Fixing clamp convenient for cutting quartz wafer
By designing a combined clamping device for worm and worm wheel rotating plate, the problem that existing quartz wafer cutting fixtures cannot be adjusted is solved, and clamping and angle adjustment of wafers of different thicknesses is achieved, which improves cutting flexibility and adaptability.
Patent Information
- Application Number
- CN202422368360.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-09-27
AI Technical Summary
The existing quartz wafer cutting fixtures can only clamp wafers of the same thickness, and cannot adjust the cutting angle according to actual needs, and have a single function.
A quartz wafer cutting and fixing fixing fixture including a clamping device is designed. Through the combination of worm, worm gear and rotating plate, the clamping and fixing of wafers of different thicknesses is realized, and the angle of the clamping plate is adjusted by rotating the worm to meet the multi-angle cutting needs.
It realizes flexible clamping and angle adjustment of quartz wafers of different thicknesses, meets diverse cutting needs, and improves the functionality and flexibility of the fixture.
Smart Images

Figure CN223266002U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of quartz wafers, and particularly relates to a fixture for quartz wafer cutting and fixing. Background Art
[0002] Quartz is a mineral composed of silicon dioxide and is one of the common rock-forming minerals in the earth's crust. There are many types of quartz, including low-temperature quartz, high-temperature quartz, etc. Among them, low-temperature quartz is the most widely distributed. Its physical and chemical properties are very stable, with glass luster and high hardness, and its specific gravity is between 2.22-2.65.
[0003] The existing quartz wafer cutting and fixing fixture places the quartz wafer on a placement plate for cutting. However, the existing quartz wafer cutting and fixing fixture can only clamp and fix quartz wafers of the same thickness. Moreover, when the quartz wafer is being cut, the cutting angle of the quartz wafer cannot be adjusted according to actual needs. As a result, the existing quartz wafer cutting and fixing fixture has a single function and cannot flexibly meet the cutting requirements of different angles. Therefore, a quartz wafer cutting and fixing fixture is needed to solve the above problems. Utility Model Content
[0004] The purpose of the utility model is to provide a fixture for quartz wafer cutting to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a fixture for quartz wafer cutting, comprising a base, a cutting table is provided on the top of the base, a clamping device is provided on one side of the cutting table, the clamping device comprises a limit plate, the limit plate is fixedly connected to the cutting table, a worm is rotatably connected inside the limit plate, one end of the worm is fixedly connected to a rotating handle, the other end of the worm is rotatably connected to a bearing, the other side of the cutting table is fixedly connected to a fixing plate, the fixing plate is fixedly connected to the bearing, the surface of the worm is meshed with a worm gear, one side of the worm gear is fixedly connected to a rotating rod, the rotating rod is opened inside the cutting table, the rotating rod is rotatably connected to the cutting table, one side of the rotating rod is fixedly connected to the rotating plate, one side of the rotating plate is fixedly connected to the first clamping plate, the The top of the L-shaped plate is fixedly connected to the top plate, and the bottom of the top plate is fixedly connected to the telescopic rod, one end of the telescopic rod is fixedly connected to the top of the second clamping plate, and the surface of the telescopic rod is sleeved with a spring, and one end of the spring is fixedly connected to the top of the second clamping plate. One side of the cutting table is fixedly connected to two fixed blocks, one side of the two fixed blocks is fixedly connected to a guide ring, and the surface of the guide ring is slidably connected to a slip ring, and the slip ring is fixedly connected to the rotating plate, and one side of the cutting table is fixedly connected to two placement plates.
[0006] By setting the above structure, the first clamping plate is moved. When the first clamping plate is moved to a position where it can clamp quartz wafers of different thicknesses, the first clamping plate and the second clamping plate can clamp and fix the quartz wafer, so that the quartz wafer cutting and fixing fixture can clamp and fix quartz wafers of different thicknesses, and the function is more comprehensive. Then, holding the rotating handle and rotating the worm, the rotating plate will also rotate. The rotation of the rotating plate can drive the first clamping plate, the second clamping plate and the quartz wafer clamped by the two to adjust the angle, thereby realizing the angle adjustment of the quartz wafer, so that the quartz wafer cutting and fixing fixture can adjust the cutting angle of the quartz wafer according to actual cutting requirements, making the quartz wafer cutting and fixing fixture more flexible.
