Chip interconnection structure
By designing the chip interconnect structure, rapid welding and effective heat dissipation between circuit boards and electronic components are achieved, the problem of low welding efficiency in the prior art is solved, and the production efficiency and protection effect are improved.
Patent Information
- Application Number
- CN202422214768.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-10
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-09-10
AI Technical Summary
During the existing chip packaging process, the circuit board and electronic components are inefficient when welding, especially when welding multiple electronic components, it takes a long time to affect production efficiency.
A chip interconnect structure is designed, including circuit boards, welding mechanisms, connecting protective covers and protective heat dissipation mechanisms, quickly welding electronic component pins through welding mechanisms, and providing protection and heat dissipation using protective covers and heat dissipation mechanisms.
It improves soldering efficiency during chip packaging, simplifies operational processes, improves production efficiency, and provides effective protection and heat dissipation of electronic components.
Smart Images
Figure CN223274263U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chips, and more particularly to a chip interconnection structure. Background Art
[0002] Ultra-wideband technology is a wireless carrier communication technology that uses nanosecond-level non-sinusoidal narrow pulses to transmit data. It has the characteristics of low system complexity, low power consumption, strong multipath resolution, high security, high access density, and low interception capability. Therefore, UWB technology is extremely suitable for high-precision positioning scenarios and is widely used in the mining industry.
[0003] In the process of packaging existing chips, when connecting electronic components to circuit boards, the circuit boards and electronic components are usually soldered individually. If there are many electronic components to be soldered on the circuit board, it takes a long time to process the entire chip, which reduces production and processing efficiency. To this end, we propose a chip interconnection structure. Utility Model Content
[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a chip interconnection structure to solve the problems existing in the above-mentioned background technology.
[0005] The utility model provides the following technical solution: a chip interconnection structure, comprising a circuit board, wherein a positioning and mounting cylinder is provided inside the edge of the circuit board, an electronic component is movably plugged into the interior of the circuit board, and a welding mechanism is provided at the bottom of the circuit board corresponding to the position of the pin of the electronic component;
[0006] Furthermore, a connecting protective cover is fixedly connected to the top of the circuit board, a threaded hole is opened in the middle of the top of the connecting protective cover, the inner side of the threaded hole is connected to a fastening bolt through a thread, and the top of the connecting protective cover is connected to a protective heat dissipation mechanism through the fastening bolt.
[0007] Furthermore, the welding mechanism includes a fixed connecting ring, the bottom of the fixed connecting ring is fixedly connected to a connecting bottom block, the inner side of the connecting bottom block is provided with a fixed limit block, a welding tin block is placed at the inner bottom end of the connecting bottom block, and a fixed groove is opened inside the welding tin block.
[0008] Furthermore, a bottom plane is provided at the bottom end of the connecting bottom block.
[0009] Furthermore, the protective heat dissipation mechanism includes a connecting mounting block, the edge of which is symmetrically provided with a connecting mounting frame, the inner side of which is fixedly connected with a fixed connecting plate, and the upper and lower surfaces of the fixed connecting plate are both provided with connecting heat dissipation blocks.
[0010] Furthermore, the outer side of the bottom surface of the connection mounting frame and the inner side of the top end of the connection protective cover are in contact with each other.
[0011] Furthermore, the bottom of the connection mounting block and the top of the connection protective cover fit together.
[0012] The technical effects and advantages of this utility model are:
[0013] The utility model is provided with a welding mechanism, which makes it easy to connect the circuit board and the electronic components. All the pins of the electronic components are inserted into the inside of the circuit board, so that the bottoms of the pins are inserted into the inner side of the welding mechanism. Then the whole is placed on a heating plate, and the welding mechanism is heated so that the inside of the welding mechanism can be welded to the pins of the electronic components. The operation is convenient and fast, and the production and processing efficiency is improved.
[0014] The utility model can be quickly assembled by means of the connecting protective cover, threaded holes, fastening bolts and protective heat dissipation mechanism, and can effectively provide sufficient protection for the top of the circuit board and electronic components. At the same time, it can also absorb the heat generated when the whole is used and diffuse it to the outside, thereby performing heat dissipation treatment, and is easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model.
