Inverted optical communication transmitting side assembly
Through the flip process, the laser chip is directly soldered to the PCBA board, which solves the problem of signal bandwidth reduction caused by formal connections, and achieves efficient photoelectric signal transmission and cost reduction.
Patent Information
- Application Number
- CN202422839627.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-11-20
AI Technical Summary
In the field of optical fiber communication, the wire bond connection of formal optical transmitting devices introduces parasitic capacitors and inductors, resulting in a reduced signal bandwidth, affecting device performance, and is complex in process and high in cost.
The flip-up process is adopted to directly solder the laser chip to the PCBA board, reduce gold wire connection, fix it using solder balls and heat dissipation glue, and combine convergence lenses and thermistors for photoelectric signal transmission and temperature control.
Reduces high-frequency signal loss, improves device performance, reduces material and packaging costs, and simplifies process flow.
Smart Images
Figure CN223259929U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical fiber communication, in particular to an inverted optical communication emission side component. Background Art
[0002] Currently, in the field of fiber-optic communications, the chips used for optical transmitters in active optical devices are typically mounted using a well-established process with stable performance. However, this process requires wire bonds to connect the electrical and optical chips. However, wire bonds introduce unpredictable parasitic capacitance and inductance, reducing the system's transmission signal bandwidth and, in turn, impacting device performance. Therefore, improvements are needed. Utility Model Content
[0003] The purpose of the utility model is to provide a flip-chip optical communication transmitting side component, which adopts a flip-chip process to directly weld the laser chip to the PCBA board, thereby reducing the high-frequency signal loss of the gold wire and improving the device performance. At the same time, since some gold wires and the process of welding the patch and gold wires are eliminated, the material and packaging costs are reduced, and the utility model has strong practicality.
[0004] In order to achieve the above objectives, the following technical solutions are adopted:
[0005] A flip-chip optical communication transmitting-side component comprises a tube shell, a cooler mounted at one end of the tube shell, a heat sink arranged on the cooler, a PCBA board arranged in the tube shell and located above the heat sink, and a laser chip connected to the bottom of the PCBA board; the laser chip is bonded to the heat sink with heat dissipation glue; an optical fiber assembly is also mounted at the other end of the tube shell corresponding to the laser chip; a converging lens is also mounted on the heat sink, located on the light output path of the laser chip, and is used to converge light emitted by the laser chip into the optical fiber assembly; a thermistor connected to the cooler is also mounted on the heat sink.
[0006] Furthermore, the laser chip is soldered to the bottom of the PCBA board via solder balls.
[0007] Furthermore, the bottom of the PCBA board is also connected to a flip-up loading board, and the laser chip is soldered to the flip-up loading board via solder balls and connected to the PCBA board.
[0008] Furthermore, the solder ball is made of gold, silver, or tin.
[0009] Furthermore, the diameter of the solder ball is between 15 and 50 μm.
[0010] Furthermore, the thermal conductivity of the heat dissipation glue is between 2.5 and 20 W / mK.
[0011] Furthermore, there are four laser chips, and a converging lens is arranged on the light output path of each laser chip.
[0012] By adopting the above solution, the beneficial effects of the utility model are:
[0013] The utility model adopts a flip-chip process to directly weld the laser chip to the PCBA board, thereby reducing the high-frequency signal loss of the gold wire and improving the device performance. At the same time, since some gold wires and the process of welding the patch and gold wires are eliminated, the material and packaging costs are reduced, and the practicality is strong. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic structural diagram of one embodiment of the present invention;
[0015] Figure 2 for Figure 1 A brief schematic diagram of
[0016] Figure 3 This is a structural diagram of another embodiment of the present invention (omitting the tube shell and PCBA board);
[0017] Figure 4 for Figure 3 A brief schematic diagram of
[0018] The accompanying drawings illustrate:
[0019] 1. Tube shell; 2. Refrigerator; 3. Heat sink; 4. PCBA board; 5. Laser chip; 6. Heat dissipation glue; 7. Fiber optic assembly; 8. Converging lens; 9. Thermistor; 10. Inverted loading board. DETAILED DESCRIPTION
[0020] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0021] Reference Figures 1 to 4 As shown, the utility model provides a flip-chip optical communication transmitting-side component. In one embodiment, it includes a tube shell 1, a refrigerator 2 installed at one end of the tube shell 1, a heat sink 3 arranged on the refrigerator 2, a PCBA board 4 arranged in the tube shell 1 and located above the heat sink 3, and a laser chip 5 connected to the bottom of the PCBA board 4; the laser chip 5 is bonded to the heat sink 3 through a heat dissipation glue 6; an optical fiber assembly 7 is further installed at the other end of the tube shell 1 corresponding to the laser chip 5; a converging lens 8 is further installed on the heat sink 3, and the converging lens 8 is located on the light output path of the laser chip 5. The converging lens 8 is used to converge the light emitted by the laser chip 5 into the optical fiber assembly 7; the heat sink 3 is also installed with a thermistor 9 connected to the refrigerator 2.
