IC chip suction device and binding machine

Abstract

The utility model discloses an IC chip suction device and a binding machine, and relates to the technical field of liquid crystal module equipment, in order to achieve the purpose, the IC chip suction device comprises an installation plate, an elastic piece and an IC chip suction head, the installation plate is used for achieving installation and fixation of the IC chip suction device, the IC chip suction head is used for sucking an IC chip, and the elastic piece is arranged on the installation plate. And the elastic piece is connected with the IC chip suction head and the mounting plate. The utility model further provides a binding machine, the binding machine comprises a moving device, the IC chip suction device and an IC chip tray, the IC chip suction device is connected with the moving device, the IC chip tray is provided with a containing groove for containing the IC chip, and the moving device drives the IC chip suction device to be close to or away from the containing groove.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal module equipment, in particular to an IC chip suction device and a binding machine. Background Art

[0002] LCD glass is a common liquid crystal display. IC chip is an integrated circuit formed by a large number of microelectronic components placed on a plastic substrate to form a chip. The different images displayed on the LCD are realized by the control function of the IC chip. In the production of related LCDs, a bonding machine is used to tightly connect the IC chip and the LCD glass. When moving the IC chip, the IC chip suction head on the bonding machine mainly uses vacuum negative pressure to suck the IC chips out of the tray one by one and move them to the position of the next process.

[0003] During production, the IC chip suction head often becomes misaligned with the tray, causing vacuum leakage and reduced suction force, making it impossible to remove the IC chip from the tray. In this case, the angle of the IC chip suction head or the tray must be adjusted to maintain a parallel position, allowing the equipment to continue properly removing the IC. This poor compatibility between the IC chip suction head and the tray requires frequent adjustments and maintenance, which consumes production time and reduces efficiency. Utility Model Content

[0004] The main purpose of the utility model is to provide an IC chip suction device and a binding machine, aiming to improve the adaptability between the IC chip suction head and the tray and improve production efficiency.

[0005] To achieve the above-mentioned purpose, the IC chip suction device proposed in the present invention includes a mounting plate, an elastic member and an IC chip suction head. The mounting plate is used to realize the installation and fixation of the IC chip suction device, the IC chip suction head is used to suck the IC chip, and the elastic member connects the IC chip suction head and the mounting plate.

[0006] The present invention also proposes a binding machine, which includes the IC chip suction device mentioned above in the mobile device and an IC chip tray. The IC chip suction device is connected to the mobile device. The IC chip tray is provided with a receiving slot for receiving the IC chip. The mobile device drives the IC chip suction device to move closer to or away from the receiving slot. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0008] Figure 1 This is a structural diagram of an embodiment of an IC chip suction device provided by the present invention;

[0009] Figure 2 for Figure 1 An oblique bottom view of the C chip suction device in the middle IC;

[0010] Figure 3 for Figure 1 Schematic diagram of the structure of the IC chip suction head;

[0011] Figure 4 for Figure 3 Bottom view of the IC chip suction head;

[0012] Figure 5 for Figure 4 A cross-sectional view of the IC chip suction head along line A-A';

[0013] Figure 6 for Figure 1 Schematic diagram of the structure of the trachea joint;

[0014] Figure 7 for Figure 6 A top view of the tracheal connector;

[0015] Figure 8 for Figure 7 A cross-sectional view of the tracheal joint along line BB';

[0016] Figure 9 This is a partial structural diagram of an embodiment of a binding machine provided by the present utility model;

[0017] Figure 10 for Figure 9 Schematic diagram of the structure of the IC chip tray.

[0018] Description of Figure Numbers:

[0019] 100. IC chip suction device; 1. Mounting plate; 1a. Through-hole; 2. Spring; 3. IC chip suction head; 31. Suction head body; 31a. First suction channel; 31b. Air outlet; 32. First boss; 32a. Suction hole; 4. Air pipe connector; 4a. Second suction channel; 41. First connecting pipe; 41a. First connecting channel; 42. Connector body; 42a. Communication channel; 43. Second connecting pipe; 431. Second boss; 4311. Guide slope; 4312. Clamping slope; 43a. Second connecting channel; 5. Vacuum air pipe; 5a. Third suction channel;

[0020] 200, binding machine; 201, IC chip tray; 201a, receiving slot.

