Circuit board and terminal equipment

Abstract

The utility model discloses a circuit board and terminal equipment, and belongs to the technical field of terminals. The circuit board comprises a first board body, a second board body and a first electronic element. The second plate body is fixedly connected with the first plate body with a first through hole, and the first electronic element is fixedly connected with one side, facing the first plate body, of the second plate body. According to the circuit board, the first through hole is formed in the first board body, and a part of the first electronic element with the highest height is hidden in the first through hole, so that the overall thickness of the circuit board can be effectively reduced. After the circuit board is installed in the terminal equipment, the overall thickness of the terminal equipment is small, and the light and thin design of the terminal equipment is facilitated. In addition, the first electronic component can be electrically connected with the first board body through the second board body, and normal work of the whole circuit board is not affected.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to a circuit board and a terminal device. Background Art

[0002] With the continuous development of terminal technology, terminal devices such as mobile phones, computers, and tablet computers have become widely popular and have become an indispensable part of people's work and life.

[0003] The terminal device may include: a circuit board. The circuit board in the terminal device contains a large number of electronic components to ensure the normal operation of the terminal device.

[0004] However, the height of the circuit board in the current terminal device is relatively large, resulting in a relatively large overall thickness of the terminal device, which is not conducive to making the terminal device thinner and lighter. Utility Model Content

[0005] The present invention provides a circuit board and a terminal device. The present invention solves the problem of the large overall thickness of the circuit board in the prior art. The technical solution is as follows:

[0006] In one aspect, a circuit board is provided, comprising: a first board body, a second board body, and a first electronic component;

[0007] The first plate has a first through hole;

[0008] The second plate is fixedly connected to one side of the first plate, and the second plate can cover the first through hole;

[0009] The first electronic component is fixedly connected to a side of the second plate body facing the first plate body, and at least a portion of the first electronic component is located in the first through hole.

[0010] Optionally, the thickness of the second plate is less than or equal to the thickness of the first plate.

[0011] Optionally, the circuit board further includes: a second electronic component and a third electronic component;

[0012] In a direction perpendicular to the surface of the circuit board, the height of the second electronic component is smaller than the height of the first electronic component and larger than the height of the third electronic component;

[0013] The second electronic component is fixedly connected to the side of the first board facing the second board; the third electronic component is fixedly connected to the side of the first board facing the second board, or to the side of the first board facing away from the second board.

[0014] Optionally, in a direction perpendicular to the surface of the circuit board, the distance between the side of the first electronic component facing away from the first board body and the side of the first board body facing away from the second board body is greater than or equal to the height of the third electronic component distributed on the side of the first board body facing away from the second board body.

[0015] Optionally, the circuit board also includes: a fourth electronic component, which is located on the side of the second board body facing away from the first electronic component, and the orthographic projection of the fourth electronic component on the board surface of the circuit board overlaps with the orthographic projection of the first electronic component on the board surface of the circuit board.

[0016] Optionally, in a direction perpendicular to the surface of the circuit board, the sum of the thickness of the second board body and the height of the fourth electronic component is less than or equal to the height (H2) of the second electronic component.

[0017] Optionally, there are multiple fourth electronic components, and the multiple fourth electronic components are connected in parallel through the second board.

[0018] Optionally, the first electronic component includes: a main control chip, and the second electronic component includes: a power management chip;

[0019] The first board has a first circuit, the second board has a second circuit, and the power management chip is electrically connected to the main control chip through the first circuit and the second circuit;

[0020] The width of the first circuit is greater than the width of other circuits in the first board, and the width of the second circuit is greater than the width of other circuits in the second board.

[0021] Optionally, the second plate has at least one second through hole, and the first plate covers the at least one second through hole;

[0022] The circuit board also includes: at least one fifth electronic component distributed on the side of the first board body facing the second board body, the at least one fifth electronic component corresponds one-to-one to the at least one second through hole, and at least a portion of each of the fifth electronic components is located in the corresponding second through hole.

[0023] Optionally, the first plate has a plurality of first connection holes;

[0024] The second plate body has a plurality of connection parts corresponding to the plurality of first connection holes one by one, and each of the connection parts has a second connection hole correspondingly connected to the first connection hole.

