Multi-compatible liquid cooling testboard for single board debugging

Abstract

The utility model relates to the technical field of computers, and discloses a multi-compatible liquid cooling testboard for single board debugging, which comprises a cooling distribution unit and a computing mainboard, an upper cover serving as a carrier is mounted on the upper layer of a framework, a second silent fan is mounted on the other side of a water drain, a liquid cooling plate is mounted on the upper layer of the framework, and a second silent fan is mounted on the lower layer of the framework. The water return end of the liquid cooling plate is communicated with a liquid cooling plate water return pipe, and the water inlet end of the liquid cooling plate is communicated with a liquid cooling plate water inlet pipe. The liquid cooling plate is installed on the surface of the CPU for heat exchange, heat generated when the CPU operates is taken away through the cooling medium, the high-temperature cooling medium enters the cooler to cool cooling liquid flowing through the interior of the cooler through forced air convection and the second silent fan, low-temperature cooling liquid is formed and then returns to the water pump integrated water tank, and closed circulation is achieved. And the heat dissipation function is achieved, and therefore the heat exchange efficiency is greatly improved in a wind-water heat exchange mode on the aspect of heat dissipation.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a multi-compatible liquid cooling test bench for single board debugging. Background Art

[0002] During the development and verification phase of a computer motherboard, single-board debugging equipment is typically used to verify motherboard functionality. Currently, most commercially available single-board debugging equipment is an air-cooled heatsink test bench. This type of test bench features a finned heatsink mounted on the surface of the computer CPU (central processing unit), which then cools the CPU through forced convection. If the CPU power consumption is high and the air-cooled finned heatsink cannot meet the cooling requirements, a liquid cooling plate is used to dissipate the CPU's heat. Using a liquid cooling plate requires an external CDU (cooling distribution unit) to exchange heat for the plate.

[0003] The traditional method, which relies on forced convection cooling with a radiator and fan, has low heat exchange efficiency. Using a fan with high air speed and volume can generate significant noise, disrupting debugging and making it unsuitable for subsequent practical use. Using a liquid cooling plate connected to an external CDU is cumbersome and difficult to operate, and it's separated from the test bench, taking up a lot of space and hindering debugging. Therefore, a multi-compatible liquid cooling test bench for single-board debugging has been proposed. Utility Model Content

[0004] In view of the deficiencies in the prior art, the present invention provides a multi-compatible liquid-cooling test bench for single-board debugging to solve the problems mentioned in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a multi-compatible liquid cooling test bench for single-board debugging, comprising a cooling distribution unit and a computing motherboard, the cooling distribution unit comprising a frame, a cooling distribution unit water inlet and a cooling distribution unit water outlet, the frame being divided into an upper and lower layers, the upper layer of the frame being provided with an upper cover as a carrier, the cooling distribution unit water inlet and the cooling distribution unit water outlet being both arranged on the surface of the upper cover, a base being provided inside the lower layer of the frame, an integrated water tank for a water pump, a fan hub and a fixing bracket being provided on the outer surface of the base, a power supply and a water drain being provided on the outer surface of the fixing bracket, a second silent fan being provided on the other side of the water drain, a liquid cooling plate being provided on the upper layer of the frame, a return water end of the liquid cooling plate being connected to a return water pipe of the liquid cooling plate, and a water inlet end of the liquid cooling plate being connected to a water inlet pipe of the liquid cooling plate;

[0006] A fan mounting bracket and a graphics card bracket are installed on the outer surface of the upper cover, and a plurality of first silent fans are installed on the outer surface of the fan mounting bracket. A guide assembly is installed on the outer surface of the upper cover on one side of the first silent fan, and the guide assembly includes a guide frame, and a plurality of rotating shafts are rotatably connected to the inside of the guide frame, and the outer surfaces of the plurality of rotating shafts are fixedly sleeved with guide plates.

[0007] Furthermore, multiple rotating shafts rotate and penetrate the rear outer surface of the guide frame, the middle rotating shaft rotates and penetrates the front outer surface of the guide frame and a worm gear is fixedly sleeved on one end of the front outer surface of the guide frame, the front outer surface of the guide frame is fixedly connected to a support plate, the outer surface of the support plate is rotatably connected to a worm, and the worm is movably engaged with the outer surface of the worm gear.

