Bus type IO substrate

Abstract

The utility model discloses a bus type IO substrate, which comprises a hollow bottom frame and an IO control panel, the IO control panel is fixed at the top of the bottom frame, and two groups of symmetrically arranged through holes are respectively formed in two sides of the bottom frame; the protective cover is fixed at the bottom of the bottom frame; the heat dissipation assembly is arranged in the middle of the bottom frame; the connecting structures are arranged on the two sides of the bottom frame. According to the utility model, the bottom frame is sleeved on the fixed column, the positioning sleeve is pressed to extrude the spring and the arc-shaped plate to descend to move towards the fixed column, and when the right end of the second guide groove abuts against the right guide column, the movement of the positioning sleeve is stopped, the pressing action on the positioning sleeve is slowly released, the spring resets, and the positioning sleeve is pushed to drive the positioning column to enter the positioning hole. The positioning sleeves and the fixing columns are mutually limited in the transverse direction and the longitudinal direction, then fixing of the bottom frame is achieved, when the bottom frame is disassembled, the positioning sleeves are pressed again to be moved out of the fixing columns, the structure is simple, operation is convenient, and the problems that screw connection fails and tools damage the IO control panel are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a bus-type IO substrate. Background Art

[0002] The IO board is a basic type of electronic circuit board commonly used in current electronic devices. For example, the Chinese utility model patent with application number 202320581973.3 discloses "a new type of IO control board, including an IO control board body, the lower surface of the IO control board body is provided with a first heat dissipation component, the lower surface of the first heat dissipation component is provided with a second heat dissipation component; the second heat dissipation component includes a mounting frame, the lower surface of the mounting frame is symmetrically provided with mounting grooves, the inner surfaces of the two mounting grooves are fixedly connected with mounting blocks, the upper surfaces of the two mounting blocks are fixedly connected to motors, the output ends of the two motors are fixedly connected to rotating shafts, the outer surfaces of the two rotating shafts are fixedly connected to mounting sleeves, the outer surfaces of the two mounting sleeves are evenly fixedly connected to multiple fan blades, and the lower surface of the mounting frame is bolted to a protective cover."

[0003] When installing or removing an IO board that is the same as or similar to the above-mentioned patent disclosure, the fixing screws must be released from the frame before the IO board can be removed. During multiple removals, the screws and the frame will fail, resulting in the IO board being installed loosely. At the same time, during the removal process, tools can easily damage the copper-based circuits on the IO board. Utility Model Content

[0004] The purpose of the present utility model is to propose a bus-type IO substrate in order to solve the technical problems mentioned in the above background technology.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] The bus-type IO baseboard includes a hollow bottom frame and an IO control board. The IO control board is fixed on the top of the bottom frame and also includes:

[0007] Two groups of symmetrically arranged through holes are respectively opened on both sides of the bottom frame;

[0008] A protective cover is fixed to the bottom of the bottom frame;

[0009] The heat dissipation component is arranged in the middle of the bottom frame;

[0010] The connecting structure is arranged on both sides of the bottom frame. The connecting structure includes a fixing rod, a positioning sleeve, a fixing column, a spring, a guide column and a support column. Two groups of support columns are fixedly connected to the bottom of the fixing rod, and the support column is fixedly connected to the bottom frame. The movable sleeves at both ends of the fixing rod are provided with positioning sleeves, the positioning sleeves pass through the fixing column, the fixing column passes through the through hole, and the top of the positioning sleeve is fixedly connected with the positioning column. A positioning hole adapted to the positioning column is provided in the middle of the fixing column, a second guide groove is provided on the positioning sleeve, and two groups of guide columns passing through the second guide groove are fixedly connected to the top of the fixing rod, and the spring sleeve is provided on the guide column section located inside the positioning sleeve.

[0011] As a further description of the above technical solution:

[0012] The connection structure further comprises: a second tooth segment is fixedly provided on the inner surface wall of the bottom of the positioning sleeve, and a first tooth segment engaged with the second tooth segment is fixedly provided on the bottom of the fixing rod.

[0013] As a further description of the above technical solution:

[0014] The connection structure also includes an inverted U-shaped guide plate, which is slidably sleeved on the guide column. The top of the guide plate is in smooth contact with the inner wall of the positioning sleeve. One end of the spring is fixedly connected to the guide plate, and the other end of the spring is fixedly connected to the fixed rod. The fixed rod has first guide grooves on both sides to accommodate the vertical ends of the guide plate.

