed, it is rotated again by 90 degrees to rotate it Go to the curing structure 11, and then carry out curing treatment to make the film on the wafer more firm, and then rotate 90°. At this time, it has completed one rotation. Then you only need to take out the wafer through the wafer loading device and place the unprocessed wafer on the wafer placement plate 7. Therefore, the above-mentioned overall rotation for one circle can complete the cleaning, film pasting and curing as one process. The above method solves the problem that the film pasting machine in the prior art cannot realize the processing of cleaning, film pasting and curing as one, and therefore the overall efficiency cannot be improved under the overall process of wafer film pasting.

[0031] In order to prevent the rotating disk 6 from tilting downward and deforming due to pressure when laminating the wafer, please refer to Figure 9 and Figure 10 It can be seen that a mounting base 13 is also installed on the work table 3, and a slide groove 15 is installed on the inner side of the mounting base 13. A second cylinder 16 is provided on the right side of the mounting base 13. The telescopic end of the second cylinder 16 is connected to a triangular cone block and extends into the slide groove 15. A supporting top block 14 is provided at the upper end of the mounting base 13. The lower end of the supporting top block 14 contacts the triangular cone block, and the upper end of the supporting top block 14 contacts the lower end of the rotating disk 6. When the wafer is filmed, the second cylinder 16 pushes the triangular cone block to move to the left, and then supports the supporting top block 14 to extend upward, so that the supporting top block 14 is pushed to the lower end of the rotating disk 6, thereby preventing the rotating disk 6 from being deformed due to pressure.

[0032] In order to ensure the stability of the rotation of the rotating disk 6, please refer to Figure 6 It can be seen that connecting rods 17 are distributed at 120° on the work surface 3, and a movable wheel 18 is provided at the upper end of the connecting rod 17, and the movable wheel 18 is in contact with the lower end of the rotating disk 6.

[0033] For details on the installation structure, please refer to Figure 4 Combine Figure 5 It can be seen that the mounting structure includes a mounting frame 4 and a square plate 8. The mounting frame 4 is installed on the work surface 3. The square plate 8 is installed on the upper end of the mounting frame 4 and the square plate 8 is located above the rotating disk 6. The dust cleaning structure 9, the wafer film structure 10, and the curing structure 11 are all installed on the upper end surface of the square plate 8.

[0034] When the wafer is rotated 90° by the rotating structure, the dust cleaning structure can clean the wafer surface. Figure 4 and Figure 7 It can be seen that the dust cleaning structure 9 includes an X-axis guide rail 901, a first motor 902, a Y-axis guide rail 903, a second motor 904, a Z-axis guide rail 905, a third motor 906, a mounting plate 907, and a fan 908; the X-axis guide rail 901 is mounted on the upper end surface of the square plate 8, a first motor 902 is mounted on one side of the X-axis guide rail 901, an output end of the first motor 902 is connected to a lead screw, a threaded sleeve is provided on the surface of the lead screw, a Y-axis guide rail 903 is connected to the threaded sleeve, a second motor 904 is connected to the output end of the second motor 904, a threaded sleeve is movably mounted on the surface of the lead screw, a connecting frame is mounted on the threaded sleeve, and a The Z-axis guide rail 905 is provided with a third motor 906 installed on the upper end of the Z-axis guide rail 905, and a lead screw is connected to the output end of the third motor 906. A threaded sleeve is provided on the surface of the lead screw, and a mounting plate 907 is mounted on the threaded sleeve. A fan 908 is mounted on the mounting plate 907. The lead screw is driven by the first motor 902 to drive the Y-axis guide rail 903 to move in the X-axis direction. The lead screw is driven by the second motor 904 on the Y-axis guide rail 903 to rotate and then drive the Z-axis guide rail 905 to move in the Y-axis direction. The fan 908 is driven by the Z-axis guide rail 905 to move in the Z-axis, thereby realizing the movement of the X, Y, and Z axes, so that the fan 908 can perform a full range of cleaning work on the wafer surface.

