Optical path wave combining chip structure

Abstract

The utility model discloses an optical path wave combining chip structure. The optical path wave combining chip structure comprises an optical path wave combining module, an emergent light reflecting element and a pair of light sources, the optical path wave combining module comprises a polarization light splitting element which is provided with a light splitting interface; each optical isolation unit comprises a polaroid, a phase delay element, a reflection optical element and a Faraday optical rotation sheet which are arranged along an incident light path; and the third phase delay element and the third reflection optical element are arranged along a reflection light path of the light splitting interface. The optical path wave combining chip is wide in application range, has the function of an optical isolator, can be miniaturized, and can meet the requirements of conventional TO-CAN packaging.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical path combining chip structure. Background Art

[0002] Optical combiners are used to combine optical signals from different optical paths into one optical signal and output it. Currently, the most widely used high-speed optical communication optical combiners are of the following three types: (1) Z-block-based optical combiners, which are obtained by butterfly packaging or box packaging of Z-blocks. These optical combiners have the disadvantages of high cost, complex process, and difficulty in miniaturization; (2) Arrayed waveguide grating (AWG)-based optical combiners, which have strict requirements on wavelength selection, high insertion loss, and are also difficult to miniaturize; (3) Filter-based optical combiners, which are large in size and also difficult to miniaturize.

[0003] To meet the requirements of conventional TO-CAN packaging, the size of the optical combiner chip needs to be significantly reduced, but current optical combiner chips are unable to meet this requirement. Utility Model Content

[0004] The purpose of this application is to provide an optical path combining chip structure, which can be miniaturized and meet the requirements of conventional TO-CAN packaging.

[0005] The present application provides an optical path combining chip structure, including an optical path combining module, an output light reflecting element, and a pair of light source components; wherein the optical path combining module further includes:

[0006] a polarization beam splitting element having a beam splitting interface;

[0007] Two optical isolation units are arranged on either side of the polarization beam splitter, each comprising: a polarizer, a phase delay element, a reflective optical element, and a Faraday rotator arranged along the incident light path; the phase delay element and the reflective optical element are used to modulate the incident polarized light; and the reflective optical elements in the two optical isolation units are used to direct the respective incident polarized lights to opposite sides of the beam splitting interface.

[0008] a third phase delay element and a third reflective optical element arranged along a reflective optical path of the beam splitting interface, the third reflective optical element being used to reflect the reflected polarized light from the beam splitting interface back to the beam splitting interface, and the third phase delay element being used to modulate the incident reflected polarized light;

[0009] A pair of light source components is used to generate incident polarized light and respectively enter the two light isolation units;

[0010] The combined wave of the two optical isolation units is output to the output light reflection element.

[0011] In some specific embodiments, the two optical isolation units are symmetrically arranged on both sides of the polarization beam splitting element.

[0012] In some specific embodiments, the deflection angle of the reflective optical elements in the two light isolation units is 80° to 100°.

[0013] In some embodiments, the reflective optical element is a reflective prism.

[0014] In some specific embodiments, the phase delay element is a half-wave plate, and the optical rotation angle of the Faraday rotator is configured to be 45°.

[0015] In some specific embodiments, the polarizer, phase delay element, and reflective optical element in each optical isolation unit are sequentially laminated and arranged along the second direction, wherein the reflective optical element and Faraday rotator in one optical isolation unit are laminated and arranged along the first direction, and the reflective optical element and Faraday rotator in the other optical isolation unit are laminated and arranged in the opposite direction of the first direction; and the Faraday rotators in the two optical isolation units are respectively laminated and arranged on both sides of the polarization beam splitting element; and the angle between the first direction and the second direction is 80° to 100°.

[0016] In some specific embodiments, the reflective optical element is a reflective prism, and the phase delay element and the Faraday rotator in each optical isolation unit are respectively arranged to fit two right-angled surfaces of the reflective optical element.

[0017] In some embodiments, the polarization angle of the third reflective optical element is 180°.

[0018] In some specific embodiments, the third reflective optical element is a high-reflection mirror or a high-reflection film.