[0008] Furthermore, the outer surfaces of the multiple rotating shafts located on the rear side of the guide frame are fixedly sleeved with a first gear, the outer surface of the rear side of the guide frame is located between two adjacent first gears and is rotatably connected to two support shafts, the outer surfaces of the two support shafts are fixedly sleeved with a second gear, the outer surfaces of the two second gears are meshed with each other, and the two second gears are respectively movably meshed with the outer surfaces of the adjacent first gears.

[0009] Furthermore, a plurality of nuts are riveted on the outer surface of the upper cover, and mounting studs are provided at the plurality of nuts.

[0010] Furthermore, one end of the liquid cooling plate return pipe is connected to the upper end of the water inlet of the cooling distribution unit, the lower end of the water inlet of the cooling distribution unit is connected to the water discharge inlet, the water discharge outlet is connected to the water inlet of the water pump integrated water tank, the water outlet of the water pump integrated water tank is connected to the lower end of the water outlet of the cooling distribution unit, and the liquid cooling plate water inlet pipe is connected to the upper end of the water outlet of the cooling distribution unit.

[0011] Furthermore, one end of the liquid cooling plate return pipe and the water inlet pipe of the liquid cooling plate are respectively provided with a first quick-change joint and a second quick-change joint, and the upper end of the water inlet of the cooling distribution unit and the upper end of the water outlet of the cooling distribution unit are respectively provided with quick-change joints corresponding to the first quick-change joint and the second quick-change joint.

[0012] Furthermore, the frame is an open structure and is constructed from aluminum profiles.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] 1. This multi-compatible liquid cooling test bench for single-board debugging is installed on the surface of the CPU through a liquid cooling plate for heat exchange. The heat generated by the CPU during operation is taken away by the cooling medium. The high-temperature cooling medium enters the radiator through forced air convection. The second silent fan cools down the coolant flowing through the radiator to form a low-temperature coolant, which then returns to the water tank with an integrated water pump. The closed cycle is repeated to achieve the heat dissipation function, thereby greatly improving the heat exchange efficiency in the form of wind and water heat exchange in the heat dissipation.

[0015] 2. This multi-compatible liquid-cooling test bench for single-board debugging rotates the worm to drive the worm wheel, so that the corresponding shaft rotates. The shaft drives the corresponding first gear to cooperate with multiple second gears to rotate the guide plate. The inclination direction of the guide plate is adjusted so that the airflow generated by the first silent fan is accurately blown to the low-power components, thereby improving the heat dissipation effect.

[0016] 3. This multi-compatible liquid cooling test bench for single-board debugging separates the CPU liquid cooling plate and uses quick-change connectors for plug-in connection. In this way, liquid cooling plates of various specifications can be used on this platform to verify CPUs of various specifications. In addition, nuts that can adapt to various computer motherboard types are riveted on the upper cover. Studs are installed at the nut points corresponding to different board types to support the computer motherboard. This makes it possible to debug computer motherboards of various board types on this platform, increasing the compatibility of the test bench and improving the reuse rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a structural diagram of the utility model when the diversion component is not installed;

[0018] Figure 2 This is a schematic diagram of the upper structure of the skeleton of the utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the cooling distribution unit of the utility model;

[0020] Figure 4 This is a schematic diagram of a partial structure of the utility model in a top view and cross-section;

[0021] Figure 5 This is a schematic diagram of the front view structure of the diversion component of the utility model;

[0022] Figure 6 This is a side structural diagram of the guide assembly of the utility model;

[0023] Figure 7 This is a schematic diagram of the skeleton structure of the utility model;

[0024] Figure 8 This is a schematic diagram of the structure of the liquid-cooled radiator of the present utility model.

[0025] In the figure: 1. Cooling distribution unit; 2. Computing motherboard; 3. Liquid cooling plate; 4. Liquid cooling plate return pipe; 5. Liquid cooling plate inlet pipe; 6. Guide assembly; 1-1. Frame; 1-2. Graphics card bracket; 1-3. Upper cover; 1-4. Nut; 1-5. Stud; 1-6. Cooling distribution unit water inlet; 1-7. Cooling distribution unit water outlet; 1-8. First silent fan; 1-9. Fan mounting bracket; 1-10. Water pump integrated water tank; 1-11. Fan hub; 1-12. Second silent fan; 1-13. Base; 1-14. Power supply; 1-15. Fixed bracket; 1-16. Drain; 4-1. First quick-change connector; 5-1. Second quick-change connector; 6-1. Guide frame; 6-2. Guide plate; 6-3. Worm gear; 6-4. Worm; 6-5. First gear; 6-6. Second gear. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] Example 1:

[0028] Please refer to Figures 1-8The utility model provides a technical solution: a multi-compatible liquid cooling test bench for single board debugging, comprising a cooling distribution unit 1 and a computing motherboard 2, the cooling distribution unit 1 comprising a skeleton 1-1, a cooling distribution unit water inlet 1-6 and a cooling distribution unit water outlet 1-7, the skeleton 1-1 is divided into an upper and lower layers, the upper layer of the skeleton 1-1 is provided with an upper cover 1-3 as a carrier, the computing motherboard 2 is provided on the surface of the upper cover 1-3, the cooling distribution unit water inlet 1-6 and the cooling distribution unit water outlet 1-7 are both provided on the surface of the upper cover 1-3, a base 1-13 is provided inside the lower layer of the skeleton 1-1, a water pump integrated water tank 1-10, a fan hub 1-11 and a fixed bracket 1-15 are provided on the outer surface of the fixed bracket 1-15, a power supply 1-14 and a water drain 1-16 are provided on the outer surface of the fixed bracket 1-15, a second silent fan 1-12 is provided on the other side of the water drain 1-16, the skeleton 1-1 is provided with a plurality of cooling fans, and the cooling distribution unit 1-3 is provided with a plurality of cooling fans. The upper layer is equipped with a liquid cooling plate 3, the return water end of the liquid cooling plate 3 is connected to the liquid cooling plate return pipe 4, and the water inlet end of the liquid cooling plate 3 is connected to the liquid cooling plate inlet pipe 5. Specifically, the computer motherboard 2 is installed, and the liquid cooling plate 3 is installed on the surface of the CPU. The CPU is cooled by the liquid cooling plate 3, and the low-temperature cooling medium is pressurized by the water pump integrated water tank 1-10 and enters the liquid cooling plate 3. The liquid cooling plate 3 is installed on the surface of the CPU for heat exchange. The heat generated by the CPU operation is absorbed by the low-temperature cooling medium, and the temperature of the cooling medium rises to form a high-temperature cooling medium, which takes away the heat during the operation of the CPU. The high-temperature cooling enters the radiator, and through forced air convection, the second silent fan 1-12 cools the coolant flowing through the inside of the radiator radiator to form a low-temperature coolant, which then returns to the water pump integrated water tank 1-10, and the closed cycle is repeated to realize the heat dissipation function, thereby greatly improving the heat exchange efficiency in the form of wind and water heat exchange in heat dissipation.

[0029] A fan mounting bracket 1-9 and a graphics card bracket 1-2 are installed on the outer surface of the upper cover 1-3. A plurality of first silent fans 1-8 are installed on the outer surface of the fan mounting bracket 1-9. A guide assembly 6 is installed on the outer surface of the upper cover 1-3 on one side of the first silent fan 1-8. The guide assembly 6 includes a guide frame 6-1. The internal rotation of the guide frame 6-1 is connected to a plurality of rotating shafts. The outer surfaces of the plurality of rotating shafts are fixedly sleeved with guide plates 6-2. Specifically, the low-power consumption components are cooled by the first silent fan 1-8, and the wind direction of the guide plate 6-2 is adjusted so that the wind flow is blown accurately to the low-power consumption components.

[0030] In this embodiment, multiple rotating shafts rotate and penetrate the rear outer surface of the guide frame 6-1, the middle rotating shaft rotates and penetrates the front outer surface of the guide frame 6-1 and is fixedly sleeved with a worm gear 6-3 at one end located on the front outer surface of the guide frame 6-1, the front outer surface of the guide frame 6-1 is fixedly connected to a support plate, the outer surface of the support plate is rotatably connected to a worm 6-4, and the worm 6-4 is movably engaged with the outer surface of the worm wheel 6-3. Specifically, by rotating the worm 6-4, the worm 6-4 drives the worm wheel 6-3 to rotate, so that the corresponding rotating shaft rotates. After the rotation is completed, the self-locking property between the worm 6-4 and the worm wheel 6-3 prevents the rotating shaft from rotating autonomously.

[0031] In this embodiment, the outer surfaces of multiple rotating shafts located at the rear side of the guide frame 6-1 are all fixedly sleeved with a first gear 6-5, the outer surface of the rear side of the guide frame 6-1 is located between two adjacent first gears 6-5 and is rotatably connected to two support shafts, the outer surfaces of the two support shafts are both fixedly sleeved with a second gear 6-6, the outer surfaces of the two second gears 6-6 are meshed with each other, and the two second gears 6-6 are respectively movably meshed with the outer surfaces of adjacent first gears 6-5. Specifically, when the middle first gear 6-5 rotates, it drives the adjacent second gears 6-6 to rotate, and through the transmission of multiple second gears 6-6, the corresponding rotating shafts rotate, so that the angle of the guide plate 6-2 is tilted.