[0007] As a preferred solution, a cutter body is provided on the top of the base.
[0008] As a preferred solution, an adjustment rod is provided on one side of the cutter body.
[0009] As a preferred solution, a cutting edge is provided on one side of the adjusting rod.
[0010] As a preferred solution, a water pipe is provided inside the cutter body.
[0011] As a preferred solution, a driving motor is provided on the top of the cutter body.
[0012] By setting the slide groove, dovetail slider, guide ring and slip ring, the slide groove can provide a limiting function for the dovetail slider slidingly connected to the inner wall of the slide groove, and the guide ring can provide a guiding function for the slip ring sliding on the surface of the guide ring.
[0013] Compared with the prior art, the beneficial effects of the present invention are:
[0014] The utility model provides a first clamping plate, a second clamping plate, a worm and a rotating plate, and moves the first clamping plate. When the first clamping plate is moved to be able to clamp quartz wafers of different thicknesses, the first clamping plate and the second clamping plate can clamp and fix the quartz wafer, so that the quartz wafer cutting and fixing fixture can clamp and fix quartz wafers of different thicknesses, and the function is more comprehensive. Then, the rotating handle is held and the worm is rotated, and the rotating plate will also rotate. The rotation of the rotating plate can drive the first clamping plate, the second clamping plate and the quartz wafer clamped by the two to adjust the angle, thereby realizing the angle adjustment of the quartz wafer, so that the quartz wafer cutting and fixing fixture can adjust the cutting angle of the quartz wafer according to actual cutting requirements, making the quartz wafer cutting and fixing fixture more flexible.
[0015] The utility model provides a slide groove, a dovetail slider, a guide ring and a slip ring, so that the slide groove can provide a limiting function for the dovetail slider slidingly connected to the inner wall of the slide groove, and the guide ring can provide a guiding function for the slip ring sliding on the surface of the guide ring. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;
[0017] Figure 2 This is a schematic diagram of the three-dimensional structure of the cutter body of the utility model when viewed from the front;
[0018] Figure 3 This is a schematic diagram of the three-dimensional structure of the clamping device of the utility model from the right side;
[0019] Figure 4 This is a schematic diagram of the three-dimensional structure of the clamping device of the utility model from the left side
[0020] Figure 5 For this utility model Figure 4 Schematic diagram of the structure enlarged at point A
[0021] In the figure: 1. Base; 2. Cutter body; 3. Adjusting rod; 4. Cutting blade; 5. Water pipe; 6. Driving motor; 7. Cutting table; 8. Clamping device; 801. Limiting plate; 802. Worm; 803. Rotating handle; 804. Bearing; 805. Fixed plate; 806. Worm gear; 807. Rotating rod; 808. Rotating plate; 809. First clamping plate; 810. Second clamping plate; 811. Rubber pad; 812. Slide groove; 813. Dovetail slider; 814. L-shaped plate; 815. Top plate; 816. Telescopic rod; 817. Spring; 818. Fixed block; 819. Guide ring; 820. Slip ring; 9. Placement plate. DETAILED DESCRIPTION
[0022] The present invention will be further described below with reference to the embodiments.
[0023] The following examples are intended to illustrate the present invention and are not intended to limit the scope of protection of the present invention. The conditions in the examples may be further adjusted according to specific conditions. Simple improvements to the method of the present invention based on the concept of the present invention fall within the scope of protection claimed by the present invention.