[0019] In some specific embodiments, the third phase delay element is a quarter wave plate.

[0020] In some specific embodiments, the polarization beam splitting element is a PBS prism.

[0021] In some specific embodiments, the optical path combining chip structure further includes a base, and the polarization splitting element, the two optical isolation units, the third phase delay element, and the third reflective optical element are all disposed on the base.

[0022] In some specific embodiments, the output light reflecting element is a reflecting prism.

[0023] In some specific embodiments, the light sources in a pair of light source assemblies are both laser light sources; further, the light source of one light source assembly is an EML laser, and the light source of the other light source assembly is a DFB laser.

[0024] In some specific embodiments, the optical path combining chip structure further includes a pair of collimating optical elements, which are respectively disposed at the light emitting front ends of a pair of light source assemblies to collimate the generated incident polarized light.

[0025] In some specific embodiments, the collimating optical element is a collimating lens made of silicon.

[0026] In some specific embodiments, the optical path combining chip structure further includes a packaging base, and the optical path combining module, the output light reflecting element and a pair of light source components are arranged on the packaging base; further, the packaging base is a TO62 base.

[0027] In some specific embodiments, a pair of light source assemblies each includes a light source, a heater, and an optical signal detection element. The light source and the optical signal detection element are arranged on the heater, and the optical signal detection element is used to monitor the working status of the light source.

[0028] In some embodiments, the light signal detecting element selects the backlight PD.

[0029] In some specific embodiments, a temperature detection element is further included for detecting the operating temperature of the optical path combining chip.

[0030] In some specific implementations, a cooler is further included that is installed at the rear end of the optical path combining module.

[0031] In some specific implementations, a capacitive filter for filtering interference signals is further included.

[0032] Compared with the prior art, this application has the following advantages and beneficial effects:

[0033] 1. The optical combiner chip of this application can realize unidirectional transmission of optical signals and reverse blocking, and has the function of optical isolator;

[0034] 2. The optical path combining chip of the present application is applicable to a wide wavelength range and can be used within the effective working wavelength range of the polarization splitter element and the Faraday rotator.

[0035] 3. This application can achieve reverse or near-reverse light output through optical path adjustment, that is, the direction of the incident light is opposite or nearly opposite to that of the outgoing light; compared with the current optical path combiner device with forward light output, the reverse or near-reverse light output is conducive to optical path folding, which enables the miniaturization of the optical path combiner module and can meet the requirements of conventional TO-CAN packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0037] Figure 1 This is a structural diagram of the optical path combining module in an embodiment of the present application;

[0038] Figure 2 for Figure 1 A 3D perspective view of the mid-path multiplexing module;

[0039] Figure 3 This is a schematic diagram of the optical transmission path of the first optical isolation unit in an embodiment of the present application;

[0040] Figure 4 This is a schematic diagram of the optical transmission path of the second optical isolation unit in an embodiment of the present application;

[0041] Figure 5 Schematic diagram of the structure of the optical path combining chip in this embodiment;

[0042] Figure 6 This is a schematic diagram of the optical transmission path of the optical combiner chip in this embodiment;

[0043] Figure 7 Schematic diagram of the three-dimensional structure of the optical path combining chip in this embodiment.

[0044] Reference numerals: optical path combining module 100, polarization beam splitter 110, light exit surface 110a, beam splitting interface 111; first polarizer 121, first light input surface 121a, first phase delay element 122, first reflective optical element 123, first Faraday rotator 124, magnetic block 125; second polarizer 131, second light input surface 131a, second phase delay element 132, second reflective optical element 133, second Faraday rotator 134; third phase delay element 140, third reflective optical element Optical element 150, base 160; output light reflecting element 200, first light source assembly 300a, first light source 310a, first heat 320a, first optical signal detection element 330a, second light source assembly 300b, second light source 310b, second heat 320b, second optical signal detection element 330b, first collimating optical element 400a, second collimating optical element 400b, packaging base 500, temperature detection element 600, filter 700, refrigerator 800, terminal 900. DETAILED DESCRIPTION

[0045] The following will be combined with the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0046] Figures 3-4 The figure shows a schematic diagram of the optical path combining module of the embodiment of the present application from a top view angle. Figures 3-4 Mark the XY rectangular coordinate system, and record the positive and negative directions of the X axis as "right" and "left" respectively, and the positive and negative directions of the Y axis as "back" and "front" respectively. Figures 1 to 4 The structure and working principle of the optical path combining module in the embodiment of the present application are first described in detail.