[0016] Figure 2 This is a schematic structural diagram of the protective heat dissipation mechanism of the present utility model.
[0017] Figure 3 This is a schematic structural diagram of the welding mechanism of the present utility model.
[0018] Figure 4 This is a schematic diagram of the cross-sectional structure of the welding mechanism of the present invention.
[0019] The accompanying drawings are marked as follows: 1. circuit board; 2. positioning and mounting cylinder; 3. electronic component; 4. welding mechanism; 5. connecting protective cover; 6. threaded hole; 7. fastening bolt; 8. protective heat dissipation mechanism; 9. fixed connecting ring; 10. connecting bottom block; 11. fixed limit block; 12. welding tin block; 13. fixing groove; 14. bottom plane; 15. connecting mounting block; 16. connecting mounting frame; 17. fixed connecting plate; 18. connecting heat dissipation block. DETAILED DESCRIPTION
[0020] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the drawings in the present invention. In addition, the forms of the various structures recorded in the following embodiments are merely examples. The present invention is not limited to the various structures recorded in the following embodiments. All other implementations obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0021] Reference Figure 1-4 The utility model provides a chip interconnection structure, including a circuit board 1, a positioning and mounting cylinder 2 is provided inside the edge of the circuit board 1, an electronic component 3 is movably plugged into the inside of the circuit board 1, and a welding mechanism 4 is provided at the bottom of the circuit board 1 corresponding to the pin position of the electronic component 3;
[0022] Among them, the top of the circuit board 1 is fixedly connected to a connecting protective cover 5, a threaded hole 6 is opened in the middle of the top of the connecting protective cover 5, the inner side of the threaded hole 6 is connected to a fastening bolt 7 through a thread, and the top of the connecting protective cover 5 is connected to a protective heat dissipation mechanism 8 through the fastening bolt 7.
[0023] Among them, the welding mechanism 4 includes a fixed connecting ring 9, the bottom of the fixed connecting ring 9 is fixedly connected to a connecting bottom block 10, the inner side of the connecting bottom block 10 is provided with a fixed limit block 11, and a soldering tin block 12 is placed at the bottom end of the inner side of the connecting bottom block 10. A fixed groove 13 is provided inside the soldering tin block 12, so that when the pins of the electronic components 3 are inserted into the interior of the circuit board 1 and the inner side of the connecting bottom block 10, the fixed limit block 11 can prevent the pins of the electronic components 3 from being pulled out upward, and the pins can be inserted into the inner side of the fixed groove 13. Then the heating block uniformly heats the connecting bottom block 10, so that the soldering tin block 12 melts and wraps the pins, thereby quickly performing the welding process.
[0024] The bottom end of the connecting bottom block 10 is provided with a bottom plane 14 , so that the connecting bottom block 10 can be stably placed on the heating plate for heating treatment under the action of the bottom plane 14 .
[0025] Among them, the protective heat dissipation mechanism 8 includes a connecting mounting block 15, and a connecting mounting frame 16 is symmetrically provided on the edge of the connecting mounting block 15. A fixed connecting plate 17 is fixedly connected to the inner side of the connecting mounting frame 16, and the upper and lower surfaces of the fixed connecting plate 17 are provided with a connecting heat dissipation block 18, so that the connecting mounting block 15 can cover the middle of the top of the connecting protective cover 5 and be connected and fixed by tightening bolts 7. At this time, the connecting mounting frame 16 can be inserted into the inner side of the top of the connecting protective cover 5, and the fixed connecting plate 17 and the connecting heat dissipation block 18 can be installed, which can provide protection as a whole. At the same time, the connecting heat dissipation block 18 and the fixed connecting plate 17 can absorb heat and dissipate it to the outside, which is easy to operate.
[0026] The outer side of the bottom surface of the connection installation frame 16 fits with the inner side of the top of the connection protection cover 5 , so that the connection installation frame 16 can be stably stuck on the inner side of the top of the connection protection cover 5 for use.