[0025] On the other hand, a terminal device is also provided, including: a middle frame, and a circuit board fixedly connected to the middle frame, and the circuit board is any one of the circuit boards described in the above embodiments.

[0026] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0027] An embodiment of the present application provides a circuit board, comprising: a first plate body, a second plate body, and a first electronic component. The second plate body is fixedly connected to the first plate body having a first through hole, and the first electronic component is fixedly connected to the side of the second plate body facing the first plate body. By providing a first through hole on the first plate body and hiding a portion of the first electronic component with the highest height within the first through hole, the overall thickness of the circuit board can be effectively reduced. After the circuit board is installed in a terminal device, the overall thickness of the terminal device is small, which is conducive to the lightweight design of the terminal device. In addition, the first electronic component can be electrically connected to the first plate body through the second plate body without affecting the normal operation of the circuit board as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0029] Figure 1 It is a schematic diagram of the structure of a circuit board;

[0030] Figure 2 This is a schematic structural diagram of a circuit board provided in an embodiment of the present application;

[0031] Figure 3 This is a structural diagram of another circuit board provided in an embodiment of the present application;

[0032] Figure 4 This is a structural diagram of another circuit board provided in an embodiment of the present application;

[0033] Figure 5 This is a structural diagram of another circuit board provided in an embodiment of the present application;

[0034] Figure 6 This is a structural diagram of a circuit board provided in another embodiment of the present application;

[0035] Figure 7 It is a structural diagram of another circuit board;

[0036] Figure 8 is a partial top view of a circuit board provided in an embodiment of the present application;

[0037] Figure 9 is a partial top view of the first plate provided in an embodiment of the present application;

[0038] Figure 10 This is a partial top view of the back side of a circuit board provided in an embodiment of the present application;

[0039] Figure 11 This is a structural diagram of another circuit board provided in another embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0041] Please refer to Figure 1 , Figure 1 The circuit board 00 may include a board body 01 , wherein the board body 01 may be used to connect electronic components, and both opposite sides of the board body 01 may be used to connect electronic components.

[0042] The electronic components in circuit board 00 can be divided into three categories: first-category electronic components 02, second-category electronic components 03, and third-category electronic components 04. First-category electronic components 02 have the largest height S1. For example, a system-on-chip (SOC) fixedly connected to one side of board 01 can have a height of 1.3 mm. Second-category electronic components 03 have the next smallest height S2. For example, a power management IC (PMIC) fixedly connected to the side of board 01 facing away from the SOC can have a height of 0.8 mm. Third-category electronic components 04 have the smallest height and can be located on the same side as first-category electronic components 02 or second-category electronic components 03.

[0043] Currently, the thickness S3 of the board 01 used to connect multiple electronic components can be 0.55 mm to ensure that the board 01 has sufficient strength to connect multiple electronic components. Thus, in a direction perpendicular to the surface of the circuit board 00, the overall thickness of the circuit board 00 can be the sum of the thickness S3 of the board 01, the height S1 of the first type of electronic components 02, and the height S2 of the second type of electronic components 03. For example, the overall thickness of the circuit board 00 can be 2.65 mm. Therefore, the height of the circuit board 00 is currently relatively large. After the circuit board 00 is installed in the terminal device, the overall thickness of the terminal device is relatively large, which is not conducive to the lightweight and thin design of the terminal device.

[0044] This embodiment of the application provides a circuit board, please refer to Figure 2 , Figure 2 Schematic diagram of a circuit board according to an embodiment of the present invention. The circuit board 000 may include a first board 100, a second board 200, and a first electronic component 300.

[0045] The first board body 100 in the circuit board 000 may have a first through hole K1 , that is, the first through hole K1 may pass through the first board body 100 .

