External magnetic field adjusting mechanism and magnetron sputtering equipment

Abstract

The utility model discloses an external magnetic field adjusting mechanism and magnetron sputtering equipment, the external magnetic field adjusting mechanism comprises a fixing assembly, a rotating assembly and a magnetic piece, the fixing assembly is used for being connected with a cathode of the magnetron sputtering equipment and is arranged outside the cathode, the rotating assembly is connected with the fixing assembly and can rotate relative to the fixing assembly, and the magnetic piece is arranged on the rotating assembly. The magnetic part is arranged on the rotating assembly, rotates together with the rotating assembly relative to the fixed assembly, and is used for adjusting the magnetic field of the cathode. The fixing assembly is arranged outside the cathode of the magnetron sputtering equipment, the rotating assembly is connected through the fixing assembly, the magnetic part is arranged on the rotating assembly, the rotating assembly drives the magnetic part to rotate relative to the fixing assembly, the magnetic part can rotate relative to the cathode, and the magnetic field distribution of the cathode is adjusted through the magnetic field of the magnetic part. And the magnetic field distribution of the cathode is uniform, and the coating uniformity of magnetron sputtering equipment is improved.

Description

Technical Field

[0001] The present application relates to the technical field of magnetron sputtering, and in particular to an external magnetic field adjustment mechanism and a magnetron sputtering device. Background Art

[0002] Magnetron sputtering is a commonly used thin film deposition technique that utilizes the principles of ion bombardment and sputtering, achieved by applying a high-frequency electric field and a static magnetic field in a vacuum environment. In this process, the material is formed into a target and mounted within a vacuum chamber. The application of an electric field creates a plasma on the target surface, while the static magnetic field simultaneously directs ions from the plasma toward the target surface for bombardment. The bombarded target surface releases atoms or molecules, which are deposited onto the substrate at high speed, forming a thin film.

[0003] An RF planar cathode typically consists of a cathode substrate and an electromagnet. The electromagnet is mounted on the cathode substrate and connects to the target material. By connecting an RF power source to the cathode substrate, the generated ions bombard the target material, causing it to deposit onto the substrate to form a thin film. In existing technologies, the cathode's magnetic field is difficult to adjust. An uneven magnetic field generated by the cathode results in uneven sputtering of the film. Utility Model Content

[0004] The main technical problem solved by the present application is to provide an external magnetic field adjustment mechanism to solve the problem that the magnetic field of the cathode is difficult to adjust, resulting in uneven sputtered films.

[0005] In order to solve the above technical problems, a technical solution adopted in this application is to provide an external magnetic field adjustment mechanism, which is suitable for magnetron sputtering equipment, including a fixed component, a rotating component and a magnetic part. The fixed component is used to connect the cathode of the magnetron sputtering equipment and is arranged on the outside of the cathode. The rotating component is connected to the fixed component and can rotate relative to the fixed component. The magnetic part is arranged on the rotating component and rotates together with the rotating component relative to the fixed component. The magnetic part is used to adjust the magnetic field of the cathode.

[0006] In some embodiments, two adjustment mechanisms are provided, which are arranged on both sides of the cathode along the axial direction and are symmetrically arranged with respect to the axial center line of the cathode.

[0007] In some embodiments, the fixing assembly includes a fixing plate, a receiving member and a supporting member. The fixing plate is arranged at both ends of the cathode, and the two ends of the receiving member are respectively connected to the fixing plate. The supporting member and the rotating assembly are arranged in the receiving member. The rotating assembly is sleeved on the periphery of the supporting member and can rotate relative to the supporting member.

[0008] In some embodiments, the total length of the rotating assembly and the magnetic member is adapted to the total length of the electromagnet of the cathode.

[0009] In some embodiments, a plurality of the rotating components and magnetic members are provided, and the magnetic members are correspondingly provided on the rotating components, and the rotation of the rotating components relative to the supporting member can be independently adjusted.

[0010] In some embodiments, the rotating assembly includes a rotating magnetic shoe, which is a cylindrical hollow structure. The rotating magnetic shoe is sleeved on the periphery of the support member, and the magnetic member is arranged on the rotating magnetic shoe.

[0011] In some embodiments, the rotating assembly also includes an adjusting member, a strip-shaped adjusting hole is provided on the accommodating member along the radial direction, the adjusting member is provided in the adjusting hole, the adjusting member can move relative to the adjusting hole, one end of the adjusting member is connected to the rotating magnetic shoe, and the other end extends out of the accommodating member, and the adjusting member is used to drive the rotating magnetic shoe to rotate relative to the supporting member.

[0012] In some embodiments, the inner end of the adjusting member passes through the rotating magnetic shoe, and the adjusting member is screwed to the rotating magnetic shoe to lock or unlock the rotation of the rotating magnetic shoe relative to the supporting member.