[0021] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] The utility model provides a chip suction device.

[0026] See also Figures 1 to 2 In one embodiment of the present invention, the chip suction device includes a mounting plate 1, an elastic member and a chip suction head, wherein the mounting plate 1 is used to install and fix the IC chip suction device, the chip suction head is used to suck the chip, and the elastic member is used to connect the chip suction head and the mounting plate 1.

[0027] In this embodiment, the chip suction device is mounted on a mounting plate 1. The mounting plate 1 can be secured to a movable device or equipment by bolts, welding, or slot engagement. The movable device or equipment can be a robotic arm or a spatially movable mechanism formed by a combination of guide rails and sliders, which is used to move the chip suction device. After the chip suction device has absorbed the chip, it is driven to move to the next process location. The chip suction device also includes a chip suction head and an elastic member. The elastic member connects the chip suction head and the mounting plate 1. The elastic member can be a spring 2, a spring, or an elastic sponge. The connection between the elastic member and the mounting plate 1 or the chip suction head can be achieved by gluing, welding, or using a clamp.

[0028] In the production of related LCD displays, IC chips are stored in trays. When the IC chip suction head 3 is not parallel to the tray, a machine alarm will be triggered. At this time, an angle is formed between the tray and the IC chip suction head 3, resulting in vacuum leakage, which reduces the suction force and makes it impossible to complete the action of sucking the IC chip out of the tray, affecting the production of LCD displays. The chip suction device of the present invention can automatically adapt to the angle formed between the tray and the IC chip suction head 3. In this way, there is no need to frequently maintain and adjust the tray or the IC chip suction head 3, which saves maintenance and adjustment time, improves production efficiency, and reduces maintenance costs.

[0029] When an angle is formed between the tray and the IC chip, when the suction head sucks the IC chip, the movable device drives the chip suction device downward to the tray. Due to the angle between the tray and the IC chip suction head 3, one end of the IC chip suction head 3 will first abut against the top surface of the IC chip, while the other end of the IC chip suction head 3 has not yet contacted the IC chip. At this time, the movable device continues to drive the chip suction device downward to squeeze the IC chip. The elastic part is partially compressed, and the other part still pushes the IC chip suction head 3 until the entire IC chip suction head 3 is completely in contact with the IC chip. At this time, there will be no vacuum leakage when sucking the IC chip. The IC chip suction head 3 can firmly suck the IC chip to move to the space where the next process is located.

[0030] In this embodiment, an elastic member is provided between the IC chip suction head 3 and the mounting plate 1. When an angle is formed between the tray and the IC chip suction head 3, the IC chip suction head 3 can automatically adapt to the formed angle and adhere to the top surface of the IC chip, and the device can continue to complete the IC suction action normally. In this way, the adaptability between the IC chip suction head 3 and the tray is improved, the production time consumed by frequent adjustments and maintenance is reduced, and production efficiency is improved.

[0031] Specifically, see Figures 3 to 5 In one embodiment of the present invention, the IC chip suction head 3 includes a suction head body 31 connected to the elastic member and a first boss 32 provided on the side of the suction head body 31 facing away from the elastic member. A first air suction channel 31a is formed in the suction head body 31, and an air outlet hole 31b is formed on the outer wall of the suction head body 31. The air outlet hole 31b connects the first air suction channel 31a with the external space. The first boss 32 has an air suction hole 32a on the side facing away from the suction head body 31. The air suction hole 32a connects the first air suction channel 31a with the external space.

[0032] In this embodiment, in order to facilitate the processing and production of the IC chip suction tip 3 and its connection to the vacuum pumping equipment, a blind hole is opened in the outer wall of the suction tip body 31 to form the air outlet 31b and the first air suction channel 31a. Optionally, the IC chip suction tip 3 can be produced by post-hole drilling processing or one-time injection molding or injection splicing process. The axial direction of the first air suction channel 31a can also be optionally set to be perpendicular to the axial direction of the air outlet 31b. For example, the first air suction channel 31a is set along the length direction of the suction tip body 31, and the air outlet 31b is set on the top wall of the air suction channel and connected to the first air suction channel 31a. Similarly, the air outlet 31b can also be optionally set on the bottom wall of the suction tip body 31. In this way, it can adapt to more complex installation environments, such as when it needs to be integrated into a robotic arm. A first boss 32 is formed on the bottom wall of the suction head body 31. One or more suction holes 32a are formed on the outer wall of the first boss 32 facing away from the suction head body 31. When multiple suction holes 32a are provided, they should be evenly distributed along the length of the first boss 32 to ensure uniform suction force on the top wall of the IC chip, ensuring a more secure suction of the IC chip. The shape and dimensions of the boss are designed based on the top surface of the IC chip being sucked and should not be too large or too small relative to the top surface of the IC chip.

