Short-circuit reliability test system for high-side driving chip

Abstract

The utility model discloses a short-circuit reliability test system for a high-side driving chip, which relates to the field of chip testing and comprises a control unit, a test board and an oscilloscope. The test board is respectively connected with the control unit and the oscilloscope, and the test board is provided with a plurality of high-side driving chips; the control unit is used for outputting a test signal to each high-side driving chip on the test board according to a preset time sequence; and the oscilloscope is used for detecting current waveforms and voltage waveforms output by the high-side driving chips on the test board and displaying the current waveforms and the voltage waveforms, so that a user determines the working states of the high-side driving chips according to whether the current waveforms and the voltage waveforms meet the preset time sequence or not. According to the utility model, the test efficiency of the high-side driving chip is improved through the system.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a high-side driver chip short-circuit reliability testing system. Background Art

[0002] Currently, high-side driver chips are among the most demanding automotive chips for reliability, with a high level of functional safety. Through iteration, foreign manufacturer Infineon currently holds the largest market share, followed by ST, NXP, and TI. Domestic manufacturers face significant challenges in developing such chips, and the utilization of testing capabilities remains uncertain. Meanwhile, the AEC-Q100-012 standard describes "Short-Circuit Reliability Characterization of Intelligent Power Devices for 12V Systems." While it defines test procedures for the repetitive short-circuit characteristics of intelligent power devices, including test circuit configuration, ambient temperature, and impedance, it does not specify the required test equipment, and standard units are virtually nonexistent on the market. For test chips, improving test efficiency can accelerate R&D cycles and reduce costs. Therefore, it is necessary to develop an efficient short-circuit reliability test system based on AEC-Q100-012. Utility Model Content

[0003] The main purpose of the utility model is to provide a high-side driver chip short-circuit reliability test system, aiming to improve the test efficiency of the high-side driver chip.

[0004] To achieve the above objectives, the present invention proposes a high-side driver chip short-circuit reliability testing system.

[0005] The high-side driver chip short-circuit reliability test system is used to test multiple automotive-grade chips, including: a control unit, a test board, and an oscilloscope;

[0006] The test board is connected to the control unit and the oscilloscope respectively, and the test board is equipped with multiple high-side driver chips;

[0007] The control unit is used to output a test signal to each high-side driver chip on the test board according to a preset timing;

[0008] The oscilloscope is used to detect the current waveform and voltage waveform output by each high-side driver chip on the test board, and display the current waveform and voltage waveform so that the user can determine the working status of each high-side driver chip based on whether the current waveform and voltage waveform meet the preset timing.

[0009] Optionally, the high-side driver chip short-circuit reliability testing system further includes: a power supply unit;

[0010] The power supply unit is connected to the test board and the control unit respectively, and is used to provide corresponding working voltages for the test board and the control unit.

[0011] Optionally, the test board includes: a plurality of test circuits;

[0012] The test circuit is connected to the power supply unit, the control unit and the oscilloscope respectively, and the test circuit is equipped with a high-side driver chip;

[0013] The test circuit is used to transmit the output current and voltage of the chip to the oscilloscope.

[0014] Optionally, the test circuit includes: a voltage dividing unit, a power supply voltage transmission unit and a chip power transmission unit;

[0015] The voltage dividing unit is respectively connected to the power supply unit, the high-side driver chip and the power supply voltage transmission unit, the power supply voltage transmission unit is respectively connected to the high-side driver chip and the oscilloscope, and the chip power transmission unit is respectively connected to the high-side driver chip and the oscilloscope;

[0016] The voltage dividing unit is used to divide the voltage output by the power supply unit;

[0017] The power supply voltage transmission unit is used to transmit the divided power supply unit voltage to the high-side driver chip and the oscilloscope;

[0018] The chip power transmission unit is used to transmit the output current and voltage of the chip to the oscilloscope.

