CVD (Chemical Vapor Deposition) substrate tray structure

Abstract

The utility model relates to the technical field of CVD (Chemical Vapor Deposition) substrate trays, and discloses a CVD substrate tray structure which is characterized in that a heating ring is embedded between a mounting base and a heat-conducting disc seat, the lower part of a heating pedestal is embedded with the heat-conducting disc seat in an aligned manner, a top baffle plate is embedded at the upper part of the mounting tray, the heating pedestal is arranged at the upper part of the mounting tray, and the heat-conducting disc seat is arranged at the lower part of the heating pedestal. The heating pedestal and the heat conduction disc seat are both made of good heat conduction materials and are installed and connected through an alignment embedding structure, heat can be intensively conducted to the upper portion of a wafer through fixed-point contact conduction between the heating pedestal and the heat conduction disc seat, efficient and rapid heating of the wafer can be achieved, and the top blocking piece is installed on the upper portion of the installation tray in an embedded mode through a notch. The non-film-coating area on the upper portion of the mounting tray can be shielded and protected through the top blocking piece, dirt is prevented from being attached to the mounting tray, cleaning operation of the tray structure can be completed only by disassembling and taking down the top blocking piece during cleaning, and compared with a traditional integrated tray structure, better cleaning convenience is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of CVD substrate trays, in particular to a CVD substrate tray structure. Background Art

[0002] CVD technology is a technology that uses chemical vapor deposition to form solid deposition by chemical reaction in the reactor using energy such as heating, plasma excitation or light radiation to make gaseous or vaporous chemicals react in the gas phase or at the gas-solid interface. Two or more gaseous raw materials are introduced into a reaction chamber, and then they react chemically with each other to form a new material, which is deposited on the surface of the chip to achieve film coating on the chip surface.

[0003] The substrate tray is a carrier for carrying the substrate during the vapor deposition process. It positions and supports the wafer workpiece and provides heating for the wafer. It is an important working component in CVD processing. In order to quickly heat the wafer, a heating structure is provided inside the tray. Traditional trays mostly adopt an integrated conductive heating structure, which uses an integrated base to conduct heat. During heating, the heat is distributed over the upper part of the entire base. The heat dispersion will reduce the heating speed of the wafer and cause heat waste, resulting in poor heating efficiency. After the coating process is completed, the coating material will adhere to the upper part of the tray. In order to ensure the normal operation of the equipment, the adhesion on the upper part of the tray must be removed by disassembly. The operation is complicated and inconvenient to use. Therefore, a CVD substrate tray structure is proposed. Utility Model Content

[0004] The purpose of the present invention is to provide a CVD substrate tray structure to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a CVD substrate tray structure, comprising a base mechanism and a tray mechanism, wherein the base mechanism is arranged at the lower portion of the tray mechanism, the base mechanism comprises a mounting base, a heating ring, and a heat conducting plate seat, wherein the heating ring is embedded and installed between the mounting base and the heat conducting plate seat;

[0006] The tray mechanism includes a mounting tray, a heating base and a top baffle. There are multiple heating bases, which are evenly installed on the upper part of the mounting tray. The lower part of the heating base is aligned and engaged with the heat conducting plate base. The top baffle is engaged and installed on the upper part of the mounting tray. The top baffle shields the non-coating area installed on the mounting tray.

[0007] Preferably, a mounting support is fixedly mounted on the middle portion of the bottom side of the mounting base, and the mounting base is supported and mounted by the mounting support.

[0008] Preferably, the heat conducting plate seat is mounted on the inner side of the notch on the upper portion of the mounting base, and both the mounting base and the heat conducting plate seat are provided with a ring groove, and the heating ring is mounted on the inner side of the ring groove.

[0009] Preferably, a pedestal mounting groove is provided on the upper portion of the mounting tray, the heating pedestal is fixedly mounted on the inner side of the pedestal mounting groove, and a wafer mounting groove is provided on the upper portion of the heating pedestal.

