Novel packaging structure

Abstract

The utility model discloses a novel packaging structure which comprises a light-emitting chip and a lens, a support layer, an insulating layer and a substrate which are arranged in sequence, an insulating part is arranged in the middle of the substrate and divides the substrate into a conductive part and a heat conduction part, the conductive part is electrically connected with the light-emitting chip, and the heat conduction part is electrically connected with the light-emitting chip. And the heat conduction part is used for transferring heat generated or remained in the light-emitting chip and the cavity. The substrate can directly conduct heat generated by the light-emitting chip to an external heat dissipation component, has heat conduction and electric conduction functions, avoids the defects that a traditional ceramic substrate is high in heat resistance and needs to be perforated for electric conduction, and simplifies the structure of the substrate.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging, and more specifically, to a novel packaging structure. Background Art

[0002] LEDs are mounted on substrates. Common sizes for LED brackets are 2.5*2.5mm and 3.5*3.5mm. Because multiple LEDs are typically placed on a single substrate, heat dissipation becomes increasingly prominent as LED brightness and power increase. Heat dissipation impacts the LED's light output characteristics and device lifespan, making it a critical issue in LED packaging.

[0003] In existing technology, LED lamp beads are directly packaged onto perforated ceramic substrates, leveraging the insulating properties of ceramic materials to achieve LED packaging. However, the high thermal resistance of ceramic materials can easily lead to inefficient heat dissipation, which in turn increases chip temperature, shortens chip life, and reduces chip light output efficiency.

[0004] Furthermore, since the substrate conducts heat energy and electric current simultaneously, the temperature of the substrate (or a portion of the substrate) increases, causing the resistance of the substrate to increase and the conductivity to decrease. Utility Model Content

[0005] The purpose of the utility model is to overcome the defects of the existing packaging structure that the heat dissipation effect is poor and the chip light extraction efficiency is low, and to provide a new packaging structure that can significantly reduce the thermal resistance of the LED, which is conducive to solving the bottleneck problem of high-power LED heat dissipation.

[0006] The technical solution adopted by the present invention is: a new packaging structure, including a light-emitting chip and a lens, a support layer, an insulating layer, and a substrate arranged in sequence, wherein the lens is arranged on the support layer, the insulating layer is hollow, and forms a cavity with the substrate capable of accommodating the light-emitting chip; the light-emitting chip is arranged on the substrate, the substrate is made of a conductive material, and an insulating portion is provided in the middle of the substrate, the insulating portion divides the substrate into at least three parts, including a conductive portion and a heat-conducting portion, the conductive portion is electrically connected to the light-emitting chip, and the heat-conducting portion is used to transfer the heat generated or residual in the light-emitting chip and the cavity. The substrate can directly conduct the heat generated by the light-emitting chip to an external heat dissipation substrate, and the substrate has both thermal and electrical conductivity functions, avoiding the defects of traditional ceramic substrates with high thermal resistance and the need to perforate the ceramic substrate for electrical conduction, thereby simplifying the structure of the substrate.

[0007] Furthermore, a circular groove is provided on the side of the substrate close to the insulating layer, and the light-emitting chip is arranged in the middle (center position) of the circular groove.

[0008] Furthermore, the insulating portion includes at least two insulating strips, namely a first insulating strip and a second insulating strip. The insulating strips are made of common plastic, and of course, can also be made of other insulating materials.

[0009] Furthermore, the area between the first insulating strip and the second insulating strip is the heat-conducting part, and the side away from the first insulating strip and the second insulating strip is the conductive part. The light-emitting chip is in direct contact with the heat-conducting part, or is connected through a medium with good thermal conductivity, but there is no electrical connection between the light-emitting chip and the heat-conducting part; the light-emitting chip is connected to the conductive part through a conductive material (such as gold wire).

[0010] Furthermore, the first insulating strip is provided with a protrusion toward the plane of the substrate.

[0011] Furthermore, a solder mask strip is provided on the side of the first insulating strip and the second insulating strip away from the substrate.

[0012] Furthermore, a accommodating cavity is formed in the middle of the support layer and extends through the support layer in the thickness direction. The downward projection of the accommodating cavity is circular. The accommodating cavity is formed in the middle of the support layer to accommodate a planar lens or a spherical lens. Since the projection surface of a common lens is circular, the downward projection surface of the accommodating cavity is circular. Of course, if the projection surface of the lens is rectangular or other shapes, the downward projection surface of the accommodating cavity can also be other corresponding shapes.

[0013] Furthermore, the upper end of the support layer forms a notch between adjacent corners. This notch is naturally formed based on the outer dimensions of the substrate and the requirement for a sufficiently large support layer. This increases the size of the accommodating cavity, allowing for the placement of large lenses. Furthermore, conventional support layers are closed on all sides. As the size of the lens increases, the thickness of the support layer decreases. This structure can easily lead to cracking and damage in the thinner sections of the support layer. The provision of the notch overcomes this drawback.