[0035] After rotating 90° again, the wafer film structure 10 can be specifically referred to in Figure 4 、 Figure 7 、 Figure 8 It can be seen that the wafer film pasting structure 10 includes a guide rail mounting frame 1001, a first guide rail 1002, and a fourth motor 1003; the guide rail mounting frame 1001 is installed on the upper end of the square plate 8, and the first guide rail 1002 is installed on one side of the guide rail mounting frame 1001, and the fourth motor 1003 is installed on one side of the first guide rail 1002. The output end of the fourth motor 1003 is connected to a lead screw, and a threaded sleeve is provided on the surface of the lead screw. A film pasting assembly 12 is installed on the threaded sleeve, and the film pasting assembly 12 is driven to move by the action of the fourth motor 1003, so that the film pasting processing of the wafer is realized through the film pasting assembly 12.

[0036] After rotating 90° again, the solidified structure can be found in Figure 4 and Figure 7It can be seen that the curing structure 11 includes a second guide rail 1101, a fifth motor 1102, a movable frame 1103, and a UV curing machine 1104; the second guide rail 1101 is installed at the upper end of the square plate 8, and the fifth motor 1102 is installed on one side of the second guide rail 1101. A screw is connected to the output end of the fifth motor 1102, and a threaded sleeve is provided on the surface of the screw. The movable frame 1103 is installed on the surface of the threaded sleeve, and a UV curing machine 1104 is installed at the lower end of the movable frame 1103. The UV curing machine 1104 is used to cure the film and the wafer.

[0037] How the film attaching component 12 implements film attaching to the wafer can be specifically referred to in Figure 4 、 Figure 7 、 Figure 8 It can be seen that the film assembly 12 includes a mounting base 1201, a first cylinder 1202, a connecting plate 1203, a right connecting plate 1204, a motor 1205, a reel 1206, a rubber pressure roller 1207, and a left connecting plate 1208; the mounting base 1201 is mounted on a threaded sleeve located in the first guide rail 1002 through a connecting frame, the upper end of the first guide rail 1002 is mounted with a first cylinder 1202, the telescopic end of the first cylinder 1202 is connected to a connecting plate 1203, a rubber pressure roller 1207 is movably mounted in the connecting plate 1203, a left connecting plate 1208 is provided on the left side of the connecting plate 1203, and a rubber pressure roller 1207 is movably mounted in the connecting plate 1203. A right connecting plate 1204 is provided, and a motor 1205 is installed on the surface of the right connecting plate 1204. The output end of the motor 1205 is connected to a reel 1206. First, the specific film roller for wafer film is placed on the arc groove of the left connecting plate 1208, and then one end of the film is extended to the reel 1206. When the wafer rotates to the initial position corresponding to the film-sticking component 12, the first cylinder 1202 drives the connecting plate 1203 to extend downward, so that its rubber pressure roller 1207 drives the film to contact the wafer surface, and then the fourth motor 1003 drives the lead screw to move in the X-axis and then drives the film-sticking component 12 to move, so that the film is attached to the wafer by applying pressure.

[0038] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A film laminating machine for laminating a wafer, comprising a base (1), an outer plate (2), and a work surface (3), wherein the outer plate (2) is mounted on the upper end of the base (1), and the work surface (3) is provided on the inner side surface of the base (1), characterized in that: A rotating structure is installed at the upper end of the work table (3), and a mounting structure is also provided at the upper end of the work table (3), and a dust cleaning structure (9), a wafer film-attaching structure (10), and a curing structure (11) are respectively installed on the mounting structure; the dust cleaning structure (9), the wafer film-attaching structure (10), and the curing structure (11) are respectively arranged at the edge of the upper end surface of the mounting structure, and the dust cleaning structure (9), the wafer film-attaching structure (10), and the curing structure (11) all correspond to the rotating structure, wherein the rotating structure includes a servo reduction motor The invention relates to a machine (5), a wafer placement plate (7), and a rotating disk (6), wherein the servo reduction motor (5) is installed on the work table (3), the rotating disk (6) is installed on the output end of the servo reduction motor (5), the wafer placement plates (7) are symmetrically distributed on the rotating disk (6), and wafers are placed on the wafer placement plates (7) by a wafer loader. The rotating disk (6) is rotated counterclockwise by the servo reduction motor (5), and each rotation is 90 degrees, corresponding to the dust cleaning structure (9), the wafer film bonding structure (10), and the curing structure (11) in sequence.

2. The film laminating machine for laminating a film on a wafer according to claim 1, characterized in that: The work table (3) is also provided with a mounting base (13), a slide groove (15) is provided on the inner side of the mounting base (13), a second cylinder (16) is provided on the right side of the mounting base (13), a telescopic end of the second cylinder (16) is connected with a triangular cone block and extends into the slide groove (15), and a supporting top block (14) is provided at the upper end of the mounting base (13), the lower end of the supporting top block (14) contacts the triangular cone block, and the upper end of the supporting top block (14) contacts the lower end of the rotating disk (6).

