Polycrystalline silicon automatic temperature measurement system

Abstract

The utility model provides an automatic temperature measuring system for polycrystalline silicon, and aims to solve the technical problem that the temperature does not reach the standard easily in the conventional method for controlling the temperature of a stub bar. The automatic temperature measuring system comprises a conveying line used for continuously conveying silicon rods; the thermal imager is located above the conveying line, and the detection end of the thermal imager faces the conveying line; a through groove is formed in the middle of the baffle, and the baffle is arranged between the thermal imager and the conveying line; the control assembly is arranged on the baffle plate and is connected with the thermal imager; the detection end of the thermal imager, the through groove in the baffle and the silicon rod on the conveying line can be located on the same straight line. According to the automatic temperature measuring system, the temperature of the stub bar is detected through the thermal imager, and the purpose of accurately controlling the temperature is achieved.

Description

Technical Field

[0001] The utility model relates to a temperature monitoring system, in particular to an automatic temperature measurement system for polysilicon. Background Art

[0002] The current processing technology for rod-shaped polysilicon after forming is as follows: polysilicon rods of about 3500mm are manually hammered into short rods of 300-600mm, and then placed in the loading section of the water quenching equipment. The short rods pass through the equipment's stepping system and enter the water quenching furnace for heating (the temperature of the silicon material leaving the furnace is about 400℃). After leaving the furnace, the short rods will go through processes such as crushing-belt conveying-sorting-packaging. The temperature of the short rods leaving the furnace is particularly critical, and they will be rapidly water-cooled to reduce their temperature to 100-160℃.

[0003] Since the belt conveyor in subsequent processes has a temperature tolerance of less than 150°C, if the temperature of the short bar material exceeds 160°C, the high temperature will cause the belt to burn after it falls onto the short bar material. Furthermore, the burned belt material will adhere to the surface of the short bar material, causing contamination. If the temperature of the short bar material reaches more than 65°C after reaching the packaging process, it may burn the packaging bag, affecting product quality.

[0004] When the temperature of the short-cut bars out of the furnace is lower than 100℃, the moisture in the gaps inside the short-cut bars cannot be completely evaporated after the short-cut bars are water-cooled. After being packaged into boxes and left to stand at room temperature for a period of time, moisture will remain inside the packaging bags, which cannot meet quality requirements.

[0005] In the prior art, most of the methods indirectly control the temperature of the short-cut bar by controlling the water temperature and the cooling time during water cooling. By controlling the temperature in this way, it is easy to cause the temperature of the short-cut bar to not meet the standard. Utility Model Content

[0006] In view of the technical problem that the temperature does not meet the standard easily occurs in the existing method of controlling the temperature of the short-cut bar, the utility model provides a polysilicon automatic temperature measurement system, which detects the temperature of the short-cut bar by a thermal imager to achieve the purpose of precise temperature control.

[0007] The technical solution of the utility model is:

[0008] A polysilicon automatic temperature measurement system, comprising:

[0009] Conveyor line, used to continuously convey silicon rods;

[0010] The thermal imager is located above the conveyor line with its detection end facing the conveyor line;

[0011] The baffle has a through slot in the middle and is located between the thermal imager and the conveyor line;

[0012] A control component is provided on the baffle and is connected to the thermal imager;

[0013] The detection end of the thermal imager, the through slot on the baffle and the silicon rods on the conveyor line may be located on the same straight line.

[0014] Optionally, the conveying line includes a plurality of carriers arranged in parallel, and a plurality of silicon rods can be placed on each carrier.

[0015] Optionally, the carrier includes two supporting members, a silicon rod can be placed on each supporting member, and a silicon rod is placed between the silicon rods on the two supporting members.

[0016] Optionally, a plurality of thermal imagers are evenly arranged along the width direction of the conveyor line, and all thermal imagers have the same inclination angle relative to the horizontal plane.

[0017] Optionally, a plurality of heat exchange tubes are provided on the baffle.

[0018] Optionally, the heat exchange tube and the control assembly are respectively located on both sides of the through groove.

[0019] Optionally, the control component includes:

[0020] A support frame is provided on the baffle and is located on one side of the through slot;

[0021] The connecting frame is slidably arranged on the supporting frame and is connected to the thermal imager.