[0047] In this embodiment, the optical path combining module includes a base 160, and a polarization splitting element 110, a first optical isolation unit, a second optical isolation unit, a third phase delay element 140 and a third reflective optical element 150 arranged on the base 160; the base 160 can optionally be a ceramic base.

[0048] Polarization beam splitter 110 has a beam splitting interface 111 that reflects polarized S light and transmits polarized P light. Beam splitting interface 111 is tilted relative to both the X-axis and the Y-axis. In this embodiment, the angles between beam splitting interface 111 and the positive directions of both the X-axis and the Y-axis are 45°. A light exit surface 110a is provided at the front end of polarization beam splitter 110, and the combined light is output from light exit surface 110a. A PBS prism can be used as a specific embodiment of polarization beam splitter 110.

[0049] The two optical isolation units are respectively designated as a first optical isolation unit and a second optical isolation unit, and are disposed on either side of the polarization beam splitter element 110. In the embodiment of the present application, the first optical isolation unit and the second optical isolation unit are symmetrically disposed on either side of the polarization beam splitter element 110. The first optical isolation unit and the second optical isolation unit respectively receive a first incident polarized light and a second incident polarized light, which are directed toward the first and second surfaces of the beam splitter interface 111 in relative directions. During the process of directing the first and second incident polarized lights toward the beam splitter interface 111, the two optical isolation units also convert the polarization states of the first and second incident polarized lights into polarized S light, which then reaches the beam splitter interface 111 as polarized S light and is reflected therefrom.

[0050] In the present application, both the first incident polarized light and the second incident polarized light arrive at the beam splitter interface 111 as polarized S light and are reflected by the first and second surfaces of the beam splitter interface 111, respectively, to form two reflected light paths. A third phase delay element 140 and a third reflecting optical element 150 are sequentially arranged on one of the reflected light paths. In this embodiment, a third phase delay element 140 and a third reflecting optical element 150 are sequentially arranged on the reflected light path of the second surface of the beam splitter interface 111. The reflected polarized light reflected by the second surface passes through the third phase delay element 140, the third reflecting optical element 150, and the third phase delay element 140 in sequence, and then returns to the second surface of the beam splitter interface 111. During this process, the third phase delay element 140 rotates the polarization plane of the reflected polarized light twice, converting the reflected polarized light into polarized P light. The reflected polarized light then returns to the second surface of the beam splitter interface 111 as polarized P light and passes through the beam splitter interface 111. The third phase retarder 140 has an optical rotation angle configured to rotate the polarization plane of the reflected polarized light twice, converting the reflected polarized light into polarized P light. Specifically, the third phase retarder 140 can be a quarter-wave plate. The third reflective optical element 150 can be a highly reflective mirror or film, which deflects the direction of travel of the reflected polarized light by 180°.

[0051] In the present application, the first optical isolation unit and the second optical isolation unit primarily serve to transmit incident polarized light and isolate light. In this embodiment, the first optical isolation unit includes a first polarizer 121, a first phase retarder 122, a first reflective optical element 123, and a first Faraday rotator 124, arranged along the first incident optical path L1. The first polarizer 121 has the same polarization direction as the first incident polarized light. The first reflective optical element 123 is used to direct the first incident polarized light toward the first surface of the beam splitting interface 111. The first phase retarder 122 and the first Faraday rotator 124 are used to rotate the polarization planes of the first incident polarized light and the backward transmitted light. The rotation angles of the first phase retarder 122 and the first Faraday rotator 124 are configured such that the first incident polarized light reaches the beam splitting interface 111 as S-polarized light and the backward transmitted light reaches the first polarizer 121 in a direction perpendicular to the polarization direction of the first polarizer 121. Backward propagating light is a beam of light that propagates in the opposite direction in the optical path and can adversely affect the light source, etc. In this application, the backward propagating light that reaches the first polarizer 121 is unable to pass through the first polarizer 121 because its polarization direction is perpendicular to that of the first polarizer 121, thereby achieving optical path isolation.

