LED lamp wick arrangement structure with high heat dissipation performance

The problem of insufficient heat dissipation of LED wicks through the misaligned arrangement of the font shape structure is solved, and the better heat dissipation effect is achieved, and the service life of the LED wicks is extended.

CN223271139UActive Publication Date: 2025-08-26WUJIANG HUANENG ELECTRONICS CO LTD
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Patent Information

Application Number
CN202422404333.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2025-08-26
Estimated Expiration
2034-09-30

AI Technical Summary

Technical Problem

The heat dissipation of LED wicks is insufficient, which leads to high temperatures that increase their light decay and affects their service life.

Method used

The shaped structure of staggered arrangement is adopted to form a shaped shape between adjacent LED wicks, increase the area of ​​the heat dissipation medium, reduce the heat flux density, reduce thermal resistance, and improve the heat dissipation effect.

Benefits of technology

Through the improved LED wick arrangement structure, the heat dissipation capability is enhanced and the service life of the LED wick is extended.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an LED lamp wick arrangement structure with high heat dissipation performance, which comprises a substrate and a plurality of LED lamp wick mounted on the substrate, the LED lamp wick is arranged into at least two rows, and the LED lamp wick in two adjacent rows are arranged in a staggered manner, so that a triangular structure is formed among the three adjacent LED lamp wick. According to the arrangement structure, the triangular arrangement structure is achieved in a staggered arrangement mode, the distance between every two adjacent LED lamp wicks is increased, and therefore the heat dissipation medium body area of the LED lamp wicks is enlarged, the heat flux density is reduced, the heat resistance is reduced, the heat molecule transfer and outward heat radiation capacity is enhanced, the heat dissipation effect is improved, and the service life of the LED lamp wicks is prolonged.
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Description

Technical Field

[0001] The utility model relates to an LED lamp, in particular to an LED lamp wick arrangement structure with high heat dissipation. Background Art

[0002] LEDs are highly efficient, long-life light sources, but they are sensitive to operating temperature. Higher operating temperatures can negate their inherent high efficiency and longevity. The PN junction temperature (Tj) of LED materials is typically 110°C, while the PN junction temperature (Tj) of conventional silicon (Si) diodes is 150°C. Therefore, LED materials require higher heat dissipation properties to maintain their high efficiency and longevity.

[0003] The LED wick is mounted on a conductive heat-dissipating substrate, and the heat generated by the wick is transferred and radiated outward through the substrate material (thermal conductivity w / mk). The heat flux density determines the heat dissipation effect. The heat flux density is the molecular weight of heat transferred per unit time by the area of ​​the heat transfer medium. When the molecular weight is determined, the area of ​​the heat-conducting medium determines the heat flux density and thermal resistance. The smaller the area of ​​the medium, the greater the heat flux density and the thermal resistance. The ability of heat molecules to transfer and radiate heat outward is weakened, the heat dissipation effect is poor, the temperature of the LED wick rises, and the light decay is aggravated. Therefore, in order to make the LED wick efficient and long-lasting, it is necessary to rationally design the mounting distribution structure and heat dissipation conditions of the LED wick, especially LED straight lamps, but not limited to this type, on the printed circuit board to reduce thermal resistance, facilitate heat dissipation, and extend the service life of the LED wick. Utility Model Content

[0004] In order to solve the above technical problems, an embodiment of the present utility model provides an LED wick arrangement structure with high heat dissipation, including a substrate and several LED wicks mounted on the substrate, the LED wicks are arranged in at least two rows, and the LED wicks in two adjacent rows are staggered with each other, so that a herringbone structure is formed between the three adjacent LED wicks.

[0005] Furthermore, three LED lamp wicks are formed in a herringbone shape, wherein two of the LED lamp wicks are arranged in the same row, and the other LED lamp wick is located in an adjacent row of the two LED lamp wicks and is located on the perpendicular midline of the line connecting the two LED lamp wicks.

[0006] Furthermore, the distance between two adjacent LED wicks in the same row is 2a, and the distance between the third LED wick and the two adjacent LED wicks is b, wherein 2a≥b.

[0007] Furthermore, the LED lamp wicks are arranged in a matrix.

[0008] Furthermore, the LED lamp cores may be connected in series or in parallel, or in a series-parallel composite connection.

[0009] Furthermore, the electrical connection method of the LED lamp core is that the positive pole is connected to the positive pole of the power supply, and the negative pole is connected to the negative pole of the power supply. The two LED lamp cores are connected in series with the positive pole connected to the negative pole, and the two LED lamp cores are connected in parallel with the positive pole connected to the positive pole and the negative pole connected to the negative pole.

[0010] Furthermore, the substrate is aluminum.

[0011] Furthermore, the LED lamp cores are connected by wires and connected to an external power source to emit light.

[0012] The beneficial effects of the utility model are as follows:

[0013] By adopting a staggered arrangement method, a herringbone arrangement structure is achieved, which increases the distance between two adjacent LED wicks, thereby expanding the dielectric area of ​​the LED wick heat dissipation, thereby reducing the heat flux density, reducing thermal resistance, and enhancing the heat molecular transfer and outward heat radiation capabilities, thereby improving the heat dissipation effect and extending the service life of the LED wick.