[0027] Among them, the bottom of the connecting mounting block 15 fits with the top of the connecting protective cover 5, so that the connecting mounting block 15 can be stably placed in the middle of the top of the connecting protective cover 5 and stably connected to the connecting protective cover 5.
[0028] The working principle of the present invention is as follows: during use, all the pins 3 of the electronic components to be installed are inserted into the interior of the circuit board 1, so that the pins can be inserted into the inner side of the fixing groove 13. At this time, the end of the fixed limit block 11 resists and restricts the pins to prevent the pins from being pulled out and detached. Then the whole is placed on the heating plate so that the bottom plane 14 and the heating plate are in contact with each other. The heating plate is then heated to melt the soldering tin block 12. After the melting is completed, the whole is taken out and separated from the heating plate. The melted soldering tin block 12 wraps the pins, thereby quickly performing the soldering process. Then the connecting mounting block 15 and the connecting mounting block 15 are connected. The connecting mounting frame 16, the fixed connecting plate 17 and the connecting heat sink 18 are moved so that the connecting mounting frame 16 can be inserted into the inner side of the top of the connecting protective cover 5, and the connecting mounting block 15 can be located in the middle of the top of the connecting protective cover 5, and is installed and fixed by tightening the bolts 7, so that the connecting mounting frame 16, the fixed connecting plate 17, the connecting heat sink 18 and the connecting protective cover 5 as a whole can provide protection for the electronic components 3, and the fixed connecting plate 17 and the connecting heat sink 18 can absorb the generated heat when they are used as a whole, and diffuse it to the outside, so as to quickly dissipate the heat. The overall structure is simple and the operation is convenient and quick.
[0029] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense, and may refer to mechanical or electrical connections, internal communication between two components, or direct connection. "Up," "down," "left," and "right" are only used to indicate relative positional relationships. When the absolute positions of the objects being described change, the relative positional relationships may also change.
[0030] Secondly: The drawings of the embodiments disclosed in this utility model only involve structures related to the embodiments disclosed in this utility model. Other structures can refer to common designs. In the absence of conflicts, the same embodiment and different embodiments of the utility model can be combined with each other.
[0031] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A chip interconnection structure, comprising a circuit board (1), characterized in that: A positioning mounting cylinder (2) is provided inside the edge of the circuit board (1), an electronic component (3) is movably plugged inside the circuit board (1), and a welding mechanism (4) is provided at the bottom of the circuit board (1) at a position corresponding to the pin of the electronic component (3); the welding mechanism (4) comprises a fixed connecting ring (9), a connecting bottom block (10) is fixedly connected to the bottom of the fixed connecting ring (9), a fixed limiting block (11) is provided on the inner side of the connecting bottom block (10), a welding tin block (12) is placed at the inner bottom end of the connecting bottom block (10), and a fixing groove (13) is provided inside the welding tin block (12).
2. The chip interconnect structure according to claim 1, wherein: The top of the circuit board (1) is fixedly connected to a connecting protective cover (5), a threaded hole (6) is provided in the middle of the top of the connecting protective cover (5), a fastening bolt (7) is connected to the inner side of the threaded hole (6) via a thread, and the top of the connecting protective cover (5) is connected to a protective heat dissipation mechanism (8) via the fastening bolt (7).
3. The chip interconnect structure according to claim 1, wherein: The bottom end of the connecting bottom block (10) is provided with a bottom plane (14).
4. The chip interconnect structure according to claim 2, wherein: The protective heat dissipation mechanism (8) comprises a connection mounting block (15), a connection mounting frame (16) is symmetrically provided on the edge of the connection mounting block (15), a fixed connection plate (17) is fixedly connected to the inner side of the connection mounting frame (16), and connection heat dissipation blocks (18) are provided on the upper and lower surfaces of the fixed connection plate (17).
5. The chip interconnect structure according to claim 4, wherein: The outer side of the bottom surface of the connection mounting frame (16) and the inner side of the top end of the connection protective cover (5) are fitted together.
6. The chip interconnect structure according to claim 4, wherein: The bottom of the connection mounting block (15) and the top of the connection protective cover (5) fit together.