Flower basket throwing mechanism and silicon wafer cleaning line
By optimizing the process and equipment structure of the silicon wafer cleaning line, efficient utilization of the drying tank heat is achieved, and the load capacity of the flower basket is increased, which solves the problems of high energy consumption and low cleaning efficiency in the existing technology, and improves the overall performance of the cleaning line.
Patent Information
- Application Number
- CN202422329968.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-09-24
AI Technical Summary
The existing silicon wafer cleaning line has insufficient heat recovery and utilization in the drying tank, high energy consumption, and a small load capacity of the throwing mechanism flower basket, which has low cleaning efficiency.
The process method of parallel alkaline washing tank, chemical tank and series rinsing tank is adopted, combined with high-temperature air energy to collect heat from the drying tank, increase the load capacity of the flower basket throwing mechanism, realize the up and down movement of the flower basket through mechanical mechanism, and optimize water resource utilization and energy consumption management.
It improves the cleaning efficiency of silicon wafers, reduces energy consumption, increases the load capacity of the flower basket, and improves the production capacity of the cleaning line and the water resource utilization efficiency.
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Figure CN223264408U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of photovoltaics, in particular to a flower basket throwing mechanism and a silicon wafer cleaning line. Background Art
[0002] After silicon wafers are sliced through a slicer in the photovoltaic industry, contaminants remain on their surfaces. These contaminants are then cleaned in a wafer cleaning line. This line includes a rinse tank, an alkaline cleaning tank, a chemical tank, and a drying tank. Debonded silicon wafers are placed in a basket, which carries them between the tanks for cleaning.
[0003] The drying tank generates a large amount of heat when working. The existing cleaning line does not effectively recycle this heat. The hot water used in the cleaning process is still heated electrically, resulting in high energy consumption.
[0004] Each tank is equipped with a basket-tossing mechanism, a mechanical mechanism that allows the basket to float up and down. The basket is placed on the mechanism, which drives the basket up and down, constantly moving in the water, improving the wafer cleaning effect. However, due to structural limitations, existing basket-tossing mechanisms can only accommodate a limited number of baskets at a time, which reduces the wafer cleaning efficiency of the cleaning line.
[0005] The above information disclosed in this background technology is only used to increase the understanding of the background technology of this application. Therefore, it may contain information that does not constitute the prior art known to ordinary technicians in this field. Summary of the Invention
[0006] In response to the problems pointed out in the background technology, the utility model proposes a flower basket throwing mechanism and a silicon wafer cleaning line, which improves the flower basket carrying capacity of the throwing mechanism, improves the silicon wafer cleaning efficiency, fully utilizes the heat of the drying tank, and reduces energy consumption.
[0007] In order to achieve the above-mentioned purpose of the utility model, the utility model adopts the following technical solutions:
[0008] In some embodiments, a flower basket tossing mechanism is provided, comprising:
[0009] Drive motor;
[0010] a first drive shaft connected to the drive motor, the first drive shaft extending along a first direction, and first bevel gears being respectively provided at both ends of the first drive shaft;
[0011] Two second drive shafts, each of the second drive shafts extending along a second direction, each of the second drive shafts being provided with a second bevel gear at one end, the first bevel gear being meshed with the second bevel gear;
[0012] An eccentric wheel, wherein two eccentric wheels arranged at intervals are provided on any of the second drive shafts;
[0013] A fixing portion, fixedly arranged in the space where the throwing mechanism is located;
[0014] a lifting portion, the lifting portion passing through the fixing portion, the lower end of the lifting portion being close to the eccentric wheel, and the lifting portion being configured to be lifted and lowered under the drive of the eccentric wheel;
[0015] a crossbeam fixedly connected to the upper end of the lifting portion, the crossbeam extending along the first direction;
[0016] A plurality of bearing parts are connected to the crossbeam, the plurality of bearing parts are arranged in sequence along the length direction of the crossbeam, and the bearing parts are configured to bear flower baskets.
[0017] In some embodiments, a linear bearing is provided on the fixing portion, and the lifting portion passes through the linear bearing.
[0018] In some embodiments, the bearing portion includes an extension portion, and the extension portion is fixedly connected to the beam.
[0019] In some embodiments, a connecting rod is provided between the two beams, and the connecting rod extends along the second direction.