[0015] As a further description of the above technical solution:

[0016] The heat dissipation assembly includes a heat conducting plate and heat dissipation fins. The heat conducting plate is arranged close to the IO control board, and a plurality of heat dissipation fins are linearly arranged and fixed on the bottom of the heat conducting plate.

[0017] As a further description of the above technical solution:

[0018] The heat dissipation assembly also includes a heat dissipation fan. A mounting frame with a cross-shaped structure is fixedly connected to the inside of the bottom frame. Two groups of heat dissipation fans are fixedly installed on the mounting frame. The heat dissipation fans are arranged below the heat dissipation fins.

[0019] As a further description of the above technical solution:

[0020] The bottom of the IO control board is fixedly connected to a pressure column that abuts against the top of the heat conducting plate.

[0021] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0022] 1. In the utility model, the fixing post is fixed to the rack to be installed on the bottom frame. When installing the bottom frame, the bottom frame is aligned with the through hole and passes through the fixing post. Then the positioning sleeve is pressed to squeeze the spring and the arc plate downward to move toward the fixing post. When the right end of the second guide groove abuts against the right guide post, the movement of the positioning sleeve is stopped, and the pressing action on the positioning sleeve is slowly released. The spring resets, pushing the positioning sleeve to drive the positioning post into the positioning hole. The positioning sleeve and the fixing post are restricted to each other in the horizontal and vertical directions, thereby achieving the fixation of the bottom frame. When disassembling the bottom frame, the positioning sleeve can be pressed again to move it out of the fixing post. The structure is simple and the operation is convenient, which avoids the problems of screw connection failure and tool damage to the IO control board.

[0023] 2. In the present invention, the arc-shaped plate and the positioning sleeve are in smooth contact, ensuring that the positioning sleeve moves smoothly. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A cross-sectional schematic diagram of a bus-type IO substrate provided according to an embodiment of the present utility model is shown;

[0025] Figure 2 A partial cross-sectional schematic diagram of a connection structure provided according to an embodiment of the present utility model is shown;

[0026] Figure 3 A schematic structural diagram of a bottom frame provided according to an embodiment of the present utility model is shown;

[0027] Figure 4 A schematic structural diagram of a connection structure provided according to an embodiment of the present utility model is shown;

[0028] Figure 5 The figure shows a three-dimensional structural diagram of a bus-type IO substrate provided according to an embodiment of the present utility model.

[0029] Legend:

[0030] 1. Bottom frame; 2. Protective cover; 3. Mounting bracket; 4. Cooling fan; 5. Heat conduction plate; 6. Cooling fins; 7. IO control board; 71. Pressure column; 8. Connecting structure; 81. Fixing rod; 8101. First guide groove; 811. First tooth segment; 82. Positioning sleeve; 8201. Second guide groove; 821. Second tooth segment; 822. Positioning column; 83. Fixing column; 8301. Positioning hole; 84. Guide plate; 85. Spring; 86. Guide column; 87. Support column. DETAILED DESCRIPTION

[0031] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] See also Figure 1-5 The utility model provides a technical solution: a bus-type IO substrate, including a hollow bottom frame 1 and an IO control board 7, the IO control board 7 is fixed to the top of the bottom frame 1, the protective cover 2 is fixed to the bottom of the bottom frame 1, and the bottom of the IO control board 7 is fixedly connected with a pressure column 71 abutting the top of the heat conducting plate 5, the heat conducting plate 5 is placed in the inner groove of the bottom frame 1, the IO control board 7 is placed in the top groove of the bottom frame 1, the pressure column 71 abuts the heat conducting plate 5, and when the IO control board 7 is fixed to the bottom frame 1 by screws, the fixation of the heat conducting plate 5 is completed, saving the installation time of the heat conducting plate 5, the heat dissipation component is arranged in the middle of the bottom frame 1, and the heat dissipation component plays a role in dissipating heat for the IO control board 7, and the connecting structure 8 is arranged on both sides of the bottom frame 1. The connecting structure 8 avoids screw connection and plays a role in fixing the bottom frame 1.

