High-temperature-resistant multilayer printed circuit board

Abstract

The utility model discloses a high temperature resistant multilayer printed circuit board, comprising a circuit board body and a heat dissipation box, two ends of the circuit board body are provided with chutes, inner walls of two sides of the heat dissipation box are fixedly connected with slide rails, an upper end of the heat dissipation box is provided with an electric fan, an upper end of the heat dissipation box is provided with a dust cover, and the dust cover is provided with a heat dissipation groove. And the upper end of the electric fan is fixedly connected with a dust removal brush rod, an open groove is formed in the sliding rail, and a heat dissipation groove is formed in the bottom of the heat dissipation box. The upper surface of the circuit board body is cooled through the electric fan, blown cooling air can flow to the bottom of the circuit board body through the open grooves, the cooling effect is achieved, then the cooling air is discharged from the cooling grooves, meanwhile, the dust removal brush rod is rotated by the electric fan together, the dust removal brush rod is made to clean the dust cover, and the dust removal efficiency is improved. And dust on the upper surface of the dustproof cover is cleaned, so that the heat dissipation effect of the electric fan is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of multilayer printed circuit boards, in particular to a high-temperature resistant multilayer printed circuit board. Background Art

[0002] Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Especially nowadays, the requirements for circuit boards are getting higher and higher. However, the performance of multi-layer circuit boards has been greatly improved compared to single-layer circuit boards, so the demand for multi-layer circuit boards is also increasing.

[0003] Existing high-temperature resistant multilayer printed circuit boards have poor high-temperature resistance during use. After working for a period of time, they will be damaged by the heat generated by electronic components, thereby shortening the service life of the circuit board, reducing the practicality and usability of the circuit board, and being unfavorable for people's use. Utility Model Content

[0004] In view of the problems in the related art, the present invention proposes a high-temperature resistant multilayer printed circuit board to overcome the above technical problems existing in the existing related art.

[0005] To this end, the specific technical solutions adopted in this utility model are as follows:

[0006] A high-temperature resistant multilayer printed circuit board includes a circuit board body and a heat dissipation box. Slide grooves are provided at both ends of the circuit board body. Slide rails are fixedly connected to the inner walls of both sides of the heat dissipation box. An electric fan is provided at the upper end of the heat dissipation box. A dust cover is provided at the upper end of the heat dissipation box. A dust cleaning brush rod is fixedly connected to the upper end of the electric fan. Slots are provided inside the slide rails. A heat dissipation groove is provided at the bottom of the heat dissipation box.

[0007] A further improvement of the technical solution of the present utility model is that the electric fan is arranged inside the center of the dust cover, the cleaning brush rod is arranged at the upper end of the dust cover, and the brush of the cleaning brush rod is in contact with the upper surface of the dust cover.

[0008] By adopting the above technical solution, when the electric fan in the solution rotates, the cleaning brush rod can be driven to rotate together, so that the cleaning brush rod cleans the dust cover and removes the dust on the surface of the dust cover, thereby ensuring the heat dissipation effect of the electric fan.

[0009] A further improvement of the technical solution of the present invention is that: the slide rail and the slide groove are adapted to each other, the slide rail is slidably connected to the slide groove, and the circuit board body is connected to the heat dissipation box through the slide rail and the slide groove.

[0010] By adopting the above technical solution, the slide rails and the slide grooves in the solution can limit the heat dissipation box.

[0011] A further improvement of the technical solution of the present invention is that support blocks are provided on both sides of the front and rear ends of the circuit board body, a shift lever is provided inside the support block, and the upper and lower ends of the shift lever are fixedly connected to a reset spring.

[0012] By adopting the above technical solution, the shift lever in the solution can play a role of resisting the slide rail, so that the slide rail can be stably fixed inside the slide groove.

[0013] A further improvement of the technical solution of the present utility model is that: a through groove is provided inside the support block, the gear rod is slidably connected to the inside of the through groove, and limiting grooves are provided on the upper and lower inner walls of the through groove. The upper and lower ends of the gear rod are fixedly connected to the limiting blocks, the limiting blocks and the limiting grooves are adapted to each other, the limiting blocks are slidably connected to the inside of the limiting groove, and the gear rod is slidably connected to the inside of the through groove through the limiting blocks and the limiting grooves.