[0032] In this embodiment, a plurality of nuts 1-4 are riveted on the outer surface of the upper cover 1-3, and mounting studs 1-5 are provided at the plurality of nuts 1-4. Specifically, the positions of the plurality of nuts 1-4 can adapt to a variety of computer motherboard 2 types. By installing studs 1-5 at the nut 1-4 points corresponding to different types of boards to support the computer motherboard 2, it is possible to debug computer motherboards 2 of various types on this platform.

[0033] In this embodiment, one end of the liquid cooling plate return pipe 4 is connected to the upper end of the cooling distribution unit water inlet 1-6, the lower end of the cooling distribution unit water inlet 1-6 is connected to the water inlet of the water drain 1-16, the water outlet of the water drain 1-16 is connected to the water inlet of the water pump integrated water tank 1-10, the water outlet of the water pump integrated water tank 1-10 is connected to the lower end of the cooling distribution unit water outlet 1-7, and the liquid cooling plate water inlet pipe 5 is connected to the upper end of the cooling distribution unit water outlet 1-7. Specifically, the entire water cooling equipment connects various components through water pipes to form a closed water cooling pipeline, and the cooling medium circulates back and forth inside it.

[0034] In this embodiment, one end of the liquid cooling plate return pipe 4 and the water inlet pipe of the liquid cooling plate 3 are respectively provided with a first quick-change joint 4-1 and a second quick-change joint 5-1, and the upper end of the cooling distribution unit water inlet 1-6 and the upper end of the cooling distribution unit water outlet are respectively provided with quick-change joints corresponding to the first quick-change joint 4-1 and the second quick-change joint 5-1. Specifically, when verifying different CPUs, the CPU liquid cooling plate 3 is separated separately, and the first quick-change joint 4-1 and the second quick-change joint 5-1 are used for plug-in connection. In this way, liquid cooling plates 3 of various specifications can be used on this platform. The cooling distribution unit water outlet 1-7 and the cooling distribution unit water inlet 1-6 use quick-change joints. For liquid cooling plates 3 of different specifications and sizes, quick joints of corresponding specifications are used to connect to the cooling distribution unit water outlet 1-7 and the cooling distribution unit water inlet 1-6 boxes to achieve sharing.

[0035] In this embodiment, the frame 1-1 is an open structure and is constructed of aluminum profiles. Specifically, the above technical solution can ensure structural strength while allowing ventilation on all sides, having a simple shape, low cost, and easy installation.

[0036] Working principle: When the utility model is in use, the studs 1-5 are installed at different nuts 1-4 to support the computing motherboard 2, so that different computing motherboards 2 can be shared. The low-power devices are cooled by the first silent fan 1-8, and the wind flow generated by the first silent fan 1-8 is guided by the guide assembly 6. The worm 6-4 is rotated, and the worm 6-4 drives the worm wheel 6-3 to rotate the middle shaft, and the shaft drives the corresponding first gear 6-5 to rotate, and makes the second gear 6-6 transmit to each other, driving the other first gears 6-5 to rotate, thereby adjusting the angle of the guide plate 6-2, and accurately guiding the wind flow generated by the first silent fan 1-8 through the guide plate 6-2, so that the wind flow is accurately blown to the low Power-consuming devices, high-power-consuming devices such as the CPU dissipate heat through the liquid cooling plate 3. The low-temperature cooling medium is pressurized by the water pump integrated water tank 1-10 and enters the liquid cooling plate 3. The liquid cooling plate 3 is installed on the surface of the CPU for heat exchange. The heat generated by the CPU operation is absorbed by the low-temperature cooling medium. The temperature of the cooling medium rises to form a high-temperature cooling medium, which takes away the heat during the operation of the CPU. The high-temperature cooling enters the radiator. Through forced air convection, the second silent fan 1-12 cools the coolant flowing through the inside of the radiator radiator to form a low-temperature coolant, and then returns to the water pump integrated water tank 1-10. The closed cycle is repeated to realize the heat dissipation function, thereby greatly improving the heat exchange efficiency in the form of wind and water heat exchange in heat dissipation.