[0046] The second plate 200 in the circuit board 000 can be fixedly connected to one side of the first plate 100, and the second plate 200 can cover the first through hole K1 of the first plate 100. That is, the orthographic projection of the first through hole K1 of the first plate 100 on the surface of the circuit board 000 can be located within the orthographic projection of the second plate 200 on the surface of the circuit board 000. It should be noted that the surface of the circuit board 000 in this application can refer to an extension of the surface of the first plate 100 or an extension of the surface of the second plate 200. The extension of the surface of the first plate 100 is the extension of the side of the first plate 100 facing the second plate 200, or the extension of the side of the first plate 100 facing away from the second plate 200. The surface of the second plate 200 is the extension of the side of the second plate 200 facing the first plate 100, or the extension of the side of the second plate 200 facing away from the first plate 100.

[0047] The first electronic component 300 in the circuit board 000 can be connected to the side of the second board 200 facing the first board 100, and at least a portion of the first electronic component 300 can be located within the first through hole K1 of the first board 100. Here, the first electronic component 300 can be electrically connected to the first board 100 through the second board 200.

[0048] In one possible implementation, the first electronic component 300 in the circuit board 000 may be the tallest electronic component in the circuit board 000. The thickness of the first board 100 in the circuit board 000 is generally smaller than the height of the first electronic component 300. Therefore, a portion of the first electronic component 300 may be located within the first through hole K1 provided on the first board 100, while another portion may extend from the first through hole K1 provided on the first board 100.

[0049] Thus, in a direction perpendicular to the surface of the circuit board 000, the height of the portion of the first electronic component 300 located within the first through-hole K1 of the first board 100 can coincide with the thickness D1 of the first board 100. Thus, the distance D3 between the side of the first electronic component 300 facing away from the first board 100 and the side of the first board 100 facing away from the second board 200 is simply the height of the portion of the first electronic component 300 extending from the first through-hole K1, that is, the value obtained by subtracting the thickness D1 of the first board 100 from the height H1 of the first electronic component 300. In contrast, for circuit boards in the related art, the distance between the side of the tallest electronic component facing away from the board and the side of the board on which it is located is the height of the tallest electronic component itself.

[0050] To this end, in this application, by providing a first through hole K1 on the first plate 300 and concealing a portion of the tallest first electronic component 300 within the first through hole K1, the overall thickness of the circuit board 000 can be effectively reduced. After the circuit board 000 is installed in the terminal device, the overall thickness of the terminal device is reduced, facilitating a lightweight and thin design for the terminal device. Furthermore, the first electronic component 300 can be electrically connected to the first plate 100 via the second plate 200 without affecting the normal operation of the entire circuit board 000.

[0051] For example, the first electronic component 300 in the circuit board 000 can be an SOC. In this way, the height H1 of the first electronic component 300 can be 1.3 mm. The thickness D1 of the first board 100 in the circuit board 000 can be 0.55 mm. In this way, the distance D3 between the side of the first electronic component 300 facing away from the first board 100 and the side of the first board 100 facing away from the second board 200 can be 0.75 mm. In the related art, when the highest electronic component in the circuit board is an SOC, the distance between the side of the electronic component facing away from the board in the circuit board and the side of the board on which the electronic component is arranged can be 1.3 mm. For this reason, compared with the existing related art, the overall thickness of the circuit board 000 in the present application can be significantly reduced.

[0052] In summary, an embodiment of the present application provides a circuit board, comprising: a first plate body, a second plate body, and a first electronic component. The second plate body is fixedly connected to the first plate body having a first through hole, and the first electronic component is fixedly connected to the side of the second plate body facing the first plate body. By providing a first through hole on the first plate body and hiding a portion of the first electronic component with the highest height in the first through hole, the overall thickness of the circuit board can be effectively reduced. After the circuit board is installed in the terminal device, the overall thickness of the terminal device is small, which is conducive to the lightweight design of the terminal device. In addition, the first electronic component can be electrically connected to the first plate body through the second plate body without affecting the normal operation of the circuit board as a whole.

[0053] Optional, please refer to Figure 3 , Figure 3 2 is a schematic diagram of the structure of another circuit board provided in an embodiment of the present application. The thickness D2 of the second board 200 in the circuit board 000 may be less than or equal to the thickness D1 of the first board 100.