[0020] In some embodiments, a silicon wafer cleaning line is provided, comprising:
[0021] A temporary storage tank, at least two first rinsing tanks, multiple first alkali washing tanks, multiple second alkali washing tanks, at least two second rinsing tanks, at least two chemical tanks, multiple third rinsing tanks, at least two pulling tanks, and multiple drying tanks are arranged in sequence;
[0022] The temporary storage tank is configured to place a flower basket containing silicon wafers;
[0023] The flower basket in the temporary storage tank is moved by a robot in sequence into a portion of the first rinsing tank, the multiple first alkaline washing tanks, a portion of the second rinsing tank, a portion of the chemical tank, the multiple third rinsing tanks, a portion of the pulling tank, and one of the multiple drying tanks;
[0024] The flower basket in the temporary storage tank is moved by a robot in sequence into another part of the first rinsing tank, the multiple second alkaline washing tanks, another part of the second rinsing tank, another part of the chemical tank, the multiple third rinsing tanks, another part of the pulling tank, and one of the multiple drying tanks;
[0025] The first water tank is provided at the sides of the plurality of drying tanks to absorb heat from the air around the drying tanks. The first water tank is configured to supply water to the water modules in the washing line.
[0026] In some embodiments, the washing line further includes a second water tank, which draws water from the first water tank, and the second water tank is configured to provide hot water to the pull tank.
[0027] In some embodiments, the washing line further includes a discharge table, which is arranged downstream of the drying tank. The discharge table is configured to place multiple rows of flower baskets. A cooling fan is provided on the discharge table, and the cooling fan is configured to cool the flower baskets.
[0028] In some embodiments, the cleaning line includes a temporary storage tank, two first rinsing tanks, two second rinsing tanks, two chemical tanks, and two pulling tanks.
[0029] In some embodiments, the washing line further comprises a first conveying line and a second conveying line, wherein the first conveying line is configured to convey empty flower baskets, and the second conveying line is configured to convey fully loaded flower baskets;
[0030] The flower baskets on the second conveyor line are moved into the temporary storage tank by a robot.
[0031] In some embodiments, a throwing mechanism is provided in the groove for placing the flower basket on the washing line, and the throwing mechanism is configured to drive the flower basket to rise and fall, and the throwing mechanism is the throwing mechanism described above.
[0032] Compared with the prior art, the advantages and positive effects of the present invention are:
[0033] In the silicon wafer cleaning line disclosed herein, the alkaline cleaning tank and the chemical tank adopt a parallel process mode, and the rinse tank adopts a series process mode. Under the condition that the original chemical process time remains unchanged, the cleaning efficiency of the whole machine can be doubled, thereby improving production capacity.
[0034] The silicon wafer cleaning line adopts rear overflow, and the overflow water runs through all the non-chemical tanks in the front, reducing water consumption.
[0035] First, high-temperature air energy is used to collect heat radiated from the drying tank. The primary water tank has a large capacity. Water from the primary tank is prioritized during each water change in the washing line. Automated water control logic adjusts hot and cold water to the desired process temperature, reducing power consumption for electric heating elements and saving energy.
[0036] In the flower basket tossing mechanism, the drive motor, first drive shaft, lift unit, and crossbeam are located on the sides of the support structure. The two second drive shafts are located below the support structure, resulting in a compact layout. Lift units are located at each end of the support structure, ensuring smooth up and down movement. The tossing mechanism provides a large flower basket load capacity.
[0037] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0039] Figure 1 is a schematic diagram of a silicon wafer cleaning line according to some embodiments;
[0040] Figure 2 is a structural diagram of a throwing mechanism according to some embodiments;
[0041] Reference numerals:
[0042] 110, temporary storage tank; 120, first rinsing tank; 130, first alkali washing tank; 140, second alkali washing tank; 150, second rinsing tank; 160, chemical tank; 170, third rinsing tank; 180, pulling tank; 190, drying tank;
[0043] 210, unloading platform; 220, first conveyor line; 230, second conveyor line; 240, inserting machine;
[0044] 310, first water tank; 320, second water tank;
[0045] 400, throwing mechanism; 410, driving motor; 420, first driving shaft; 421, first bevel gear; 430, second driving shaft; 431, second bevel gear; 440, eccentric wheel; 450, lifting unit; 460, fixing unit; 461, linear bearing; 470, crossbeam; 480, bearing unit; 481, extension unit; 490, connecting rod;
[0046] 500. Flower basket. DETAILED DESCRIPTION
[0047] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0048] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.