[0019] Optionally, the voltage dividing unit includes: a first resistor and a first inductor;

[0020] The first end of the first resistor is connected to the second end of the first inductor, and the second end of the first resistor is connected to the VS pin of the high-side driver chip and the power supply voltage transmission unit respectively;

[0021] The first end of the first inductor is connected to the power supply unit.

[0022] Optionally, the power supply voltage transmission unit includes: a first capacitor and a second capacitor;

[0023] A first end of the first capacitor is connected to the voltage dividing unit, and a second end of the first capacitor is connected to the oscilloscope;

[0024] A first end of the second capacitor is connected to the voltage dividing unit, and a second end of the second capacitor is connected to the oscilloscope.

[0025] Optionally, the chip power transmission unit includes: a first power transmission subunit, a second power transmission subunit, and a first power transmission subunit;

[0026] The first power transmission subunit is connected to the IS pin of the high-side driver chip and the oscilloscope respectively, and is used to transmit the current and voltage output by the IS pin of the high-side driver chip to the oscilloscope;

[0027] The second power transmission subunit is connected to the OUT1 pin of the high-side driver chip and the oscilloscope, respectively, and is used to transmit the current and voltage output by the OUT1 pin of the high-side driver chip to the oscilloscope;

[0028] The third power transmission subunit is connected to the OUT2 pin of the high-side driver chip and the oscilloscope respectively, and is used to transmit the current and voltage output by the OUT2 pin of the high-side driver chip to the oscilloscope.

[0029] Optionally, the first power transmission subunit includes: a second resistor;

[0030] The first end of the second resistor is connected to the IS pin of the high-side driver chip, and the second end of the second resistor is connected to the oscilloscope.

[0031] Optionally, the second power transmission subunit includes: a third resistor and a second inductor;

[0032] The first end of the third resistor is connected to the second end of the second resistor, and the second end of the third resistor is connected to the oscilloscope;

[0033] The first end of the second inductor is connected to the OUT1 pin of the high-side driver chip.

[0034] Optionally, the third power transmission subunit includes: a fourth resistor and a third inductor;

[0035] The first end of the fourth resistor is connected to the second end of the third resistor, and the second end of the fourth resistor is connected to the oscilloscope;

[0036] The first end of the third inductor is connected to the OUT2 pin of the high-side driver chip.

[0037] The utility model discloses a high-side driver chip short-circuit reliability test system, which relates to the field of chip testing. The high-side driver chip short-circuit reliability test system includes: a control unit, a test board, and an oscilloscope; the test board is connected to the control unit and the oscilloscope respectively, and the test board is equipped with multiple high-side driver chips; the control unit is used to output a test signal to each high-side driver chip on the test board according to a preset timing; the oscilloscope is used to detect the current waveform and voltage waveform output by each high-side driver chip on the test board, and display the current waveform and voltage waveform so that a user can determine the working status of each high-side driver chip based on whether the current waveform and voltage waveform meet the preset timing. The utility model outputs a test signal to each high-side driver chip on the test board according to a designed timing through the control unit; the oscilloscope detects the current waveform and voltage waveform output by each high-side driver chip on the test board, and displays the current waveform and voltage waveform so that a user can determine the working status of each high-side driver chip based on whether the current waveform and voltage waveform meet the preset timing. The above system can test multiple high-side driver chips on a test board at the same time, thereby improving the test efficiency of the high-side driver chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0039] Figure 1 This is a structural diagram of the first embodiment of the high-side driver chip short-circuit reliability testing system provided by the utility model;

[0040] Figure 2 This is a structural diagram of a second embodiment of a high-side driver chip short-circuit reliability testing system provided by the present utility model;

[0041] Figure 3 A schematic structural diagram of a third embodiment of a high-side driver chip short-circuit reliability testing system provided by the present invention;

[0042] Figure 4 This is a structural diagram of a fourth embodiment of a high-side driver chip short-circuit reliability testing system provided by the present invention;

[0043] Figure 5 This is a structural diagram of a fifth embodiment of the high-side driver chip short-circuit reliability testing system provided by the present utility model;

[0044] Figure 6 This is the waveform diagram of long pulse repetitive short circuit test;

[0045] Figure 7 This is the waveform diagram of short pulse repetitive short circuit test;

[0046] Figure 8 This is a schematic diagram of a single test circuit;

[0047] Figure 9 Schematic diagrams of multiple test circuits.