[0052] The second optical isolation unit has the same structure as the first optical isolation unit and includes a second polarizer 131, a second phase delay element 132, a second reflective optical element 133, and a second Faraday rotator 134 arranged along the second incident light path L2. The structure and principle of the second optical isolation unit are the same as those of the first optical isolation unit and are not further described here.

[0053] In a magnetic field, the first Faraday rotator 124 and the second Faraday rotator 134 can rotate the polarization plane of polarized light. In this embodiment, magnets are used to generate the magnetic field. For example, a magnetic block can be disposed at the top of each of the first and second Faraday rotators 124 and 134. Alternatively, a magnetic block 125 can be disposed at the top of each of the first and second Faraday rotators 124 and 134, spanning the first and second Faraday rotators 124 and 134.

[0054] In this embodiment, the first reflective optical element 123 and the second reflective optical element 133 are used to deflect the direction of the incident polarized light by 80° to 100°, so that the deflected incident polarized light is incident on two opposite sides of the light splitting interface 111. The first reflective optical element 123 and the second reflective optical element 133 can be specifically selected from reflective prisms.

[0055] In the first and second optical isolation units, first incident polarized light enters from the first light input surface 121a at the front end of the first polarizer 121, and second incident polarized light enters from the second light input surface 131a at the front end of the second polarizer 131. The first and second phase delay elements 122 and 132 are used to rotate the polarization plane of the incident polarized light. The first and second reflective optical elements 123 and 133 are used to change the direction of travel of the polarized light by reflection. The first and second Faraday rotators 124 and 134 are used to rotate the polarization plane of the incident polarized light again, converting the polarized light into S-polarized light, which then reaches both sides of the beam splitting interface 111.

[0056] In this embodiment, a possible specific layout of the optical path combining module is as follows:

[0057] The second reflective optical element 133, the second Faraday rotator 134, the polarization beam splitter 110, the first Faraday rotator 124, and the first reflective optical element 123 are sequentially laminated along a first direction; the first polarizer 121, the first phase retarder 122, and the first reflective optical element 123 are sequentially laminated along a second direction; and the second polarizer 131, the second phase retarder 132, and the second reflective optical element 133 are sequentially laminated along the second direction. The angle between the first direction and the second direction is 80° to 100°. In this embodiment, the first and second directions are the positive directions of the X and Y axes, and the angle between them is 90°. Selecting a 90° angle facilitates manufacturing and reduces size.

[0058] When the first reflective optical element 123 and the second reflective optical element 133 are reflective prisms, the first Faraday rotator 124 and the first phase retarder 122 are respectively arranged to mate with two right-angled surfaces of the first reflective optical element 123 , and the second Faraday rotator 134 and the second phase retarder 132 are respectively arranged to mate with two right-angled surfaces of the second reflective optical element 133 .

[0059] The working principle of the optical path combining module of the present application will be provided below in conjunction with embodiments.

[0060] In this embodiment, the first phase delay element 122 and the second phase delay element 132 are half-wave plates, which are used to rotate the polarization plane of polarized light 45° counterclockwise. The first Faraday rotator 124 and the second Faraday rotator 134 have a rotation angle of 45°, which is used to rotate the polarization plane of polarized light 45° counterclockwise. The first reflective optical element 123 and the second reflective optical element 133 are reflective prisms.