[0033] For further information, see Figures 1 to 2In one embodiment of the present invention, the chip suction device also has a vacuum air pipe 5 and an air pipe joint 4, one end of the air pipe joint 4 is connected to the periphery of the air outlet 31b, and the other end of the air pipe joint 4 is connected to the vacuum air pipe 5, the vacuum air pipe 5 forms a third air suction channel 5a, and the air pipe joint 4 forms a second air suction channel 4a, and the second air suction channel 4a connects the air outlet 31b and the third air suction channel 5a.

[0034] In this embodiment, the end of the vacuum air tube 5 away from the air tube connector 4 is connected to a vacuum pump or other vacuum extraction device. The vacuum air tube 5 is a flexible and elastic tube. As the IC chip suction head 3 moves, the vacuum air tube 5 deforms slightly and rebounds as the IC chip suction head 3 returns to its original position, accommodating the IC chip suction head 3's movement to pick up and move the chip. The vacuum air tube 5 can be made of polyurethane (PU) or silicone flexible tubing.

[0035] The end of the trachea connector 4 close to the suction head body 31 is connected to the inner periphery or the outer periphery of the air outlet 31b. For example, the end of the trachea connector 4 close to the suction head body 31 is inserted into the air outlet 31b and has an interference fit with the inner wall of the air outlet 31b. For another example, a protruding pipe section is formed at one end of the periphery of the air outlet 31b, and the end of the trachea connector 4 close to the suction head body 31 is sleeved on the outer wall of the protruding pipe section and has an interference fit with the outer wall of the protruding pipe section.

[0036] Specifically, see Figures 6 to 8 In one embodiment of the present utility model, the trachea connector 4 includes a first connecting tube 41, a connector body 42, and a second connecting tube 43 connected in sequence. The first connecting tube 41 extends into the air outlet 31b and is connected to the inner wall of the air outlet 31b. The second connecting tube 43 extends into the third air intake channel 5a and is connected to the inner wall of the third air intake channel 5a. The first connecting tube 41 forms a first connecting channel 41a, the second connecting tube 43 forms a second connecting channel 43a, and the connector body 42 forms a communication channel 42a. The first connecting channel 41a, the communication channel 42a, and the second connecting channel 43a are connected in sequence to form the second air intake channel 4a.

[0037] In this embodiment, the air pipe connector 4 can be a straight or right-angle elbow connector, depending on the installation environment. The outer wall of the nozzle body 31 of this embodiment defines a blind hole within the nozzle body 31 to form the air outlet 31b and the first air intake channel 31a. Therefore, if the air pipe connector 4 of this embodiment were a straight one, the vacuum air pipe 5 would extend a certain distance along the length of the nozzle body 31, requiring a high installation space and easily causing scratches with other surrounding mechanical equipment. To minimize the space occupied by the vacuum air pipe 5 extending along the length of the nozzle body 31, the air pipe connector 4 of this embodiment is a right-angle elbow connector.

[0038] In order to facilitate the connection with the vacuum air pipe 5 and the suction head body 31, the air pipe joint 4 is set to a three-section type, including a first connecting pipe 41 for extending into the air outlet 31b and connecting with the inner wall of the air outlet 31b, a joint body 42 and a second connecting pipe 43 for extending into the vacuum air pipe 5 and connecting with the inner wall of the vacuum air pipe 5. In this way, during installation, the first connecting pipe 41 is connected to the air outlet 31b, and then the vacuum air pipe 5 is put on the outside of the second connecting pipe 43, which is convenient and quick.