[0048] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0050] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0051] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0052] The utility model provides a high-side driver chip short-circuit reliability testing system.

[0053] See also Figure 1 , Figure 1This is a structural diagram of the first embodiment of the high-side driver chip short-circuit reliability testing system provided by the present utility model.

[0054] In the first embodiment of the present utility model, the high-side driver chip short-circuit reliability test system is used to test multiple automotive-grade chips, including: a control unit 1, a test board 2 and an oscilloscope 3;

[0055] The test board 2 is connected to the control unit 1 and the oscilloscope 3 respectively, and the test board 2 is equipped with multiple high-side driver chips;

[0056] The control unit 1 is configured to output a test signal to each high-side driver chip on the test board 2 according to a preset timing sequence;

[0057] The oscilloscope 3 is used to detect the current waveform and voltage waveform output by each high-side driver chip on the test board 2, and display the current waveform and voltage waveform so that the user can determine the working status of each high-side driver chip based on whether the current waveform and voltage waveform meet the preset timing.

[0058] It should be noted that the number of chips installed on the test board 2 can be 15, 30 or other numbers, which is not limited in this embodiment.

[0059] It should be noted that the control unit 1 may be an MCU, FPGA, DSP or ARM processor, etc., which is not limited in this embodiment.

[0060] It should be noted that the oscilloscope 3 may be a common oscilloscope 3 , a multi-purpose oscilloscope 3 , a multi-line oscilloscope 3 , or a mixed signal oscilloscope 3 , and this embodiment does not impose any limitation thereto.

[0061] Taking into account the test requirements, the oscilloscope 3 should be an oscilloscope 3 with 4 channels or more.

[0062] It should be noted that the preset timing can be changed according to actual needs, and this embodiment does not limit this.

[0063] It should be noted that the test signal can be changed according to actual needs, and this embodiment does not limit this.

[0064] In this embodiment, the test board 2 is installed with 15 high-side driver chips, and the control unit 1 has at least 30 I / O ports.

[0065] refer to Figure 6 and Figure 7 , Figure 6 This is the long pulse repetitive short circuit test waveform. Figure 7 This is the waveform diagram of short pulse repetitive short circuit test.

[0066] In this embodiment, the test signal includes a long pulse repetitive short circuit test waveform and a short pulse repetitive short circuit test waveform, and the user can select one according to the experimental requirements.

[0067] In a specific implementation, the controller outputs a test signal to each high-side driver chip on the test board 2 according to a preset timing, and the oscilloscope 3 detects the current waveform and voltage waveform output by each high-side driver chip on the test board 2, and displays the current waveform and voltage waveform. The user determines the working status of each high-side driver chip based on whether the current waveform and voltage waveform meet the preset timing.

[0068] Based on the first embodiment of the present invention, in the second embodiment of the present invention, the same or similar contents as those in the first embodiment can be referred to the above description and will not be described in detail. Figure 2 , Figure 2 This is a structural diagram of the second embodiment of the high-side driver chip short-circuit reliability testing system of the present utility model.

[0069] Considering that the test board and the control unit 1 may require a power supply to provide corresponding operating voltage;

[0070] In this embodiment, the high-side driver chip short-circuit reliability testing system further includes: a power supply unit 4;

[0071] The power supply unit 4 is connected to the test board 2 and the control unit 1 respectively, and is used to provide corresponding operating voltages for the test board 2 and the control unit 1 .

[0072] It should be noted that the power supply unit 4 may be a switching power supply, a voltage-stabilized power supply, a UPS power supply, or other types of power supplies, which are not limited in this embodiment.