[0010] Preferably, the upper part of the heat-conducting plate seat is evenly and fixedly provided with heat-conducting bosses, the distribution position of the heat-conducting bosses corresponds to the heating platform seat, the bottom of the heating platform is provided with a boss embedding groove, and the heat-conducting bosses are embedded in the inner side of the boss embedding groove.

[0011] Preferably, a circular through groove is provided through the upper part of the top baffle, the number and distribution positions of the circular through grooves are adapted to the heating base, the upper protrusion of the heating base is embedded in the inner side of the circular through groove, and the top baffle is installed on the upper part of the mounting tray through the circular through groove.

[0012] Compared with the prior art, the above technical solution adopted by the present invention has the following technical effects:

[0013] The tray structure adopts a fixed-point heat conduction heating method, and uses a heat conduction plate seat to evenly conduct the heat of the ring groove, and a heating platform is provided on the upper part of the mounting tray. The heating platform and the heat conduction plate seat are both made of benign heat-conducting materials and are installed and connected through a matching interlocking structure. The fixed-point contact conduction between the heating platform and the heat conduction plate seat can concentrate the heat to the upper part of the wafer, which can achieve efficient and rapid heating of the wafer, greatly improving the heating efficiency of the device, and a top baffle is provided on the upper part of the mounting tray. The top baffle is installed on the upper part of the mounting tray through a slot interlocking, and the non-coated area on the upper part of the mounting tray can be shielded and protected by the top baffle to prevent dirt from adhering to the mounting tray. The top baffle can be disassembled independently. When cleaning, you only need to remove the top baffle to complete the cleaning operation of the tray structure. Compared with the traditional integrated tray structure, it has better cleaning convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0015] Figure 1 This is a schematic diagram of the overall installation structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the overall split upper side structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the overall split lower side structure of the utility model;

[0018] Figure 4 This is a schematic diagram of the installation structure of the installation tray and the upper side of the heating base of the utility model;

[0019] Figure 5 This is a schematic diagram of the installation structure of the installation tray and the lower side of the heating platform of the present invention.

[0020] Explanation of the accompanying drawings: 1. Mounting base; 2. Heating ring; 3. Heat-conducting plate seat; 4. Mounting tray; 5. Heating platform; 6. Top baffle; 7. Mounting support; 8. Ring groove; 9. Heat-conducting boss; 10. Boss groove; 11. Chip mounting groove; 12. Circular through groove. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application.

[0023] Example

[0024] See also Figure 1-5 The utility model provides a technical solution: a CVD substrate tray structure, including a base mechanism and a tray mechanism. The base mechanism is arranged at the lower part of the tray mechanism for supporting and installing the tray mechanism. The base mechanism includes a mounting base 1, a heating ring 2 and a heat conducting plate seat 3. In order to facilitate the installation and connection of the mounting base 1, a mounting support 7 is fixedly installed in the middle of the bottom side of the mounting base 1. The mounting base 1 is supported and installed with an external CVD equipment through the mounting support 7.

[0025] The heat conducting plate seat 3 can be made of high conductivity ceramic material, which has excellent heat conduction and high temperature resistance properties. Figure 2 As shown, the heat-conducting plate seat 3 is embedded and installed on the inner side of the groove on the upper part of the mounting base 1. The heating ring 2 can be a resistive heating device. In order to facilitate the connection and installation of the heating ring 2, a ring embedding groove 8 is provided on the embedding side of the mounting base 1 and the heat-conducting plate seat 3. The heating ring 2 is embedded and installed on the inner side of the ring embedding groove 8. The heating ring 2 is embedded and installed between the mounting base 1 and the heat-conducting plate seat 3 for heating the chip.