[0022] Optionally, the support frame has a slide groove, and the connecting frame is slidably arranged in the slide groove.

[0023] Optionally, a screw is provided in the chute, one end of the screw being connected to the output shaft of a motor;

[0024] The connecting frame is provided with threaded holes matching the screw rods.

[0025] Optionally, the inclination angle of the screw is the same as the inclination angle of the thermal imager.

[0026] Compared with the prior art, the beneficial effects of the present invention are:

[0027] By setting a thermal imager above the conveyor line for conveying short-cut bars and limiting the detection area of ​​the thermal imager by using a baffle, it can only detect the short-cut bars, thereby reducing the impact of ambient temperature on the thermal imager.

[0028] By means of this technical solution, the temperature of the short-cut bar material can be directly and accurately measured, thereby ensuring that the temperature of the short-cut bar material is between 100°C and 160°C. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0030] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0031] Figure 2 It is a structural diagram of the utility model;

[0032] Figure 3 Schematic diagram of the installation structure of the thermal imager. DETAILED DESCRIPTION

[0033] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0034] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will recognize the application of other processes and / or the use of other materials.

[0035] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0036] Example:

[0037] See also Figure 1 、 Figure 2 and Figure 3 This embodiment discloses an automatic temperature measurement system for polysilicon, comprising a conveyor line 10, a thermal imager 20, a baffle 30, and a control assembly 40. The conveyor line 10 is used to transport water-cooled short bar stock 50. The baffle 30 is disposed above the conveyor line 10. The control assembly 40 is mounted on the baffle 30. The thermal imager 20 is located above the baffle 30 and mounted on the control assembly 40.

[0038] Specifically, the conveyor line 10 conveys the water-cooled short bar stock 50 horizontally, with the length direction of all short bar stock 50 perpendicular to the conveying direction of the conveyor line 10. A baffle 30 is located above the conveyor line 10, and its length direction is parallel to the length direction of the short bar stock 50. A through slot 31 is defined in the middle of the baffle 30, and its length direction is aligned with the length direction of the baffle 30.

[0039] The control component 40 is installed on one side of the through slot 31, and a thermal imager 20 is set on the control component 40, with the detection end of the thermal imager 20 facing the conveyor line 10, so that the detection end of the thermal imager 20, the through slot 31 on the baffle 30 and the silicon rods on the conveyor line 10 can be located on the same straight line.

[0040] During operation, when the conveyor line 10 is conveying the short bar 50 , there is a moment when the detection end of the thermal imager 20 can fully detect the surface temperature of the entire short bar 50 .

[0041] In this embodiment, a thermal imager 20 is installed above the conveyor line 10 that transports the short bars 50, and a baffle 30 is used to limit the area detected by the thermal imager 20 so that it can only detect the short bars 50, thereby reducing the impact of ambient temperature on the thermal imager 20. Through this technical solution, the temperature of the short bars 50 can be directly and accurately measured, thereby ensuring that the temperature of the short bars 50 is between 100°C and 160°C.

[0042] In one specific embodiment:

[0043] The conveyor line 10 includes a plurality of carriers, all of which are arranged in parallel at equal intervals, and a plurality of short-cut bars 50 can be placed on each carrier.

[0044] Specifically, the carrier unit includes two support members 11, which are arranged parallel to each other with a gap between them. The top surface of the support member 11 has a strip-shaped concave structure. When the short bar 50 is placed, the bottom of the short bar 50 is embedded in the strip-shaped concave structure.

[0045] When a short bar 50 is placed on each of the two support members 11, the distance between the two short bars 50 is smaller than the diameter of the short bars 50. Therefore, a short bar 50 can be placed on top of the two short bars 50, so that three short bars 50 can be placed on the two support rods at a time.

[0046] During operation, the image detected by the detection end of the thermal imager 20 passes through the through slot 31 on the baffle 30. Therefore, when the thermal imager 20 detects all the short rods 50 on a carrier unit, the thermal imager 20 will detect all the images between the front and rear sides of the short rods 50 on the two support members 11.

[0047] Through this embodiment, the detection efficiency of the thermal imager 20 on the short bar material 50 can be improved.