[0022] Continue to refer to Figures 1 to 4 As shown, in this embodiment, the tube shell 1 is used to fix the overall optical device assembly and the PCBA board 4 (the PCBA board 4 has a laser driver and DSP for signal processing). In this embodiment, four laser chips 5 are provided, and a converging lens 8 is arranged on the light output path of each laser chip 5. The transmission rate is 800Gbps, that is, a total of four channels, each channel is 200Gbps, and the wavelength is 1310nm; the laser chip 5 is bonded to the heat sink 3 through the heat dissipation glue 6, the heat dissipation glue 6 is used for heat dissipation, the optical fiber assembly 7 is used for coupling the laser, the refrigerator 2 is used for laser temperature control, and the thermistor 9 is used for laser temperature monitoring; the heat sink 3, that is, the COC heat sink, is used to support and dissipate heat from the laser array; the converging lens 8 is used to couple the light emitted by the laser chip 5 to the optical fiber assembly 7.
[0023] For the optical path part, such as Figure 1 As shown, the laser chip 5 emits Gaussian light of a specific wavelength, which is then converged by a converging lens 8 and incident on the optical fiber assembly 7. For the circuit portion, the PCBA board 4 has a metallized pattern with a specific impedance. The laser chip 5 is soldered to the PCBA board 4 via a flip chip (a flip chip is a pinless structure that generally contains circuit units and is designed to be soldered to the PCBA board 4 via an appropriate number of solder balls (covered with conductive adhesive and electrically and mechanically connected to the circuit) located on its surface.
[0024] In this embodiment, during packaging, the cooler 2, thermistor 9, and optical fiber assembly 7 are first fixed to the tube shell 1 through epoxy patching and baking; then, the laser chip 5 is soldered to the PCBA board 4 through Flipchip, and then the above two semi-finished products are glued together with glue and fixed by baking; then, the laser and COC heat sink are injected with heat dissipation glue 6, and finally, a converging lens 8 is used for coupling (the converging lens 8 is fixed using UV glue).
[0025] In addition, in another embodiment, Figures 3 to 4As shown, the bottom of the PCBA board 4 is also connected to a flip loading board 10, and the laser chip 5 is soldered to the flip loading board 10 via solder balls and connected to the PCBA board 4. In this embodiment, a flip loading board 10 is provided for high-frequency signal transmission and overall structural support. During packaging, the cooler 2, thermistor 9, and the optical fiber assembly 7 are first fixed to the tube shell 1 through epoxy patching and baking; then, the flip loading board 10 is reflow soldered to the PCBA board 4; then, the laser chip 5 is soldered to the flip loading board 10 via flip chip, and then the two semi-finished products are glued together and fixed by baking; then, the laser and COC heat sink are injected with heat dissipation glue 6, and finally, a converging lens 8 is used for coupling (the converging lens 8 is fixed using UV glue).
[0026] In one embodiment, the solder ball is made of gold, silver, or tin; the diameter of the solder ball is between 15 and 50 μm; and the thermal conductivity of the heat dissipation glue 6 is between 2.5 and 20 W / mK.
[0027] In summary, the present invention adopts a flip-chip process to directly solder the laser chip 5 to the PCBA board 4, thereby reducing the high-frequency signal loss of the gold wire and improving the device performance. At the same time, since some gold wires and the process of soldering the patch and gold wire are reduced, the material and packaging costs are reduced, and the practicality is strong.
[0028] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A flip-chip optical communication transmitting side component, characterized in that: The device comprises a tube shell, a cooler installed at one end of the tube shell, a heat sink arranged on the cooler, a PCBA board arranged in the tube shell and located above the heat sink, and a laser chip connected to the bottom of the PCBA board; the laser chip is bonded to the heat sink with heat dissipation glue; an optical fiber assembly is also installed at the other end of the tube shell corresponding to the laser chip; a converging lens is also installed on the heat sink, which is located on the light output path of the laser chip and is used to converge the light emitted by the laser chip into the optical fiber assembly; a thermistor connected to the cooler is also installed on the heat sink.
2. The flip-chip optical communication transmitting-side component according to claim 1, characterized in that: The laser chip is soldered to the bottom of the PCBA board via solder balls.
3. The flip-chip optical communication transmitting-side component according to claim 1, characterized in that: The bottom of the PCBA board is also connected to a flip-up loading board, and the laser chip is soldered to the flip-up loading board through solder balls and connected to the PCBA board.
4. The flip-chip optical communication transmitting-side component according to claim 2 or 3, characterized in that: The solder balls are made of gold, silver, or tin.
5. The flip-chip optical communication transmitting-side component according to claim 4, characterized in that: The diameter of the solder ball is between 15 and 50 μm.
6. The flip-chip optical communication transmitting-side component according to claim 5, characterized in that: The thermal conductivity of the heat dissipation glue is between 2.5 and 20 W / mK.
7. The flip-chip optical communication transmitting-side component according to claim 1, characterized in that: There are four laser chips, and a converging lens is arranged on the light output path of each laser chip.