Computer water-cooling radiator

Abstract

The utility model provides a computer water-cooling radiator which comprises a radiating substrate, a shell is fixedly installed on the radiating substrate, radiating fins are arranged on the radiating substrate, the radiating substrate is in a pyramid frustum shape, the radiating substrate and the shell are in conical surface sealing connection in a riveting mode, a shunting assembly is fixedly installed on the radiating substrate, spoilers are symmetrically installed on the radiating substrate, and the spoilers are connected with the shell in a riveting mode. The shell is provided with a water inlet connector and a water outlet connector. The heat dissipation substrate is provided with the heat dissipation fins, the heat dissipation substrate and the shell are matched to seal the heat dissipation fins in the sealing chamber, cooling liquid is introduced to achieve the heat dissipation effect, the heat dissipation substrate is in a pyramid frustum shape, and during assembly, the heat dissipation substrate and the shell are in conical surface sealing connection in a riveting mode, so that the connecting position of the heat dissipation substrate and the shell is attached in a sealing mode, and the heat dissipation effect is improved. The water-cooling radiator is prevented from leaking liquid easily in the use process, and the use safety of electronic components is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation devices, and particularly relates to a computer water-cooling radiator. Background Art

[0002] Electronic components, such as a computer's CPU and GPU, generate heat when they consume power. The longer they are used, the more heat they generate. These components have a normal operating temperature range. Exceeding this temperature range can shorten their lifespan or even cause damage. Therefore, radiators are widely used to maintain these components within their normal operating temperature. Water-cooled radiators are popular due to their high heat dissipation efficiency, but existing water-cooled radiators are prone to leakage during use, causing short circuits and damage to electronic components.

[0003] A Chinese utility model with authorization publication number CN 219716068 U relates to the field of heat dissipation equipment technology, particularly a computer radiator based on a 3D VC circulation heat dissipation structure. The radiator comprises a substrate and a heat dissipation structure fixedly mounted on the substrate. The heat dissipation structure includes a housing and a baffle assembly. A flow chamber is defined within the housing, and a carrier is disposed within the flow chamber. A heat sink A and a heat sink B are fixedly mounted on the top and sides of the carrier, respectively. The heat sinks A and B cooperate with the baffle assembly to form a liquid flow channel. By disposing heat sinks A and B on the top and sides of the carrier, respectively, heat conducted from the sealing plate and the substrate is dissipated into the liquid within the flow channel, causing the liquid to evaporate, condense, and circulate. The liquid flows sequentially along flow channel A, flow channel C, flow channel B, flow channel C, and flow channel A, cooling heat sink A and the two sets of heat sinks B, thereby rapidly reducing the temperature of the carrier. However, the radiator has poor sealing properties and is prone to leakage. Utility Model Content

[0004] The purpose of the present invention is to provide a computer water-cooling radiator to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a computer water-cooled radiator, comprising a heat dissipation substrate, which is fixedly mounted with a shell, the heat dissipation substrate being provided with heat dissipation fins, the heat dissipation substrate being in the shape of a truncated pyramid, the heat dissipation substrate and the shell being connected to each other in a conical sealing manner by riveting, the heat dissipation substrate being fixedly mounted with a diverter assembly, the heat dissipation substrate being symmetrically mounted with spoilers, and the shell being provided with a water inlet joint and a water outlet joint.

[0006] Preferably, the heat dissipation substrate is provided with a sealing glue groove, and the shell is provided with a glue injection hole.

[0007] Preferably, the depth of the glue injection hole is smaller than the thickness of the heat dissipation substrate.

[0008] Preferably, the number of the glue injection holes is 2.

[0009] Preferably, the heat dissipation substrate and the housing are both made of metallic copper.

[0010] Compared with the prior art, the beneficial effects of the present invention are:

[0011] The heat dissipation substrate of the utility model is provided with heat dissipation fins. The heat dissipation substrate and the shell cooperate to seal the heat dissipation fins in a sealed chamber, and coolant is introduced to achieve the heat dissipation effect. The heat dissipation substrate is in the shape of a truncated pyramid. During assembly, the heat dissipation substrate and the shell are connected in a conical sealing manner by riveting, so that the connection between the heat dissipation substrate and the shell is sealed and fitted, thereby preventing the water-cooled radiator from leaking during use and ensuring the safe use of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is the first perspective structural view of the present invention.