[0013] In some embodiments, an adjustment handle is provided at the outer end of the adjustment member, and a scale is provided at the adjustment hole.

[0014] The present application also provides a magnetron sputtering device, comprising the above-mentioned external magnetic field adjustment mechanism.

[0015] The beneficial effect of the present application is: in the present application, a fixed component is arranged outside the cathode of the magnetron sputtering equipment, the rotating component is connected through the fixed component, a magnetic part is arranged on the rotating component, and the rotating component drives the magnetic part to rotate relative to the fixed component, so that the magnetic part can be rotated relative to the cathode, and the magnetic field distribution of the cathode is adjusted by the magnetic field of the magnetic part, so that the magnetic field distribution of the cathode is uniform, thereby improving the uniformity of the coating of the magnetron sputtering equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a structural diagram according to an embodiment of the present application;

[0017] Figure 2 is a front structural diagram according to an embodiment of the present application;

[0018] Figure 3 is a schematic top view of the structure according to an embodiment of the present application;

[0019] Figure 4 is a schematic diagram of a rear view structure according to an embodiment of the present application;

[0020] Figure 5 is a schematic side view of the structure according to an embodiment of the present application;

[0021] Figure 6 It is a schematic cross-sectional structural diagram according to an embodiment of the present application. DETAILED DESCRIPTION

[0022] To facilitate understanding of the present application, the present application is described in more detail below with reference to the accompanying drawings and specific embodiments. The accompanying drawings provide preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification. Rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0023] It should be noted that, unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the relevant listed items.

[0024] For the description of this application, the non-limiting Figure 1 The marks "front", "rear", "up", "down", "left" and "right" shown in the figure are used to facilitate understanding of the embodiment and are not intended to limit the present application. Among them, the front-to-back direction represents the longitudinal direction, the left-to-right direction represents the transverse direction, and the up-down direction represents the vertical direction.

[0025] Figures 1-6 An embodiment of the external magnetic field adjustment mechanism of the present application is shown. The external magnetic field adjustment mechanism is suitable for magnetron sputtering equipment, including a fixed component 1, a rotating component 2 and a magnetic part 3. The fixed component 1 is used to connect the cathode 4 of the magnetron sputtering equipment and is arranged on the outside of the cathode 4. The rotating component 2 is connected to the fixed component 1 and can rotate relative to the fixed component 1. The magnetic part 3 is arranged on the rotating component 2 and rotates together with the rotating component 2 relative to the fixed component 1. The magnetic part 3 is used to adjust the magnetic field of the cathode 4.

[0026] In the present application, a fixed component 1 is arranged outside the cathode 4 of the magnetron sputtering device, and the rotating component 2 is connected through the fixed component 1. A magnetic part 3 is arranged on the rotating component 2. The rotating component 2 drives the magnetic part 3 to rotate relative to the fixed component 1, so that the magnetic part 3 can be rotated relative to the cathode 4. The magnetic field distribution of the cathode 4 is adjusted by the magnetic field of the magnetic part 3, so that the magnetic field distribution of the cathode 4 is uniform, thereby improving the uniformity of the coating of the magnetron sputtering device.

[0027] In some embodiments, the number and position of the adjustment mechanism can be set as needed to meet different application scenarios. For example, the adjustment mechanism can be set to one, which can be set just below or to the side of the cathode 4. Figure 1 As shown, when two adjustment mechanisms are provided, they are arranged on both sides of the cathode 4 along the axial direction and symmetrically with respect to the center of the cathode 4. When three adjustment mechanisms are provided, one adjustment mechanism can be provided directly below and on both sides of the cathode 4. The specific adjustment can be made according to different usage scenarios of the cathode 4.

[0028] In the relative rotation mode of the rotating component 2 and the fixed component 1, the fixed component 1 can be two fixed plates extending at both ends of the bottom plate of the cathode 4, the rotating component can be a strip rod, the magnetic component 3 is arranged on the rotating component 2, and the two ends of the strip rod are rotatably connected to the fixed plate 11 through a coupling. In this way, the rotating component 2 can be rotated relative to the fixed component 1, and the magnetic field of the cathode 4 can be adjusted by the rotatable magnetic component 3.

[0029] In some embodiments, as Figure 1 and Figure 6 As shown, the fixed assembly 1 includes a fixed plate 11, a container 12, and a support member 13. The fixed plate 11 is arranged at both ends of the cathode 4. The fixed plate 11 is L-shaped. The two ends of the container 12 can be connected to the fixed plate 11 at both ends through flanges 14. The container 12 is cylindrical. The support member 13 and the rotating assembly 2 are arranged in the container 12 and located at the center of the container 12. The support member 13 is cylindrical, and the two ends of the support member 13 are arranged on the fixed plate 11 or on the two ends of the container 12. The rotating assembly 2 is sleeved on the periphery of the support member 13 and rotates relative to the support member 13.