3. The film laminating machine for laminating a film on a wafer according to claim 1, characterized in that: Connecting rods (17) are distributed at 120 degrees on the work surface (3), and a movable wheel (18) is provided at the upper end of the connecting rod (17), and the movable wheel (18) contacts the lower end of the rotating disk (6).

4. The film laminating machine for laminating a film on a wafer according to claim 1, characterized in that: The mounting structure comprises a mounting frame (4) and a square plate (8); the mounting frame (4) is mounted on a work surface (3); a square plate (8) is mounted on the upper end of the mounting frame (4) and the square plate (8) is located above the rotating disk (6); and a dust cleaning structure (9), a wafer film attaching structure (10), and a curing structure (11) are all mounted on the upper end surface of the square plate (8).

5. The film laminating machine for laminating a film on a wafer according to claim 1, characterized in that: The dust cleaning structure (9) comprises an X-axis guide rail (901), a first motor (902), a Y-axis guide rail (903), a second motor (904), a Z-axis guide rail (905), a third motor (906), a mounting plate (907), and a fan (908); the X-axis guide rail (901) is mounted on the upper end surface of the square plate (8); the first motor (902) is mounted on one side of the X-axis guide rail (901); a lead screw is connected to the output end of the first motor (902); a threaded sleeve is provided on the surface of the lead screw, and the threaded sleeve is connected to the Y-axis guide rail (90 3), a second motor (904) is connected to one side of the Y-axis guide rail (903), an output end of the second motor (904) is connected to a lead screw, a threaded sleeve is movably mounted on the surface of the lead screw, a connecting frame is mounted on the threaded sleeve, a Z-axis guide rail (905) is mounted on the connecting frame, a third motor (906) is mounted on the upper end of the Z-axis guide rail (905), an output end of the third motor (906) is connected to a lead screw, a threaded sleeve is provided on the surface of the lead screw, a mounting plate (907) is mounted on the threaded sleeve, and a fan (908) is mounted on the mounting plate (907).

6. The film laminating machine for laminating a film on a wafer according to claim 1, characterized in that: The wafer film laminating structure (10) comprises a guide rail mounting frame (1001), a first guide rail (1002), and a fourth motor (1003); the guide rail mounting frame (1001) is mounted on the upper end of the square plate (8), the first guide rail (1002) is mounted on one side of the guide rail mounting frame (1001), the fourth motor (1003) is mounted on one side of the first guide rail (1002), the output end of the fourth motor (1003) is connected to a lead screw, a threaded shaft sleeve is provided on the surface of the lead screw, and a film laminating assembly (12) is mounted on the threaded shaft sleeve.

7. The film laminating machine for laminating a film on a wafer according to claim 1, characterized in that: The curing structure (11) comprises a second guide rail (1101), a fifth motor (1102), a movable frame (1103), and a UV curing machine (1104); the second guide rail (1101) is mounted on the upper end of the square plate (8); the fifth motor (1102) is mounted on one side of the second guide rail (1101); a lead screw is connected to the output end of the fifth motor (1102); a threaded shaft sleeve is provided on the surface of the lead screw; the movable frame (1103) is mounted on the surface of the threaded shaft sleeve; and the UV curing machine (1104) is mounted on the lower end of the movable frame (1103).

8. The film laminating machine for laminating a film on a wafer according to claim 6, characterized in that: The film sticking assembly (12) comprises a mounting seat (1201), a first cylinder (1202), a connecting plate (1203), a right connecting plate (1204), a motor (1205), a reel (1206), a rubber pressure roller (1207), and a left connecting plate (1208); the mounting seat (1201) is mounted on a threaded sleeve located in the first guide rail (1002) through a connecting frame, and the upper end of the first guide rail (1002) is mounted with the first cylinder (1202). ), the telescopic end of the first cylinder (1202) is connected to a connecting plate (1203), a rubber pressure roller (1207) is movably installed in the connecting plate (1203), a left connecting plate (1208) is provided on the left side of the connecting plate (1203), a right connecting plate (1204) is provided on the right side of the connecting plate (1203), a motor (1205) is installed on the surface of the right connecting plate (1204), and the output end of the motor (1205) is connected to a reel (1206).

Images