Gas ejector pipe structure of vertical furnace tube equipment

Abstract

The utility model discloses a gas ejector pipe structure of vertical furnace tube equipment, a gas ejector pipe is a straight pipe with a gas inlet at the bottom end and a closed top, gas ejector holes are distributed on the side wall of the gas ejector pipe at equal intervals along the vertical direction, and the gas ejector holes are of a transverse extension structure. The gas ejector pipe structure disclosed by the utility model is used for chemical vapor deposition of wafers and has the advantage of improving the thickness uniformity of a deposited film of the wafers.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing equipment and relates to a vertical chemical vapor deposition furnace tube equipment, in particular to an air injection pipe structure of the vertical furnace tube equipment. Background Art

[0002] Among the structural components of a semiconductor vertical furnace tube, the air injection pipe is the terminal execution component for delivering the reaction gas into the furnace tube, and has certain design requirements for its shape, air inlet and air outlet. Figure 1 As shown, the overall shape is a cylinder extending vertically upward, with two air inlets 104 at the bottom and an air injection structure on the side of the main body in the shape of multiple circular holes 105' arranged vertically.

[0003] like Figure 2 As shown, during the deposition process, the two reaction gases enter the injection pipe through the two gas inlets 104 for pre-mixing, and then are ejected from the injection structure, pass through the wafer surface, and finally discharged from the gap in the side wall of the furnace pipe.

[0004] When the mixed gas is ejected from the jet structure, since the circular holes 105' are arranged vertically, the ejected gas will be in a relatively concentrated beam-like airflow. The beam-like airflow passes through the surface of the wafer 10. Combined with the wafer boat, it will drive the wafer to rotate during chemical vapor deposition, resulting in a higher thickness of the deposited film in the center of the wafer 10. The deposited film as a whole is in a central convex state, and the uniformity of the film thickness is low. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide an air jet pipe structure of a vertical furnace tube device, which can improve the uniformity of the thickness of the wafer deposited film when used for chemical vapor deposition of wafers, thereby overcoming the shortcomings of the prior art.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A jet pipe structure for a vertical furnace tube device, wherein the jet pipe is a straight pipe with an air inlet at the bottom and a closed top, and jet ports are distributed vertically and at equal intervals on the side wall of the jet pipe, characterized in that the jet ports are a transversely extending structure.

[0008] In the present invention, the transverse extension structure is a transverse gap.

[0009] In the present invention, the width of the transverse gap is 1.5-3 mm, and the arc length is 8-15 mm.

[0010] In the present invention, the transversely extending structure is a row of transversely arranged through holes.

[0011] In the present invention, the diameter of the through holes is 1.5-3 mm, the center distance is 4-7.5 mm, and the number of the through holes is 3-5.

[0012] In the present invention, the inner diameter of the air jet pipe is 8-12 mm.

[0013] In the present invention, there are two air inlets.

[0014] In the present invention, one of the air inlets is located on a straight pipe section extending from the air injection pipe, and the other air inlet is located on a curved pipe section branching out from a side of the air injection pipe.

[0015] By adopting the above technical solution, since the air nozzle is a laterally extended structure, the gas will diffuse to both sides in the horizontal direction when it is ejected, so that the gas distribution range is wider and the contact area between the airflow and the wafer surface is larger, which can make the deposited film thickness in each area on each wafer more consistent, the deposited film thickness is more uniform, and the phenomenon of bulge in the center of the wafer deposited film is reduced.

[0016] Therefore, the gas injection tube structure of the present invention has the advantage of improving the uniformity of the thickness of the deposited film on the wafer when used for chemical vapor deposition of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0018] Figure 1 It is a schematic diagram of the structure of the jet pipe in the prior art;

[0019] Figure 2 A top view of a conventional air injection pipe disposed in a vertical furnace tube device;

[0020] Figure 3 Schematic diagram of the air injection pipe structure of Example 1;

[0021] Figure 4 This is a schematic structural diagram of the air injection pipe of Example 1 applied to a vertical furnace tube device;

[0022] Figure 5 A top view of the inner tube of the air injection tube of Example 1 applied in a vertical furnace tube device;

[0023] Figure 6 Schematic diagram of the injection pipe structure of Example 2. DETAILED DESCRIPTION

[0024] The jet pipe structure of the vertical furnace tube equipment of the utility model is as follows Figure 4 As shown, the air injection pipe 105 is a cylindrical straight pipe with an air inlet 104 at the bottom and a closed top.

[0025] The sidewall of the air-injection pipe is vertically and evenly spaced with air-injection ports 201, which are laterally extending structures. In this embodiment, the laterally extending structures are transverse slits.