[0013] Figure 2 This is the second perspective structural view of the present invention.

[0014] Figure 3 It is an exploded structural view of the present invention.

[0015] Figure 4 It is a cross-sectional structural view of the present utility model.

[0016] Markings in the figure: heat dissipation substrate 1, shell 2, heat dissipation fins 3, diversion component 4, spoiler 5, water inlet joint 6, water outlet joint 7, sealant groove 8, and glue injection hole 9. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] Example 1:

[0019] like Figures 1-4As shown, the present invention provides a computer water-cooling radiator, including a heat dissipation substrate 1, to which a housing 2 is fixedly mounted. The heat dissipation substrate 1 is provided with heat dissipation fins 3. The heat dissipation substrate 1 is in the shape of a truncated pyramid. The heat dissipation substrate 1 and the housing 2 are connected by riveting to form a conical surface seal. The heat dissipation substrate 1 is fixedly mounted with a diverter assembly 4. The heat dissipation substrate 1 is symmetrically mounted with a spoiler 5. The housing 2 is provided with a water inlet joint 6 and a water outlet joint 7. The heat dissipation substrate 1 is provided with a sealing glue groove 8, and the housing 2 is provided with a glue injection hole 9. The hole depth of the glue injection hole 9 is less than the thickness of the heat dissipation substrate 1. The number of glue injection holes 9 is 2. The heat dissipation substrate 1 and the housing 2 are both made of metallic copper.

[0020] Through the above technical solution, the heat dissipation substrate 1 of the utility model is provided with heat dissipation fins 3. The heat dissipation substrate 1 and the shell 2 cooperate to seal the heat dissipation fins 3 in a sealed chamber, and coolant is introduced to achieve the heat dissipation effect. The heat dissipation substrate 1 is in the shape of a truncated pyramid. During assembly, the heat dissipation substrate 1 and the shell 2 are sealed and connected with the conical surface by riveting, so that the connection between the heat dissipation substrate 1 and the shell 2 is sealed and fit, preventing the water-cooled radiator from leaking during use, and ensuring the safe use of electronic components.

[0021] Example 2:

[0022] like Figures 1-4 As shown, the heat dissipation substrate 1 of the present invention is fixedly mounted to a housing 2. The heat dissipation substrate 1 and the housing 2 are sealed and fixed to form a sealed chamber, which is used to pass cold water for cooling. Heat dissipation fins 3 are provided on the surface of the heat dissipation substrate 1. These heat dissipation fins 3 are located within the sealed chamber to effectively dissipate heat during operation. The heat dissipation substrate 1 has a truncated pyramid shape, which is designed to improve the sealing performance of the connection between the heat dissipation substrate 1 and the housing 2, ensuring the efficient operation of the cooling system. The housing 2 has an opening that seals with the heat dissipation substrate 1. The heat dissipation substrate 1 and the housing 2 are connected by riveting to ensure the integrity of the seal and prevent any leakage of the cooling liquid.

[0023] The frustum-shaped design of the heat dissipation substrate 1 ensures that the outer wall of the heat dissipation substrate 1 is tightly connected to the sidewall of the opening of the housing 2 during the riveting process, forming an effective conical seal. This structure effectively reduces the impact of thermal expansion caused by temperature changes on sealing performance, preventing liquid leakage and damage to the equipment. A diverter assembly 4 is fixedly mounted on the heat dissipation substrate 1, positioned directly opposite the water inlet connector 6. After the cold water enters the sealed chamber, it passes through the diverter assembly 4, effectively dispersing the water flow. This diversion process ensures that the cold water can pass through each heat dissipation fin 3, thereby maximizing heat dissipation efficiency.

[0024] The heat dissipation substrate 1 is symmetrically mounted with spoilers 5, located on either side of the diverter assembly 4, further enhancing the flow of the cold water. After passing through the diverter assembly 4, the cold water is affected by the spoilers 5, causing the cold water to disperse and flow within the sealed chamber. This flow pattern significantly improves the heat exchange efficiency between the cold water and the heat dissipation fins 3, thereby enhancing the heat dissipation effect. The housing 2 is provided with a water inlet connector 6 and a water outlet connector 7, which are designed to facilitate the inflow and outflow of cooling water.