[0061] The first incident polarized light, denoted as λ1, is horizontally polarized P light. The polarization direction of the first polarizer 121 is the same as that of the incident polarized light λ1. The incident polarized light λ1 is input from the first light input surface 121a at the front end of the first polarizer 121, travels along the positive Y-axis, and reaches the first phase retarder 122. The first phase retarder 122 rotates the polarization plane of the polarized light 45° counterclockwise. The polarized light then passes through the first reflective optical element 123, changing its direction of travel to the negative X-axis. The first Faraday rotator 124 rotates the polarization plane of the polarized light 45° counterclockwise, converting it into horizontally polarized S light. The horizontally polarized S light is incident from the right side of the polarization splitter 110 on the first surface of the beam splitter interface 111. After reflection from the beam splitter interface 111, it is output from the light exit surface 110a at the front end of the polarization splitter 110, producing the first exit light. The first exit light is horizontally polarized S light with a polarization direction opposite to that of the incident polarized light λ1.

[0062] The second incident polarized light, denoted as λ2, is horizontally polarized P light. The polarization direction of the second polarizer 131 is the same as that of the incident polarized light λ2. The incident polarized light λ2 is input from the second light input surface 131a at the front end of the second polarizer 131, travels along the positive Y-axis, and reaches the second phase delay element 132. The second phase delay element 132 rotates the polarization plane of the polarized light 45° counterclockwise. After passing through the second reflective optical element 133, the polarized light changes its direction of travel to the positive X-axis. The second Faraday rotator 134 rotates the polarization plane of the polarized light by another 45° counterclockwise, converting the horizontally polarized P light into horizontally polarized S light. The horizontally polarized S light is incident on the second surface of the beam splitting interface 111 from the left side of the polarization beam splitter 110, is reflected by the beam splitting interface 111, and travels in the positive direction along the Y axis to the third phase delay element 140. The third phase delay element 140 converts the circularly polarized light into circularly polarized light. The third reflective optical element 150 is used to deflect the traveling direction of the circularly polarized light by 180°, and then returns to the third phase delay element 140. The circularly polarized light is converted into linearly polarized P light, which is incident on the second surface of the beam splitting interface 111 from the rear end of the polarization beam splitter 110, passes through the beam splitting interface 111, and is output from the light exit surface 110a at the front end of the polarization beam splitter 110 to obtain a second output light. The second output light is horizontally polarized P light with a direction opposite to that of the incident polarized light λ2.

[0063] When external reflected light enters, backward propagation light is generated. The polarization state of the backward propagation light is random and can be decomposed into polarized S light and polarized P light. The polarized S light is reflected by the first surface of the beam splitting interface 111 and enters the first optical isolation unit in the reverse direction. The first Faraday rotator 124 rotates the reverse polarized S light counterclockwise by 45°. The first reflective optical element 123 guides the light to the first phase delay element 122, which rotates the light clockwise by 45°, offsetting the rotation of the first Faraday rotator 124. The reverse polarized S light then reaches the first polarizer 121 in its original state. At this point, the polarized S light is perpendicular to the polarization direction of the first polarizer 121, thereby achieving optical isolation.

[0064] The polarized P light in the backward transmitted light passes through the first surface of the splitter interface 111 and enters the third phase delay element 140. The third phase delay element 140 converts it into polarized S light. The third reflective optical element 150 guides it to the second surface of the splitter interface 111 again, and it is reflected by the second surface of the splitter interface 111 and enters the second optical isolation unit in the opposite direction. The second optical isolation unit implements optical isolation on it. The principle is the same as that of the first optical isolation unit, which will not be repeated here.

[0065] The horizontally polarized S light reflected by the first surface of the beam splitting interface 111 and the horizontally polarized P light transmitted through the second surface of the beam splitting interface 111 are combined with each other and output from the light output surface 110 a of the polarization beam splitting element 110 .

[0066] In the above embodiment, horizontally polarized P light is input, and completely orthogonal horizontally polarized P light and horizontally polarized S light are output, which can be applied to polarization multiplexing optical communication transmission.

[0067] In the above-mentioned embodiments, the optical path design was redesigned using a polarization beam splitter, a phase delay element (e.g., a half-wave plate or a quarter-wave plate), a reflective optical element, and a Faraday rotator, achieving reverse light output, where the incident polarization and the outgoing polarization are opposite. While existing optical combiner devices mostly output light in the forward direction, reverse light output allows for optical path folding, providing a foundation for significantly reducing the size of optical combiner modules and chips, enabling miniaturization of optical combiner modules.

