Semiconductor electroplating device

Abstract

The utility model discloses a semiconductor electroplating device which comprises a bin body, the bin body comprises a main bin and two auxiliary bins, and the two auxiliary bins are distributed on the same side of the bin body and are communicated and connected with the main bin; an annular rail and a plurality of sets of clamping mechanisms are arranged above the bin body, the annular rail is sleeved with the tops of the multiple sets of clamping mechanisms, a driving mechanism is further arranged on the side edge of the annular rail, and the driving mechanism is connected with the multiple sets of clamping mechanisms and controls the multiple sets of clamping mechanisms to move in the circumferential direction of the annular rail; a polar plate is arranged on the inner side of the bin body; according to the utility model, the circular track is arranged, the plurality of sets of clamping mechanisms are arranged, and the tops of the plurality of sets of clamping mechanisms are sleeved on the circular track, so that the clamping mechanisms can move along the circumference direction of the circular track under the action of external force; the bottom of the clamping mechanism can clamp the semiconductor to extend into the electroplating liquid, and the semiconductor, the electroplating liquid, the polar plate and the power supply form an electroplating closed loop, so that electroplating treatment can be realized in the moving process of the semiconductor.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a semiconductor electroplating device. Background Art

[0002] With the rapid development of modern technology, the semiconductor industry plays a vital role in various fields, such as computers, communications, and consumer electronics. In the semiconductor manufacturing process, electroplating technology is an indispensable process for achieving internal circuit connections within the chip and forming metal layers. This is the process of using electroplating equipment to form a metal layer (such as copper, gold, or silver) on the surface of a semiconductor material (such as a silicon wafer) through electrochemical deposition.

[0003] Currently, there are solutions for semiconductor electroplating in the prior art, such as a semiconductor lead electroplating device disclosed in a Chinese patent CN110965096A. The device includes an upper base plate disposed below a lower base plate, the lower base plate and the upper base plate being fixedly connected by four support rods, a plating tank containing a plating solution disposed above the upper base plate, vibrators symmetrically fixed to the left and right inner walls of the plating tank to vibrate the plating solution, discharge pins fixed to the lower inner wall of the plating tank to discharge the plating solution, and a lifting device disposed between the plating tank and the lower base plate to lift the plating tank upward. The device provided by this patent is easy to operate and has low manufacturing costs. It can realize the vertical movement of a box containing workpieces, ensuring that the plating solution is in full contact with the workpiece during electroplating, thereby ensuring the quality of the plating.

[0004] As we all know, semiconductor manufacturing is a complex process involving multiple process steps. The electroplating process needs to be well compatible with other processes (such as photolithography, etching, chemical mechanical polishing, etc.). This means that the entire semiconductor manufacturing process takes a long time. If the electroplating equipment used in the above-mentioned patent body is used to electroplate the semiconductors one by one, and each semiconductor requires a suitable electroplating time, this will result in a large amount of time consumed when electroplating batches of semiconductors, and low production efficiency for the entire semiconductor manufacturing. Utility Model Content

[0005] The purpose of the present utility model is to provide a semiconductor electroplating device, aiming to improve the equipment used for semiconductor electroplating, and solve the problem that the efficiency of batch semiconductor electroplating needs to be improved.

[0006] The utility model is implemented as follows: a semiconductor electroplating device includes a warehouse body, the warehouse body includes a main warehouse and two auxiliary warehouses, the two auxiliary warehouses are distributed on the same side of the warehouse body, and are both connected to the main warehouse; a ring rail and multiple clamping mechanisms are arranged above the warehouse body, the tops of the multiple clamping mechanisms are sleeved on the ring rail, and a driving mechanism is also arranged on the side of the ring rail, the driving mechanism is connected to the multiple clamping mechanisms, and controls the multiple clamping mechanisms to move along the circumference direction of the ring rail; an electrode plate is arranged on the inner side of the warehouse body, and a conductive rail is also arranged above it, and the conductive rail, the electrode plate and the clamping mechanism can form a closed loop.

[0007] Preferably, a base frame is provided under the warehouse body, a control box and an air pump are provided on the base frame, the control box and the air pump are electrically connected, an air pipe is provided on the inner side of the warehouse body, a valve body is provided at the end of the air pipe protruding from the warehouse body, and is connected to the air pump.