[0030] In some embodiments, the length of the rotating assembly 2 and the magnetic member 3 can be set according to different needs and can be less than or equal to the length of the electromagnet in the cathode 4. If less than the length of the electromagnet in the cathode 4, they can also be set in the middle or on both sides of the cathode 4 as needed to set different positions according to different adjustment magnetic fields. Preferably, the length of the rotating assembly 2 and the magnetic member 3 is adapted to the length of the electromagnet in the cathode 4 and is equal to the length of the electromagnet in the cathode 4.

[0031] The rotating assembly 2 can be a unitary structure, and the corresponding magnetic member 3 can also be a unitary structure. That is, the rotating assembly 2 is a unitary hollow cylindrical structure, which is mounted on the outside of the support member 13, and the magnetic member 3 is a unitary square structure, which is mounted on the rotating assembly 2. In this case, the length of the rotating assembly 2 and the magnetic member 3 is equal to the length of the electromagnet in the cathode 4. When the rotating assembly 2 rotates, the magnetic field of the electromagnet in the entire cathode 4 can be adjusted.

[0032] In some embodiments, as Figure 1 and Figure 6As shown, multiple rotating assemblies 2 and magnetic members 3 are provided, and the magnetic members 3 are correspondingly arranged on the rotating assemblies 2. The rotation of the rotating assembly 2 relative to the support member 13 can be independently adjusted. In this case, the rotating assembly 2 also has a hollow cylindrical structure, and multiple rotating assemblies 2 are mounted outside the support member 13. The magnetic members 3 correspond to the rotating assemblies 2 and have the same length. The total length of these rotating assemblies 2 and the total length of the magnetic members 3 is equal to the length of the electromagnet in the cathode 4. In this case, the magnetic field at a certain position on the cathode 4 can be flexibly adjusted as needed. For example, when there are two rotating assemblies 2, corresponding to the front and rear of the cathode 4, the magnetic fields at the front and rear of the cathode 4 can be adjusted separately. When more rotating assemblies 2 are provided, each rotating assembly 2 can adjust the magnetic field of the cathode 4 at its corresponding position accordingly. This makes it more convenient to adjust the magnetic field at different positions of the cathode 4 as needed, thereby further improving the uniformity of the magnetic field distribution of the cathode 4.

[0033] In some embodiments, as Figure 1 and Figure 6 As shown, the rotating component 2 includes a rotating magnetic shoe 21. The rotating magnetic shoe 21 is cylindrical with a hollow structure in the middle. The hollow part is adapted to the outer diameter of the support 13. The rotating magnetic shoe 21 is sleeved on the periphery of the support 13. The rotating magnetic shoe 21 can rotate relative to the support 13. The magnetic member 3 is arranged on the rotating magnetic shoe 21. The magnetic member 3 is arranged in the direction of the cathode 4 and is adjacent to the cathode 4.

[0034] In some embodiments, as Figure 1 and Figure 6 As shown, the rotating assembly 2 also includes an adjustment member 22. A strip-shaped adjustment hole 15 is provided radially on the receiving member 12. The adjustment member 22 is disposed within the adjustment hole 15 and is movable relative to the adjustment hole 15. The length of the adjustment hole 15 corresponds to the movement distance of the adjustment member 22, which is the rotation range of the rotating magnetic shoe 21. One end of the adjustment member 22 is connected to the rotating magnetic shoe 21, and the other end extends beyond the receiving member 12. The adjustment member 22 is used to rotate the rotating magnetic shoe 21 relative to the support member 13. The adjustment member 22 can be used to adjust the rotation angle of the rotating magnetic shoe 21 to flexibly adjust the magnetic field of the magnetic member 3. The relative fixation of the rotating magnetic shoe 21 and the support member 13 can be achieved through a transition fit between the rotating magnetic shoe 21 and the support member 13. In the absence of external force, a certain amount of friction exists at the mating portion to prevent the mating structure from rotating. In the presence of a certain external force, the external force can cause the mating structure to rotate or move up and down. Corresponding grooves and protrusions may also be provided on the rotating magnetic shoe 21 and / or the support member 13 to restrict the rotation through the cooperation of the grooves and the protrusions.

