Wafer detection equipment capable of decontaminating

Abstract

The wafer detection equipment comprises a wafer bearing disc, the wafer bearing disc is provided with a circular positioning groove for placing and positioning a wafer, and an air blowing mechanism for blowing away pollutants on the top surface of the wafer and a camera for detecting the wafer are arranged above the wafer bearing disc. The side groove wall of the positioning groove is provided with a negative pressure dirt suction port used for sucking away pollutants at the edge of the wafer. As the side groove wall of the positioning groove is provided with the negative pressure dirt suction port, the negative pressure dirt suction port can suck away pollutants blown to the edge of the wafer, so that the pollutants are removed, and the pollution of the pollutants to the edge of the wafer is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a wafer detection device capable of being decontaminated. Background Art

[0002] Patent document CN210626359U discloses a decontamination wafer detection device, which includes a wafer carrier plate, a circular positioning groove is opened on the wafer carrier plate, and a blowing mechanism and a camera facing the positioning groove are provided above the wafer carrier plate. When in use, the wafer is placed in the positioning groove, and the blowing mechanism blows air toward the wafer in the positioning groove to blow away the contaminants on the top surface of the wafer, and then the camera detects the wafer. The wafer is usually thin (the thickness is generally not more than 1mm). When it is placed in the positioning groove, its top surface is usually lower than the positioning groove notch. Therefore, when the blowing mechanism blows air toward the top surface of the wafer, the contaminants on the top surface of the wafer will be blown to the edge of the wafer and then accumulated on the edge of the wafer, continuously contaminating the edge of the wafer and affecting the detection result of the edge of the wafer. Utility Model Content

[0003] The problem to be solved by the utility model is to provide a wafer detection device capable of removing contamination, wherein the device can remove contaminants blown to the edge of the wafer.

[0004] In order to solve the above technical problems, the utility model provides a decontamination wafer inspection device, including a wafer carrier plate, a circular positioning groove for wafer placement and positioning, an air blowing mechanism for blowing away contaminants on the top surface of the wafer and a camera for inspecting the wafer are provided above the wafer carrier plate, and a negative pressure suction port for sucking away contaminants on the edge of the wafer is provided on the side wall of the positioning groove.

[0005] Furthermore, it includes a negative pressure generator for providing negative pressure to the negative pressure sewage suction port.

[0006] Furthermore, there are multiple negative pressure sewage suction ports arranged in parallel in the circumferential direction.

[0007] Furthermore, a fill light that emits light upward is provided on the top of the wafer carrier plate, and a reflector is also provided, which reflects the light emitted by the fill light into the positioning groove.

[0008] Furthermore, the fill light and the reflector are both ring-shaped.

[0009] Furthermore, a negative pressure suction cup and a vertical driving mechanism driving the negative pressure suction cup are provided. The negative pressure suction cup is aligned downward with the positioning groove, and the vertical driving mechanism drives the negative pressure suction cup downward to suck away the wafer placed in the positioning groove.

[0010] Furthermore, it includes a lateral drive mechanism for driving the negative pressure suction cup to move lateraly.

[0011] Furthermore, the transverse drive mechanism includes a first transverse drive mechanism in the left and right direction, and the first transverse drive mechanism drives and connects to the vertical drive mechanism; and / or the transverse drive mechanism includes a second transverse drive mechanism in the front and back direction, and the vertical drive mechanism drives and connects to the second transverse drive mechanism, and the second transverse drive mechanism drives and connects to the negative pressure suction cup and the camera.

[0012] Furthermore, the carrier plate is specifically a negative pressure adsorption plate, and negative pressure adsorption holes for adsorbing wafers are opened on the bottom wall of the positioning groove.

[0013] Since a negative pressure suction port is opened on the side wall of the positioning groove, the negative pressure suction port can suck away pollutants blown to the edge of the wafer, thereby removing these pollutants and reducing the contamination of the wafer edge by the pollutants. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the wafer inspection equipment, with the camera and air blow tube pointing downward toward the positioning slot.