[0025] During the heat dissipation process, heat dissipation substrate 1 absorbs heat from electronic circuits such as the CPU or GPU and transfers this heat to heat dissipation fins 3 through heat conduction. When cold water enters the sealed chamber through water inlet connector 6, it quickly flows onto the surface of heat dissipation fins 3, cooling them. During this process, heat dissipation substrate 1, through its large surface area, fully transfers heat to the flowing cold water.

[0026] As the cold water flows, the temperature of the cooling fins 3 drops. The cooled water is then discharged through the outlet connector 7, completing the heat dissipation process. The entire radiator system operates in a continuous cycle, ensuring that the electronic components remain within a safe operating temperature range during operation.

[0027] The radiator's structural design also takes into account system stability and reliability under high power consumption and prolonged use. The sealed structure of the water-cooled radiator prevents leakage, a crucial feature for protecting electronic components. The robust seal formed between the heat sink substrate 1 and the housing 2, achieved through riveting, allows the cooling liquid to flow freely within the sealed chamber, eliminating any risk of short circuits and component damage caused by leakage.

[0028] The application of water-cooled radiators is not limited to personal computers. An increasing number of industrial equipment, servers, and high-performance computers are also beginning to use water-cooling technology. With the continuous upgrade and performance improvement of electronic components, the requirements for cooling systems are also becoming increasingly stringent. With their efficient heat dissipation capabilities and excellent heat management, water-cooled radiators have become the preferred cooling solution for many high-performance devices.

[0029] The heat sink substrate 1 of this utility model is provided with a sealant groove 8, and the housing 2 is provided with a glue injection hole 9. During the manufacturing process, glue is injected into the sealant groove 8 through the glue injection hole 9. This step further improves the sealing between the heat sink substrate 1 and the housing 2, ensuring the reliability and safety of the radiator during use. The use of sealant plays a key role in the structural design of the radiator. By enhancing the sealing, it significantly reduces the risk of leakage, thereby effectively protecting the safety of electronic equipment.

[0030] The sealant groove 8 of the heat sink substrate 1 is used to hold injected sealant. This groove design ensures that the sealant forms a secure interface with the heat sink substrate 1 after curing, thereby ensuring a seal between the heat sink substrate 1 and the housing 2. During operation, the heat sink 1 and the housing 2 may experience thermal expansion due to temperature fluctuations. Using sealant effectively fills the tiny gaps caused by thermal expansion, preventing coolant leakage.

[0031] The glue injection holes 9 on the housing 2 facilitate the injection of sealant during the production process. During the glue injection process, the glue is introduced into the sealant groove 8 through the glue injection holes 9, ensuring that the sealant is evenly distributed within the groove. The glue injection process is demanding, and the operator must carefully control the injection speed and glue flow rate to avoid bubbles and uneven flow during the injection process. Through a scientific glue injection process, the sealant is guaranteed to completely fill the sealant groove 8, creating a good seal.

[0032] After the sealant cures, the connection between the heat sink substrate 1 and the housing 2 becomes tighter, reducing the risk of short circuits caused by liquid leakage. Heat generated by the electronic components during operation is transferred through the heat sink substrate 1 to the cooling fins 3, while coolant flows into the sealed chamber through the water inlet connector 6, ensuring that the radiator maintains excellent heat dissipation performance even under high loads. Over time, the coolant in the radiator may evaporate due to high temperatures. The presence of the sealant effectively prevents coolant loss and maintains the efficiency of the cooling system.

[0033] In radiators, the coolant may be other types besides water, making the sealant's heat and corrosion resistance crucial. Because the coolant flows at high temperatures, the sealant must possess high heat resistance to prevent degradation or failure. Furthermore, the coolant's composition can also corrode the sealant, making it crucial to select the right sealant material to ensure it maintains its sealing performance over extended use.