[0049] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout this application, unless otherwise specified, "plurality" means two or more.
[0050] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0051] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0052] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will recognize the application of other processes and / or the use of other materials.
[0053] In some embodiments, a silicon wafer cleaning line is provided, referring to Figure 1 It includes a temporary storage tank 110, at least two first rinsing tanks 120, multiple first alkaline washing tanks 130, multiple second alkaline washing tanks 140, at least two second rinsing tanks 150, at least two chemical tanks 160, multiple third rinsing tanks 170, at least two pulling tanks 180, and multiple drying tanks 190 arranged in sequence.
[0054] The temporary storage tank 110 is configured to place a flower basket 500 containing silicon wafers.
[0055] The flower basket 500 in the temporary storage tank 110 is moved by the robot in sequence into a portion of the first rinsing tank 120, multiple first alkaline washing tanks 130, a portion of the second rinsing tank 150, a portion of the chemical tank 160, multiple third rinsing tanks 170, a portion of the pulling tank 180, and one of the multiple drying tanks 190.
[0056] The flower basket 500 in the temporary storage tank 110 is moved by the robot in sequence into another part of the first rinsing tank 120, multiple second alkaline washing tanks 140, another part of the second rinsing tank 150, another part of the chemical tank 160, multiple third rinsing tanks 170, another part of the pulling tank 180, and one of the multiple drying tanks 190.
[0057] In other words, after the temporary storage tank 110 is filled with flower baskets 500, the robot moves all the flower baskets 500 into a portion of the first rinsing tank 120, and then they are sequentially transferred to the subsequent cleaning process; then new flower baskets 500 are loaded into the temporary storage tank 110, and the newly loaded flower baskets 500 are moved by the robot into another portion of the first rinsing tank 120, and then they are sequentially transferred to the subsequent cleaning process.
[0058] In a specific embodiment, the cleaning line includes a temporary storage tank 110 , two first rinsing tanks 120 , two second rinsing tanks 150 , two chemical tanks 160 , and two pulling tanks 180 .
[0059] Specifically, the silicon wafer cleaning line includes a temporary storage tank 110 (recorded as tank 0), two first rinsing tanks 120 (recorded as tank 1# and tank 2# respectively), three first alkaline washing tanks 130 (recorded as tank 3#, tank 4# and tank 5# respectively), three second alkaline washing tanks 140 (recorded as tank 6#, tank 7# and tank 8# respectively), two second rinsing tanks 150 (recorded as tank 9# and tank 10# respectively), two chemical tanks 160 (recorded as tank 11# and tank 12# respectively), six third rinsing tanks 170 (recorded as tank 13#, tank 14#, tank 15#, tank 16#, tank 17# and tank 18# respectively), two pulling tanks 180 (recorded as tank 19# and tank 20# respectively), and four drying tanks 190 (recorded as tank 21#, tank 22#, tank 23# and tank 24# respectively).
[0060] The silicon wafer cleaning process includes:
[0061] The flower basket 500 containing silicon wafers is moved by the robot into the 0# slot for temporary storage;
[0062] After the flower baskets 500 in the 0# tank are full, the gantry truss robot moves the flower baskets 500 in the tank into the 1# tank or 2# tank for pre-cleaning;
[0063] The flower baskets 500 in the 1# tank are then sequentially placed in the 3# tank, 4# tank, and 5# tank for alkali washing; the flower baskets 500 in the 2# tank are then sequentially placed in the 6# tank, 7# tank, and 8# tank for alkali washing; the 3# tank, 4# tank, 5# tank and the 6# tank, 7# tank, and 8# tank are arranged in parallel and have the same functions;
[0064] The flower baskets 500 in tank 5 then enter tanks 9#, 11#, and 13# in sequence. Tank 9# is a rinse tank to rinse away the chemical components in the previous tank. Tank 11# is a chemical tank 160 to clean the silicon wafers with chemical agents. Tank 13# is a rinse tank. The flower baskets 500 in tank 8# then enter tanks 10#, 12#, and 13# in sequence. Tank 10# has the same function as tank 9#, and tank 12# has the same function as tank 11#.