[0008] Preferably, a plurality of thread grooves are provided on the top of the ring rail, and a bracket is provided above the ring rail, a screw rod is provided through the bracket, and the top thread of the screw rod is inserted into the thread groove; a vertical plate is fixedly provided below the bracket, and the vertical plate contacts the ground.

[0009] Preferably, the driving mechanism includes an annular belt, a driving wheel and a supporting arc plate. Two supporting arc plates are provided and are respectively installed at the two ends of the bracket. The two ends of the annular belt are respectively sleeved on the two supporting arc plates. The driving wheel passes through a supporting arc plate and is installed on the output shaft of the second motor. The second motor is fixedly connected to the supporting arc plate.

[0010] Preferably, the clamping mechanism includes a vertical rod, on the top of which a snap plate is fixed, the central angle of the snap plate is greater than 180°, and the snap plate is sleeved on the ring rail; a sleeve is sleeved on the upper end of the vertical rod, the sleeve is located on the outside of the annular belt, and is connected to the annular belt.

[0011] Preferably, the conductive rail is configured as a U-shaped structure and is connected to the bracket. A splicing plate is fixedly provided at the opening of the conductive rail, and the splicing plate is made of insulating material. The conductive rail is connected to a slide at the upper end of the vertical rod, and the slide is made of conductive material.

[0012] Preferably, a tube and a wire are fixedly provided on the side of the skateboard, the wire passes through the tube, the tube passes through the vertical rod, and the end is connected to the skateboard, and a spring is sleeved on the tube to control the skateboard to fit the conductive rail.

[0013] Preferably, the clamping mechanism also includes a clamping device installed at the bottom of the vertical rod, the clamping device includes a first motor and two clamping plates, the first motor is installed on the frame, and a bidirectional threaded rod is provided through the frame, the bidirectional threaded rod is connected to the first motor through a gear, the two clamping plates are symmetrically arranged on the outside of the frame, and the tops are respectively threaded on the ends of the bidirectional threaded rod; a limiting rod is also provided on the frame, and the two ends of the limiting rod are respectively provided through the two clamping plates.

[0014] Preferably, a conductive block is provided at the bottom of the clamping plate, and the conductive rail is connected to the slide plate via a wire.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. This embodiment is provided with a ring track and multiple sets of clamping mechanisms, and the tops of the multiple sets of clamping mechanisms are mounted on the ring track. Therefore, the clamping mechanisms can be moved along the circumference of the ring track under the action of external force; because the bottom of the clamping mechanism can clamp the semiconductor and extend it into the electroplating solution, and at the same time, the semiconductor, the electroplating solution, the electrode plate and the power supply form an electroplating closed loop, therefore, electroplating treatment can be achieved during the movement of the semiconductor. At the same time, multiple semiconductors move in the electroplating solution, that is, within the same time interval, the electroplating treatment of multiple semiconductors can be completed simultaneously, thereby improving the circuit efficiency.

[0017] 2. The utility model is provided with a conductive rail, and a slide plate is provided on the vertical rod. At the same time, the slide plate is in sliding electrical contact with the conductive rail. Therefore, when the conductive rail is connected to the power supply through a wire, and the slide plate is connected to the semiconductor through a wire, the semiconductor can be connected to the electroplating circuit composed of the electrode plate and the electroplating solution, providing support for the simultaneous movement of multiple semiconductors without affecting the semiconductor electroplating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of the utility model as a whole;

[0019] Figure 2 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 3 It is a structural diagram of the warehouse body of the utility model;

[0021] Figure 4 This is a schematic structural diagram of the ring rail and bracket of the utility model;

[0022] Figure 5 It is a structural schematic diagram of the conductive rail of the utility model;

[0023] Figure 6 It is a structural diagram of the driving mechanism of the utility model;

[0024] Figure 7It is a structural diagram of the clamping mechanism of the utility model;

[0025] Figure 8 It is a structural schematic diagram of the clamping device of the utility model;

[0026] Figure 9 It is a structural schematic diagram of the vertical rod of the utility model.