[0068] The size of the optical path combining module in the above embodiment can be controlled to 2.5mm*1.3mm, which is fully applicable to conventional TO-CAN packaging.

[0069] The above optical path combining module can be applied to the optical path combining chip. Figures 5-7 , shown is the optical path combining chip of this embodiment, which mainly includes a package base 500, and an optical path combining module 100, an output light reflecting element 200, a first light source 310a, and a second light source 310b arranged on the package base 500. The first light source 310a and the second light source 310b are used to generate a first incident polarized light and a second incident polarized light, respectively. The optical path combining module 100 is used to combine optical signals. The output light reflecting element 200 is used to change the direction of the output light after the combination, so that it travels in a specific direction. In this embodiment, the package base 500 is a TO62 base; the output light reflecting element 200 is a 45-degree surface reflecting prism, which is arranged at the axis of the TO62 base. The first light source 310a and the second light source 310b are both laser light sources. Specifically, the first light source 310a is an EML laser, and the second light source 310b is a DFB laser.

[0070] First and second collimating optical elements 400a and 400b are respectively disposed at the front ends of the first and second light sources 310a and 310b to collimate the incident polarized light generated by the first and second light sources 310a and 310b. In this embodiment, the first and second collimating optical elements 400a and 400b are collimating lenses made of silicon.

[0071] In this embodiment, the first light source 310a and the second light source 310b are the core components of the first light source assembly 300a and the second light source assembly 300b. Furthermore, the first light source assembly 300a also includes a first core 320a and a first optical signal detection element 330a. The first core 320a is a highly thermally conductive ceramic substrate. The first light source assembly 300a and the first optical signal detection element 330a are disposed on the first core 320a. The first optical signal detection element 330a monitors the operating status of the first light source 310a by detecting optical signals.

[0072] Similarly, the second light source assembly 300b also includes a second heater 320b and a second optical signal detection element 330b. The second heater 320b is a high thermal conductivity ceramic base board. The second light source assembly 300b and the second optical signal detection element 330b are arranged on the second heater 320b. The second optical signal detection element 330b monitors the working status of the second light source 310b by detecting optical signals.

[0073] In this embodiment, the first optical signal detecting element 330a and the second optical signal detecting element 330b are respectively disposed behind the first light source 310a and the second light source 310b; the first optical signal detecting element 330a and the second optical signal detecting element 330b both select the backlight PD.

[0074] In this embodiment, a temperature detection element 600, such as a thermistor, is installed on the package base 500 to detect the operating temperature of the optical path combining chip; a capacitor filter 700 is installed on the package base 500 to filter high-frequency interference signals; a cooler 800, such as a TEC semiconductor cooler, is installed at the rear end of the optical path combining module 100 to cool the optical path combining module 100; a plurality of terminals 900 are provided on the package base 500, and the terminals 900 are gold wire bonding terminals, which are used to provide circuit driving, signal acquisition, and other functions for the chip components.

[0075] The working principle of the above-mentioned optical path combining chip is: the first light source 310a and the second light source 310b generate lasers, which are collimated by the first collimating optical element 400a and the second collimating optical element 400b, and enter the optical path combining module 100 from the first light input surface 121a and the second light input surface 131a respectively. After being combined by the optical path combining module 100, they are output from the light output surface 110a to the output light reflecting element 200, reflected by the output light reflecting element 200, and emitted in a direction perpendicular to the packaging base 500.

[0076] Note that the above are only preferred embodiments of the present application and the technical principles employed. Those skilled in the art will understand that the present application is not limited to the specific embodiments herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the scope of protection of the present application, all of which fall within the scope of protection of the present application.