[0035] In some embodiments, as Figure 1 and Figure 6As shown, the inner end of the adjusting member 22 passes through the rotating magnetic shoe 21 and contacts the outer surface of the support member 13. The adjusting member 22 is screwed to the rotating magnetic shoe 21 to lock or unlock the rotation of the rotating magnetic shoe 21 relative to the support member 13. When the adjusting member 22 is tightened, the inner end of the adjusting member 22 contacts the outer surface of the support member 13, locking the rotating magnetic shoe 21 to the support member 13. When the adjusting member 22 is loosened, the inner end of the adjusting member 22 separates from the outer surface of the support member 13, and the rotating magnetic shoe 21 can be rotated by the adjusting member 22 to adjust the magnetic field of the rotating upper magnetic member 3.

[0036] In some embodiments, as Figure 1 and Figure 6 As shown, an adjustment handle 23 is provided at the outer end of the adjustment member 22, and a scale is provided at the adjustment hole 15. The adjustment handle 23 is easy to grasp, and the scale at the adjustment hole 15 allows for intuitive determination of the position of the adjustment member 22, and thus the rotation angle of the rotating magnetic shoe 21. This provides a quantitative standard for adjusting the magnetic field of the cathode 4, facilitating accurate adjustment of the magnetic field of the cathode 4.

[0037] Based on the same inventive concept, the present application also provides a magnetron sputtering device, including the above-mentioned external magnetic field adjustment mechanism.

[0038] It can be seen that the present application discloses an external magnetic field adjustment mechanism, in which a fixed component is arranged outside the cathode of the magnetron sputtering equipment, and a rotating component is connected through the fixed component. A magnetic part is arranged on the rotating component, and the magnetic part is driven to rotate relative to the fixed component by the rotating component. Even if the magnetic part rotates relative to the cathode, the magnetic field distribution of the cathode is adjusted by the magnetic field of the magnetic part, so that the magnetic field distribution of the cathode is uniform, thereby improving the uniformity of the coating of the magnetron sputtering equipment.

[0039] The above are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structural transformations made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An external magnetic field adjustment mechanism, suitable for magnetron sputtering equipment, characterized in that: It includes a fixed component, a rotating component and a magnetic component. The fixed component is used to connect the cathode of the magnetron sputtering equipment and is arranged on the outside of the cathode. The rotating component is connected to the fixed component and can rotate relative to the fixed component. The magnetic component is arranged on the rotating component and rotates together with the rotating component relative to the fixed component. The magnetic component is used to adjust the magnetic field of the cathode.

2. The external magnetic field adjustment mechanism according to claim 1, characterized in that: There are two adjustment mechanisms, which are arranged on both sides of the cathode along the axial direction and are symmetrically arranged with respect to the axial center line of the cathode.

3. The external magnetic field adjustment mechanism according to claim 1, characterized in that: The fixed assembly includes a fixed plate, a container and a support member. The fixed plate is arranged at both ends of the cathode. The two ends of the container are respectively connected to the fixed plate. The support member and the rotating assembly are arranged in the container. The rotating assembly is sleeved on the periphery of the support member and can rotate relative to the support member.

4. The external magnetic field adjustment mechanism according to claim 3, characterized in that: The total length of the rotating assembly and the magnetic member is adapted to the total length of the electromagnet of the cathode.

5. The external magnetic field adjustment mechanism according to claim 3 or 4, characterized in that: There are multiple rotating components and magnetic parts, and the magnetic parts are correspondingly arranged on the rotating components. The rotation of the rotating components relative to the supporting member can be adjusted independently.

6. The external magnetic field adjustment mechanism according to claim 5, characterized in that: The rotating assembly includes a rotating magnetic shoe, which is a cylindrical hollow structure. The rotating magnetic shoe is sleeved on the periphery of the supporting component, and the magnetic component is arranged on the rotating magnetic shoe.

7. The external magnetic field adjustment mechanism according to claim 6, characterized in that: The rotating assembly also includes an adjusting member, a strip-shaped adjusting hole is provided on the accommodating member in a radial direction, the adjusting member is provided in the adjusting hole, the adjusting member can move relatively along the adjusting hole, one end of the adjusting member is connected to the rotating magnetic shoe, and the other end extends out of the accommodating member, and the adjusting member is used to drive the rotating magnetic shoe to rotate relative to the supporting member.

8. The external magnetic field adjustment mechanism according to claim 7, characterized in that: The inner end of the adjusting member passes through the rotating magnetic shoe, and the adjusting member is screwed to the rotating magnetic shoe for locking or unlocking the rotation of the rotating magnetic shoe relative to the supporting member.

9. The external magnetic field adjustment mechanism according to claim 8, characterized in that: An adjusting handle is provided at the outer end of the adjusting member, and a scale is provided at the adjusting hole.

10. A magnetron sputtering device, characterized in that: It includes the external magnetic field adjustment mechanism according to any one of claims 1 to 9.

Images