[0054] It should be noted that the first board 100 in circuit board 000 requires a large connection area to connect most of the electronic components in circuit board 000. To ensure the overall strength of first board 100, the thickness D1 of first board 100 is also relatively large. For example, the thickness D1 of first board 100 can be 0.55 mm. However, the second board 200 in circuit board 000 only needs to connect the first electronic component 300 and other electronic components related to the first electronic component 300. Therefore, the connection area of ​​second board 200 can be smaller. To this end, the overall strength of second board 200 can be ensured by having a smaller thickness. Therefore, the thickness D2 of second board 200 can be equal to the thickness D1 of first board 100. For example, the thickness D2 of second board 200 can be 0.55 mm. Alternatively, the thickness D2 of second board 200 can be less than the thickness D1 of first board 100. For example, the thickness D2 of second board 200 can be 0.5 mm. Here, in order to ensure that the overall thickness of the circuit board 000 is small, the thickness D2 of the second board body 200 is preferably 0.5 mm.

[0055] In this case, it can be ensured that the thickness of the second board body 200 in the circuit board 000 will not be too thick. Even if the first board body 100 and the second board body 200 in the circuit board 000 are stacked and designed as a whole, the overall thickness of the circuit board 000 can be reduced by hiding a part of the first electronic component 300 set on the second board body 200 in the first through hole K1 in the first board body 100.

[0056] Optional, such as Figure 3As shown, the circuit board 000 may further include a second electronic component 400 and a third electronic component 500. In a direction perpendicular to the surface of the circuit board 000, the height H2 of the second electronic component 400 may be less than the height H1 of the first electronic component 300, and may be greater than the height H3 of the third electronic component 500. The second electronic component 400 may be fixedly connected to the side of the first board 100 facing the second board 200. The third electronic component 500 may be fixedly connected to the side of the first board 100 facing the second board 200, or the third electronic component 500 may be fixedly connected to the side of the first board 100 facing away from the second board 200.

[0057] For example, the second electronic component 400 in the circuit board 000 may include a PMIC, and the height of the PMIC may be 0.8 mm. The third electronic component 500 in the circuit board 000 may include a universal flash storage (UFS) chip and a board-to-board (BTB) connector.

[0058] In the present application, in a direction perpendicular to the surface of the circuit board 000, the distance D3 between the side of the first electronic component 300 facing away from the first board 100 and the side of the first board 100 facing away from the second board 200 in the circuit board 000 can be greater than or equal to the height H3 of the third electronic component 500 distributed on the side of the first board 100 facing away from the second board 200. This ensures that the maximum height of the front of the circuit board 000 is the distance D3 between the side of the first electronic component 300 facing away from the first board 100 and the side of the first board 100 facing away from the second board 200, thereby ensuring that the maximum height of the front of the circuit board 000 is relatively low. Here, the front of the circuit board 000 refers to the side of the first board 100 facing away from the second board 200.

[0059] It should be noted that in order to ensure that the maximum front height of circuit board 000 is the distance between the side of the first electronic component 300 facing away from the first board 100 and the side of the first board 100 facing away from the second board 200, all electronic components in circuit board 000 with a height greater than this distance must be placed on the side of the first board 100 facing the second board 200. Here, the electronic component with a height greater than this distance is the second electronic component 400 in circuit board 200. In other words, the height of the second electronic component 400 in circuit board 000 is less than the height H1 of the first electronic component 300 and greater than the distance D3 between the side of the first electronic component 300 facing away from the first board 100 and the side of the first board 100 facing away from the second board 200.

[0060] For example, if the thickness D1 of the first board 100 in circuit board 000 is 0.55 mm and the first electronic component 300 in circuit board 000 is a SOC, that is, if the height H1 of the first electronic component 300 is 1.3 mm, the distance D3 between the side of the first electronic component 300 facing away from the first board 100 and the side of the first board 100 facing away from the second board 200 can be 0.75 mm. Thus, to ensure that the front height of circuit board 000 is 0.75 mm, all electronic components in circuit board 000 with a height greater than 0.75 mm can be placed on the side of the first board 100 facing the second board 200. For example, if the second electronic component 400 is a PMIC, the height of the second electronic component 400 can be 0.8 mm. In this way, the PMIC can be fixedly connected to the side of the first board 100 facing the second board 200.