[0033] Specifically, such as Figure 2-5As shown, the connecting structure 8 includes a fixing rod 81, a positioning sleeve 82, a fixing column 83, an inverted U-shaped guide plate 84, a spring 85, a guide column 86 and a support column 87. Two groups of support columns 87 are fixedly connected to the bottom of the fixing rod 81. The support columns 87 are fixedly connected to the bottom frame 1. Positioning sleeves 82 are movably sleeved at both ends of the fixing rod 81. The positioning sleeves 82 pass through the fixing columns 83. Two groups of symmetrical through holes are respectively opened on both sides of the bottom frame 1. The fixing columns 83 pass through the through holes. The top of the positioning sleeve 82 is fixedly connected to the positioning column 822. A positioning hole 8301 adapted to the positioning column 822 is opened in the middle of the fixing column 83. A second guide groove 8201 is opened on the positioning sleeve 82. Two groups of guide columns 86 passing through the second guide groove 8201 are fixedly connected to the top of 81, and the spring 85 is sleeved on the guide column 86 section located inside the positioning sleeve 82. The inner surface wall of the bottom of the positioning sleeve 82 is fixedly provided with a second tooth section 821, and the bottom of the fixing rod 81 is fixedly provided with a first tooth section 811 engaged with the second tooth section 821. The inverted U-shaped guide plate 84 is slidably sleeved on the guide column 86, and the top of the guide plate 84 is in smooth contact with the inner wall of the positioning sleeve 82. One end of the spring 85 is fixedly connected to the guide plate 84, and the other end of the spring 85 is fixedly connected to the fixing rod 81. The fixing rod 81 has first guide grooves 8101 on both sides to accommodate the vertical ends of the guide plates 84 passing through. When the second guide slot 8201 is in contact with the right guide post 86, the movement of the positioning sleeve 82 is stopped, and the pressing action of the positioning sleeve 82 is slowly released. The spring 85 is reset, pushing the positioning sleeve 82 to drive the positioning post 822 into the positioning hole 8301. At the same time, the second tooth segment 821 is engaged with the first tooth segment 811, and the positioning sleeve 82 and the fixing post 83 are mutually restricted in the horizontal and vertical directions, thereby achieving the fixation of the bottom frame 1. When the bottom frame 1 is disassembled, the positioning sleeve 82 is pressed again to move it out of the fixing post 83. The structure is simple and the operation is convenient, which avoids the problem of screw connection failure and tool damage to the IO control board 7.

[0034] Specifically, such as Figure 1 and Figure 3 As shown, the heat dissipation assembly includes a cooling fan 4, a heat conducting plate 5, and heat dissipation fins 6. The heat conducting plate 5 is positioned near the IO control board 7. Several heat dissipation fins 6 are linearly arranged and fixed to the bottom of the heat conducting plate 5. A cross-shaped mounting bracket 3 is fixedly connected to the interior of the bottom frame 1. Two sets of cooling fans 4 are fixedly mounted on the mounting bracket 3. The cooling fans 4 are positioned below the heat dissipation fins 6. When the cooling fans 4 are turned on, the heat conducting plate 5 and heat dissipation fins 6 cooperate to enhance the heat dissipation effect on the IO control board 7.

[0035] Furthermore, this embodiment provides a main working circuit structure on an IO control board 7. The circuit connection of the IO control board 7 includes a control circuit, a communication circuit, a power supply circuit, an LED drive circuit, an IO integrated circuit, and an output circuit. The control circuit uses an ARM chip of ARM Cortex M0 as the core, the communication circuit uses the RS232 protocol standard, the power supply circuit uses the voltage regulator chip AMS1117-3.3 as the core, the LED drive circuit mainly controls the external LED chip by inputting SPI protocol signals from the CPU, the IO integrated circuit mainly controls the serial-to-parallel chip 74HC595D compatible with the SPI protocol after buffering the output signal by the buffer 74HC245D, and realizes the function of controlling any number of output bit signals by occupying 4 pins of the CPU, and the output circuit is composed of 16 drive circuits with the same structure. The control circuit is electrically connected to the power circuit, the control circuit is bidirectionally electrically connected to the communication circuit, and the control circuit is unidirectionally electrically connected to the LED drive circuit, the IO integrated circuit, and the output circuit.