[0026] The tray mechanism is used for placing and installing the wafer. The tray mechanism includes a mounting tray 4, a heating platform 5 and a top baffle 6. The heating platform 5 is used for positioning and installing the wafer. The heating platform 5 can be made of high-conductivity ceramic material with excellent thermal conductivity and high-temperature resistance. Figure 4 As shown, seven heating pedestals 5 are provided. In order to facilitate the connection and installation of the heating pedestals 5, a pedestal mounting groove is provided on the upper part of the mounting tray 4. The heating pedestal 5 is fixedly installed on the inner side of the pedestal mounting groove. In order to fit the chip, a chip mounting groove 11 is provided on the upper part of the heating pedestal 5.

[0027] In order to be installed and connected with the mounting tray 4, a circular through groove 12 is opened through the upper part of the top baffle 6. The number and distribution positions of the circular through grooves 12 are adapted to the heating platform 5. The upper protrusion of the heating platform 5 is embedded in the inner side of the circular through groove 12. The top baffle 6 is installed on the upper part of the mounting tray 4 through the circular through groove 12. The top baffle 6 shields the non-coated area installed on the mounting tray 4. The top baffle 6 can shield and protect the non-coated area on the upper part of the mounting tray 4 to prevent dirt from adhering to the mounting tray 4. The top baffle 6 can be disassembled independently. When cleaning, you only need to disassemble and remove the top baffle 6 to complete the cleaning operation of the tray structure. Compared with the traditional integrated tray structure, it has better cleaning convenience.

[0028] In order to install and connect with the heating platform 5, as shown in the attached Figure 2 As shown, heat-conducting bosses 9 are evenly and fixedly provided on the upper part of the heat-conducting plate seat 3, and the distribution position of the heat-conducting bosses 9 corresponds to that of the heating platform 5. A boss embedding groove 10 is provided at the bottom of the heating platform 5, and the heat-conducting boss 9 is embedded in the inner side of the boss embedding groove 10. The lower part of the heating platform 5 is aligned with the heat-conducting plate seat 3, and a fixed-point heat-conducting heating method is adopted. The heat of the ring embedding groove 8 is evenly distributed and conducted by the heat-conducting plate seat 3, and a heating platform 5 is provided on the upper part of the mounting tray 4. The heating platform 5 and the heat-conducting plate seat 3 are both made of benign heat-conducting material and are installed and connected by an aligned embedding structure. The heat can be concentratedly conducted to the upper part of the chip through the fixed-point contact conduction between the heating platform 5 and the heat-conducting plate seat 3, so that the chip can be heated efficiently and quickly.

[0029] Working principle or structural principle, when in use, select the mounting tray 4 that is compatible with the processed wafer, then install the mounting tray 4 on the upper part of the heat-conducting disc seat 3, then align and fit the top baffle 6 on the upper part of the mounting tray 4 to complete the assembly operation of the device, during processing, align and fit the wafer into the wafer mounting groove 11 on the upper part of the heating platform 5, then close the CVD equipment to perform coating processing on the wafer, during processing, the heating ring 2 in the mounting base 1 and the heating component in the equipment work simultaneously, the heat generated by the heating ring 2 is evenly conducted through the heat-conducting disc seat 3, and the heat-conducting convex portion on the upper part of the heat-conducting disc seat 3 The seat 9 is tightly fitted with the convex seat groove 10 at the bottom of the heating platform 5, and the heat is concentratedly conducted to the upper part of the heating platform 5 through contact conduction, and the wafer in the heating platform 5 is heated and heated. After reaching the set temperature, the gaseous raw materials react to form a coating material, and the material settles to the surface of the wafer to form a coating. After that, the device is cooled to form a coating on the surface of the wafer, and the processing operation is completed. When cleaning the device, the top baffle 6 on the upper part of the mounting tray 4 is disassembled and removed as a whole, and then the dirt on the top of the top baffle 6 is cleaned through the electrolytic cell. After completion, the cleaned top baffle 6 is reset and installed to complete the cleaning operation.