[0061] Optional, such as Figure 4 As shown, Figure 4 is a schematic diagram of the structure of another circuit board provided in an embodiment of the present application. Circuit board 000 may further include: a fourth electronic component 600. The fourth electronic component 600 in circuit board 000 may be located on a side of the second board 200 facing away from the first electronic component 300, and the orthographic projection of the fourth electronic component 600 on the board surface of circuit board 000 may overlap with the orthographic projection of the first electronic component 300 on the board surface of circuit board 000.

[0062] It should be noted that if the first electronic component 300 in the circuit board 000 is a SOC, the fourth electronic component 600 in the circuit board 000 can be connected to a power distribution network (PDN). The fourth electronic component 600, located on the side of the second board 200 facing away from the first electronic component 300, can be used to regulate the voltage of the first electronic component 300 to ensure a stable current in the first electronic component 300.

[0063] It should also be noted that in order to ensure that the PDN can normally adjust the voltage of the first electronic component 300, the PDN needs to have a capacitance matching the first electronic component 300. The capacitance of the PDN is proportional to the height of the PDN.

[0064] In the present application, the fourth electronic component 600 that is a PDN may be of the following three types:

[0065] In the first possible case, if Figure 4As shown, the fourth electronic component 600 can be a 0402 package capacitor having a capacitance matching that of the first electronic component 300. In a direction perpendicular to the surface of the circuit board 000, the height of the 0402 package capacitor can be 0.5 mm. Thus, if the thickness D2 of the second board 200 is 0.5 mm and the thickness H2 of the second electronic component 400, which is a PMIC, is 0.8 mm, the sum D4 of the thickness D2 of the second board 200 and the height H4 of the fourth electronic component 600, i.e., 1 mm, can be greater than the thickness H2 of the second electronic component 400, i.e., 0.8 mm.

[0066] In this case, the maximum height of the back side of the circuit board 000 is the distance D4 between the side of the fourth electronic component 600 facing away from the first board 100 and the side of the first board 100 facing the second board 200, which is 1 mm. Here, the back side of the circuit board 000 is the side of the first board 100 facing the second board 200. Therefore, if the thickness D1 of the first board 100 is 0.55 mm and the height H1 of the first electronic component 300 is 1.3 mm, the overall thickness of the circuit board 000 can be 2.3 mm. This is smaller than the overall thickness of 2.65 mm in conventional circuit boards.

[0067] In the second possible case, if Figure 5 As shown, Figure 5 is a schematic diagram of the structure of another circuit board provided by an embodiment of the present application. The fourth electronic component 600 can be a 0201 packaged capacitor, the capacitance of which is smaller than that of a 0401 packaged capacitor. In this case, there can be multiple fourth electronic components 600, and the multiple fourth electronic components 600 can be connected in parallel via the second board 200. Thus, the multiple fourth electronic components 600 connected in parallel via the second board 200 can have a capacitance matching that of the first electronic component 300, and the height of the 0201 packaged capacitor can be 0.35 mm in a direction perpendicular to the surface of the circuit board 000. Thus, if the thickness D2 of the second board 200 is 0.5 mm and the thickness H2 of the second electronic component 400 of the PMIC is 0.8 mm, the sum D4 of the thickness D2 of the second board 200 and the height H4 of the fourth electronic component 600, i.e., 0.85 mm, can also be greater than the thickness H2 of the second electronic component 400, i.e., 0.8 mm.

[0068] In this case, the maximum height of the back surface of the circuit board 000, or the distance D4 between the side of the fourth electronic component 600 facing away from the first board 100 and the side of the first board 100 facing the second board 200, is 0.85 mm. Therefore, if the thickness D1 of the first board 100 is 0.55 mm and the height H1 of the first electronic component 300 is 1.3 mm, the overall thickness of the circuit board 000 can be 2.15 mm. This is significantly thinner than the overall thickness of 2.3 mm in the first case.