[0065] Starting from 13# tank, it enters 14# tank, 15# tank, 16# tank, 17# tank and 18# tank in sequence. 13# tank to 18# tank have the same function, which are all rinsing tanks. The flower basket 500 passes through each tank in turn.
[0066] The flower basket 500 then enters the 19# or 20# tanks. The 19# and 20# tanks have the same function, which is a slow-pulling structure. The temperature of the tank is relatively high. The silicon wafers are immersed in this high-temperature water and the flower basket 500 is pulled out of the water at a certain angle to reduce the adhesion of water on the silicon wafers.
[0067] The flower basket 500 then enters slot 21#, slot 22#, slot 23#, or slot 24# respectively. Slot 21#, slot 22#, slot 23#, and slot 24# have the same function, which is drying slot 190. The silicon wafers placed in the slot are dried by hot air circulation.
[0068] In the silicon wafer cleaning line disclosed herein, the alkaline cleaning tank and the chemical tank 160 adopt a parallel process mode, and the rinsing tank adopts a series process mode. Under the condition that the original chemical process time remains unchanged, the cleaning efficiency of the whole machine can be doubled, thereby improving production capacity.
[0069] In some embodiments, tanks 13# to 18#, as well as tanks 19# and 20#, use a step-by-step overflow method to improve the cleaning effect. The overflow direction of tanks 19# and 20# follows the direction of tanks 18#, 17#, 16#, 15#, 14#, and 13#, respectively, so that the water in the latter tank is always cleaner than the previous tank.
[0070] Tanks 9# and 10# are rinsing tanks, which use the overflow water of tank 13# respectively. Tanks 1# and 2# use the overflow water of tank 9# and tank 10# respectively, which achieves the purpose of rinsing and saves water.
[0071] The silicon wafer cleaning line adopts rear overflow, and the overflow water runs through all the non-chemical tanks 160 in the front, reducing water consumption.
[0072] In some embodiments, the silicon wafer cleaning line further includes a first water tank 310, which is positioned adjacent to the drying tanks 190. The first water tank 310 absorbs heat from the air surrounding the drying tanks 190, heating the water within the first water tank 310. The first water tank 310 is configured to supply water to a water module within the cleaning line, such as a cleaning tank.
[0073] The first water tank 310 uses high-temperature air energy to collect heat radiated from the drying tank 190. The first water tank 310 has a large capacity. During each water change in the washing line, water from the first water tank is preferentially used. Automated water control logic adjusts hot and cold water to the desired process temperature, reducing power consumption by the electric heating tubes and saving energy.
[0074] In some embodiments, the silicon wafer cleaning line further includes a second water tank 320 . The second water tank 320 draws water from the first water tank 310 and is configured to provide hot water to the pulling tank 180 .
[0075] The second water tank 320 draws water from the first water tank 310 and quickly heats it to the process temperature for use in the pulling tank 180.
[0076] In some embodiments, the cleaning line further includes a first conveyor line 220 and a second conveyor line 230. The first conveyor line 220 is configured to convey empty flower baskets 500, and the second conveyor line 230 is configured to convey fully loaded flower baskets 500. The flower baskets 500 on the second conveyor line 230 are moved into the temporary storage tank 110 by a robot.
[0077] In some embodiments, the silicon wafer cleaning line also includes a discharge table 210, which is arranged downstream of the drying tank 190. The discharge table 210 is configured to place multiple rows of flower baskets 500. A cooling fan is provided on the discharge table 210, and the cooling fan is configured to cool the flower baskets 500.
[0078] The unloading platform 210 uses a belt conveyor to load the flower baskets 500 removed from the drying tank 190. For example, four rows of flower baskets 500 can be placed on the unloading platform 210. One or two sets of cooling fans are installed in the two middle rows to reduce the temperature of the flower baskets 500 and the silicon wafers. The last row of the unloading belt conveyor is the basket grabbing position for the next process. From this position, the robot grabs the flower baskets 500 one by one and enters the sorting process.
[0079] The robot places the sorted empty flower baskets 500 on the first conveyor line 220, and the first conveyor line 220 sends the empty flower baskets 500 one by one to the upper process of the cleaning machine, that is, the inserting machine 240 position, to realize the circulation of the flower baskets 500.
[0080] In some embodiments, an ultrasonic vibration plate is provided in each process tank. The vibration plate creates a cavitation effect in the water and, combined with the reagents in the tank, improves the cleaning effect of the silicon wafer.