[0014] Furthermore, the downward projection surface of the cavity is circular, which facilitates the formation of a circular light spot and is then adapted to the lens.

[0015] Furthermore, the thickness of the substrate is 0.1 mm to 0.4 mm. Compared with the existing ceramic substrate, the substrate of the present invention has a smaller thickness and a better heat conduction effect.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] The heat generated by the light-emitting chip is directly transferred to the heat dissipation structure. The substrate has both thermal and electrical conductivity functions, avoiding the high thermal resistance of traditional ceramic substrates and the need to perforate the ceramic substrate for conductivity. This simplifies the structure of the substrate and significantly reduces the thermal resistance of high-power LEDs. The lower surface of the substrate and the heat dissipation structure can be directly soldered using solder paste, improving the traditional high-thermal resistance connection method using bolts, thermally conductive silicon or phase change materials. Direct soldering can significantly reduce the thermal resistance of high-power LEDs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a structural diagram of Example 1;

[0019] Figure 2 It is an exploded view of Example 1;

[0020] Figure 3 This is a structural diagram of Example 2;

[0021] Figure 4 This is an exploded view of Example 2.

[0022] In the attached figure:

[0023] 1-light-emitting chip; 2-support layer; 3-insulating layer; 4-substrate; 5-groove; 6-first insulating strip; 7-second insulating strip; 8-bump; 9-soldering strip; 10-lens. DETAILED DESCRIPTION

[0024] The present invention is further described below in conjunction with specific embodiments. The accompanying drawings are for illustrative purposes only and are not to be construed as limiting this patent. Certain components in the accompanying drawings may be omitted, enlarged, or reduced in size to better illustrate the embodiments, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that certain well-known structures and their descriptions may be omitted from the accompanying drawings.

[0025] For the convenience of description and display, Figure 1 as well as Figure 3 The lens 10 shown is transparent, that is, the structure behind the lens 10 can be clearly seen through the lens 10. However, in practice, the lens 10 will have a certain optical refraction effect to achieve focusing, astigmatism or other optical effects, which will cause the structure behind the lens 10 to be unable to be clearly seen.

[0026] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if there are terms such as "front", "rear", "left", "right" and the like indicating directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. In addition, in the present invention, the descriptions such as "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" or "second" can explicitly or implicitly include at least one such feature.

[0027] Example 1

[0028] This embodiment provides a new packaging structure. Figure 1 as well as Figure 2 The novel packaging structure includes a light-emitting chip 1, a lens 10, a support layer 2, an insulating layer 3, and a substrate 4, arranged in this order. The lens 10 is mounted on the support layer 2. The insulating layer 3 is hollow and, together with the substrate 4, forms a cavity capable of accommodating the light-emitting chip 1. The light-emitting chip 1 is mounted on the substrate 4, which is made of a conductive material. In this embodiment, the substrate 4 is copper. Of course, in other embodiments, the substrate 4 can also be made of other materials with both electrical and thermal conductivity. The sides of the substrate 4 are 3.5 mm x 3.5 mm, and the sides of the support layer 2 and insulating layer 3 have the same dimensions as the substrate 4. The support layer 2, insulating layer 3, and substrate 4 can be connected by adhesive bonding or by press-fitting. An insulating portion is provided in the middle of the substrate 4, dividing it into three parts: two conductive portions and a thermally conductive portion. The conductive portion is electrically connected to the light-emitting chip 1, and the thermally conductive portion is used to transfer heat generated by the light-emitting chip 1 and residual heat in the cavity.

[0029] The thickness of the substrate 4 is 0.2 mm. Compared with the existing ceramic substrate, the thickness of the substrate 4 of this embodiment is smaller and the thermal conductivity is better. The thickness of the substrate 4 can also be 0.1 mm, 0.3 mm, 0.4 mm, or any value between 0.1 and 0.4 mm. Of course, in some other embodiments, the insulating portion can also divide the substrate 4 into more than three parts, and at least two of the parts are conductive portions. In other words, the number of the conductive portions is at least two, corresponding to the positive pole and the negative pole respectively. When the number of the conductive portions is more than two, some of the conductive portions are connected to the positive pole of the power supply, and the remaining portion is connected to the negative pole of the power supply.