[0027] In the figure: 1. Warehouse body; 11. Base frame; 12. Air pump; 13. Plate; 14. Air pipe; 15. Main warehouse; 16. Auxiliary warehouse; 2. Annular rail; 21. Threaded groove; 3. Bracket; 31. Screw; 32. Vertical plate; 4. Conductive rail; 41. Splicing plate; 5. Driving mechanism; 51. Annular belt; 52. Support arc plate; 53. Driving wheel; 6. Clamping mechanism; 61. Clamping device; 611. First motor; 612. Clamping plate; 613. Conductive block; 614. Limiting rod; 615. Bidirectional threaded rod; 62. Vertical rod; 621. Snap plate; 622. Sleeve; 623. Wire; 624. Spring; 625. Slide plate. DETAILED DESCRIPTION

[0028] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0029] The following is a further description with reference to the accompanying drawings and specific embodiments:

[0030] Example 1

[0031] To improve the efficiency of batch semiconductor electroplating and thereby accelerate batch semiconductor processing, this embodiment provides a new electroplating device. This device can simultaneously electroplate multiple semiconductors. Specifically, within the same time interval, multiple semiconductors can be electroplated simultaneously, thereby improving circuit efficiency. A specific embodiment of this electroplating device is described below.

[0032] like Figure 1 、 Figure 2 、 Figure 3As shown, the electroplating device includes a warehouse body 1, a bracket 3, a ring rail 2, a conductive rail 4, a clamping mechanism 6, etc. The warehouse body 1 includes a main warehouse 15 and two auxiliary warehouses 16. The main warehouse 15 is configured as a cylindrical structure and is provided with a notch on its side wall. The two auxiliary warehouses 16 are both installed at the notch of the main warehouse 15. Therefore, the auxiliary warehouse 16 is connected to the main warehouse 15, and the electroplating solution can be filled between the main warehouse 15 and the auxiliary warehouse 16. In addition, a pole plate 13 is also provided on the side wall of the warehouse body 1. The pole plate 13 is connected to a wire, and the wire is connected to the control box, and the control box is connected to the power supply. The control box is a prior art and is briefly introduced here. Specifically, it includes a controller, relays and contactors, fuses and circuit breakers, a power module, etc., which can control the on and off of the electrolysis circuit. The electroplating solution and the pole plate 13 both include the metal required for the plating layer.

[0033] like Figure 4 、 Figure 7 、 Figure 9 As shown, a vertical plate 32 is fixedly provided below the bracket 3. The vertical plate 32 contacts the ground, so that the bracket 3 is stably provided and is located between the two auxiliary bins 16. A screw 31 is provided through the two brackets 3, and the ring rail 2 is provided below the bracket 3. At the same time, a plurality of thread grooves 21 are provided on the top of the ring rail 2. The top threads of the screw 31 are inserted into the thread grooves 21. Therefore, under the action of the screw 31, the ring rail 2 is stably installed on the bracket 3. At the same time, the clamping mechanism 6 includes a vertical rod 62 and a clamping device 61. The clamping device 61 is installed below the vertical rod 62. A snap plate 621 is provided on the top of the vertical rod 62. The central angle of the snap plate 621 is greater than 180 degrees and is sleeved on the ring rail 2. Therefore, the vertical rod 62 can be stably provided below the ring rail 2 and can move along the circumference of the ring rail 2 under the action of external force. Then, under the clamping action of the clamping device 61, the semiconductor can be stably provided at the bottom of the vertical rod 62 and immersed in the electroplating solution. In addition, the clamping device 61 is connected to the semiconductor through the conductive block 613, and the conductive block 613 is connected to the control box through a wire. Therefore, the semiconductor and the electrode 13 form a closed circuit, and then a coating can be formed on the semiconductor to complete the electroplating process. Because the auxiliary warehouse 16 is long and forms an electrolytic cell that moves forward and backward with the main warehouse 15, the vertical rod 62 can be controlled to move along the ring track 2, and the clamping mechanism 6 can be controlled to drive the semiconductor to move in the electroplating solution, so that the semiconductor is in contact with the electroplating solution for a sufficient time to complete the electroplating process. Therefore, multiple sets of clamping mechanisms 6 are set. Therefore, after a certain semiconductor is immersed in the electroplating solution, other semiconductors can be controlled to be immersed in the electroplating solution through other clamping mechanisms 6. Therefore, the phenomenon of multiple semiconductors entering the electroplating solution at the same time is formed, which provides convenience for completing batch semiconductor electroplating more quickly and efficiently.