[0014] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a schematic diagram of the LED wick arrangement structure in this embodiment.

[0017] Figure 2 Schematic diagram of a herringbone structure in this embodiment. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be noted that the terms "upper", "lower", "bottom", "inner", "outer", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention. In addition, the terms "first", "second", etc., are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of such features.

[0020] Combine Figure 1 As shown, the present invention provides an LED lamp having an LED wick arrangement structure with high heat dissipation, comprising a substrate 1 and a plurality of LED wicks 2 mounted on the substrate 1. The LED wicks 2 are arranged in at least two rows, with the LED wicks 2 in two adjacent rows being staggered relative to each other, so that a herringbone structure 3 is formed between three adjacent LED wicks.

[0021] Specific, combined Figure 2 As shown, three LED lamp wicks 2 form a herringbone structure, wherein two of the LED lamp wicks 2 are arranged in the same row, namely the first LED lamp wick 21 and the second LED lamp wick 22; the other LED lamp wick, that is, the third LED lamp wick 23 is located in an adjacent row of the first LED lamp wick 21 and the second LED lamp wick 22, and is located on the median of the line connecting the two LED lamp wicks 21 and 22.

[0022] In this embodiment, when the power and size of the LED wick 2 are constant, the LED wick arrangement structure is changed, and a herringbone arrangement structure is achieved through a staggered arrangement method, thereby increasing the distance between two adjacent LED wicks 2, thereby expanding the dielectric body area of ​​the LED wick heat dissipation, thereby reducing the heat flux density, enhancing the heat molecular transfer and outward heat radiation capabilities, improving the heat dissipation effect, preventing the LED wick from failing due to concentrated heat overload, and extending the service life of the LED wick.

[0023] Preferably, in this embodiment, the distance between the first LED wick 21 and the second LED wick 22 adjacent to each other in the same row is 2a, and the distance between the third LED wick 23 and the first LED wick 21 and the second LED wick 22 is b, where 2a≥b. In other embodiments, 2a may also be less than b.

[0024] This LED wick arrangement structure can expand the number of LED wicks 2 to a greater number, forming multiple rows and columns, and forming an LED wick matrix according to the above-mentioned herringbone arrangement structure.

[0025] The LED wicks 2 can be connected in series, in parallel, or in a combination of series and parallel. Specifically, the LED wicks 2 are electrically connected with the positive pole connected to the positive pole of the power supply and the negative pole connected to the negative pole of the power supply. A series connection of two LED wicks connects the positive pole to the negative pole, and a parallel connection connects the positive pole to the positive pole and the negative pole to the negative pole.

[0026] In this embodiment, the substrate 1 is made of aluminum, but is not limited to aluminum in other embodiments.

[0027] The LED lamp cores 2 are connected by wires and are connected to an external power source to emit light.

[0028] The present invention uses specific embodiments to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. An LED lamp wick arrangement structure with high heat dissipation, characterized in that: The invention comprises a substrate and several LED lamp cores mounted on the substrate. The LED lamp cores are arranged into at least two rows. The LED lamp cores in two adjacent rows are staggered with each other so that a herringbone structure is formed between three adjacent LED lamp cores.

2. The LED lamp wick arrangement structure with high heat dissipation according to claim 1, characterized in that: The three LED lamp wicks form a herringbone shape, wherein two of the LED lamp wicks are arranged in the same row, and the other LED lamp wick is located in an adjacent row of the two LED lamp wicks and is located on the mid-perpendicular line connecting the two LED lamp wicks.

3. The LED lamp wick arrangement structure with high heat dissipation according to claim 2, characterized in that: The distance between two adjacent LED wicks in the same row is 2a, and the distance between the third LED wick and the two adjacent LED wicks is b, wherein 2a≥b.

4. The LED lamp wick arrangement structure with high heat dissipation according to claim 1, characterized in that: The LED lamp cores are arranged in a matrix.

5. The LED lamp wick arrangement structure with high heat dissipation according to claim 1, characterized in that: The LED lamp cores may be connected in series or in parallel, or in a series-parallel composite connection.

6. The LED lamp wick arrangement structure with high heat dissipation according to claim 5, characterized in that: The electrical connection method of the LED lamp core is that the positive pole is connected to the positive pole of the power supply, and the negative pole is connected to the negative pole of the power supply. The two LED lamp cores are connected in series with the positive pole connected to the negative pole, and the two LED lamp cores are connected in parallel with the positive pole connected to the positive pole and the negative pole connected to the negative pole.

7. The LED lamp wick arrangement structure with high heat dissipation according to claim 1, characterized in that: The substrate is made of aluminum.

8. The LED lamp wick arrangement structure with high heat dissipation according to claim 1, characterized in that: The LED lamp cores are connected by wires and are connected to an external power source to emit light.

Citation Information

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