[0069] In a third possible scenario, the fourth electronic component 600 can use a PDN with a smaller capacitance than the 0201 package capacitor, further reducing the height of the first four electronic components 600. In one possible scenario, the sum of the height H4 of the fourth electronic component 600 and the thickness D2 of the second board 200 can be less than the height H2 of the second electronic component 400. This allows the maximum backside height of the circuit board 000, which is the distance between the side of the second electronic component 400 facing away from the first board 100 and the side of the first board 100 facing the second board 200, to be 0.8 mm. Therefore, if the thickness D1 of the first board 100 is 0.55 mm and the height H1 of the first electronic component 300 is 1.3 mm, the overall thickness of the circuit board 000 can be 2.1 mm. This allows the circuit board 000 in this scenario to have the smallest overall thickness compared to the first and second scenarios.

[0070] It should be noted that after the plurality of fourth electronic components 600 are connected in parallel via the second plate 200, parasitic capacitance will be generated by the plurality of fourth electronic components 600 connected in parallel. Therefore, to ensure that the capacitance of the plurality of fourth electronic components 600 connected in parallel matches that of the first electronic component 300, the total capacitance of the plurality of fourth electronic components 600 connected in parallel can be made to have a certain ratio to the capacitance required by the first electronic component 300. Furthermore, the plurality of fourth electronic components 600 can be concentrated on the side of the second plate 200 facing away from the first electronic component 300, so that the plurality of fourth electronic components 600 connected in parallel can better regulate the voltage of the first electronic component 300.

[0071] In this application, please refer to Figure 6 , Figure 6This is a schematic diagram of the structure of a circuit board provided in another embodiment of the present application. The first electronic component 300 in circuit board 000 may include a main control chip. For example, the first electronic component 300 may be a SOC. The second electronic component 400 in circuit board 000 may include a power management chip. For example, the second electronic component 400 may be a PMIC. In this case, the first board 100 may have a first circuit 101, and the second board 200 may have a second circuit 201. The power management chip may be electrically connected to the main control chip via the first circuit 101 and the second circuit 201.

[0072] Please note that, please refer to Figure 7 , Figure 7 This is a schematic diagram of the structure of another circuit board. In the prior art, the power management chip 03 can be electrically connected directly to the main control chip 02 via the line 05 in the board body 01. Thus, compared to the prior art, the total length of the first line 101 and the second line 102 used to connect the power management chip and the main control chip in this application is 4 to 5 times the total length of the lines used to connect the power management chip and the main control chip in the prior art. Furthermore, the longer the lines in the circuit board, the greater the line impedance. When the impedance of the lines connecting the power management chip and the main control chip increases, signal transmission between the power management chip and the main control chip will be affected.

[0073] For this purpose, in this application, please refer to Figure 8 , Figure 8 This is a partial top view of a circuit board provided in an embodiment of the present application. The width of the first circuit 101 in the first board 100 can be greater than the width of other circuits in the first board 100, and the width of the second circuit 201 in the second board 200 can be greater than the width of other circuits in the second board 200. Here, the wider the circuit, the lower the circuit impedance. To this end, in order to prevent the impedance of the first circuit 101 and the second circuit 201 from affecting the signal transmission between the power management chip and the main control chip, the impedance of the first circuit 101 and the second circuit 201 can be reduced by widening the width of the first circuit 101 and the second circuit 201.

[0074] It should be noted that in order to ensure the uniformity of the impedance of the line used to connect the power management chip and the main control chip, the width of the first line 101 in the first board 100 can depend on the length of the first line 101, and the width of the second line 102 in the second board 200 can depend on the width of the second line 102, so that the impedance of the first line 101 can be the same as the impedance of the second line 102.

[0075] In this application, if Figure 6As shown, the second board 200 in the circuit board 000 may have at least one second through hole K2, and the first board 100 may cover the at least one second through hole K2 in the second board 200. The circuit board 000 may further include: at least one fifth electronic component 700 distributed on the side of the first board 100 facing the second board 200, and the at least one fifth electronic component 700 may correspond one-to-one with the at least one second through hole K2, and at least a portion of each fifth electronic component 700 may be located within the corresponding second through hole K2.