Claims

1. An optical path combining chip structure, characterized by: It includes an optical path combining module, an output light reflecting element and a pair of light source components; The optical path combining module further comprises: a polarization beam splitting element having a beam splitting interface; Two optical isolation units are respectively arranged on both sides of the polarization beam splitting element, each optical isolation unit includes: a polarizer, a phase delay element, a reflective optical element, and a Faraday rotator arranged along the incident light path; the phase delay element and the reflective optical element are used to modulate the incident polarized light; the reflective optical elements in the two optical isolation units are used to guide the respective incident polarized lights to the two sides of the beam splitting interface relative to each other; a third phase delay element and a third reflective optical element arranged along a reflective optical path of the beam splitting interface, the third reflective optical element being used to reflect the reflected polarized light from the beam splitting interface back to the beam splitting interface, and the third phase delay element being used to modulate the incident reflected polarized light; A pair of light source components is used to generate incident polarized light and respectively enter the two light isolation units; The combined wave of the two optical isolation units is output to the output light reflecting element.

2. The optical path combining chip structure according to claim 1, wherein: The deflection angle of the reflective optical elements in the two light isolation units is 80° to 100°.

3. The optical path combining chip structure according to claim 1, wherein: The phase delay element is a 1 / 2 wave plate, and the optical rotation angle of the Faraday rotator is configured to be 45°.

4. The optical path combining chip structure according to claim 1, wherein: The polarizer, phase delay element, and reflective optical element in each optical isolation unit are sequentially laminated and arranged along the second direction. The reflective optical element and Faraday rotator in one optical isolation unit are laminated and arranged along the first direction, while the reflective optical element and Faraday rotator in the other optical isolation unit are laminated and arranged in the opposite direction to the first direction. The Faraday rotators in the two optical isolation units are respectively laminated and arranged on both sides of the polarization beam splitting element. The angle between the first direction and the second direction is 80° to 100°.

5. The optical path combining chip structure according to claim 4, wherein: The reflective optical element is a reflective prism, and the phase delay element and the Faraday rotator in each optical isolation unit are respectively arranged in contact with two right-angled surfaces of the reflective optical element.

6. The optical path combining chip structure according to claim 1, wherein: The polarization angle of the third reflective optical element is 180°.

7. The optical path combining chip structure according to claim 6, wherein: The third reflective optical element is a high reflective mirror or a high reflective film.

8. The optical path combining chip structure according to claim 1, wherein: The third phase delay element is a quarter wave plate.

9. The optical path combining chip structure according to claim 1, wherein: The polarization beam splitting element is a PBS prism.

10. The optical path combining chip structure according to claim 1, wherein: The optical path combining module further includes a base, and the polarization beam splitting element, the two optical isolation units, the third phase delay element, and the third reflective optical element are all disposed on the base.

11. The optical path combining chip structure according to claim 1, wherein: The output light reflecting element is a reflecting prism.

12. The optical path combining chip structure according to claim 1, wherein: The light sources in the pair of light source assemblies are both laser light sources.

13. The optical path combining chip structure according to claim 12, wherein: In the pair of light source assemblies, the light source of one light source assembly is an EML laser, and the light source of the other light source assembly is a DFB laser.

14. The optical path combining chip structure according to claim 1, wherein: It also includes a pair of collimating optical elements, which are respectively arranged at the light emitting front ends of a pair of light source components and are used to collimate the generated incident polarized light.

15. The optical path combining chip structure according to claim 14, wherein: The collimating optical element is a collimating lens made of silicon.

16. The optical path combining chip structure according to claim 1, wherein: It also includes a packaging base, on which the optical path combining module, the output light reflecting element and a pair of light source components are arranged.

17. The optical path combining chip structure according to claim 16, wherein: The package base is a TO62 base.

18. The optical path combining chip structure according to claim 1, wherein: The light source components all include a light source, a heater and an optical signal detection element. The light source and the optical signal detection element are arranged on the heater, and the optical signal detection element is used to monitor the working status of the light source.

19. The optical path combining chip structure according to claim 18, wherein: The optical signal detecting element selects a backlight PD.

20. The optical path combining chip structure according to claim 1, wherein: It also includes a temperature detection element for detecting the operating temperature of the optical path combining chip.

21. The optical path combining chip structure according to claim 1, wherein: It also includes a cooler installed at the rear end of the optical path combining module.

22. The optical path combining chip structure according to claim 1, wherein: Also included is a capacitor filter for filtering interfering signals.

Images