[0039] Further, see Figures 6 to 8 In one embodiment of the present invention, the outer wall of the first connecting tube 41 is provided with an external thread, and the inner wall of the air outlet 31b is provided with an internal thread adapted to the external thread. In this embodiment, in order to strengthen the connection between the trachea connector 4 and the inner wall of the air outlet 31b, the outer wall of the first connecting tube 41 is provided with an external thread, and the inner wall of the air outlet 31b is provided with an internal thread adapted to the external thread. The trachea connector 4 can be rotatably screwed into the air outlet 31b. Furthermore, a hexagonal nut is provided on the side of the connector body 42 facing away from the first connecting tube 41, making it convenient to tighten the trachea connector 4 using a tool such as a wrench. Furthermore, a sealing member such as a sealing ring or sealant can be provided on the outer surface of the first connecting tube 41. As the trachea connector 4 is tightened, the sealing member is squeezed to seal the gap between the trachea connector 4 and the connector body 42, thereby improving the sealing performance of the device.

[0040] Further, see Figure 6 and Figure 8 In one embodiment of the present invention, a second boss 431 is formed on the outer wall of the second connecting tube 43, and the second boss 431 gradually shrinks in a direction away from the joint body 42 to form a guide slope 4311 and a clamping plane, and / or, at least two second bosses 431 are formed on the outer wall of the second connecting tube 43 at intervals. In this embodiment, the vacuum air pipe 5 is a flexible air pipe. To enhance the friction between the air pipe connector 4 and the inner wall of the vacuum air pipe 5 and prevent the vacuum air pipe 5 from falling off, a second boss 431 is provided on the outer wall of the second connecting pipe 43. The second boss 431 gradually shrinks in a direction away from the connecting pipe body to the same outer diameter as the second connecting pipe 43, which is equivalent to the bottom of the cone outer wall. This forms a guide slope 4311 and a clamping plane. The presence of the guide slope 4311 makes it easier to insert the second connecting pipe 43 into the vacuum air pipe 5, and the clamping plane ensures that the second connecting pipe 43 and the inner wall of the vacuum air pipe 5 are more firmly clamped. To further strengthen the connection between the second connecting pipe 43 and the vacuum air pipe 5, the number of second bosses 431 can be increased and the second connecting pipe 43 can be extended accordingly. For example, the bosses can also be configured as bosses with uniform cross-sections, which can still enhance the friction between the outer wall of the second connecting pipe 43 and the inner wall of the vacuum air pipe 5.

[0041] Further, see Figures 1 to 2 In one embodiment of the present invention, the elastic member is a spring 2. In this embodiment, the IC chip suction head 3 is connected to the mounting plate 1 via the spring 2. One end of the spring 2 is bonded to the mounting plate 1, and the other end is bonded to the top wall of the suction head body 31. To prevent the weight of the IC chip suction head 3 from causing unnecessary uneven deformation of the spring 2, thereby affecting the normal use of the IC chip suction head 3 when the tray and the IC chip are parallel, the position of the spring 2 needs to be designed symmetrically. For example, when there is only one spring 2, the spring 2 should be located at the center of the top wall of the suction head body 31. When there are two springs 2, the two springs 2 should be symmetrically arranged about an axis of symmetry of the top wall of the suction head body 31. When there are three springs 2, one spring 2 should be located at the center of the top wall of the suction head body 31, and the remaining two springs 2 should be symmetrically arranged about an axis of symmetry of the top wall of the suction head body 31. In short, the spring 2 should be evenly stressed when no IC chip is being sucked up, so that the IC chip suction head 3 remains balanced and stable, to ensure accurate positioning before sucking up the chip and to ensure accurate positioning before placing the chip in the next process position after sucking up the chip.

[0042] Further, see Figures 1 to 2 In one embodiment of the present invention, the IC chip suction device 100 includes at least two spaced-apart elastic members, each of which connects the IC chip suction head 3 to the mounting plate 1. In this embodiment, to ensure that the IC chip suction head 3 is pressed against the top wall of the IC chip and maintains close contact with the top wall of the IC chip, the number of elastic members is increased, thereby increasing the elastic force exerted on the IC chip suction head 3, thereby ensuring a close contact between the IC chip suction head 3 and the top wall of the IC chip.