[0024] See also Figure 1-5The utility model provides a fixing fixture for quartz wafer cutting, comprising a base 1, a cutting table 7 is provided on the top of the base 1, a clamping device 8 is provided on one side of the cutting table 7, the clamping device 8 comprises a limit plate 801, the limit plate 801 is fixedly connected to the cutting table 7, a worm 802 is rotatably connected inside the limit plate 801, one end of the worm 802 is fixedly connected to a rotating handle 803, the other end of the worm 802 is rotatably connected to a bearing 804, the other side of the cutting table 7 is fixedly connected to a fixing plate 805, the fixing plate 805 is fixedly connected to the bearing 804, the surface of the worm 802 is meshedly connected to a worm gear 806, one side of the worm gear 806 is fixedly connected to a rotating rod 807, and the rotating rod 807 is opened. The rotating rod 807 is arranged inside the cutting table 7, and is rotatably connected to the cutting table 7. A rotating plate 808 is fixedly connected to one side of the rotating rod 807, and a first clamping plate 809 is fixedly connected to one side of the rotating plate 808. A second clamping plate 810 is provided on one side of the rotating plate 808, and a rubber pad 811 is fixedly connected to the bottom of the second clamping plate 810. A sliding groove 812 is provided inside the rotating plate 808, and a dovetail slider 813 is slidably connected to the inner wall of the sliding groove 812. The dovetail slider 813 is fixedly connected to the second clamping plate 810. An L-shaped plate 814 is fixedly connected to one side of the rotating plate 808, and a top plate 815 is fixedly connected to the top of the top plate 815. The bottom of the telescopic rod 810 is fixedly connected to the top plate 815. 16, one end of the telescopic rod 816 is fixedly connected to the top of the second clamping plate 810, the surface of the telescopic rod 816 is provided with a spring 817, one end of the spring 817 is fixedly connected to the top of the second clamping plate 810, one side of the cutting table 7 is fixedly connected to two fixed blocks 818, one side of the two fixed blocks 818 is fixedly connected to a guide ring 819, the surface of the guide ring 819 is slidably connected to a slip ring 820, the slip ring 820 is fixedly connected to the rotating plate 808, one side of the cutting table 7 is fixedly connected to two placing plates 9, by setting the first clamping plate 809, the second clamping plate 810, the worm 802 and the rotating plate 808, the first clamping plate 809 is moved, and when the first clamping plate 809 moves to the position where it can When quartz wafers of different thicknesses can be clamped, the first clamping plate 809 and the second clamping plate 810 can clamp and fix the quartz wafers, so that the quartz wafer cutting and fixing fixture can clamp and fix quartz wafers of different thicknesses, and the function is more comprehensive. Then hold the rotating handle 803 and rotate the worm 802, and the rotating plate 808 will also rotate. The rotation of the rotating plate 808 can drive the first clamping plate 809, the second clamping plate 810 and the quartz wafer clamped by the two to adjust the angle, thereby realizing the angle adjustment of the quartz wafer, so that the quartz wafer cutting and fixing fixture can adjust the cutting angle of the quartz wafer according to the actual cutting requirements, making the quartz wafer cutting and fixing fixture more flexible.
[0025] A cutter body 2 is provided on the top of the base 1 .
[0026] An adjusting rod 3 is provided on one side of the cutter body 2 .
[0027] A cutting edge 4 is provided on one side of the adjusting rod 3 .
[0028] A water pipe 5 is provided inside the cutter body 2 .
[0029] A driving motor 6 is provided on the top of the cutter body 2. By arranging a slide groove 812, a dovetail slider 813, a guide ring 819 and a slip ring 820, the slide groove 812 can provide a limiting function for the dovetail slider 813 slidingly connected to the inner wall of the slide groove 812, and the guide ring 819 can provide a guiding function for the slip ring 820 sliding on the surface of the guide ring 819.