[0073] In a specific implementation, the power supply unit 4 provides corresponding operating voltages to the test board 2 and the control unit 1 .

[0074] Based on the second embodiment of the present invention, in the third embodiment of the present invention, the same or similar contents as those in the second embodiment can be referred to the above description and will not be described in detail. Figure 3 , Figure 3 This is a structural diagram of the third embodiment of the high-side driver chip short-circuit reliability testing system of the present utility model.

[0075] refer to Figure 8 and Figure 9 , Figure 8 This is a single test circuit schematic. Figure 9 Schematic diagrams of multiple test circuits.

[0076] In this embodiment, the test board 2 includes: a plurality of test circuits 21;

[0077] The test circuit is connected to the power supply unit 4, the control unit 1 and the oscilloscope 3 respectively, and the test circuit is equipped with a high-side driver chip;

[0078] The test circuit 21 is used to transmit the output current and voltage of the chip to the oscilloscope 3 .

[0079] In a specific implementation, the test circuit 21 is respectively connected to the power supply unit 4, the control unit 1 and the oscilloscope 3. The test circuit 21 is equipped with a high-side driver chip. The test circuit 21 transmits the output current and voltage of the chip to the oscilloscope 3; the oscilloscope 3 detects the current waveform and voltage waveform output by each high-side driver chip on the test board 2, and displays the current waveform and voltage waveform so that the user can determine the working status of each high-side driver chip based on whether the current waveform and voltage waveform meet the preset timing.

[0080] Based on the third embodiment of the present invention, in the fourth embodiment of the present invention, the same or similar contents as those in the third embodiment can be referred to the above description and will not be described in detail. Figure 4 , Figure 4 This is a structural diagram of a fourth embodiment of a high-side driver chip short-circuit reliability testing system according to the present invention.

[0081] Considering that the experiment may need to divide the voltage output by the power supply unit 4 and may need to detect the divided power supply voltage;

[0082] In this embodiment, the test circuit 21 includes: a voltage dividing unit 211, a power supply voltage transmission unit 212 and a chip power transmission unit 213;

[0083] The voltage dividing unit 211 is respectively connected to the power supply unit 4, the high-side driver chip and the supply voltage transmission unit 212, the supply voltage transmission unit 212 is respectively connected to the high-side driver chip and the oscilloscope 3, and the chip power transmission unit 213 is respectively connected to the high-side driver chip and the oscilloscope 3;

[0084] The voltage dividing unit 211 is used to divide the voltage output by the power supply unit 4;

[0085] The power supply voltage transmission unit 212 is used to transmit the divided voltage of the power supply unit 4 to the high-side driver chip and the oscilloscope 3;

[0086] The chip power transmission unit 213 is used to transmit the output current and voltage of the chip to the oscilloscope 3 .

[0087] In a specific implementation, the voltage divider unit 211 divides the voltage output by the power supply unit 4; the power supply voltage transmission unit 212 transmits the divided voltage of the power supply unit 4 to the high-side driver chip and the oscilloscope 3; the current waveform and voltage waveform output by each high-side driver chip on the test board 2 are detected, and the current waveform and voltage waveform are displayed so that the user can determine the working status of each high-side driver chip based on whether the current waveform and voltage waveform meet the preset timing.

[0088] Based on the fourth embodiment of the present invention, in the fifth embodiment of the present invention, the same or similar contents as those in the fourth embodiment can be referred to the above description and will not be described in detail. Figure 5 , Figure 5 This is a structural diagram of a fifth embodiment of a high-side driver chip short-circuit reliability testing system according to the present invention.

[0089] In this embodiment, the voltage dividing unit 211 includes: a first resistor R1 and a first inductor L1;

[0090] The first end of the first resistor R1 is connected to the second end of the first inductor, and the second end of the first resistor R1 is connected to the VS pin of the high-side driver chip and the power supply voltage transmission unit 212 respectively;

[0091] The first end of the first inductor is connected to the power supply unit 4 .