[0014] By adopting the above technical solution, the limiting block and the limiting groove in the solution can limit the gear lever, so that the gear lever can perform linear sliding motion without falling out of the through groove.

[0015] A further improvement of the technical solution of the present utility model is that: the return spring is fixedly connected to one end of the limit block, and the end of the return spring away from the limit block is fixedly connected to the limit groove.

[0016] By adopting the above technical solution, the reset spring in the solution can drive the gear lever to perform a reset movement, so that the gear lever returns to its original position.

[0017] A further improvement of the technical solution of the present utility model is that: the front and rear ends of the circuit board body are provided with movable rods, the front and rear ends of the circuit board body are movably connected to threaded rods through bearings, a thread groove is provided inside the movable rod, the threaded rod is threadedly engaged with the inside of the thread groove, second inclined surfaces are provided at both ends of the movable rod, and a first inclined surface is provided on the inner side of the gear rod.

[0018] By adopting the above-mentioned technical solution, the rotation of the threaded rod in this solution can drive the movable rod to slide under the action of the thread of the threaded rod engaging with the inside of the threaded groove, thereby causing the first inclined surface and the second inclined surface to rub against each other, so that the gear rod slides inside the through groove under the thrust of friction, thereby playing a role of resisting the slide rail, so that the slide rail can be stably fixed inside the slide groove.

[0019] A further improvement of the technical solution of the present utility model is that the front and rear ends of the circuit board body are fixedly connected with guide rods, the interior of the movable rod is provided with guide grooves, the guide grooves are provided on both sides of the thread groove, and the guide rods are slidably connected to the interior of the guide grooves.

[0020] By adopting the above technical solution, the guide rod and the guide groove in the solution can limit the movable rod, so that the movable rod can perform linear sliding motion.

[0021] The beneficial effects of the utility model are:

[0022] 1. The upper surface of the circuit board body is cooled by the electric fan, and the cooling air blown out will pass through the slot to the bottom of the circuit board body, and dissipate heat, and then be discharged from the heat dissipation slot. At the same time, the cleaning brush rod will be rotated by the electric fan, so that the cleaning brush rod can clean the dust cover and remove the dust on the surface of the dust cover, thereby ensuring the heat dissipation effect of the electric fan.

[0023] 2. By rotating the threaded rod, the movable rod is driven to slide, so that the first inclined surface and the second inclined surface rub against each other, so that the gear rod slides inside the through groove under the thrust of friction, thereby resisting the slide rail, so that the slide rail can be stably fixed inside the slide groove, providing good stability for the heat dissipation box. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 This is a front view according to an embodiment of the present utility model;

[0026] Figure 2 This is a structural diagram of a circuit board body according to an embodiment of the present utility model;

[0027] Figure 3 According to the embodiment of the present invention Figure 2 A in the middle shows the enlarged structure diagram;

[0028] Figure 4 This is a structural diagram of the movable rod according to an embodiment of the present utility model;

[0029] Figure 5 This is a diagram of the internal structure of the heat dissipation box according to an embodiment of the present utility model;

[0030] Figure 6 It is a structural diagram of a heat dissipation box according to an embodiment of the present utility model.

[0031] In the picture:

[0032] 1. Circuit board body; 101. Slide groove; 102. Threaded rod; 103. Guide rod; 104. Support block; 105. Limit groove; 106. Gear lever; 107. Limit block; 108. First inclined surface; 109. Return spring; 2. Heat sink; 201. Heat sink; 202. Slide rail; 203. Slot; 204. Electric fan; 205. Cleaning brush rod; 206. Dust cover; 3. Movable rod; 301. Second inclined surface; 302. Threaded groove; 303. Guide groove. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] According to an embodiment of the present utility model, a high-temperature resistant multilayer printed circuit board is provided.

[0035] Embodiment 1;

[0036] like Figure 1-6 As shown, the high-temperature resistant multilayer printed circuit board according to the embodiment of the utility model includes a circuit board body 1 and a heat dissipation box 2. Slide grooves 101 are provided at both ends of the circuit board body 1, and slide rails 202 are fixedly connected to the inner walls of both sides of the heat dissipation box 2. An electric fan 204 is provided at the upper end of the heat dissipation box 2, and a dust cover 206 is provided at the upper end of the heat dissipation box 2. A dust cleaning brush rod 205 is fixedly connected to the upper end of the electric fan 204, a slot 203 is provided inside the slide rail 202, and a heat dissipation groove 201 is provided at the bottom of the heat dissipation box 2.