[0036] Working principle: When in use, the fixing post 81 is fixed on the rack to be installed on the bottom frame 1. When installing the bottom frame 1, align the bottom frame 1 with the through hole and pass it through the fixing post 83, then press the positioning sleeve 82 to squeeze the spring 85 and the arc plate 84 to move downward toward the fixing post 83. Since the arc plate 84 and the positioning sleeve 82 are in smooth contact, the positioning sleeve 82 can move smoothly. When the right end of the second guide groove 8201 abuts against the right guide post 86, the movement of the positioning sleeve 82 is stopped and the positioning sleeve is slowly released. The pressing action of the positioning sleeve 82 resets the spring 85, pushing the positioning sleeve 82 to drive the positioning column 822 into the positioning hole 8301. At the same time, the second tooth segment 821 is engaged with the first tooth segment 811, and the positioning sleeve 82 and the fixing column 83 are restricted to each other in the horizontal and vertical directions, thereby achieving the fixation of the bottom frame 1. When disassembling the bottom frame 1, press the positioning sleeve 82 again to move it out of the fixing column 83. The structure is simple and easy to operate, avoiding the problems of screw connection failure and tool damage to the IO control board 7.

[0037] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A bus-type IO substrate, comprising a hollow bottom frame (1) and an IO control board (7), wherein the IO control board (7) is fixed on the top of the bottom frame (1), characterized in that: Also includes: Two groups of symmetrically arranged through holes are respectively provided on both sides of the bottom frame (1); A protective cover (2) is fixed to the bottom of the bottom frame (1); A heat dissipation component is arranged in the middle of the bottom frame (1); The connecting structure (8) is arranged on both sides of the bottom frame (1), and the connecting structure (8) includes a fixing rod (81), a positioning sleeve (82), a fixing column (83), a spring (85), a guide column (86) and a support column (87). The bottom of the fixing rod (81) is fixedly connected with two groups of support columns (87). The support columns (87) are fixedly connected to the bottom frame (1). The two ends of the fixing rod (81) are movable sleeves with positioning sleeves (82). The positioning sleeves (82) pass through the fixing column (83). The fixed column (83) passes through the through hole, the top of the positioning sleeve (82) is fixedly connected with a positioning column (822), the middle of the fixed column (83) is provided with a positioning hole (8301) adapted to the positioning column (822), the positioning sleeve (82) is provided with a second guide groove (8201), the top of the fixed rod (81) is fixedly connected with two groups of guide columns (86) passing through the second guide groove (8201), and the spring (85) is sleeved on the guide column (86) section located inside the positioning sleeve (82).

2. The bus-type IO substrate according to claim 1, characterized in that: The connection structure (8) further comprises: a second latching tooth section (821) fixedly provided on the inner surface wall of the bottom of the positioning sleeve (82); and a first latching tooth section (811) engaged with the second latching tooth section (821) fixedly provided on the bottom of the fixing rod (81).

3. The bus-type IO substrate according to claim 2, characterized in that: The connecting structure (8) further comprises an inverted U-shaped guide plate (84), the inverted U-shaped guide plate (84) being slidably sleeved on the guide post (86), the top of the guide plate (84) being in smooth contact with the inner wall of the positioning sleeve (82), one end of a spring (85) being fixedly connected to the guide plate (84), the other end of the spring (85) being fixedly connected to the fixing rod (81), and first guide grooves (8101) for accommodating the vertical ends of the guide plate (84) passing through are provided on both sides of the fixing rod (81).

4. The bus-type IO substrate according to claim 1, wherein: The heat dissipation assembly comprises a heat conducting plate (5) and heat dissipation fins (6); the heat conducting plate (5) is arranged close to the IO control board (7); and a plurality of heat dissipation fins (6) are linearly arranged and fixed on the bottom of the heat conducting plate (5).

5. The bus-type IO substrate according to claim 4, characterized in that: The heat dissipation assembly further comprises a heat dissipation fan (4); a mounting frame (3) in a cross-shaped structure is fixedly connected to the interior of the bottom frame (1); two groups of heat dissipation fans (4) are fixedly mounted on the mounting frame (3); and the heat dissipation fans (4) are arranged below the heat dissipation fins (6).

6. The bus-type IO substrate according to claim 5, characterized in that: The bottom of the IO control board (7) is fixedly connected to a pressure column (71) that abuts against the top of the heat conducting board (5).

Images