[0092] It should be noted that the first resistor R1 can be a fixed resistor or an adjustable resistor, which is not limited in this embodiment.

[0093] It should be noted that the first inductor L may be a fixed inductor or a variable inductor, which is not limited in this embodiment.

[0094] In a specific implementation, the first end of the first resistor R1 is connected to the second end of the first inductor L, and the second end of the first resistor R1 is connected to the VS pin of the high-side driver chip and the power supply voltage transmission unit 212, respectively. The first end of the first inductor L is connected to the power supply unit 4. The first resistor R1 divides the voltage output by the power supply unit 4, and the first inductor L smoothes the current of the power supply unit 4.

[0095] Furthermore, the power supply voltage transmission unit 212 includes: a first capacitor C1 and a second capacitor C2;

[0096] A first end of the first capacitor C1 is connected to the voltage dividing unit 211 , and a second end of the first capacitor C1 is connected to the oscilloscope 3 ;

[0097] A first end of the second capacitor C2 is connected to the voltage dividing unit 211 , and a second end of the second capacitor C2 is connected to the oscilloscope 3 .

[0098] It should be noted that the first capacitor C1 may be a fixed capacitor or a variable capacitor, which is not limited in this embodiment.

[0099] In a specific implementation, the first end of the first capacitor C1 is connected to the voltage dividing unit 211, and the second end of the first capacitor C1 is connected to the oscilloscope 3; the divided voltage of the power supply unit 4 is transmitted to the oscilloscope 3 through the first capacitor C1; the first end of the second capacitor C2 is connected to the voltage dividing unit 211, and the second end of the second capacitor C2 is connected to the oscilloscope 3; the divided voltage of the power supply unit 4 is transmitted to the oscilloscope 3 through the second capacitor C2.

[0100] Based on the fifth embodiment of the present invention, in the sixth embodiment of the present invention, the same or similar contents as those in the fifth embodiment can be referred to the above description and will not be described in detail. Figure 6 , Figure 6 This is a structural diagram of a sixth embodiment of a high-side driver chip short-circuit reliability testing system according to the present invention.

[0101] In this embodiment, the chip power transmission unit 213 includes: a first power transmission sub-unit 2131, a first power transmission sub-unit 2132, and a first power transmission sub-unit 2133;

[0102] The first power transmission subunit 2131 is connected to the IS pin of the high-side driver chip and the oscilloscope 3 respectively, and is used to transmit the current and voltage output by the IS pin of the high-side driver chip to the oscilloscope 3;

[0103] The first power transmission subunit 2132 is connected to the OUT1 pin of the high-side driver chip and the oscilloscope 3 respectively, and is used to transmit the current and voltage output by the OUT1 pin of the high-side driver chip to the oscilloscope 3;

[0104] The first power transmission subunit 2133 is connected to the OUT2 pin of the high-side driver chip and the oscilloscope 3 respectively, and is used to transmit the current and voltage output by the OUT2 pin of the high-side driver chip to the oscilloscope 3.

[0105] In specific implementation, the first power transmission sub-unit 2131 is respectively connected to the IS pin of the high-side driver chip and the oscilloscope 3, and transmits the current and voltage output by the IS pin of the high-side driver chip to the oscilloscope 3; the first power transmission sub-unit 2132 is respectively connected to the OUT1 pin of the high-side driver chip and the oscilloscope 3, and transmits the current and voltage output by the OUT1 pin of the high-side driver chip to the oscilloscope 3; the first power transmission sub-unit 2133 is respectively connected to the OUT2 pin of the high-side driver chip and the oscilloscope 3, and transmits the current and voltage output by the OUT2 pin of the high-side driver chip to the oscilloscope 3.

[0106] Furthermore, the first power transmission subunit 2131 includes: a second resistor R2;

[0107] A first end of the second resistor R2 is connected to the IS pin of the high-side driver chip, and a second end of the second resistor is connected to the oscilloscope 3 .