[0030] The substrate 4 is also provided with a circular groove 5 on the side close to the insulating layer 3, and the light-emitting chip 1 is arranged at the center of the circular groove 5. The circular groove 5 forms a cup-shaped or bowl-shaped reflective structure, and the sidewalls of the groove 5 have a certain light reflection effect, which can reflect the light emitted by the light-emitting chip 1 and make the light emitted in the thickness direction of the novel packaging structure. The groove 5 can be regarded as a micro-reflective structure, which helps to improve the bonding strength between the packaging glue (not shown in the figure) and the substrate 4, as well as increase the reflection area, improve the reflectivity, and enhance the light extraction efficiency. Preferably, the sidewalls of the groove 5 can be directly connected to the bottom wall so that the light is reflected efficiently and no heat concentration area is formed in the groove 5. The shape of the groove 5 is adapted to the lens 10 installed on the bracket layer 2. Of course, if the projection of the lens 10 in the thickness direction of the novel packaging structure is other shapes (such as a rectangle or an ellipse), the groove 5 can also be other shapes.

[0031] The insulating portion includes at least two insulating strips, namely a first insulating strip 6 and a second insulating strip 7. The insulating strips are made of common plastic, but can also be made of other insulating materials. After the substrate 4 is formed, a specific shape is removed from the central region of the substrate 4. The first insulating strip 6 and the second insulating strip 7 are then formed into the same shape (e.g., a strip) through an injection molding process. The first insulating strip 6 and the second insulating strip 7 are then replaced in the removed region, forming a complete substrate 4 with functional partitions.

[0032] The area between the first insulating strip 6 and the second insulating strip 7 is the heat-conducting portion, and the side away from the first insulating strip 6 and the second insulating strip 7 is the conductive portion. There are two conductive portions, which are electrically connected to the positive pole of the power supply and the negative pole of the power supply, respectively. The light-emitting chip 1 is in direct contact with the heat-conducting portion, or is connected through a medium with good thermal conductivity (such as thermal adhesive), but there is no electrical connection between the light-emitting chip 1 and the heat-conducting portion; the light-emitting chip 1 is connected to the conductive portion through a metal lead (such as a gold wire). The metal lead adopts a trapezoidal wire bonding method, which can increase the height between the wire arc and the conductive portion, reduce the possibility of short circuit caused by metal lead collapse, and improve the reliability of the new packaging structure.

[0033] The first insulating strip 6 is provided with a protrusion 8 toward the plane of the substrate 4 , and the protrusion 8 is used to indicate the position of the positive pole, that is, the conductive part facing the protrusion 8 is the positive pole, and the opposite side is the negative pole.

[0034] The heat generated by the light-emitting chip 1 or the heat remaining in the cavity is transferred to a heat dissipation structure (not shown) via the heat-conducting portion. The substrate 4 simultaneously performs both thermal and electrical conductivity functions, avoiding the high thermal resistance of conventional ceramic substrates and the need for perforations for electrical conduction. This simplifies the structure of the substrate 4 and significantly reduces the thermal resistance of high-power LEDs. Furthermore, the heat-conducting portion and the conductive portion are separated, allowing the conductive portion to only conduct current, thereby reducing the temperature and resistance of the conductive portion of the substrate 4 and improving its conductivity.

[0035] The lower surface of the substrate 4 (i.e., the surface away from the light-emitting chip 1) and the heat dissipation structure can be directly soldered using solder paste, which improves the traditional high thermal resistance connection method using bolts, thermal conductive silicon or phase change materials. Direct soldering can significantly reduce the thermal resistance of high-power LEDs.

[0036] Example 2

[0037] like Figure 3 as well as Figure 4 As shown, this embodiment provides another novel packaging structure, including a light-emitting chip 1, a lens 10, a support layer 2, an insulating layer 3, and a substrate 4, which are arranged in sequence. The insulating layer 3 is hollow and, together with the substrate 4, forms a cavity capable of accommodating the light-emitting chip 1. The light-emitting chip 1 is disposed on the substrate 4, which is made of a conductive material. An insulating portion is provided in the middle of the substrate 4, which divides the substrate 4 into at least three parts, including a conductive portion and a thermal conductive portion. The conductive portion is electrically connected to the light-emitting chip 1, and the thermal conductive portion is used to transfer heat generated or remaining in the light-emitting chip 1 and the cavity.

[0038] The side length of the substrate 4 is 2.5 mm × 2.5 mm, and the side length of the support layer 2 and the insulating layer 3 is the same as that of the substrate 4. A accommodating cavity is formed in the middle of the support layer 2, which is continuous along the thickness direction, and the downward projection surface of the accommodating cavity is circular. The accommodating cavity is formed in the middle of the support layer 2 to accommodate a plane lens (not shown in the figure) or a spherical lens 10. Since the projection surface of the common lens 10 is circular, the downward projection surface of the accommodating cavity is circular. Of course, if the projection surface of the lens 10 is rectangular or other shapes, the downward projection surface of the accommodating cavity can also be other corresponding shapes.