[0037] In this embodiment, the upper surface of the circuit board body 1 is cooled by the electric fan 204, and the cooling air blown out will pass through the slot 203 to the bottom of the circuit board body 1, and perform the cooling effect, and then be discharged from the heat dissipation slot 201. At the same time, the cleaning brush rod 205 will be rotated together with the electric fan 204, so that the cleaning brush rod 205 cleans the dust cover 206 and removes the dust on the upper surface of the dust cover 206, thereby ensuring the cooling effect of the electric fan 204.

[0038] Embodiment 2:

[0039] like Figure 1-6As shown, according to the high-temperature resistant multi-layer printed circuit board of the embodiment of the present invention, the electric fan 204 is arranged inside the center of the dust cover 206, the cleaning brush rod 205 is arranged at the upper end of the dust cover 206, the brush of the cleaning brush rod 205 is in contact with the upper surface of the dust cover 206, the slide rail 202 and the slide groove 101 are adapted to each other, the slide rail 202 is slidably connected to the slide groove 101, the circuit board body 1 is connected to the heat dissipation box 2 through the slide rail 202 and the slide groove 101, and support blocks 104 are provided on both sides of the front and rear ends of the circuit board body 1, and a gear rod 106 is provided inside the support block 104, and a reset spring 109 is fixedly connected to the upper and lower ends of the gear rod 106.

[0040] In this embodiment, when the electric fan 204 rotates, the dust cleaning brush rod 205 can be driven to rotate together, so that the dust cleaning brush rod 205 cleans the dust cover 206 and removes the dust on the upper surface of the dust cover 206, thereby ensuring the heat dissipation effect of the electric fan 204. The slide rail 202 and the slide groove 101 can limit the heat dissipation box 2, and the gear lever 106 can resist the slide rail 202, so that the slide rail 202 can be stably fixed inside the slide groove 101.

[0041] Embodiment 3;

[0042] like Figure 1-6 As shown, according to the high-temperature resistant multilayer printed circuit board of the embodiment of the present invention, a through groove is provided inside the support block 104, a gear lever 106 is slidably connected to the inside of the through groove, and a limiting groove 105 is provided on the upper and lower inner walls of the through groove. The upper and lower ends of the gear lever 106 are fixedly connected to the limiting block 107, the limiting block 107 is adapted to the limiting groove 105, the limiting block 107 is slidably connected to the inside of the limiting groove 105, the gear lever 106 is slidably connected to the inside of the through groove through the limiting block 107 and the limiting groove 105, a reset spring 109 is fixedly connected to one end of the limiting block 107, and the reset spring 109 is away from one end of the limiting block 107. The ends are fixedly connected to the limit groove 105, and the front and rear ends of the circuit board body 1 are provided with a movable rod 3. The front and rear ends of the circuit board body 1 are movably connected to the threaded rod 102 through bearings. A threaded groove 302 is provided inside the movable rod 3, and the threaded rod 102 is threadedly engaged with the inside of the threaded groove 302. A second inclined surface 301 is provided at both ends of the movable rod 3, and a first inclined surface 108 is provided on the inner side of the gear rod 106. The front and rear ends of the circuit board body 1 are fixedly connected to the guide rod 103, and a guide groove 303 is provided inside the movable rod 3. The guide groove 303 is provided on both sides of the threaded groove 302, and the guide rod 103 is slidably connected to the inside of the guide groove 303.

[0043] In this embodiment, the limit block 107 and the limit groove 105 can limit the gear rod 106, so that the gear rod 106 can make a linear sliding motion and will not leave the through groove. The return spring 109 can drive the gear rod 106 to make a reset motion, so that the gear rod 106 returns to its original position. The rotation of the threaded rod 102 can drive the movable rod 3 to make a sliding motion under the action of the threaded rod 102 thread engaging with the threaded groove 302, so that the first inclined surface 108 and the second inclined surface 301 rub against each other, so that the gear rod 106 slides inside the through groove under the thrust of friction, thereby playing a role in resisting the slide rail 202, so that the slide rail 202 can be stably fixed inside the slide groove 101, and the guide rod 103 and the guide groove 303 can limit the movable rod 3, so that the movable rod 3 can make a linear sliding motion.

[0044] In order to facilitate understanding of the above technical solutions of the present invention, the working principle or operation method of the present invention in actual process is described in detail below.