[0037] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-compatible liquid cooling test bench for single board debugging, comprising a cooling distribution unit (1) and a computing mainboard (2), characterized in that: The cooling distribution unit (1) comprises a frame (1-1), a cooling distribution unit water inlet (1-6) and a cooling distribution unit water outlet (1-7); the frame (1-1) is divided into an upper and lower layer; the upper layer of the frame (1-1) is provided with an upper cover (1-3) as a carrier; the computing motherboard (2) is provided on the surface of the upper cover (1-3); the cooling distribution unit water inlet (1-6) and the cooling distribution unit water outlet (1-7) are both provided on the surface of the upper cover (1-3); the lower layer of the frame (1-1) is provided with a base (1-13); The outer surface of the base (1-13) is installed with a water pump integrated water tank (1-10), a fan hub (1-11) and a fixed bracket (1-15); the outer surface of the fixed bracket (1-15) is installed with a power supply (1-14) and a water drain (1-16); the other side of the water drain (1-16) is installed with a second silent fan (1-12); the upper layer of the skeleton (1-1) is installed with a liquid cooling plate (3); the return water end of the liquid cooling plate (3) is connected to a liquid cooling plate return pipe (4); the water inlet end of the liquid cooling plate (3) is connected to a liquid cooling plate inlet pipe (5); A fan mounting bracket (1-9) and a graphics card bracket (1-2) are installed on the outer surface of the upper cover (1-3); a plurality of first silent fans (1-8) are installed on the outer surface of the fan mounting bracket (1-9); a guide assembly (6) is installed on the outer surface of the upper cover (1-3) on one side of the first silent fan (1-8); the guide assembly (6) includes a guide frame (6-1); a plurality of rotating shafts are rotatably connected inside the guide frame (6-1); and a guide plate (6-2) is fixedly sleeved on the outer surfaces of the plurality of rotating shafts.

2. The multi-compatible liquid cooling test bench for single board debugging according to claim 1, characterized in that: The plurality of rotating shafts all rotate and penetrate the rear outer surface of the guide frame (6-1); the middle rotating shaft rotates and penetrates the front outer surface of the guide frame (6-1); and a worm gear (6-3) is fixedly sleeved on one end of the front outer surface of the guide frame (6-1); the front outer surface of the guide frame (6-1) is fixedly connected to a support plate; the outer surface of the support plate is rotatably connected to a worm (6-4); and the worm gear (6-4) is movably engaged with the outer surface of the worm gear (6-3).

3. The multi-compatible liquid cooling test bench for single board debugging according to claim 1, characterized in that: The outer surfaces of the plurality of rotating shafts located at the rear side of the guide frame (6-1) are all fixedly sleeved with a first gear (6-5); the outer surface of the rear side of the guide frame (6-1) is located between two adjacent first gears (6-5) and is rotatably connected to two support shafts; the outer surfaces of the two support shafts are both fixedly sleeved with a second gear (6-6); the outer surfaces of the two second gears (6-6) are meshed with each other, and the two second gears (6-6) are respectively movably meshed with the outer surfaces of the adjacent first gears (6-5).

4. The multi-compatible liquid cooling test bench for single board debugging according to claim 1, characterized in that: A plurality of nuts (1-4) are riveted on the outer surface of the upper cover (1-3), and mounting studs (1-5) are provided at the plurality of nuts (1-4).

5. The multi-compatible liquid cooling test bench for single board debugging according to claim 1, characterized in that: One end of the liquid cooling plate return pipe (4) is connected to the upper end of the cooling distribution unit water inlet (1-6), the lower end of the cooling distribution unit water inlet (1-6) is connected to the water inlet of the water drain (1-16), the water outlet of the water drain (1-16) is connected to the water inlet of the water pump integrated water tank (1-10), the water outlet of the water pump integrated water tank (1-10) is connected to the lower end of the cooling distribution unit water outlet (1-7), and the liquid cooling plate water inlet pipe (5) is connected to the upper end of the cooling distribution unit water outlet (1-7).

6. The multi-compatible liquid cooling test bench for single board debugging according to claim 1, characterized in that: One end of the liquid cooling plate return pipe (4) and the water inlet pipe of the liquid cooling plate (3) are respectively provided with a first quick-change joint (4-1) and a second quick-change joint (5-1), and the upper end of the cooling distribution unit water inlet (1-6) and the upper end of the cooling distribution unit water outlet are respectively provided with quick-change joints corresponding to the first quick-change joint (4-1) and the second quick-change joint (5-1).

7. The multi-compatible liquid cooling test bench for single board debugging according to claim 1, characterized in that: The frame (1-1) is an open structure and is constructed of aluminum profiles.

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