[0034] The number of the glue injection holes 9 of the present invention is 2. During glue injection, one glue injection hole 9 is used for glue injection and the other is used for exhaust, ensuring that the sealant fills the sealant groove 8, thereby improving the sealing performance of the present invention.

[0035] The depth of the glue injection hole 9 in this invention is less than the thickness of the heat sink 1. This design prevents glue from flowing into the sealed chamber formed by the heat sink 1 and the housing 2 during the injection process. In the production process of water-cooled radiators, ensuring accurate and effective glue injection is crucial. By designing the depth of the glue injection hole 9 to be less than the thickness of the heat sink 1, the direction of glue flow can be effectively controlled, ensuring that glue does not enter the sealed chamber, thereby protecting the working environment of the cooling system.

[0036] The heat sink substrate 1 and housing 2 of this utility model are both made of copper. Copper, as an excellent thermal conductor, has excellent thermal conductivity, enabling the heat sink substrate 1 to quickly transfer heat generated by electronic components to the coolant. Water-cooled radiators play a crucial role in the heat dissipation of electronic devices, so choosing the right material directly impacts the overall performance of the radiator.

[0037] Copper has a high thermal conductivity and can more efficiently transfer heat from the heat sink substrate 1 to the coolant than other metal materials such as aluminum. In practical applications, electronic components such as CPUs and GPUs generate significant heat during operation. If this heat cannot be dissipated promptly, it will cause the electronic components to heat up, affecting their performance and lifespan. Using copper as the heat sink substrate 1 can largely solve this problem, significantly improving heat dissipation efficiency.

[0038] In addition to its thermal conductivity, copper also offers excellent corrosion resistance. In the operating environment of a water-cooled radiator, the chemical composition of the coolant can corrode the metal. Copper resists this corrosion to a certain degree, ensuring that the radiator's performance is not affected by material degradation over extended use. Furthermore, copper's mechanical properties are relatively stable at high temperatures, allowing it to maintain good structural integrity under high loads.

[0039] The connection between the heat sink substrate 1 and the housing 2 is crucial for ensuring the water-cooled radiator's sealing performance. Copper's excellent workability facilitates precise connection through various processes, such as riveting and welding. During the water-cooled radiator's manufacturing process, copper ensures a secure connection between the heat sink substrate 1 and the housing 2, preventing coolant leaks caused by poor connections.

[0040] The structural design of the heat sink 1 is closely related to the choice of material. Using copper for the heat sink 1 further improves heat dissipation by increasing the surface area of ​​the heat sink fins 3. The design of the heat sink fins 3 allows for rapid heat transfer from the heat sink 1 to the coolant. The thermal conductivity of copper ensures rapid heat transfer, ensuring that the radiator maintains effective heat dissipation even under high loads.

[0041] In practical applications of water-cooled radiators, both the heat dissipation substrate 1 and the housing 2 are made of copper, a material that offers numerous performance advantages. Copper's high thermal conductivity and corrosion resistance effectively prevent overheating caused by poor heat dissipation when operating in high-temperature environments. Furthermore, copper radiators offer a long service life, providing stable heat dissipation for electronic devices.

[0042] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0043] The above description is only used to illustrate the technical solution of the present invention and is not intended to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A computer water-cooling radiator, comprising a heat dissipation substrate, wherein the heat dissipation substrate is fixedly mounted with a housing, characterized in that: The heat dissipation substrate is provided with heat dissipation fins, the heat dissipation substrate is in the shape of a truncated pyramid, the heat dissipation substrate and the shell are sealed with a conical surface by riveting, the heat dissipation substrate is fixedly installed with a diversion component, the heat dissipation substrate is symmetrically installed with a spoiler, and the shell is provided with a water inlet joint and a water outlet joint.

2. A computer water cooling radiator according to claim 1, characterized in that: The heat dissipation substrate is provided with a sealing glue groove, and the shell is provided with a glue injection hole.

3. A computer water cooling radiator according to claim 2, characterized in that: The depth of the glue injection hole is smaller than the thickness of the heat dissipation substrate.

4. A computer water cooling radiator according to claim 2, characterized in that: The number of the glue injection holes is 2.

5. The computer water cooling radiator according to claim 1, characterized in that: The heat dissipation substrate and the housing are both made of copper.

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