[0081] In some embodiments, each process tank on the cleaning line for placing the flower basket 500 is provided with a throwing mechanism 400 , and the throwing mechanism 400 is configured to drive the flower basket 500 to rise and fall.
[0082] The tossing mechanism 400 is a mechanical mechanism that can float up and down. The flower basket 500 is placed on the tossing mechanism 400. The tossing mechanism 400 drives the flower basket 500 to move up and down, so that the flower basket 500 is always in a moving state in the water, fully contacting the microbubbles generated by the ultrasonic vibration plate, thereby improving the cavitation effect.
[0083] In some embodiments, reference Figure 2 The throwing mechanism 400 includes a driving motor 410.
[0084] The throwing mechanism 400 includes a first driving shaft 420. The first driving shaft 420 is connected to the driving motor 410, and the first driving shaft 420 extends along a first direction. First bevel gears 421 are respectively provided at both ends of the first driving shaft 420.
[0085] The throwing mechanism 400 includes two second drive shafts 430. Each second drive shaft 430 extends along the second direction. A second bevel gear 431 is provided at one end of each second drive shaft 430. The first bevel gear 421 meshes with the second bevel gear 431. The first direction is perpendicular to the second direction.
[0086] The throwing mechanism 400 includes an eccentric wheel 440. Two eccentric wheels 440 are arranged at intervals on any second driving shaft 430.
[0087] The throwing mechanism 400 includes a fixing portion 460. The fixing portion 460 is fixedly disposed in the space where the throwing mechanism 400 is located, for example, the fixing portion 460 is fixedly disposed inside the process tank.
[0088] The throwing mechanism 400 includes a lifting portion 450. The lifting portion 450 is connected to the fixing portion 460. The lower end of the lifting portion 450 is close to the eccentric wheel 440. The lifting portion 450 is configured to be raised and lowered under the drive of the eccentric wheel 440. The lifting portion 450 is, for example, a lifting rod structure.
[0089] The throwing mechanism 400 includes a crossbeam 470. The crossbeam 470 is fixedly connected to the upper end of the lifting portion 450, and the crossbeam 470 extends along the first direction.
[0090] The throwing mechanism 400 includes a plurality of supporting parts 480. The supporting parts 480 are connected to the crossbeam 470 and are arranged in sequence along the length direction of the crossbeam 470. The supporting parts 480 are configured to support the flower basket 500.
[0091] When in use, the flower basket 500 is placed on the bearing part 480, and the drive motor 410 is started. The drive motor 410 drives the first drive shaft 420 to rotate, and through the cooperation between the first bevel gear 421 and the second bevel gear 431, drives the two second drive shafts 430 to rotate, and the second drive shafts 430 drive the eccentric wheel 440 to rotate, and the eccentric wheel 440 drives the lifting part 450 to move up and down, and the lifting part 450 drives the crossbeam 470 to move up and down, and the crossbeam 470 drives the bearing part 480 to move up and down, thereby realizing the up and down movement of the flower basket 500.
[0092] The driving motor 410 , the first driving shaft 420 , the lifting portion 450 and the crossbeam 470 are located on the side of the supporting portion 480 , and the two second driving shafts 430 are located below the supporting portion 480 , resulting in a compact spatial layout.
[0093] The lifting parts 450 are respectively provided at both ends of the supporting part 480, so that the supporting part 480 can move up and down smoothly.
[0094] The flower basket 500 of the throwing mechanism 400 has a large carrying capacity. For example, the throwing mechanism 400 can accommodate three carrying parts 480 .
[0095] In some embodiments, a linear bearing 461 is provided on the fixing portion 460 , and the lifting portion 450 passes through the linear bearing 461 .
[0096] A linear bearing 461 is provided at a position of the lifting portion 450 via the fixing portion 460 to restrict the up and down movement of the lifting portion 450 .
[0097] In some embodiments, the load-bearing portion 480 is a frame structure, and the load-bearing portion 480 includes an extension portion 481. The extension portion 481 is arranged on the top of the load-bearing portion 480 and extends toward the outside of the load-bearing portion 480. The extension portion 481 is fixedly connected to the beam 470 to achieve fixed installation of the load-bearing portion 480 on the load-bearing portion 480.