[0048] In another specific embodiment:

[0049] A plurality of thermal imagers 20 are evenly arranged along the width direction of the conveyor line 10, and all thermal imagers 20 have the same inclination angle relative to the horizontal plane. Through this embodiment, the temperature of different positions on each short bar 50 can be accurately detected.

[0050] In another specific embodiment:

[0051] A plurality of heat exchange tubes 32 are provided on the baffle 30 , and the heat exchange tubes 32 and the control assembly 40 are respectively located on both sides of the through slot 31 , wherein the heat exchange tubes 32 pass through the inside of the baffle 30 and are laid along the length direction of the baffle 30 .

[0052] In this embodiment, the temperature of the baffle 30 can be lowered by the heat exchange tube 32 , thereby improving the accuracy of the area division when the system analyzes the temperature after detection by the thermal imager 20 .

[0053] In another specific embodiment:

[0054] The control component 40 includes a support frame 41 and a connecting frame 42. The support frame 41 is arranged on the baffle 30 and is located on one side of the baffle 30. One side of the support frame 41 is close to the through slot 31, and a plurality of slide grooves are provided on this side of the support frame 41. The length direction of the slide groove is perpendicular to the length direction of the through slot 31.

[0055] A connecting frame 42 is provided on the chute of the support frame 41, and the thermal imagers 20 are all mounted on the connecting frame 42. By slidingly mounting the thermal imagers 20 on the control assembly 40 in this embodiment, the area detected by the thermal imagers 20 on the conveyor line 10 can be adjusted, thereby changing the number of short bar stock 50 detected each time.

[0056] Preferably, a screw 43 is provided in the chute, one end of which is dynamically connected to the output shaft of a motor 44. The connecting frame 42 has a threaded hole that matches the screw 43, and the inclination angle of the screw 43 is the same as the inclination angle of the thermal imager 20. The motor 44 drives the screw 43 to rotate, and the threaded fit between the screw 43 and the connecting frame 42 controls the distance between the thermal imager 20 and the baffle 30.

[0057] The above-described embodiments merely represent specific implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the scope of the present invention, all of which fall within the scope of protection of the present invention.

Claims

1. A polysilicon automatic temperature measurement system, characterized in that: include: Conveyor line, used to continuously convey silicon rods; The thermal imager is located above the conveyor line with its detection end facing the conveyor line; The baffle has a through slot in the middle and is located between the thermal imager and the conveyor line; A control component is provided on the baffle and is connected to the thermal imager; The detection end of the thermal imager, the through slot on the baffle and the silicon rods on the conveyor line may be located on the same straight line.

2. The polysilicon automatic temperature measurement system according to claim 1, characterized in that: The conveying line includes a plurality of carriers arranged in parallel, and each carrier can hold a plurality of silicon rods.

3. The polysilicon automatic temperature measurement system according to claim 2, characterized in that: The carrier includes two supporting members, each of which can be placed on a silicon rod, and a silicon rod is placed between the silicon rods on the two supporting members.

4. The polysilicon automatic temperature measurement system according to claim 1, characterized in that: A plurality of thermal imagers are evenly arranged along the width direction of the conveyor line, and all thermal imagers have the same inclination angle relative to the horizontal plane.

5. The polysilicon automatic temperature measurement system according to claim 1, characterized in that: A plurality of heat exchange tubes are arranged on the baffle.

6. The polysilicon automatic temperature measurement system according to claim 5, characterized in that: The heat exchange tube and the control component are respectively located on both sides of the through groove.

7. The polysilicon automatic temperature measurement system according to claim 1, characterized in that: The control components include: A support frame is provided on the baffle and is located on one side of the through slot; The connecting frame is slidably arranged on the supporting frame and is connected to the thermal imager.

8. The polysilicon automatic temperature measurement system according to claim 7, characterized in that: The supporting frame is provided with a slide groove, and the connecting frame is slidably arranged in the slide groove.

9. The polysilicon automatic temperature measurement system according to claim 8, characterized in that: A screw is provided in the chute, one end of which is connected to the output shaft of a motor; The connecting frame is provided with threaded holes matching the screw rods.

10. The polysilicon automatic temperature measurement system according to claim 9, characterized in that: The inclination angle of the screw is the same as that of the thermal imager.

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