[0015] Figure 2 yes Figure 1 A partial enlarged view of the Figure 1 Part A.

[0016] Figure 3 yes Figure 1 A partial enlarged view of the Figure 1 Part B.

[0017] Figure 4 is a cross-sectional view of a wafer carrier with wafers placed in positioning slots.

[0018] Figure 5 This is a schematic diagram of the wafer inspection equipment, in which the air compressor and negative pressure generator are schematically drawn.

[0019] Figure 6 This is a schematic diagram of the wafer inspection equipment. In the figure, the negative pressure suction cup places the wafer on the left side of the wafer placement plate. DETAILED DESCRIPTION

[0020] The present invention is further described in detail below in conjunction with specific embodiments.

[0021] Decontamination-capable wafer inspection equipment Figure 1 , including a base 1, a wafer carrier 2 is installed on the front of the base 1, a circular positioning groove 21 is opened on the top of the wafer carrier 2, and a negative pressure adsorption hole 22 is opened on the bottom wall of the circular positioning groove 21. The circular carrier 2 is a negative pressure adsorption plate, see Figure 3 The bottom of the negative pressure chamber 23 is provided with a negative pressure adsorption hole 22 downwardly connected to the negative pressure chamber 23, and a first negative pressure interface 31 is installed on the wall of the negative pressure chamber 23. Figure 3 and Figure 4 The device includes an existing negative pressure generator 4, which is provided with a first negative pressure pipe 41 connected to the first negative pressure interface 31. Before testing the wafer 100, the operator first places the wafer 100 in the positioning groove 21 of the wafer carrier 2, then starts the negative pressure generator 4 and opens the first valve 51, allowing the negative pressure generator 4 to provide negative pressure to the first negative pressure interface 31, thereby indirectly providing negative pressure to the negative pressure chamber 23 and the negative pressure adsorption hole 22, and using the negative pressure adsorption hole 22 to adsorb the wafer 100 to achieve positioning of the wafer 100. Figure 1 The device includes a camera 8 and a drive device 30 connected to the camera 8. The drive device 30 can drive the camera 8 to move horizontally and vertically. When inspecting the wafer 100, the operator controls the drive device 30 to drive the camera 8 to move vertically to a suitable height, and then drives the camera 8 to move horizontally to the top of the wafer carrier 2 so that the camera 8 is aligned downward with the wafer 100 in the positioning groove 21 (see FIG. Figure 4 ) of the area to be inspected, the camera 8 can be used to inspect the wafer 100 (see Figure 4 ) is detected in the area to be detected.

[0022] Drive device 30 Figure 1, including a first linear module 61, a second linear module 62 and a third linear module 63. The three linear modules 61, 62 and 63 are all existing technologies. The three have the same structure but different lengths and directions. Take the first linear module 61 as an example: the first linear module 61 is a horizontal module in the left and right directions, installed at the rear of the base 1, which includes a screw nut drive mechanism 610 in the left and right directions and a first slide 611 installed on the screw nut drive mechanism 611, and also includes a first drive motor 612 that drives the screw nut drive mechanism 610. The first drive motor 612 drives the first slide 611 to slide left and right through the screw nut drive mechanism 610. The second linear module 62 is shorter than the first linear module 61 and is a vertical module. It is installed on the first slide 611 of the first linear module 61. The first linear module 61 is driven to connect to the second linear module 62 in this way, and can drive the second linear module 62 to move left and right. The third linear module 63 is shorter than the second linear module 62 and is a transverse module in the front-to-back direction. It is mounted on the second slide 621 of the second linear module 62. The second linear module 62 is connected to the third linear module 63 in this way, and can drive the third linear module 63 to move up and down. A mounting bracket 635 is mounted on the third slide 631 of the third linear module 63, and the camera 8 is mounted on the mounting bracket. The third linear module 63 is connected to the mounting bracket 635 and the camera 8 in this way, and can drive the mounting bracket 635 and the camera 8 to move forward and backward. The first linear module 61 serves as the first transverse drive mechanism. The operator controls the first drive motor 612 of the first linear module 61 to drive the first slide 611 to slide left and right. The first slide 611 indirectly drives the mounting bracket 635 and the camera 8 mounted on the mounting bracket 635 to move left and right through the second linear module 62 and the third linear module 63. The second linear module 62 serves as the vertical drive mechanism. The operator controls the second drive motor 622 of the second linear module 62 to drive the second slide 621 up and down. The second slide 621 indirectly drives the mounting frame 635 and the camera 8 mounted on it to move vertically up and down through the third linear module 63. The third linear module 63 serves as the second transverse drive mechanism. The operator controls the third drive motor 632 of the third linear module 63 to drive the third slide 631 forward and backward. The third slide 631 drives the mounting frame 635 and the camera 8 mounted on it to move horizontally forward and backward.