[0098] In some embodiments, a connecting rod 490 is provided between the two cross beams 470 , and the connecting rod 490 extends along the second direction, which helps to improve the stability of the structure.
[0099] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.
[0100] The above are only specific embodiments of the present invention, but the scope of protection of the present invention is not limited to them. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this utility model should be included in the scope of protection of the present utility model. Therefore, the scope of protection of the present utility model should be based on the scope of protection of the claims.
Claims
1. A flower basket throwing mechanism, characterized in that: include: Drive motor; a first drive shaft connected to the drive motor, the first drive shaft extending along a first direction, and first bevel gears being respectively provided at both ends of the first drive shaft; Two second drive shafts, each of the second drive shafts extending along a second direction, each of the second drive shafts being provided with a second bevel gear at one end, the first bevel gear being meshed with the second bevel gear; An eccentric wheel, wherein two eccentric wheels arranged at intervals are provided on any of the second drive shafts; A fixing portion, fixedly arranged in the space where the throwing mechanism is located; a lifting portion, the lifting portion passing through the fixing portion, the lower end of the lifting portion being close to the eccentric wheel, and the lifting portion being configured to be lifted and lowered under the drive of the eccentric wheel; a crossbeam fixedly connected to the upper end of the lifting portion, the crossbeam extending along the first direction; A plurality of bearing parts are connected to the crossbeam, the plurality of bearing parts are arranged in sequence along the length direction of the crossbeam, and the bearing parts are configured to bear flower baskets.
2. The flower basket throwing mechanism according to claim 1, characterized in that: A linear bearing is provided on the fixing portion, and the lifting portion passes through the linear bearing.
3. The flower basket throwing mechanism according to claim 1, characterized in that: The bearing portion includes an extension portion, and the extension portion is fixedly connected to the crossbeam.
4. The flower basket throwing mechanism according to claim 1, characterized in that: A connecting rod is provided between the two cross beams, and the connecting rod extends along the second direction.
5. A silicon wafer cleaning line, characterized in that: Includes: A temporary storage tank, at least two first rinsing tanks, multiple first alkali washing tanks, multiple second alkali washing tanks, at least two second rinsing tanks, at least two chemical tanks, multiple third rinsing tanks, at least two pulling tanks, and multiple drying tanks are arranged in sequence; The temporary storage tank is configured to place a flower basket containing silicon wafers; The flower basket in the temporary storage tank is moved by a robot in sequence into a portion of the first rinsing tank, the multiple first alkaline washing tanks, a portion of the second rinsing tank, a portion of the chemical tank, the multiple third rinsing tanks, a portion of the pulling tank, and one of the multiple drying tanks; The flower basket in the temporary storage tank is moved by a robot in sequence into another part of the first rinsing tank, the multiple second alkaline washing tanks, another part of the second rinsing tank, another part of the chemical tank, the multiple third rinsing tanks, another part of the pulling tank, and one of the multiple drying tanks; The first water tank is provided at the sides of the plurality of drying tanks to absorb heat from the air around the drying tanks. The first water tank is configured to supply water to the water modules in the washing line.
6. The silicon wafer cleaning line according to claim 5, characterized in that: The cleaning line further includes a second water tank, which draws water from the first water tank and is configured to provide hot water to the pull tank.
7. The silicon wafer cleaning line according to claim 5, characterized in that: The washing line also includes a feeding table, which is arranged downstream of the drying tank. The feeding table is configured to place multiple rows of flower baskets. A cooling fan is provided on the feeding table, and the cooling fan is configured to cool the flower baskets.
8. The silicon wafer cleaning line according to claim 5, characterized in that: The cleaning line includes a temporary storage tank, two first rinsing tanks, two second rinsing tanks, two chemical tanks, and two pulling tanks.
9. The silicon wafer cleaning line according to claim 5, characterized in that: The cleaning line further includes a first conveying line and a second conveying line, wherein the first conveying line is configured to convey empty flower baskets, and the second conveying line is configured to convey fully loaded flower baskets; The flower baskets on the second conveyor line are moved into the temporary storage tank by a robot.
10. The silicon wafer cleaning line according to any one of claims 5 to 9, characterized in that: A throwing mechanism is provided in the groove for placing the flower basket on the washing line, and the throwing mechanism is configured to drive the flower basket to rise and fall. The throwing mechanism is the throwing mechanism according to any one of claims 1 to 4.