[0076] It should be noted that the fifth electronic component 700 in the circuit board 000 can be the second electronic component 400 in the above embodiment, and / or, the fifth electronic component 700 in the circuit board 000 can be the third electronic component 500 distributed on the side of the first board 100 facing the second board 200 in the above embodiment.

[0077] Optional, such as Figure 9 and Figure 10 As shown, Figure 9 is a partial top view of the first plate provided in an embodiment of the present application, Figure 10 It is a partial top view of the back side of a circuit board provided in an embodiment of the present application. The first board body 100 in the circuit board 000 may have a plurality of first connection holes M1. The second board body 200 in the circuit board 000 may have a plurality of connection parts 202 corresponding one-to-one to the plurality of first connection holes M1. And each connection part 202 may have a second connection hole M2 corresponding to the first connection hole M1. In this way, the circuit board 000 may also include a plurality of connecting members corresponding one-to-one to the plurality of first connection holes M1, and the first board body 100 and the second board body 200 may be fixedly connected together through the cooperation of the connecting members with the first connection holes M1 and the second connection holes M2.

[0078] It should be noted that the second plate body 200 in the circuit board 000 can first be welded together with the first plate body 100. In order to ensure the reliability of the fixed connection between the second plate body 200 and the first plate body 100, the second plate body 200 and the first plate body 100 can be fixedly connected together through a connecting piece and the cooperation of the second connection hole M2 of the second plate body 200 and the first connection hole M1 of the first plate body 100.

[0079] It should also be noted that the middle frame of the terminal device in subsequent embodiments may have multiple third connection holes that are in one-to-one communication with the multiple first connection holes M1 and the multiple second connection holes M2. In this way, the circuit board 000 can be fixedly connected to the middle frame of the terminal device through the cooperation of the connector with the first connection holes M1 of the first board 100, the second connection holes M2 of the second board 200, and the third connection holes of the middle frame.

[0080] In this application, please refer to 11, Figure 11This is a schematic diagram of the structure of another circuit board provided in another embodiment of the present application. Circuit board 000 may further include a shielding cover 800. The electronic components in circuit board 000 are located within shielding cover 800. This shielding cover can be used to shield against external interference to ensure the normal operation of the electronic components. For example, shielding cover 800 in circuit board 000 can be made of copper.

[0081] It should be noted that the shielding cover 800 in the circuit board 000 may include: a first shielding cover 801 fixedly connected to the first board 100 and a second shielding cover 802 fixedly connected to the second board 200. The second shielding cover 802 may be fixedly connected to a side of the second board 200 facing away from the first board 200. The fourth electronic component 600 in the circuit board 000 and the fifth electronic component 700 located in the second through hole K2 of the second board 200 may be located within the second shielding cover 802.

[0082] The first shielding cover 801 can be fixedly connected to the side of the first board 100 facing away from the second board 200, or the first shielding cover 801 can be fixedly connected to the side of the first board 100 facing the second board 200. Furthermore, the first electronic component 300 in the circuit board 000 and the third electronic component 500 distributed on the side of the first board 100 facing away from the second board 200 can be located within the first shielding cover 801 distributed on the side of the first board 100 facing away from the second board 200. The second electronic component 400 in the circuit board 000 and the third electronic component 500 distributed on the side of the first board 100 facing the second board 200 can be located within the first shielding cover 801 distributed on the side of the first board 100 facing the second board 200.

[0083] In summary, an embodiment of the present application provides a circuit board, comprising: a first plate body, a second plate body, and a first electronic component. The second plate body is fixedly connected to the first plate body having a first through hole, and the first electronic component is fixedly connected to the side of the second plate body facing the first plate body. By providing a first through hole on the first plate body and hiding a portion of the first electronic component with the highest height in the first through hole, the overall thickness of the circuit board can be effectively reduced. After the circuit board is installed in the terminal device, the overall thickness of the terminal device is small, which is conducive to the lightweight design of the terminal device. In addition, the first electronic component can be electrically connected to the first plate body through the second plate body without affecting the normal operation of the circuit board as a whole.