[0026] In this embodiment, the inner diameter of the air injection tube 105 is 8-12 mm, the width of the transverse gap is 1.5-3 mm, and the arc length is 8-15 mm.

[0027] There are two air inlets 104 , one of which is located on a straight pipe section 104 a extending from the air injection pipe 105 , and the other is located on a curved pipe section 104 b branching out from the side of the air injection pipe 105 .

[0028] like Figure 4 and Figure 5 As shown, the air injection pipe 105 of this embodiment is applied to a vertical furnace tube device. The vertical furnace tube device further includes an outer tube 101 , an inner tube 102 , a wafer boat 103 , and a base 200 .

[0029] The outer tube 101 and inner tube 102 are both mounted on a base 200. The inner tube 102 is located within the outer tube 101. A vertical wafer boat 103 is positioned within the inner tube 102. The base 200 includes a rotating mechanism (not shown) that drives the wafer boat 103 within the inner tube 102. An air injection pipe 105 is located within the inner tube 102, positioned on one side of the wafer boat 103 and extending axially along the wafer boat 103, i.e., standing upright within the inner tube 102.

[0030] The wafer boat 103 can hold dozens of wafers spaced evenly along the axial direction. The air jet 201 faces the gap between adjacent wafers. A slit 107 extending axially (i.e., vertically) along the inner tube 102 is defined on the sidewall of the inner tube 102 facing the air jet 105. A gap between the sidewall of the inner tube 102 with the slit 107 and the sidewall of the outer tube 101 forms an air outlet channel 108. The base 200 is provided with an exhaust port 106 connected to the air outlet channel 108.

[0031] When the vertical furnace tube device performs chemical vapor deposition on a wafer, the reaction gas is ejected from each nozzle 201 on the side of the injection tube 201 , passes through the surface of the wafer, and is finally discharged from the gap on the inner tube 102 .

[0032] Since the jet nozzle 201 is a laterally extending structure, the gas will diffuse to both sides in the horizontal direction when it is ejected, making the gas distribution range wider and the contact area between the airflow and the surface of the wafer 10 larger, so that the thickness of the deposited film in each area on each wafer 10 can be more consistent, the thickness of the deposited film can be more uniform, and the phenomenon of bulging in the center of the wafer deposited film can be reduced.

[0033] Example 2

[0034] like Figure 6As shown, unlike Example 1, the air jets 201 on the air jet tube 105 of this embodiment employ a different, laterally extending structure, namely, air jets 201 are a row of transversely arranged through-holes. This air jet structure generally provides a wider horizontal distribution of the ejected gas, thereby improving the uniformity of the deposited film thickness. Specifically, the through-holes have a diameter of 1.5-3 mm, a center-to-center spacing of 4-7.5 mm, and a number of 3-5.

[0035] The other structures are the same as those in Example 1 and will not be described again.

[0036] It can be seen from the above detailed description that the gas injection tube structure of the present invention has the advantage of improving the uniformity of the thickness of the deposited film on the wafer when used for chemical vapor deposition of the wafer.

Claims

1. A jet pipe structure for a vertical furnace tube device, wherein the jet pipe is a straight pipe having an air inlet at the bottom and a closed top, and the sidewalls of the jet pipe are provided with jet ports spaced vertically and evenly spaced, characterized in that: The air jet is a transversely extending structure.

2. The air injection pipe structure of the vertical furnace tube equipment according to claim 1, characterized in that: The transverse extension structure is a transverse gap.

3. The air injection pipe structure of the vertical furnace tube equipment according to claim 2, characterized in that: The width of the transverse gap is 1.5-3 mm, and the arc length is 8-15 mm.

4. The air injection pipe structure of the vertical furnace tube equipment according to claim 1, characterized in that: The transverse extension structure is a row of through holes arranged transversely.

5. The air injection pipe structure of the vertical furnace tube equipment according to claim 4, characterized in that: The diameter of the through holes is 1.5-3 mm, the center distance is 4-7.5 mm, and the number of the through holes is 3-5.

6. The air injection pipe structure of the vertical furnace tube equipment according to claim 1, characterized in that: The inner diameter of the air jet pipe is 8-12 mm.

7. The air injection pipe structure of the vertical furnace tube equipment according to claim 1, characterized in that: There are two air inlets.

8. The air injection pipe structure of the vertical furnace tube equipment according to claim 7, characterized in that: One of the air inlets is located on a straight pipe section extending from the air injection pipe, and the other air inlet is located on a curved pipe section branching out from a side of the air injection pipe.

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