[0039] Furthermore, a notch is formed at the upper end of the support layer 2 between adjacent corners. The notch is naturally formed based on the outer dimensions of the substrate 4 and the requirement that the support layer 2 be large enough, so that the size of the accommodating cavity can be increased, so that a large-sized lens 10 can be placed in the accommodating cavity. In the present embodiment, the side length of the substrate 4 is 2.5mm×2.5mm, so it is necessary to increase the size of the accommodating cavity of the support layer 2 in order to accommodate the lens 10. In Example 1, since the size of the substrate 4 is 3.5mm×3.5mm, its accommodating cavity can be conventionally set. The formation of a notch at the upper end of the support layer 2 between adjacent corners also brings another advantage, that is, the traditional support layer is closed on all sides. When the size of the matched lens 10 is enlarged, the thickness of the support layer around it will be reduced. If this structure is adopted, the position of the support layer 2 with a smaller thickness is prone to cracking and damage. By setting a notch, this defect can be overcome.

[0040] The downward projection surface of the cavity formed by the insulating layer 3 and the substrate 4 is circular, so that a circular light spot can be easily formed and thus matched with the lens 10 .

[0041] Example 3

[0042] See Figure 3 as well as Figure 4 Based on the second embodiment, this embodiment provides another novel packaging structure, comprising a light-emitting chip 1, and a support layer 2, an insulating layer 3, and a substrate 4 arranged in sequence. The insulating layer 3 is hollow and, together with the substrate 4, forms a cavity capable of accommodating the light-emitting chip 1. The light-emitting chip 1 is disposed on the substrate 4, which is made of a conductive material. An insulating portion is provided in the middle of the substrate 4, dividing the substrate 4 into at least three parts: a conductive portion and a thermal conductive portion. The conductive portion is electrically connected to the light-emitting chip 1, and the thermal conductive portion is used to transfer heat generated or remaining in the light-emitting chip 1 and the cavity.

[0043] Unlike the second embodiment, in this embodiment, the insulating portion includes a first insulating strip 6 and a second insulating strip 7. A solder mask 9 is further provided on the side of the first insulating strip 6 and the second insulating strip 7 away from the substrate 4. The solder mask 9 serves to isolate the conductive portion when the novel package structure is mounted on a main substrate (on which several novel package structures are arranged in a matrix), thereby preventing solder wire crosstalk and short circuits.

[0044] In the specific contents of the above-mentioned specific implementation methods, the various technical features can be combined in any non-contradictory manner. In order to make the description concise, not all possible combinations of the above-mentioned technical features are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. A person skilled in the art will be able to make other variations or modifications based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A new packaging structure, characterized in that: The invention comprises a light-emitting chip (1) and a lens (10), a support layer (2), an insulating layer (3), and a substrate (4) which are arranged in sequence. The insulating layer (3) is hollow and forms a cavity with the substrate (4) capable of accommodating the light-emitting chip (1). The light-emitting chip (1) is arranged on the substrate (4). The substrate (4) is made of a conductive material. An insulating portion is provided in the middle of the substrate (4). The insulating portion divides the substrate (4) into at least three parts, including a conductive portion and a heat-conducting portion. The conductive portion is electrically connected to the light-emitting chip (1). The heat-conducting portion is used to transfer heat generated or remaining in the light-emitting chip (1) and the cavity.

2. The novel packaging structure according to claim 1, characterized in that: A circular groove (5) is also provided on the side of the substrate (4) close to the insulating layer (3).

3. The novel packaging structure according to claim 2, characterized in that: The insulating portion comprises at least two insulating strips, namely a first insulating strip (6) and a second insulating strip (7).

4. The novel packaging structure according to claim 3, characterized in that: The area between the first insulating strip (6) and the second insulating strip (7) is the heat-conducting portion, and the side away from the first insulating strip (6) and the second insulating strip (7) is the conductive portion.

5. The novel packaging structure according to claim 3, characterized in that: The first insulating strip (6) is provided with a protrusion (8) in the plane direction of the substrate (4).

6. The novel packaging structure according to any one of claims 3 to 5, characterized in that: The first insulating strip (6) and the second insulating strip (7) are further provided with a soldering-proof strip (9) on the side away from the substrate (4).

7. The novel packaging structure according to claim 1, characterized in that: A accommodating cavity is formed in the middle of the support layer (2) and is continuous in the thickness direction, and the downward projection of the accommodating cavity is circular.

8. The novel packaging structure according to claim 7, characterized in that: The upper end of the support layer (2) forms a gap between adjacent corners.

9. The novel packaging structure according to claim 1, characterized in that: The downward projection surface of the cavity is circular.

10. The novel packaging structure according to claim 1, characterized in that: The thickness of the substrate (4) is 0.1 mm to 0.4 mm.

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