[0023] See Figure 1 、 Figure 3 and Figure 5Contaminants inevitably adhere to the top surface of the wafer 100. Therefore, the present device is equipped with an air blowing mechanism 9, which includes an existing air compressor 91 and an air blowing pipe 92. The air blowing pipe 92 is mounted on the mounting frame 635 and located in front of the camera 8. The drive device 30 is driven by the mounting frame 635 to connect to the air blowing pipe 92. The air blowing pipe 92 can move synchronously with the mounting frame 635 and the camera 8 under the drive of the drive device 30. The air compressor 91 is equipped with a positive pressure pipe 911, which is connected to the air blowing pipe 92. The positive pressure pipe 911 is equipped with a second valve 52 and an existing filter 55. The second valve 52 is normally closed. Before inspecting the wafer 100: first control the driving device 30 to drive the air blow pipe 92 to move horizontally to above the positioning groove 21 of the wafer carrier 2, so that the air blow pipe 92 is aimed downward at the top surface of the wafer 100; then open the second valve 52, let the air compressor 91 provide compressed gas to the air blow pipe 92, and use the air blow pipe 92 to blow the compressed gas toward the top surface of the wafer 100, blow away the contaminants on the top surface of the wafer 100, and blow the contaminants to the edge of the wafer 100. During this process, the filter 55 filters out impurities such as dust in the compressed gas to prevent the compressed air from bringing these impurities to the top surface of the wafer 100.

[0024] See Figure 2 、 Figure 4 and Figure 5 Four circumferentially arranged negative pressure suction ports 211 are formed on the side walls of the positioning groove 21. Four second negative pressure interfaces 32 are mounted on each of the four negative pressure suction ports 211. The negative pressure generator 4 is provided with a second negative pressure tube 42, which is connected to a first adapter 421. Four first connecting tubes 422 are connected to the first adapter 421, each connected to the four second negative pressure interfaces 32. A third valve 53 is mounted on the second negative pressure tube 42. After opening the second valve 52, the operator opens the third valve 53, allowing the negative pressure generator 4 to provide negative pressure to the second negative pressure interfaces 32 and thus to the negative pressure suction ports 211. The negative pressure suction ports 211 then remove contaminants blown onto the edge of the wafer 100, thereby removing these contaminants and reducing contamination of the wafer 100. After the contaminants are removed by the negative pressure suction ports 211, the operator closes the third valve 53 and the second valve 52 before inspecting the wafer 100.

[0025] See Figure 2 and Figure 4The top of the wafer carrier 2 is equipped with an annular fill light 24 that emits light upward. Also located above the fill light 24 is an annular reflector 25, which is tilted toward the inside of the positioning groove 21. When ambient light is dim, the operator turns on the fill light 24 on the top of the wafer carrier 2, directing it upward. The reflector 25 then reflects the light from the fill light 24 into the positioning groove 21. Because the fill light 24 does not illuminate the top surface of the wafer 100 directly, but instead provides indirect illumination through the reflector 25, the light emitted by the fill light 24 becomes softer after being reflected by the reflector 25, effectively reducing glare.