[0034] like Figure 2 、 Figure 6 、 Figure 9As shown, to control the movement of multiple clamping mechanisms 6 along the circumference of the circular track 2, a driving mechanism 5 is also provided on the side of the circular track 2. The driving mechanism 5 includes an annular belt 51, a drive wheel 53, and a support arc plate 52. Two support arc plates 52 are provided, one mounted at each end of the bracket 3. The ends of the support arc plates 52 are chamfered. The ends of the annular belt 51 are respectively mounted on the two support arc plates 52. Therefore, the support arc plates 52 can force the annular belt 51 into a straight state. At the same time, the drive wheel 53 is provided through one of the support arc plates 52 and is mounted on the output shaft of a second motor. The second motor is fixedly connected to the support arc plate 52. Therefore, when the second motor is turned, the annular belt 51 can be controlled to rotate relative to the support arc plate 52, providing support for the regular movement of the multiple clamping mechanisms 6. The annular belt 51 here can be configured as a synchronous belt, and the drive wheel 53 is adapted to the synchronous belt. Therefore, the rotation of the annular belt 51 can be controlled by the rotation of the drive wheel 53. In addition, a sleeve 622 is sleeved on the upper end of the vertical rod 62. The sleeve 622 is located outside the annular belt 51 and is connected to the annular belt 51. Therefore, when the annular belt 51 rotates, the movement of the vertical rod 62 can be controlled, thereby controlling the movement of the semiconductor.

[0035] like Figure 2 、 Figure 5 、 Figure 9 As shown, in order to ensure that the conductive block 613 is always connected to the power supply to form a closed electroplating circuit during the movement of the semiconductor, a conductive rail 4 is provided on the side of the bracket 3, and the conductive rail 4 is connected to the control box via a wire. The conductive rail 4 is configured as a U-shaped structure, and a splicing plate 41 is fixedly installed at the opening of the conductive rail 4. The splicing plate 41 is made of insulating material. With this configuration, the conductive rail 4 and the splicing plate 41 are spliced ​​together to form a closed track without affecting the operation of the conductive rail 4. At the same time, a slide 625 is provided at the upper end of the vertical rod 62. The slide 625 is made of conductive material and is connected to the conductive block 613 via a wire when in sliding electrical contact with the conductive rail 4. Therefore, when the conductive block 613 contacts the semiconductor entering the electroplating solution, a closed electroplating circuit is formed. The connection between the slide 625 and the conductive rail 4 is similar to the contact between the pantograph of an electric traction vehicle and the power grid.

[0036] like Figure 9 As shown, in order to ensure that the slide 625 is always in sliding electrical contact with the conductive rail 4, a tube body and a wire 623 are fixedly provided on the side of the slide 625. The wire 623 is set through the tube body, and the tube body is set through the vertical rod 62, and the end is connected to the slide 625. A spring 624 is sleeved on the tube body, and the spring 624 is in a compressed state. Therefore, under the action of the spring 624, the slide 625 is controlled to fit the conductive rail 4.

[0037] like Figure 8As shown, in order to enable the semiconductor to be stably immersed in the electroplating solution, the clamping device 61 includes a first motor 611 and two clamping plates 612. The first motor 611 is mounted on the frame, and a bidirectional threaded rod 615 is provided on the frame. The bidirectional threaded rod 615 is connected to the first motor 611 via a gear. Therefore, when the first motor 611 is working, the bidirectional threaded rod 615 can be controlled to rotate. The two clamping plates 612 are symmetrically arranged on the outside of the frame, and the tops are respectively threadedly sleeved on the ends of the bidirectional threaded rod 615. Therefore, when the bidirectional threaded rod 615 rotates, the two clamping plates 612 can be moved relative to each other. A limiting rod 614 is also provided on the frame. The two ends of the limiting rod 614 are respectively provided through the two clamping plates 612. Therefore, under the action of the limiting rod 614, the clamping plates 612 are stably and movably installed relative to the frame. In addition, a conductive block 613 is mounted on the clamping plates 612.

[0038] Example 2

[0039] like Figure 1 、 Figure 3 As shown, on the basis of Example 1, in order to stir the electroplating liquid in the warehouse body 1, a base frame 11 is provided below the warehouse body 1, an air pump 12 is provided on the base frame 11, a control box and the air pump 12 are electrically connected, an air pipe 14 is provided on the inner side of the warehouse body 1, a valve body is provided at the end of the air pipe 14 protruding from the warehouse body 1, and the valve body is connected to the air pump 12. Therefore, gas can be input into the electroplating liquid under the action of the air pump 12, and the electroplating liquid is stirred during the rising process of the gas, so that the electroplating liquid is mixed more evenly.