[0043] Further, see Figures 1 to 2 In one embodiment of the present invention, mounting plate 1 is provided with a connecting portion for mounting and securing the IC chip pickup device. In this embodiment, mounting plate 1 is provided with at least two spaced-apart through-holes 1a for inserting bolts to secure mounting plate 1 to a movable upstream device or mechanism. For example, the connecting portion may be configured as a snap, clamp, or weld.

[0044] The present invention also provides a binding machine 200, see Figures 9 and 10 In one embodiment of the present invention, the binding machine 200 includes a mobile device, a chip suction device and a chip tray. The mounting plate 1 is connected to the mobile device. The chip tray is provided with a receiving slot 201a for receiving the chip. The mobile device drives the IC chip suction head 3 to approach or move away from the receiving slot 201a.

[0045] The specific structure of the chip suction device refers to the above-mentioned embodiment. Since the present binding machine 200 adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here. Among them, the moving device can adopt a mechanical arm or a spatial moving mechanism composed of a guide rail and a slider to move the IC chip to the position of the next process after suction. The IC chip tray 201 is provided with a plurality of receiving grooves 201a arranged at equal intervals horizontally and vertically. The IC chips to be processed in the next process are placed in the receiving grooves 201a, which facilitates the positioning of the moving device when sucking the IC chip.

[0046] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An IC chip suction device, characterized in that: The IC chip suction device includes a mounting plate, an elastic member and an IC chip suction head, wherein the mounting plate is used to install and fix the IC chip suction device, the IC chip suction head is used to suck the IC chip, and the elastic member is used to connect the IC chip suction head and the mounting plate.

2. The IC chip suction device according to claim 1, wherein: The IC chip suction head includes a suction head body connected to the elastic member and a first boss provided on a side of the suction head body facing away from the elastic member; A first air suction channel is formed in the suction head body, and an air outlet is formed on the outer wall of the suction head body, wherein the air outlet connects the first air suction channel with the external space; An air suction hole is formed on a side of the first boss facing away from the suction head body, and the air suction hole is connected to the first air suction channel and the external space.

3. The IC chip suction device according to claim 2, wherein: The IC chip suction device further comprises a vacuum air pipe and an air pipe joint, one end of the air pipe joint is connected to the periphery of the air outlet, and the other end of the air pipe joint is connected to the vacuum air pipe; The vacuum air pipe is formed with a third air inlet channel, and the air pipe joint is formed with a second air inlet channel, and the second air inlet channel is connected with the air outlet and the third air inlet channel.

4. The IC chip suction device according to claim 3, wherein: The trachea joint includes a first connecting pipe, a joint body, and a second connecting pipe connected in sequence, the first connecting pipe extending into the air outlet and connected to the inner wall of the air outlet, and the second connecting pipe extending into the third air inlet channel and connected to the inner wall of the third air inlet channel; The first connecting tube forms a first connecting channel, the second connecting tube forms a second connecting channel, the joint body forms a communication channel, and the first connecting channel, the communication channel, and the second connecting channel are sequentially connected to form the second air intake channel.

5. The IC chip suction device according to claim 4, wherein: The outer wall of the first connecting pipe is provided with an external thread, the inner wall of the air outlet is provided with an internal thread adapted to the external thread, and the internal thread is connected to the external thread.

6. The IC chip suction device according to claim 4, wherein: A second boss is formed on the outer wall of the second connecting pipe, and the second boss gradually shrinks in a direction away from the joint body to form a guiding inclined surface and a clamping plane; And / or, at least two second bosses arranged at intervals are formed on the outer wall of the second connecting pipe.

7. The IC chip suction device according to any one of claims 1 to 6, wherein: The elastic member is a spring.

8. The IC chip suction device according to any one of claims 1 to 6, wherein: The IC chip suction device includes at least two elastic members arranged at intervals, and each elastic member is respectively connected to the IC chip suction head and the mounting plate.

9. The IC chip suction device according to any one of claims 1 to 6, wherein: The mounting plate is provided with a connecting portion, and the connecting portion is used for mounting and fixing the IC chip suction device.

10. A binding machine, characterized in that: The binding machine includes: mobile devices; The IC chip suction device according to any one of claims 1 to 9, wherein the mounting plate is connected to the moving device; and An IC chip tray, wherein the IC chip tray is provided with a receiving slot for receiving the IC chip; The moving device drives the mounting plate to move the IC chip suction head toward or away from the receiving groove.

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