[0030] In summary, the tray structure adopts a fixed-point heat conduction heating method, and uses the heat-conducting plate seat 3 to evenly conduct the heat of the ring groove 8, and a heating platform 5 is provided on the upper part of the mounting tray 4. The heating platform 5 and the heat-conducting plate seat 3 are both made of benign heat-conducting materials and are installed and connected through a matching interlocking structure. The fixed-point contact conduction between the heating platform 5 and the heat-conducting plate seat 3 can concentrate the heat to the upper part of the wafer, which can achieve efficient and rapid heating of the wafer, greatly improving the heating efficiency of the device, and a top baffle 6 is provided on the upper part of the mounting tray 4. The top baffle 6 is installed on the upper part of the mounting tray 4 through a slot interlocking, and the non-coated area on the upper part of the mounting tray 4 can be shielded and protected by the top baffle 6 to prevent the mounting tray 4 from adhering to dirt. The top baffle 6 can be disassembled independently. When cleaning, you only need to disassemble and remove the top baffle 6 to complete the cleaning operation of the tray structure, which has better cleaning convenience than the traditional integrated tray structure.

[0031] Those skilled in the art will appreciate that various combinations and / or combinations of features described in the various embodiments and / or claims of the present invention may be employed, even if such combinations and / or combinations are not explicitly described in the present invention. In particular, various combinations and / or combinations of features described in the various embodiments and / or claims of the present invention may be employed without departing from the spirit and teachings of the present invention. All such combinations and / or combinations fall within the scope of the present invention.

Claims

1. A CVD substrate tray structure, comprising a base mechanism and a tray mechanism, characterized in that: The base mechanism is arranged at the lower part of the tray mechanism, and the base mechanism comprises a mounting base (1), a heating ring (2) and a heat conducting plate seat (3), wherein the heating ring (2) is mounted between the mounting base (1) and the heat conducting plate seat (3); The tray mechanism comprises a mounting tray (4), a heating platform (5) and a top baffle (6), wherein a plurality of the heating platforms (5) are provided, and the heating platforms (5) are evenly mounted on the upper portion of the mounting tray (4), the lower portion of the heating platform (5) is aligned and engaged with the heat conducting plate seat (3), and the top baffle (6) is engaged and mounted on the upper portion of the mounting tray (4), and the top baffle (6) shields the non-coating area mounted on the mounting tray (4).

2. The CVD substrate tray structure according to claim 1, wherein: A mounting support (7) is fixedly mounted on the middle portion of the bottom side of the mounting base (1), and the mounting base (1) is supported and mounted by the mounting support (7).

3. The CVD substrate tray structure according to claim 2, wherein: The heat conducting plate seat (3) is mounted on the inner side of the notch on the upper portion of the mounting base (1), and the mounting sides of the mounting base (1) and the heat conducting plate seat (3) are both provided with a ring embedding groove (8), and the heating ring (2) is mounted on the inner side of the ring embedding groove (8).

4. The CVD substrate tray structure according to claim 3, wherein: The upper portion of the mounting tray (4) is provided with a pedestal mounting groove, the heating pedestal (5) is fixedly mounted on the inner side of the pedestal mounting groove, and the upper portion of the heating pedestal (5) is provided with a wafer mounting groove (11).

5. The CVD substrate tray structure according to claim 4, wherein: The upper part of the heat-conducting plate seat (3) is evenly and fixedly provided with heat-conducting bosses (9), and the distribution position of the heat-conducting bosses (9) corresponds to that of the heating platform seat (5). The bottom of the heating platform seat (5) is provided with a boss embedding groove (10), and the heat-conducting bosses (9) are embedded in the inner side of the boss embedding groove (10).

6. The CVD substrate tray structure according to claim 1, wherein: A circular through groove (12) is provided through the upper portion of the top baffle (6), the number and distribution positions of the circular through grooves (12) are adapted to the heating platform (5), the upper protrusion of the heating platform (5) is engaged with the inner side of the circular through groove (12), and the top baffle (6) is mounted on the upper portion of the mounting tray (4) through the circular through groove (12).

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