Chip heat dissipation mounting seat

Abstract

The utility model provides a chip heat dissipation installation seat, especially relates to the chip installation technology field, and comprises a pedestal, the top of the pedestal is provided with a fixing groove, the inner side of the fixing groove is fixedly connected with a first pin in a penetrating manner, the outer side of the first pin is integrally molded with a clamping plate, and the top of the pedestal is provided with a chip body. The base is fixed on a circuit board through the first pin, then the second pin on the chip body is inserted into the fixing groove and is connected with one end of the first pin in an inserted mode, during insertion, the second pin is inserted between the first pin and the clamping plate, and the second pin is clamped through deformation of the clamping plate. In this way, the chip body can be quickly inserted and installed, then the insertion plates at the bottoms of the heat dissipation fins are inserted into the insertion grooves between the fixing frame and the base, it is guaranteed that insertion of the insertion grooves and the insertion plates is firmer and will not slip off at will through cooperation of the protruding blocks and the grooves, and the multiple protruding blocks are arranged and can adapt to chip bodies of different thicknesses.

Description

Technical Field

[0001] The utility model relates to the technical field of chip installation, in particular to a chip heat dissipation mounting seat. Background Art

[0002] Chip installation involves multiple steps, including chip placement, welding and testing to ensure that the chip can be correctly and stably installed on the circuit board and has good performance and reliability. When the chip is installed and used, it needs to be cooled to prevent damage and ensure its normal use, which requires a chip heat dissipation mount. Utility Model Content

[0003] The purpose of the present invention is to provide a chip heat dissipation mounting seat to solve the problem in the background art that when a chip is installed and used, it is necessary to dissipate heat to prevent damage and ensure normal use.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a chip heat dissipation mounting seat, comprising a base, a fixing groove is provided on the top of the base, a first pin is fixedly connected through the inner side of the fixing groove, a clamp is integrally formed on the outer side of the first pin, a chip body is provided on the top of the base, the chip body includes a second pin, the second pin is provided on the outer side of the chip body, a fixing frame is integrally formed on the outer side of the base, a slot is provided on the inner side of the fixing frame, a groove is provided on the inner side wall of the slot, an insert board is plugged into the inner side of the slot, a bump is integrally formed on the outer side of the insert board, and a heat dissipation fin is fixedly connected to the top of the insert board.

[0005] Preferably, the fixing grooves are provided in two groups, and each group of the fixing grooves is provided with four.

[0006] Preferably, two fixing frames are provided, and the two fixing frames are fixed on both sides of the base respectively, and the inner wall of the slot is adapted to the outer wall of the plug board.

[0007] Preferably, the protrusions are distributed at equal intervals on the outer wall of the inserting plate.

[0008] Preferably, the top of the chip body fits in contact with the bottom of the heat dissipation fin.

[0009] Compared with the prior art, the beneficial effects of the present invention are as follows: when the chip heat dissipation mounting seat is in use, the base is fixed to the circuit board through the first pin, and then the second pin on the chip body is inserted into the fixing groove and plugged into one end of the first pin. When plugging in, the second pin is inserted between the first pin and the clamping plate, and the second pin is clamped through the deformation of the clamping plate and its own resilience, so that the chip body can be quickly plugged in and installed. Afterwards, the plug-in plate at the bottom of the heat dissipation fin is inserted into the slot between the fixing frame and the base, and the protrusion cooperates with the groove to ensure that the slot and the plug-in plate are plugged in more firmly and will not slip off at will. Moreover, the setting of multiple protrusions can adapt to chip bodies of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a schematic diagram of the appearance structure of the utility model;

[0011] Figure 2 This is a schematic diagram of the structure of the base and the fixing groove of the utility model;

[0012] Figure 3 This is a schematic diagram of the structure of the matching slot and plug-in board of the utility model;

[0013] Figure 4 It is a schematic diagram of the matching structure of the first pin and the clamping plate of the utility model.

[0014] In the figure: 1. Base; 2. Fixing slot; 3. First pin; 4. Clamp; 5. Chip body; 6. Second pin; 7. Fixing frame; 8. Slot; 9. Groove; 10. Insert board; 11. Bump; 12. Heat sink fin. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0016] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application.