[0108] It should be noted that the second resistor R2 may be a fixed resistor or an adjustable resistor, which is not limited in this embodiment.

[0109] In a specific implementation, the first end of the second resistor R2 is connected to the IS pin of the high-side driver chip, and the second end of the second resistor is connected to the oscilloscope 3. The current and voltage output by the IS pin of the high-side driver chip are output to the oscilloscope 3 through the second resistor R2.

[0110] Furthermore, the first power transmission subunit 2132 includes: a third resistor R3 and a second inductor L2;

[0111] The first end of the third resistor R3 is connected to the second end of the second resistor R2, and the second end of the third resistor R3 is connected to the oscilloscope 3;

[0112] A first end of the second inductor L2 is connected to the OUT1 pin of the high-side driver chip.

[0113] It should be noted that the third resistor R3 may be a fixed resistor or an adjustable resistor, which is not limited in this embodiment.

[0114] It should be noted that the second inductor L2 may be a fixed inductor or a variable inductor, which is not limited in this embodiment.

[0115] In a specific implementation, the first end of the third resistor R3 is connected to the second end of the second resistor R2, and the second end of the third resistor R3 is connected to the oscilloscope 3. The first end of the second inductor L2 is connected to the OUT1 pin of the high-side driver chip. The current and voltage output from the OUT1 pin of the high-side driver chip are output to the oscilloscope 3 through the third resistor R3 and the second inductor L2.

[0116] Furthermore, the first power transmission subunit 2133 includes: a fourth resistor and a third inductor;

[0117] The first end of the fourth resistor is connected to the second end of the third resistor R3, and the second end of the fourth resistor is connected to the oscilloscope 3; the first end of the third inductor is connected to the OUT2 pin of the high-side driver chip.

[0118] It should be noted that the fourth resistor may be a fixed resistor or an adjustable resistor, which is not limited in this embodiment.

[0119] It should be noted that the third inductor may be a fixed inductor or a variable inductor, which is not limited in this embodiment.

[0120] In a specific implementation, the first end of the fourth resistor is connected to the second end of the third resistor R3, and the second end of the fourth resistor is connected to the oscilloscope 3. The first end of the third inductor is connected to the OUT2 pin of the high-side driver chip. The current and voltage output from the OUT2 pin of the high-side driver chip are output to the oscilloscope 3 through the fourth resistor and the third inductor.

[0121] The utility model discloses a high-side driver chip short-circuit reliability test system, which relates to the field of chip testing. The high-side driver chip short-circuit reliability test system includes: a control unit 1, a test board 2, and an oscilloscope 3; the test board 2 is connected to the control unit 1 and the oscilloscope 3, respectively, and the test board 2 is equipped with multiple high-side driver chips; the control unit 1 is used to output a test signal to each high-side driver chip on the test board 2 according to a preset timing; the oscilloscope 3 is used to detect the current waveform and voltage waveform output by each high-side driver chip on the test board 2, and display the current waveform and voltage waveform so that a user can determine the operating status of each high-side driver chip based on whether the current waveform and voltage waveform meet the preset timing. The utility model improves the testing efficiency of high-side driver chips through the above system.

[0122] The above description is only for the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made based on the contents of the present invention specification and drawings, or direct / indirect application in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A high-side driver chip short-circuit reliability test system for testing multiple automotive-grade chips, characterized by: The high-side driver chip short-circuit reliability test system includes: a control unit, a test board and an oscilloscope; The test board is connected to the control unit and the oscilloscope respectively, and the test board is equipped with multiple high-side driver chips; The control unit is used to output a test signal to each high-side driver chip on the test board according to a preset timing; The oscilloscope is used to detect the current waveform and voltage waveform output by each high-side driver chip on the test board, and display the current waveform and voltage waveform so that the user can determine the working status of each high-side driver chip based on whether the current waveform and voltage waveform meet the preset timing.