[0045] In practical application,

[0046] In summary, with the help of the above technical solution of the present invention, the slide rail 202 is first slid into the inside of the slide groove 101, and then the threaded rod 102 is rotated to drive the movable rod 3 to slide under the action of the threaded rod 102 being engaged with the thread groove 302, so that the first inclined surface 108 and the second inclined surface 301 rub against each other, so that the gear rod 106 slides inside the through groove under the thrust of friction, thereby resisting the slide rail 202, so that the slide rail 202 can be stably fixed inside the slide groove 101, and then the electric fan 204 is used to dissipate heat to the upper surface of the circuit board body 1, and the blown heat dissipation air will pass through the slot 203 to the bottom of the circuit board body 1 and have a heat dissipation effect, and then be discharged from the heat dissipation groove 201, and at the same time, the dust cleaning brush rod 205 will be rotated together with the electric fan 204, so that the dust cleaning brush rod 205 cleans the dust cover 206 and removes the dust on the upper surface of the dust cover 206.

[0047] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high temperature resistant multilayer printed circuit board, comprising a circuit board body (1) and a heat dissipation box (2), characterized in that: Slide grooves (101) are provided at both ends of the circuit board body (1), slide rails (202) are fixedly connected to the inner walls of both sides of the heat dissipation box (2), an electric fan (204) is provided at the upper end of the heat dissipation box (2), a dust cover (206) is provided at the upper end of the heat dissipation box (2), a dust cleaning brush rod (205) is fixedly connected to the upper end of the electric fan (204), a slot (203) is provided inside the slide rail (202), and a heat dissipation groove (201) is provided at the bottom of the heat dissipation box (2).

2. A high temperature resistant multilayer printed circuit board according to claim 1, characterized in that: The electric fan (204) is arranged in the center of the dust cover (206), and the dust cleaning brush rod (205) is arranged at the upper end of the dust cover (206). The brush of the dust cleaning brush rod (205) is in contact with the upper surface of the dust cover (206).

3. A high temperature resistant multilayer printed circuit board according to claim 2, characterized in that: The slide rail (202) is adapted to the slide groove (101), the slide rail (202) is slidably connected to the slide groove (101), and the circuit board body (1) is connected to the heat dissipation box (2) via the slide rail (202) and the slide groove (101).

4. A high temperature resistant multilayer printed circuit board according to claim 3, characterized in that: Support blocks (104) are provided on both sides of the front and rear ends of the circuit board body (1), a shift lever (106) is provided inside the support block (104), and the upper and lower ends of the shift lever (106) are fixedly connected to a return spring (109).

5. A high temperature resistant multilayer printed circuit board according to claim 4, characterized in that: A through slot is provided inside the support block (104), the shift rod (106) is slidably connected to the inside of the through slot, and limiting slots (105) are provided on the upper and lower inner walls of the through slot. The upper and lower ends of the shift rod (106) are fixedly connected to limiting blocks (107), the limiting blocks (107) and the limiting slot (105) are adapted to each other, the limiting blocks (107) are slidably connected to the inside of the limiting slot (105), and the shift rod (106) is slidably connected to the inside of the through slot through the limiting blocks (107) and the limiting slot (105).

6. A high temperature resistant multilayer printed circuit board according to claim 5, characterized in that: The return spring (109) is fixedly connected to one end of the limit block (107), and the end of the return spring (109) away from the limit block (107) is fixedly connected to the limit slot (105).

7. A high temperature resistant multilayer printed circuit board according to claim 6, characterized in that: The front and rear ends of the circuit board body (1) are provided with movable rods (3), and the front and rear ends of the circuit board body (1) are movably connected to threaded rods (102) through bearings. A thread groove (302) is provided inside the movable rod (3), and the threaded rod (102) is threadedly engaged with the inside of the thread groove (302). Second inclined surfaces (301) are provided at both ends of the movable rod (3), and a first inclined surface (108) is provided on the inner side of the gear lever (106).

8. A high temperature resistant multilayer printed circuit board according to claim 7, characterized in that: The front and rear ends of the circuit board body (1) are fixedly connected to guide rods (103), a guide groove (303) is provided inside the movable rod (3), the guide groove (303) is provided on both sides of the thread groove (302), and the guide rod (103) is slidably connected inside the guide groove (303).

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