[0026] See Figure 1 and Figure 3 , four negative pressure suction cups 7 are mounted on the mounting frame 635 in parallel around the periphery, and the driving device 30 drives the four negative pressure suction cups 7 through the mounting frame 635. The four negative pressure suction cups 7 can move synchronously with the mounting frame 635, the camera 8 and the air blowing tube 92 under the drive of the driving device 30. Figure 5 The negative pressure generator 4 is provided with a third negative pressure tube 43, and the third negative pressure tube 43 is connected to a second adapter 431. The second adapter 431 is installed on the mounting frame 635, and is connected to four second connecting tubes 432, which are respectively connected to four negative pressure suction cups 7. A fourth valve 54 is provided at the third negative pressure tube 43. After the detection is completed, the operator closes the first valve 51 and opens the fourth valve 54, and controls the driving device 30 to drive the negative pressure suction cup 7 as follows: first, the negative pressure suction cup 7 is driven to move horizontally until the negative pressure suction cup 7 is downwardly aligned with the wafer 100 placed in the positioning groove 21, and then the negative pressure suction cup 7 is driven to move downward until the negative pressure suction cup 7 sucks the wafer 100 downward, and then the negative pressure suction cup 7 is driven to move upward to suck away the wafer 100, thereby bringing the wafer 100 to the top of the wafer carrier 2, and finally, the negative pressure suction cup 7 is driven to move to the lower left side to move the wafer 100 to the left side of the wafer carrier 2, as shown in FIG. Figure 6 In this state, the operator closes the fourth valve 54 and can remove the wafer 100.

[0027] The above is only an embodiment of the present invention and does not limit the scope of patent protection. Those skilled in the art can make non-substantial changes or substitutions based on the present invention and still fall within the scope of patent protection.

Claims

1. A decontamination wafer inspection device comprising a wafer carrier having circular positioning slots for positioning wafers, an air blowing mechanism for blowing away contaminants on the top surface of the wafer, and a camera for inspecting the wafer, the device comprising: A negative pressure suction port for sucking away pollutants from the wafer edge is provided on the side wall of the positioning groove.

2. The wafer inspection device according to claim 1, wherein: The utility model comprises a negative pressure generator which provides negative pressure for the negative pressure sewage suction port.

3. The wafer inspection device according to claim 1, wherein: There are multiple negative pressure sewage suction ports arranged in parallel in the circumferential direction.

4. The wafer inspection device according to claim 1, wherein: The top of the wafer carrier is provided with an upward-emitting fill light and a reflector that reflects the light emitted by the fill light into the positioning groove.

5. The wafer inspection device according to claim 4, wherein: The fill light and reflector are both ring-shaped.

6. The wafer inspection device according to claim 1, wherein: A negative pressure suction cup and a vertical driving mechanism driving the negative pressure suction cup are provided. The negative pressure suction cup is downwardly aligned with the positioning groove. The vertical driving mechanism drives the negative pressure suction cup downward to suck away the wafer placed in the positioning groove.

7. The wafer inspection device according to claim 6, wherein: It includes a lateral driving mechanism for driving the negative pressure suction cup to move lateraly.

8. The wafer inspection device according to claim 7, wherein: The transverse drive mechanism includes a first transverse drive mechanism in the left and right direction, which is driven and connected to the vertical drive mechanism; and / or the transverse drive mechanism includes a second transverse drive mechanism in the front and back direction, which is driven and connected to the second transverse drive mechanism, which is driven and connected to the negative pressure suction cup and the camera.

9. The wafer inspection device according to claim 1, wherein: The carrier plate is specifically a negative pressure adsorption plate, and negative pressure adsorption holes for adsorbing wafers are opened on the bottom wall of the positioning groove.

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