2. The high-side driver chip short-circuit reliability testing system according to claim 1, wherein: The high-side driver chip short-circuit reliability testing system further includes: a power supply unit; The power supply unit is connected to the test board and the control unit respectively, and is used to provide corresponding working voltages for the test board and the control unit.

3. The high-side driver chip short-circuit reliability testing system according to claim 2, wherein: The test board includes: a plurality of test circuits; The test circuit is connected to the power supply unit, the control unit and the oscilloscope respectively, and the test circuit is equipped with a high-side driver chip; The test circuit is used to transmit the output current and voltage of the chip to the oscilloscope.

4. The high-side driver chip short-circuit reliability testing system according to claim 3, wherein: The test circuit includes: a voltage dividing unit, a power supply voltage transmission unit and a chip power transmission unit; The voltage dividing unit is respectively connected to the power supply unit, the high-side driver chip and the power supply voltage transmission unit, the power supply voltage transmission unit is respectively connected to the high-side driver chip and the oscilloscope, and the chip power transmission unit is respectively connected to the high-side driver chip and the oscilloscope; The voltage dividing unit is used to divide the voltage output by the power supply unit; The power supply voltage transmission unit is used to transmit the divided power supply unit voltage to the high-side driver chip and the oscilloscope; The chip power transmission unit is used to transmit the output current and voltage of the chip to the oscilloscope.

5. The high-side driver chip short-circuit reliability testing system according to claim 4, wherein: The voltage dividing unit includes: a first resistor and a first inductor; The first end of the first resistor is connected to the second end of the first inductor, and the second end of the first resistor is connected to the VS pin of the high-side driver chip and the power supply voltage transmission unit respectively; The first end of the first inductor is connected to the power supply unit.

6. The high-side driver chip short-circuit reliability testing system according to claim 4, wherein: The power supply voltage transmission unit includes: a first capacitor and a second capacitor; A first end of the first capacitor is connected to the voltage dividing unit, and a second end of the first capacitor is connected to the oscilloscope; A first end of the second capacitor is connected to the voltage dividing unit, and a second end of the second capacitor is connected to the oscilloscope.

7. The high-side driver chip short-circuit reliability testing system according to claim 4, wherein: The chip power transmission unit includes: a first power transmission sub-unit, a second power transmission sub-unit, and a third power transmission sub-unit; The first power transmission subunit is connected to the IS pin of the high-side driver chip and the oscilloscope respectively, and is used to transmit the current and voltage output by the IS pin of the high-side driver chip to the oscilloscope; The second power transmission subunit is connected to the OUT1 pin of the high-side driver chip and the oscilloscope, respectively, and is used to transmit the current and voltage output by the OUT1 pin of the high-side driver chip to the oscilloscope; The third power transmission subunit is connected to the OUT2 pin of the high-side driver chip and the oscilloscope respectively, and is used to transmit the current and voltage output by the OUT2 pin of the high-side driver chip to the oscilloscope.

8. The high-side driver chip short-circuit reliability testing system according to claim 7, wherein: The first power transmission subunit includes: a second resistor; The first end of the second resistor is connected to the IS pin of the high-side driver chip, and the second end of the second resistor is connected to the oscilloscope.

9. The high-side driver chip short-circuit reliability testing system according to claim 8, wherein: The second power transmission subunit includes: a third resistor and a second inductor; The first end of the third resistor is connected to the second end of the second resistor, and the second end of the third resistor is connected to the oscilloscope; The first end of the second inductor is connected to the OUT1 pin of the high-side driver chip.

10. The high-side driver chip short-circuit reliability testing system according to claim 9, wherein: The third power transmission subunit includes: a fourth resistor and a third inductor; The first end of the fourth resistor is connected to the second end of the third resistor, and the second end of the fourth resistor is connected to the oscilloscope; The first end of the third inductor is connected to the OUT2 pin of the high-side driver chip.

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