[0030] The working principle and use process of the present invention are as follows: the first clamping plate 809 is moved. The movement of the first clamping plate 809 will drive the dovetail slider 813 fixed thereto to slide on the inner wall of the slide groove 812 provided on the rotating plate 808. At the same time, the spring 817 will be compressed as the first clamping plate 809 moves. The telescopic rod 816 inside the spring 817 will also be appropriately contracted, thereby increasing the clamping space between the first clamping plate 809 and the second clamping plate 810. When the first clamping plate 809 moves to the point where it can clamp quartz wafers of different thicknesses, the quartz wafers are placed on the second clamping plate 810. Release the first clamping plate 809. At this time, the first clamping plate 809 and the second clamping plate 810 can clamp and fix the quartz wafer. Then hold the rotating handle 803 and rotate the worm 802. The rotation of the worm 802 will drive the worm gear 806 engaged with it to rotate. The rotation of the worm gear 806 will drive the rotating rod 807 fixedly connected to it to rotate. The rotation of the rotating rod 807 will drive the rotating plate 808 fixedly connected to it to rotate. The rotation of the rotating plate 808 can drive the first clamping plate 809, the second clamping plate 810 and the quartz wafer clamped by the two to adjust the angle, thereby realizing the angle adjustment of the quartz wafer.
[0031] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A fixture for facilitating the cutting of quartz wafers, comprising a base (1), characterized in that: A cutting table (7) is provided on the top of the base (1), and a clamping device (8) is provided on one side of the cutting table (7). The clamping device (8) comprises a limit plate (801), the limit plate (801) is fixedly connected to the cutting table (7), a worm (802) is rotatably connected inside the limit plate (801), one end of the worm (802) is fixedly connected to a rotating handle (803), and the other end of the worm (802) is rotatably connected to a bearing (804), and a fixed plate (805) is fixedly connected to the other side of the cutting table (7). The worm (802) is fixedly connected to the bearing (804), the surface of the worm (802) is meshed with a worm wheel (806), one side of the worm wheel (806) is fixedly connected to a rotating rod (807), the rotating rod (807) is provided inside the cutting table (7), the rotating rod (807) is rotatably connected to the cutting table (7), one side of the rotating rod (807) is fixedly connected to a rotating plate (808), one side of the rotating plate (808) is fixedly connected to a first clamping plate (809), one side of the rotating plate (808) is provided with a second clamping plate (810), the second clamping plate ( The bottom of the rotating plate (808) is fixedly connected to a rubber pad (811), a sliding groove (812) is provided inside the rotating plate (808), and a dovetail slider (813) is slidably connected to the inner wall of the sliding groove (812), and the dovetail slider (813) is fixedly connected to the second clamping plate (810), and one side of the rotating plate (808) is fixedly connected to an L-shaped plate (814), and the top of the L-shaped plate (814) is fixedly connected to a top plate (815), and the bottom of the top plate (815) is fixedly connected to a telescopic rod (816), and one end of the telescopic rod (816) is fixed to the second clamping plate. The top of the second clamping plate (810) is fixedly connected, the surface of the telescopic rod (816) is provided with a spring (817), one end of the spring (817) is fixedly connected to the top of the second clamping plate (810), one side of the cutting table (7) is fixedly connected to two fixed blocks (818), one side of the two fixed blocks (818) is fixedly connected to a guide ring (819), the surface of the guide ring (819) is slidably connected to a slip ring (820), the slip ring (820) is fixedly connected to the rotating plate (808), and one side of the cutting table (7) is fixedly connected to two placement plates (9).
2. The fixture for facilitating quartz wafer cutting according to claim 1, characterized in that: A cutter body (2) is provided on the top of the base (1).
3. The fixture for facilitating quartz wafer cutting according to claim 2, characterized in that: An adjusting rod (3) is provided on one side of the cutter body (2).
4. The fixture for facilitating quartz wafer cutting according to claim 3, characterized in that: A cutting blade (4) is provided on one side of the adjusting rod (3).
5. The fixture for facilitating quartz wafer cutting according to claim 3, characterized in that: A water pipe (5) is provided inside the cutter body (2).
6. The fixture for facilitating quartz wafer cutting according to claim 5, characterized in that: A driving motor (6) is provided on the top of the cutter body (2).