[0017] Example

[0018] See also Figure 1-4 The present invention provides a chip heat dissipation mounting seat: it includes a base 1, a fixing groove 2 is provided on the top of the base 1, a first pin 3 is fixedly connected to the inner side of the fixing groove 2, a clamping plate 4 is integrally formed on the outer side of the first pin 3, a chip body 5 is provided on the top of the base 1, the chip body 5 includes a second pin 6, the second pin 6 is arranged on the outer side of the chip body 5, a fixing frame 7 is integrally formed on the outer side of the base 1, a slot 8 is provided on the inner side of the fixing frame 7, a groove 9 is provided on the inner side wall of the inner cavity of the slot 8, an inserting board 10 is inserted into the inner side of the slot 8, a bump 11 is integrally formed on the outer side of the inserting board 10, and a heat dissipation fin 12 is fixedly connected to the top of the inserting board 10. When in use, the base 1 is passed through the first A pin 3 is fixed on the circuit board, and then the second pin 6 on the chip body 5 is inserted into the fixing slot 2 and plugged into one end of the first pin 3. During plugging, the second pin 6 is inserted between the first pin 3 and the clamping plate 4. Through the deformation of the clamping plate 4 and its own resilience, the second pin 6 is clamped, so that the chip body 5 can be quickly plugged in and installed. Afterwards, the plug-in plate 10 at the bottom of the heat dissipation fin 12 is inserted into the slot 8 between the fixing frame 7 and the base 1. The protrusion 11 cooperates with the groove 9 to ensure that the slot 8 and the plug-in plate 10 are more firmly plugged in and will not slip off at will. In addition, the setting of multiple protrusions 11 can adapt to chip bodies 5 of different thicknesses.

[0019] Furthermore, two groups of fixing slots 2 are provided, and one group of fixing slots 2 is provided with four.

[0020] Furthermore, two fixing frames 7 are provided, and the two fixing frames 7 are fixed on both sides of the base 1 respectively, and the inner wall of the slot 8 is adapted to the outer wall of the plug-in board 10 .

[0021] Furthermore, the bumps 11 are distributed at equal intervals on the outer wall of the inserting board 10 .

[0022] Furthermore, the top of the chip body 5 fits in contact with the bottom of the heat dissipation fin 12 .

[0023] Working principle: When in use, the base 1 is fixed to the circuit board through the first pin 3, and then the second pin 6 on the chip body 5 is inserted into the fixing slot 2, and plugged with one end of the first pin 3. When plugging, the second pin 6 is inserted between the first pin 3 and the clamping plate 4. Through the deformation of the clamping plate 4 and its own resilience, the second pin 6 is clamped, so that the chip body 5 can be quickly plugged and installed. Afterwards, the plug-in plate 10 at the bottom of the heat dissipation fin 12 is inserted into the slot 8 between the fixing frame 7 and the base 1. The protrusion 11 cooperates with the groove 9 to ensure that the slot 8 and the plug-in plate 10 are more firmly plugged in and will not slip off at will. Moreover, the setting of multiple protrusions 11 can adapt to chip bodies 5 of different thicknesses.

[0024] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these implementation rules without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip heat dissipation mounting seat, comprising a base (1), characterized in that: The top of the base (1) is provided with a fixing groove (2), the inner side of the fixing groove (2) is fixedly connected with a first pin (3), the outer side of the first pin (3) is integrally formed with a clamping plate (4), the top of the base (1) is provided with a chip body (5), the chip body (5) includes a second pin (6), the second pin (6) is arranged on the outer side of the chip body (5), the outer side of the base (1) is integrally formed with a fixing frame (7), the inner side of the fixing frame (7) is provided with a slot (8), the inner side wall of the slot (8) is provided with a groove (9), the inner side of the slot (8) is plugged with an insert board (10), the outer side of the insert board (10) is integrally formed with a bump (11), and the top of the insert board (10) is fixedly connected with a heat dissipation fin (12).

2. The chip heat dissipation mounting base according to claim 1, characterized in that: The fixing grooves (2) are provided in two groups, and one group of the fixing grooves (2) is provided with four.

3. The chip heat dissipation mounting base according to claim 1, characterized in that: Two fixing frames (7) are provided, and the two fixing frames (7) are fixed on both sides of the base (1) respectively. The inner wall of the slot (8) is adapted to the outer wall of the inserting plate (10).

4. The chip heat dissipation mounting base according to claim 1, characterized in that: The protrusions (11) are distributed at equal intervals on the outer wall of the inserting plate (10).

5. The chip heat dissipation mounting base according to claim 1, characterized in that: The top of the chip body (5) is in contact with the bottom of the heat dissipation fin (12).

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