[0084] An embodiment of the present application further provides a terminal device, which may include: a middle frame, and a circuit board fixedly connected to the middle frame. The circuit board in the terminal device may be the circuit board described in the above embodiment. The overall thickness of the circuit board is relatively small, and after the circuit board is fixedly connected to the middle frame, the thickness of the terminal device equipped with the circuit board is also relatively small. For example, the terminal device may be a mobile phone, a tablet computer, a laptop computer, an e-book, or the like.

[0085] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0086] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A circuit board, characterized in that: include: A first plate (100), a second plate (200) and a first electronic component (300); The first plate (100) has a first through hole (K1); The second plate (200) is fixedly connected to one side of the first plate (100), and the second plate (200) is capable of covering the first through hole (K1); The first electronic component (300) is fixedly connected to a side of the second plate (200) facing the first plate (100), and at least a portion of the first electronic component (300) is located in the first through hole (K1).

2. The circuit board according to claim 1, wherein: The thickness (D2) of the second plate body (200) is less than or equal to the thickness (D1) of the first plate body (100).

3. The circuit board according to claim 1, wherein: The circuit board further comprises: a second electronic component (400) and a third electronic component (500); In a direction perpendicular to the surface of the circuit board, the height (H2) of the second electronic component (400) is smaller than the height (H1) of the first electronic component (300) and larger than the height (H3) of the third electronic component (500); The second electronic component (400) is fixedly connected to the side of the first plate (100) facing the second plate (200); and the third electronic component (500) is fixedly connected to the side of the first plate (100) facing the second plate (200), or fixedly connected to the side of the first plate (100) facing away from the second plate (200).

4. The circuit board according to claim 3, wherein: In a direction perpendicular to the surface of the circuit board, a distance (D3) between a side of the first electronic component (300) facing away from the first board body (100) and a side of the first board body (100) facing away from the second board body (200) is greater than or equal to a height (H3) of a third electronic component (500) distributed on a side of the first board body (100) facing away from the second board body (200).

5. The circuit board according to claim 3, wherein: The circuit board further comprises: a fourth electronic component (600), the fourth electronic component (600) being located on a side of the second board (200) facing away from the first electronic component (300), and an orthographic projection of the fourth electronic component (600) on the board surface of the circuit board overlaps with an orthographic projection of the first electronic component (300) on the board surface of the circuit board.

6. The circuit board according to claim 5, characterized in that In a direction perpendicular to the surface of the circuit board, the sum (D4) of the thickness (D2) of the second board body (200) and the height (H4) of the fourth electronic component (600) is less than or equal to the height (H2) of the second electronic component (400).

7. The circuit board according to claim 6, wherein: There are multiple fourth electronic components (600), and the multiple fourth electronic components (600) are connected in parallel via the second plate (200).

8. The circuit board according to claim 3, wherein: The first electronic component (300) includes: a main control chip, and the second electronic component (400) includes: a power management chip; The first board (100) has a first circuit (101), the second board (200) has a second circuit (201), and the power management chip is electrically connected to the main control chip via the first circuit (101) and the second circuit (201); The width of the first circuit (101) is greater than the width of other circuits in the first plate (100), and the width of the second circuit (201) is greater than the width of other circuits in the second plate (200).

9. The circuit board according to any one of claims 1 to 8, characterized in that: The second plate body (200) has at least one second through hole (K2), and the first plate body (100) covers the at least one second through hole (K2); The circuit board further comprises: at least one fifth electronic component (700) distributed on the side of the first board body (100) facing the second board body (200), the at least one fifth electronic component (700) corresponding to the at least one second through hole (K2) on a one-to-one basis, and at least a portion of each fifth electronic component (700) is located in the corresponding second through hole (K2).

10. The circuit board according to any one of claims 1 to 8, characterized in that: The first plate (100) has a plurality of first connection holes (M1); The second plate body (200) has a plurality of connection parts (202) corresponding one-to-one to the plurality of first connection holes (M1), and each of the connection parts (202) has a second connection hole (M2) correspondingly connected to the first connection hole (M1).

11. A terminal device, characterized in that: include: A middle frame, and a circuit board fixedly connected to the middle frame, wherein the circuit board is the circuit board according to any one of claims 1 to 10.

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