[0040] The above is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A semiconductor electroplating device, characterized in that: The invention comprises a warehouse body (1), wherein the warehouse body (1) comprises a main warehouse (15) and two auxiliary warehouses (16), wherein the two auxiliary warehouses (16) are distributed on the same side of the warehouse body (1) and are both connected to the main warehouse (15); a ring rail (2) and multiple sets of clamping mechanisms (6) are arranged above the warehouse body (1), wherein the tops of the multiple sets of clamping mechanisms (6) are sleeved on the ring rail (2), and a driving mechanism (5) is also arranged on the side of the ring rail (2), wherein the driving mechanism (5) is connected to the multiple sets of clamping mechanisms (6) and controls the multiple sets of clamping mechanisms (6) to move along the circumference direction of the ring rail (2); an electrode plate (13) is arranged on the inner side of the warehouse body (1), and a conductive rail (4) is also arranged above the warehouse body, wherein the conductive rail (4), the electrode plate (13) and the clamping mechanism (6) can form a closed loop.

2. A semiconductor electroplating device according to claim 1, characterized in that: A base frame (11) is provided below the warehouse body (1), a control box and an air pump (12) are provided on the base frame (11), the control box and the air pump (12) are electrically connected, an air pipe (14) is provided on the inner side of the warehouse body (1), and the end of the air pipe (14) protruding from the warehouse body (1) is connected to the air pump (12).

3. A semiconductor electroplating device according to claim 1, characterized in that: A plurality of thread grooves (21) are provided on the top of the ring rail (2), and a bracket (3) is provided above the ring rail (2). A screw rod (31) is provided through the bracket (3), and the top thread of the screw rod (31) is inserted into the thread groove (21); a vertical plate (32) is fixedly provided below the bracket (3), and the vertical plate (32) is in contact with the ground.

4. A semiconductor electroplating device according to claim 3, characterized in that: The driving mechanism (5) comprises an annular belt (51), a driving wheel (53) and a supporting arc plate (52). Two supporting arc plates (52) are provided and are respectively mounted on the two ends of the bracket (3). The two ends of the annular belt (51) are respectively sleeved on the two supporting arc plates (52). The driving wheel (53) passes through a supporting arc plate (52) and is mounted on the output shaft of the second motor. The second motor is fixedly connected to the supporting arc plate (52).

5. A semiconductor electroplating device according to claim 4, characterized in that: The clamping mechanism (6) comprises a vertical rod (62), a snap plate (621) is fixedly arranged on the top of the vertical rod (62), the snap plate (621) has a central angle greater than 180° and is sleeved on the ring rail (2); a sleeve (622) is sleeved on the upper end of the vertical rod (62), the sleeve (622) is located outside the annular belt (51) and is connected to the annular belt (51).

6. A semiconductor electroplating device according to claim 5, characterized in that: The conductive rail (4) is configured as a U-shaped structure and is connected to the bracket (3); a splicing plate (41) is fixedly provided at the opening of the conductive rail (4); the splicing plate (41) is made of an insulating material; the conductive rail (4) is connected to a slide plate (625) at the upper end of the vertical rod (62); the slide plate (625) is made of a conductive material.

7. A semiconductor electroplating device according to claim 6, characterized in that: A tube body and a wire (623) are fixedly provided on the side of the slide plate (625); the wire (623) passes through the tube body, the tube body passes through the vertical rod (62), and the end is connected to the slide plate (625); a spring (624) is sleeved on the tube body, and the spring (624) controls the slide plate (625) to fit the conductive rail (4).

8. A semiconductor electroplating device according to claim 6, characterized in that: The clamping mechanism (6) further comprises a clamping device (61) mounted at the bottom of the vertical rod (62), the clamping device (61) comprising a first motor (611) and two clamping plates (612), the first motor (611) being mounted on a frame, and a bidirectional threaded rod (615) being provided through the frame, the bidirectional threaded rod (615) being connected to the first motor (611) via a gear, the two clamping plates (612) being symmetrically arranged on the outside of the frame, and the tops of the two clamping plates (612) being respectively threadedly sleeved on the ends of the bidirectional threaded rod (615); a limiting rod (614) is further provided on the frame, and the two ends of the limiting rod (614) are respectively provided through the two clamping plates (612).

9. A semiconductor electroplating device according to claim 8, characterized in that: A conductive block (613) is provided at the bottom of the clamping plate (612), and the conductive rail (4) is connected to the slide plate (625) via a wire (623).

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